Smart Manufacturing

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. Nominations for the 2025 20 Under 30 Award are now open, providing the opportunity to recognize and honor the next wave of industry trailblazers.The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys and discover how they are thriving and paving the way for future generations in the semiconductor world.Introducing Mariusz Grabowski: Lead Design Engineer at Cadence Design SystemsMariusz Grabowski, a 2023 20 Under 30 award recipient at the age of 24. He is now a Lead Design Engineer at Cadence Design Systems, Inc., where he’s been making strides in digital systems design for nearly three years. Prior to this role, he gained valuable experience as an FPGA Design and Verification Engineer at Aldec Inc. Grabowski holds a master’s degree with distinction in automation and robotics from AGH University of Science and Technology in Krakow, Poland. During his academic career, he was an active member of both the Avader and Integra Scientific Groups. He also achieved recognition at events like DASIP 2023 and in the International FPGA Hackathon, where he and his team earned 2nd and 3rd place. He is currently also pursuing a postgraduate degree in Project Management at SGH Warsaw School of Economics. SEMI: What inspired you to join the semiconductor industry? Grabowski: I have always been fascinated by the fundamental workings of advanced systems and that curiosity led me to pursue a career in the semiconductor industry. As a digital design engineer, it is exciting for me to contribute to the creation of such large and sophisticated architectures from basic building blocks. Now, I’m proud to be a part of Cadence Design Systems, where I can work on the cutting-edge designs with some of the most talented and hard-working engineers. Grabowski and his team at the awards ceremony at FPGA Hackathon 2023SEMI: How did your early experiences and education shape your career path?Grabowski: During my studies, I had the opportunity to work on hands-on projects with an FPGA platform, which led me to my first job as an FPGA design and verification engineer. That experience gave me a broader perspective on the industry’s scale and reinforced my passion for tackling challenges, learning and growing in this field.Grabowski presenting his paper at the DASIP 2023 ConferenceSEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you? Grabowski: For me, it is successfully balancing full-time studies with work. It was a challenging experience, but it provided invaluable opportunities to grow my skills and gain hands-on experience. During that time, I completed numerous projects, participated in scientific conferences and industry events like DASIP 2023, and even earned 2nd and 3rd place in the International FPGA Hackathon. These achievements reinforced my passion for the field and my ability to thrive under pressure. SEMI: As a young professional in the industry, what is your greatest challenge? Grabowski: One of the biggest challenges is navigating the complexity of large-scale projects, where seamless coordination between multiple teams across the globe is crucial. As someone still early in my career, gaining the experience to manage the cross-functional aspects of a project while ensuring my own contributions are technically sound has been both demanding and rewarding.Grabowski at the Discussion Panel on Industry Career Perspectives at DATE 2024 ConferenceSEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Grabowski: The sheer amount of information and complexity in the industry can feel overwhelming. It is essential to embrace curiosity and continuous learning, but it is also crucial to recognize that you can’t do everything alone. My advice is to find your area of expertise and collaborate with others; teamwork is key to bringing impactful projects to life. Cadence’s Design Team in Warsaw, Poland Manager Jacek Rosiak—3rd from the leftSEMI: How do you envision future work environments? Grabowski: I envision future work environments as places where technology fosters creativity and collaboration, diversity is celebrated, and flexibility and work-life balance are prioritized. These environments will empower employees to perform at their best while feeling supported and valued. I am proud to be a part of Cadence Design Systems, where I feel that these values are strongly cultivated. SEMI: What impact has the 20 Under 30 Award had on your career? Grabowski: Receiving the 20 Under 30 Award was an incredible validation of the hard work I’ve put into my role. It gave me a confidence boost, affirming that I am on the right path and capable of making meaningful contributions to my company and the broader semiconductor industry. It also brought significant recognition, which opens up numerous opportunities.Following 20 Under 30 JourneysMariusz Grabowski’s journey in the semiconductor industry highlights the power of dedication, curiosity, and continuous learning. From his early experiences with FPGA platforms to his significant accomplishments in both academia and industry, Grabowski is a true example of how passion and hard work can drive meaningful contributions. As a young professional, his insights offer valuable inspiration for the next generation of engineers eager to make their mark in this ever-evolving field. With a bright future ahead, Grabowski is sure to continue influencing the world of technology, one innovative project at a time.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. SEMI ContactMaria Daniela Perez, Communications ManagerEmail: [email protected]

