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ESDA

Brings Advocacy for the adoption of RISC-V processors and processor verification tool standards

Leverages broad experience in EDA business strategy, marketing and sales

SAN JOSE, Calif., March 05, 2026 (GLOBE NEWSWIRE) -- Breker Verification Systems today named Larry Lapides, former Synopsys Executive Director of RISC-V Tools Business Development, to its Advisory Board.

In making today’s announcement, David Kelf, Breker’s CEO, noted that Lapides has been a tireless advocate for the adoption of RISC-V processors and the urgent need for RISC-V processor verification tool standards. “Larry’s RISC-V knowledge and his ties to the RISC-V community are welcome additions to Breker and our advisory board.”

“Breker sits at the forefront in the development of commercial processor verification solutions and is a valued member of the RISC-V community,” remarks Lapides. “It will be a pleasure to work with Breker to move this important effort forward.”

Larry Lapides Biography
Lapides joined Synopsys through the acquisition of Imperas Software, where he was Vice President of Worldwide Sales and Marketing. He previously ran worldwide sales at EDA companies including Verisity Design and has more than 30 years in software tools and EDA, plus time spent in infrared systems engineering.

Lapides holds a Bachelor of Arts degree in Physics from UC Berkeley, a Master of Science degree in Applied Physics from Cornell University and an MBA from Clark University in Worcester, Mass.

About Breker Verification Systems
Breker Verification Systems solves complex semiconductor challenges across the functional verification process from streamlining UVM-based testbench composition to execution for IP block verification, significantly enhancing SoC integration and firmware verification with automated solutions that provide test content portability and reuse. Breker’s solutions include a SystemVIP library of scenarios for RISC-V and Arm, core and SoC testing, coherency, security and other critical areas. Breker solutions easily layer into existing environments and operate across simulation, emulation, prototyping, and post-silicon execution platforms. Its Trek family is production-proven at leading semiconductor companies worldwide and enables design managers and verification engineers to realize measurable productivity gains, speed coverage closure and easy verification knowledge reuse. As a leader in the development of the Accellera Portable Stimulus Standard (PSS), privately held Breker has a reputation for dramatically reducing verification schedules in advanced development environments. Case studies that feature Analog Devices, Broadcom, IBM and other companies leveraging Breker’s solutions are available on the Breker website.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/

TrekSoC, TrekSoC-Si, TrekBox and SoC Scenario Modeling are registered trademark of Breker Verification Systems. Breker Verification Systems acknowledges trademarks or registered trademarks of other organizations for their respective products.

MILPITAS, Calif. — January 12, 2026 — Electronic System Design (ESD) industry revenue increased 8.8% to $5,566.4 million in the third quarter of 2025 from the $5,114.5 million registered in the third quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average rose 10.4%, based on a comparison of the most recent four quarters to the prior four.

“The electronic design automation (EDA) industry continues to report strong year-over-year revenue growth in Q3 2025,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “All product categories reported increases, with Semiconductor IP (SIP) and Services showing double digit gains. Geographic regions including Americas, EMEA, and APAC reported growth in Q3, with a double digit increase in APAC.”

The companies tracked in the EDMD report employed 73,185 people globally in Q3 2025, a 17.3% increase over the Q3 2024 headcount of 62,417 and up 0.9% compared to Q2 2025.

The quarterly EDMD report contains detailed revenue information within the following category and geographic breakdowns. 

Revenue by Product and Application Category – Year-Over-Year Change

  • Computer-Aided Engineering (CAE) revenue increased 9.1% to $2,097.8 million. The four-quarter CAE moving average increased 11.6%.
  • IC Physical Design and Verification revenue increased 1.3% to $865.4 million. The four-quarter moving average for the category decreased 1.2%.
  • Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue rose 3.4% to $466.2 million. The four-quarter moving average for PCB and MCM rose 8.1%.
  • Semiconductor Intellectual Property (SIP) revenue increased 13.6% to $1,915.7 million. The four-quarter SIP moving average rose 14.8%.
  • Services revenue increased 10.2% to $221.4 million. The four-quarter Services moving average rose 13.7%.