In a world where technological advancements move at lightning speed, the semiconductor industry is facing unprecedented challenges. The demand for smaller, faster, and more energy-efficient devices is growing, and traditional manufacturing processes are being pushed to their limits. Enter Spin-on Dielectrics (SOD), a breakthrough material technology that offers a cost-effective, scalable solution for micro-gap filling and high-performance dielectric films. As the industry evolves, SOD is expected to play a pivotal role in enabling the next generation of chips that power everything from AI to everyday electronics.To learn more, SEMI Europe and Merck KGaA, Darmstadt, Germany, held a joint webinar that focused on semiconductor device process evolution by SOD. The session featured insights from three technology experts in the company, including Dr. Surésh Rajaraman, Executive Vice President and Head of Thin Film Business Unit, along with Atsuko Yamamoto, R D Manager for Spin-On Dielectric, and Go Nakano, Global Marketing Manager for Dielectric Materials.SEMI: What is SOD, and how does it fit within the broader semiconductor manufacturing process?Rajaraman: SOD, Spin on Dielectrics, is a unique class of materials used to deposit thin layers of dielectric films, which act as insulators or other functional films, on semiconductor devices. The fabrication of a semiconductor chip involves thousands of intricate steps that incorporate conductors, semiconductors, and insulators. SOD is a versatile technology that supports device performance and miniaturization by enabling better gap fill and film uniformity, all while offering attractive cost of ownership.SEMI: Why is there so much focus on SOD materials, and how are they evolving to meet future industry demands?Rajaraman: As semiconductor devices become more complex—such as 3D NAND scaling to more than 300 layers and DRAM incorporating pillar capacitors—there’s a growing need for materials that can address challenges like interconnect delays, power consumption, and heat generation while maintaining optimal performance. Traditional dielectric materials are reaching their limits, making Spin-on Dielectrics (SOD) a critical solution. SOD offers advantages like bottom-up and seam-free gap filling, enabling ultra-thin insulating and other functional layers that enhance electrical and thermal efficiency and support next-generation device scaling.The industry is pushing the boundaries of scaling, with increasing aspect ratios and complex structures in Logic, 3D NAND and DRAM. Modern devices now require deposition in features which are not only incredibly narrow but also increasingly deep due to going into the third dimension. This creates new challenges, such as stress buildup and cracking in conventional SOD materials. To overcome this, we are developing enhanced formulations with improved mechanical stability and polymer backbone engineering. These innovations enhance gap-filling properties and resistance to process-induced stress, ensuring SOD remains a key enabler for advanced semiconductor manufacturing.SEMI: What are the current industry trends driving the adoption of SOD?Nakano: SOD is becoming a key technology because of its excellent gap-filling performance. Unlike gas-phase deposition methods like Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD), SOD is a liquid-phase process. This makes it more efficient for high-aspect-ratio structures. It also helps reduce costs while maintaining high-performance dielectric properties.With increasing demand for high-density memory and logic devices, SOD is crucial for applications like DRAM and NAND flash, which require precise dielectric layer formation. In DRAM, we’re witnessing a shift from planar to vertical transistors, and even to monolithic 3D DRAM. These changes require new materials for gate insulators and electrodes, alongside improvements in aspect ratio gap filling.For NAND memory, manufacturers are increasing the number of memory layers, leading to taller memory stacks and deeper trenches. As lateral scaling progresses, narrower and more complex structures demand high-aspect-ratio trench fills to maintain performance and reliability.Logic devices are also evolving, with transistor structures moving from FinFETs to nanosheets and forksheets. This transition enhances performance, but it also introduces challenges in wiring density and electrical properties. The narrower pitch of wiring requires advanced dielectric solutions, like SOD, to enable reliable, high-performance semiconductor architectures.SEMI: With all these recent innovations, what role does Merck KGaA, Darmstadt, Germany play in supporting these advancements, and what does the company offer its customers? Rajaraman: As the semiconductor industry pushes the boundaries of scaling, doing so requires materials that can support increasingly complex structures. We are the only materials company in the industry to possess the full spectrum of process technologies for gap-filling capabilities, including SOD, ALD, CVD, and Flowable CVD. Our strategic acquisition of Versum Materials has expanded our capabilities with organosilicon precursors. Combined with our SOD expertise, it allows us to reengineer material backbones with more material choices and tailored properties to optimize performance in high-aspect-ratio applications.To support this, we’ve expanded our global R D footprint. We now operate in various application labs, enabling close collaboration with customers for material customization and fine-tuning properties to address specific manufacturing challenges. Last year, we inaugurated a new R D center in Korea as part of our commitment to being near our customers and accelerating time-to-market for next-generation semiconductor solutions. As semiconductor roadmaps become more complex, customization and collaboration also become more critical. The key to innovation lies in working closely with our customers, understanding their challenges, refining materials, and optimizing processes together. By fostering this ongoing partnership, we can accelerate technological advancements and ensure that new solutions align seamlessly with evolving industry demands.SEMI: Can you share some technical insights on SOD?Yamamoto: SOD is a key material used in semiconductor manufacturing to create insulating layers with high precision. One of the essential components in SOD is PHPS (Perhydropolysilazane), a polymer composed of silicon, nitrogen, and hydrogen. This material is applied as a liquid solution and transforms into a high-quality silicon oxide film through a series of thermal processes.PHPS is essential because it enables precise gap filling in extremely small structures, helping to improve device reliability. The process involves spin-coating the polymer onto a wafer, followed by pre-baking to remove solvents. Then, it undergoes high temperature curing in an oxygen and steam atmosphere, forming a dense silicon oxide film. This method ensures uniform coverage and cost efficiency compared to traditional dry film deposition techniques.Our Spinfil® product line has evolved over the past two decades, starting with the Spinfil® 400 series and advancing through the Spinfil® 600 to the widely used Spinfil® 800 series. These improvements have enhanced gap-filling capabilities and film uniformity, making them ideal for high-aspect-ratio trench structures. The critical baking process involves spin coating and pre-baking before wafers undergo batch processing in a high-temperature furnace. Controlled temperature and moisture conditions transform Spinfil® into silicon oxide films, optimizing properties such as refractive index, shrinkage, and etching resistance and ensuring reliability in semiconductor applications.SEMI: What are the latest trends in new polymer development for SOD?Yamamoto: Our research focuses on three key areas: enhancing film quality, developing SOD for high-aspect-ratio trench filling, and advancing low-k SOD for semiconductor processes.To improve film quality, we introduced the Neofil®series, an evolution of the Spinfil® 800 series. This innovation reduces film shrinkage, lowers stress, and enhances wet etching rates, making it ideal for next-generation semiconductor nodes.Our latest Neofil® series for high-aspect-ratio trench filling is targeted for traditional dry processes like CVD and ALD, which can often lead to void formation and require multiple deposition-etch steps. Our latest SOD materials address this by improving polymer elasticity, ensuring uniform filling of deep trenches up to 16 microns without cracks, making them suitable for emerging 3D nanostaircase designs.In low-k SOD development, we’re focusing on siloxane-based polymers, which provide excellent trench-filling capabilities while maintaining strong mechanical and electrical properties. Compared to flowable CVD and ALD, SOD offers a more cost-effective and efficient alternative. With continued advancements, we anticipate SOD will become a key material for future semi-damascene processes, enhancing embedding performance and overall device reliability.SEMI ContactSitong He, Communications Manager Email: [email protected]

While many individuals in leadership positions are seen as role models, only a select few have the ability to create a lasting impact on both individuals and organizations. Role models play a pivotal role in the growth of individuals, teams, and entire companies. Whether intentionally or not, role models possess the power to shape the possibilities others envision for themselves, and exceptional role models harness this power to empower and inspire.The Role Models article series shines a light on remarkable individuals who serve as inspirational leaders for their achievements, leadership, and positive influence. In each installment, we delve into the life and accomplishments of these exceptional role models, exploring their journeys, values, and the impact they've made on their organizations, communities, and across industries. Join us in celebrating these outstanding individuals and discover the valuable lessons they offer for aspiring leaders and changemakers.Role Model - Stephan HaferlIn an industry driven by innovation and high-tech advancements, Stephan Haferl stands out as a transformative leader at the helm of Comet, a globally recognized Swiss technology leader specializing in x-ray and radio frequency solutions for the semiconductor industry. As CEO, Stephan Haferl has successfully guided the company through a period of transformation, focusing on innovation, operational excellence, and customer satisfaction. With extensive experience in business management and a Ph.D. in mechanical and process engineering from the Swiss Federal Institute of Technology (ETH), Haferl has led Comet’s transformation while also contributing to the broader industry as a member of the Board of Directors at Belimed AG and the SEMI Europe Advisory Board.In this interview, Haferl shares his personal journey and leadership philosophy, offering invaluable insights into the mindset of a successful business leader and the values that drive his work. His dedication to mentorship, diversity, and cross-functional learning serves as a beacon for future generations of leaders.SEMI: Please tell us about your background and professional experience.Haferl: My father passed away from cancer when I was a young child, and though I have only faint memories of him, he left behind a remarkable legacy. He had a great library filled with books on physics, math, and engineering, as well as stories and photographs showcasing his passion for tinkering and DIY projects. In many ways, this collection became a foundation for my intellectual development. Reading his books, going through his notes from university, and exploring his projects allowed me to feel spiritually connected with him. Fortunately, his passion for the technical world was something I inherited. I became a dedicated engineer and tinkerer, and that mindset has helped me embrace every challenge I encounter. While this is a large part of “what I am”, I believe that “who I am” is even more important. That was shaped largely by my maternal grandmother. She lost her husband, my grandfather, during the war when my mother was just a baby. Despite this hardship, she remained single throughout her life, focusing on raising my mother and running my late grandfather’s little shop in post-war rural Norway. She was tougher than nails, stoic, industrious, but above all, she was humble and kind. My grandmother has been, and will always be, my role model, in both my personal and professional life. “It is my conviction and advice to aspiring leaders: If you want to be successful in business, go on a cross-functional learning journey.”– Stephan HaferlSEMI: What was your journey to becoming the CEO of Comet?Haferl: Driven by curiosity and a desire to understand as many aspects of business as possible, my journey has been one of evolution. I started in engineering and moved through various areas, including operations, R D, product management, sales, and business development. Overtime, I transitioned from being an individual contributor to a team leader, and eventually to management roles with higher levels of responsibility. There were moments when I stepped away from activities that were comfortable and familiar, like R D, in order to have new experiences and learn something new, even when it went against advice or my own judgement. I intentionally chose to become a seasoned generalist with a few areas of specialty, rather than a functional specialist. Although it may sound a bit idealistic, I never had a specific plan to end up in my current role.That said, if I could offer advice to aspiring leaders, it would be this: To succeed in business, embark on a cross-functional learning journey. Nothing prepares you more for a leadership role than hands-on experience across as many areas of business as possible.Ribbon Cutting Ceremony of the new facility in San Jose.SEMI: What has been your greatest challenge as CEO?Haferl: My greatest challenge as CEO has been and will always be, creating a healthy balance between the things I’m passionate about: the responsibilities of my job, the people around me, my family, and ultimately, myself. While a crisis or challenge in business can be overcome with the support of your entire organization and external systems, managing your time, maintaining well-being, and ensuring you’re fully present is entirely your own responsibility. The larger the role, the more demanding this balance becomes.SEMI: What has been your greatest learning as CEO?Haferl: There isn’t one single greatest learning. Instead, being a CEO offers you the opportunity to experience many truisms firsthand, such as:As a CEO, you are often alone in the spotlight and must learn to be comfortable absorbing the pressure that comes with it, entirely on your own.Your title means little unless you strive to earn it every day. If you’re a good leader, you don’t need to create followers – they will emerge naturally.A team of excellent individual contributors can be outperformed by a cohesive group – a true team of average players who stick together and go the extra miles for one another. I’ve seen this dynamic play out many times during my younger years in team sports. SEMI: What makes a great leader?Haferl: With so much literature on leadership, one might believe that there is an easy answer to this question. However, the sheer volume of attention leadership receives highlights that there isn’t a single definitive answer. I believe a great leader creates clarity and drives closure while also inspiring and motivating the team to achieve their goals while being approachable and ethical. Leadership effectiveness often depends on the team being managed, as there are various archetypal leadership styles.I’ve always aimed to build teams made up of individuals who are loyal, ambitious, disciplined, smart, honest, and kind. Within such teams, I find that a highly participative leadership style is most effective. Chinese New Year Dinner in China.SEMI: Has mentorship played a significant role in your professional success?Haferl: Mentorship has played, and continues to play, a pivotal role in my career. I have gained invaluable insights from highly experienced people who took me under their wings and showed me the ropes. Even now, as a CEO and often feeling peerless within the company, having someone to confide in and seek advice from, or get a second opinion when I am uncertain is absolutely essential.Additionally, I find it deeply rewarding to mentor two or three individuals at any given time. It is a way me to give back while continuing to learn through the process. Staying connected with younger staff is equally important – they are a valuable source of fresh insights and candid feedback.SEMI: How are you setting an example for your generation and demonstrating what you'd like to see from your generation's leaders?Haferl: Let me reframe the question by sharing the characteristics I prioritize when hiring people. As mentioned earlier, I value loyalty, ambition, discipline, intelligence, honesty, and kindness. I strive to embody these qualities in my own leadership and seek out individuals who share the same values. By consistently upholding these principles and surrounding myself with like-minded people, I aim to set a positive example and influence those around me. Townhall in Japan.SEMI: How have you helped to empower the next generation of leaders and in particular women?Haferl: I’m actively involved as mentor to a select group of high-potential employees within the company, many of whom I’ve supported for years. Even those I’ve coached who have since moved on to outside the company remain in touch, and I continue to offer guidance when needed. Interestingly, the women I have mentored have made the greatest impact, both within and beyond the company, which has been incredibly rewarding to witness. SEMI: What advice do you have for the next generation of industry leaders?Haferl: It is wise to develop a strong foundation of functional expertise in one area before expanding your knowledge. However, as a leader, you cannot rely solely on being a subject matter expert. Leadership requires understanding people, grasping the big picture, and knowing when to focus on the finer details in certain areas. To make decisive decisions, create clarity, and drive closure, you need a broad understanding of the work you’re leading. Q A with the team in South Korea.SEMI: What are the best ways to attract students and especially women to consider careers in the semiconductor industry?Haferl: Inspire them with purpose, ignite their passion, and cultivate their curiosity. Provide safe and meaningful access to the industry through internships and opportunities to work on small projects. There are many ways to pave the road for the next generation, and the semiconductor industry has the resources to make it happen. There are no excuses!SEMI: What role should diversity, equity, inclusion, and belonging play in an organization's strategy?Haferl: This is incredibly important, and I always explain to my team using this analogy: If you want to win the Champions League in football, you can’t just hire the best goalies. You need a corresponding specialist for each role to build a winning team. If you fail to treat those specialists equitably, you will lose their passion and, ultimately, their unique strength. Finally, even if you hire the best players, you’ll lose against a cohesive team of mediocre players if you don’t foster a sense of inclusion and belonging – where everyone is united as “all for one, one for all.”Groundbreaking Ceremony of Comet’s new facility in Malaysia.Through his journey and leadership philosophy, Stephan Haferl demonstrates that being a great leader is not about titles or expertise alone, but about fostering clarity and purpose, building strong teams, and nurturing those around you. His emphasis on mentorship, the importance of a diverse and inclusive environment, and the value of broadening one's knowledge to encompass all aspects of business highlights his commitment to developing well-rounded leaders. For Haferl, leadership is a dynamic balance – between personal and professional commitments, passion and discipline, and individual contributions and team success. By continuously learning, mentoring, and staying connected to the next generation of talent, he sets an inspiring example for current and future leaders in the semiconductor industry and beyond.SEMI ContactCassandra Melvin, Senior Director of Business Development and OperationsEmail: [email protected]

In recent years, SEMI has been increasing its attention to sustainability within the global semiconductor industry. With the formation of the Semiconductor Climate Consortium (SCC) within the SEMI Sustainability Initiative, member companies have joined hands to collaborate and collectively tackle the challenge of meeting the industry’s ambitious sustainability goals.The SEMI Smart Manufacturing Initiative is a global effort focused on the future of manufacturing in electronics that helps microelectronics manufacturers enable business value by facilitating awareness and problem-solving to reduce barriers and realize timely ROI for critical Industry 4.0/5.0 technology deployment.Addressing the Industry’s Sustainability Inflection Point The Initiative’s Accelerating Sustainability with Smart Manufacturing Task Force formed in the summer of 2023 is a pivotal effort that collaborates with the SEMI Sustainability Initiative. The task force provides the “how” to the “what” of corporate sustainability goals, focusing on a bottom-up approach that leverages various sensing technologies, at the cleanroom, sub-fab and facilities levels for both greenfield and brownfield device-making facilities, to enable predictive analytics.The task force is designed to be a driving force to encourage the industry’s shift from a fragmented, top-down approach – which does not address the increasing usage of carbon as device-making becomes more complex – to a more integrated, bottom-up strategy. The task force has created a roadmap based on three pillars comprising connecting, sensing, and predicting technologies, which are meant to be cumulative and could dramatically reduce the carbon footprint for making microelectronics like semiconductors. The task force participants believe this to be the first industry roadmap to address all areas of fab processing, leveraging Industry 4.0/5.0, including AI for the purpose of enhancing the sustainability of operations.The task force’s roadmap is comprehensive and includes a variety of sensing technologies, digital twin methodologies, and machine learning/AI techniques for reducing Scope 1 (direct, process-based) and Scope 2 (indirect, energy-related) greenhouse gas (GHG) emissions, water usage and material waste. Once the roadmap is completed, factory management can prioritize the implementation of best practices based on the quantified impact factors of specified use cases. The roadmap outlines methodologies for brownfield and greenfield fabs separately based on practical capex and implementation recommendations.The task force has finalized its assessment of practical solutions for reducing Scope 1 and Scope 2 emissions, and it is now addressing water usage best practices before addressing material waste later this year and into 2025. SEMI will publish separate white papers regarding Scope 1 and 2 as a precursor to offering the roadmap as a customized tool for fabs.The semiconductor manufacturing industry stands at an inflection point from a sustainability perspective. Consider this: U.S. CHIPS Act funding is set to support 19 greenfield fabs, which collectively will consume the equivalent of 11 Empire State Buildings’ worth of steel. That’s a monumental environmental impact. Additionally, the Q2 2024 SEMI World Fab Forecast is tracking approximately 104 new fabs worldwide coming online between 2023 and 2027. Each of these fabs requires significant amounts of concrete, steel, and construction equipment, all with their own GHG footprints. This all represents a challenge that the industry must grapple with head-on.Furthermore, there is the energy-intensive nature of large semiconductor fabs, the cost implications of renewable power acquisition, and the substantial water usage by medium and mega-sized fabs. The main mission of the task force is to create an industry roadmap—a practical blueprint—for device makers to invest in sustainability, following a systematic, bottom-up approach.Accelerating Sustainability with Smart Manufacturing at SEMICON West At the Smart Manufacturing Pavilion at SEMICON WEST 2024 , a special session centered around the key components of the Accelerating Sustainability with Smart Manufacturing Task Force roadmap. Task force leaders helped coordinate a unique session to showcase the roadmap findings and detailed case studies for Scope 1 and 2 emissions. The session included speakers from Deloitte, Linkan Engineering, Micron, Solvay, Spectrum Environmental Services, and ULVAC.Accelerating Sustainability with Smart Manufacturing Session at SEMICON West 2024The opening keynote by Adeline Tay of Micron covered the company’s pioneering efforts to improve sustainability in semiconductor manufacturing. Tay highlighted how to enable a net-zero transition sooner via smart manufacturing technologies including digital twins, real-time power monitoring and optimization, lower global warming potential gas usage, and emission data visibility.The next presentation by Brian Coppa (Task Force Co-Chair) of ULVAC [1] revealed the findings of the SEMI task force roadmap, which described the most critical technologies to reduce Scope 1 and 2 emissions and quantified them with respect to impact level to help fab managers prioritize budget allocation for meeting related sustainability goals at the cleanroom, sub-fab and facilities levels. Coppa provided estimates on the substantial decreases in emissions that can be achieved (see Figure 1) using the compilation of recommended technologies (i.e. predictive analytics such as AI, machine learning and predictive maintenance) that are outlined in the task force roadmap. Figure 1: Task force roadmap estimates for the emissions reduction potential for Scope 1 and 2, respectively.Jake Townsend of Deloitte [2] followed and underlined the industry’s sustainability challenge with regards to chip-making carbon footprint and the opportunities from design to fab, to sub-fab and facilities. Townsend presented that the industry’s water management carbon footprint is estimated to be at least 2 orders of magnitude higher by weight compared to consumer products such as a car or hamburger.Next, Steve Hall of Spectrum Environmental Solutions [3] discussed how compliance testing and measurements differ from common GHG reporting, which is calculation based. The Electronics Code for Federal Regulations 40CFR 98 Subpart 1 now requires the electronics industry to report both calculated emission factors and smokestack measurements. Hall showed the benefits of Fourier-transform infrared spectroscopy (FTIR) monitoring at the smokestack level and the accuracy it can provide for reporting.Michael Peter Pitroff of Solvay [4] provided an in-depth case study on how the F2-based cleaning gas Solvaclean® can replace SF6 chemistries for chamber cleans, facilitated by in-situ gas monitoring techniques, to reduce Scope 1 emissions in plasma etch and deposition processes. Pitroff covered the financial and throughput impacts of the replacement and described how higher global warming potential (GWP) gases can be replaced with low GWP gases in Bosch wafer etch processes.Finally, Drew Horseman of Linkan Engineering [5] presented innovations in water treatment for the semiconductor industry. Horseman covered current state-of-the-art, energy-efficient reverse osmosis (RO) systems and addressed specific benefits of RO optimization. He showed how data acquisition and analytics are the first step to eventually reaching zero-liquid-discharge (ZLD), which is the future of sustainable water treatment.Get Involved!Overall, the Smart Sustainability session at the Smart Manufacturing Pavilion at SEMICON West 2024 enlightened many attendees on how smart manufacturing technologies like AI can help advance sustainability in semiconductor manufacturing using a more scalable, automated approach. Visit the SEMI Smart Manufacturing Initiative homepage to learn more about upcoming activities and contact [email protected] to get involved in the task force.Amit Srivastava is Manager, Data Science- Smart Manufacturing and Artificial Intelligence at Micron Technology, Brian Coppa is Product Engineering Lead at ULVAC, and they lead the SEMI Accelerating Sustainability with Smart Manufacturing Task Force. Mark da Silva is Senior Director of the Smart Manufacturing Initiative and APHI Technology Community at SEMI. Topics: Smart Manufacturing , SEMI Smart Manufacturing Initiative , semiconductor manufacturing , Digital Twin standards , manufacturing productivity , Digital Twin framework , manufacturing efficiency , semiconductor industry , semiconductor ecosystem, sustainability , SEMICON West , decarbonization , Semiconductor Climate Consortium , greenhouse gas emissionsReferences from the Smart Sustainability Session at Smart Manufacturing Pavilion available to SEMICON West 2024 attendees: SEMI Smart Sustainability Roadmap: Blueprint for Device MakersGreen Chips are the New Blue-Chip InvestmentMeeting Net Zero Manufacturing Challenges with Real-Time Monitoring of Exhaust Laterals in Sub-FabsSolvaClean as replacement of SF6 in cleaning and etchingInnovations in Water Treatment: Exhibiting the Importance of Data in Sustainable Process Development

Leveraging predictive modeling and other efficiency-enhancing innovations, Digital Twins promise to optimize semiconductor design, manufacturing processes and equipment maintenance while improving overall operational efficiency.