Revenue by Region – Year-Over-Year Change

  • The Americas, the largest reporting region by revenue, procured $2,402.2 million of electronic system design products and services in Q3 2025, a 3.4% increase. The four-quarter moving average for the Americas rose 10.3%.
  • Europe, Middle East, and Africa (EMEA) procured $675.1 million of electronic system design products and services in Q3 2025, a 4.6% increase. The four-quarter moving average for EMEA grew 7.6%.
  • Japan’s procurement of electronic system design products and services decreased 11.5% to $264.0 million in Q3 2025. The four-quarter moving average for Japan increased 2.4%.
  • Asia Pacific (APAC) procured $2,223.0 million of electronic system design products and services in Q3 2025, a 20.5% increase. The four-quarter moving average for APAC grew 12.8%. 

About the EDMD Report

The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) report presents Electronic Design Automation (EDA), SIP and Services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows: 

  • Revenue by product category (CAE, IC Physical Design and Verification, SIP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
  • Revenue by geographic region (Americas, EMEA, Japan and APAC)
  • Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

Follow the ESD Alliance

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

MILPITAS, Calif. — October 6, 2025 — Electronic System Design (ESD) industry revenue increased 8.6% to $5,089.4 million in the second quarter of 2025 from the $4,685.5 million registered in the second quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average rose 10.4%, based on a comparison of the most recent four quarters to the prior four.

SEMI ESDA“The electronic design automation (EDA) industry continues to report strong year-over-year revenue growth in Q2 2025,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “Product categories including Computer-Aided Engineering (CAE), Printed Circuit Board and Multi-Chip Module, Semiconductor IP, and Services reported increases, with CAE and Services showing double digit gains. Geographic regions including Americas, EMEA, and APAC reported growth in Q2, even hitting double digits in Americas and EMEA.”

The companies tracked in the EDMD report employed 72,529 people globally in Q2 2025, a 14.8% increase over the Q2 2024 headcount of 63,188 and up 12.6% compared to Q1 2025. 

The quarterly EDMD report contains detailed revenue information within the following category and geographic breakdowns. 

Revenue by Product and Application Category – Year-Over-Year Change

  • Computer-Aided Engineering (CAE) revenue increased 17.2% to $1,929 million. The four-quarter CAE moving average increased 13.5%.
  • IC Physical Design and Verification revenue decreased 9.9% to $701.9 million. The four-quarter moving average for the category decreased 3.1%.
  • Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue rose 7.8% to $430.5 million. The four-quarter moving average for PCB and MCM rose 8.8%.
  • Semiconductor Intellectual Property (SIP) revenue increased 8.7% to $1,826.7 million. The four-quarter SIP moving average rose 13.2%.
  • Services revenue increased 11.9% to $201.2 million. The four-quarter Services moving average rose 21.3%.

Revenue by Region – Year-Over-Year Change

  • The Americas, the largest reporting region by revenue, procured $2,282.4 million of electronic system design products and services in Q2 2025, a 12.2% increase. The four-quarter moving average for the Americas rose 14.1%.
  • Europe, Middle East, and Africa(EMEA) procured $650.9 million of electronic system design products and services in Q2 2025, an 11.4% increase. The four-quarter moving average for EMEA grew 10.7%.
  • Japan’s procurement of electronic system design products and services decreased 9.2% to $277.4 million. The four-quarter moving average for Japan increased 4.4%.
  • Asia Pacific (APAC) procured $1,878.7 million of electronic system design products and services in Q2 2025, a 6.7% increase. The four-quarter moving average for APAC grew 7.2%. 

About the EDMD Report

The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) report presents Electronic Design Automation (EDA), SIP and Services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows: 

  • Revenue by product category (CAE, IC Physical Design and Verification, SIP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
  • Revenue by geographic region (Americas, EMEA, Japan and APAC)
  • Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

Follow the ESD Alliance

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

 

MILPITAS, Calif. –– August 25, 2025 –– Lip-Bu Tan, Chief Executive Officer of Intel Corporation and former CEO of Cadence Design Systems, will be honored with the 2025 Phil Kaufman Award for distinguished contributions to Electronic System Design (ESD). 

 

The annual award from the Electronic System Design Alliance (ESD Alliance), a SEMI technology community, and the Council on Electronic Design Automation (CEDA) of the Institute of Electrical and Electronics Engineers (IEEE) will be presented at the Phil Kaufman Award presentation and banquet, November 6 in San Jose, Calif. The organizations are honoring Tan for his leadership and impact on the ESD industry. 

“Lip-Bu Tan has played a pivotal role in shaping the trajectory of the semiconductor industry through his visionary leadership and strategic initiatives,” said Alberto Sangiovanni-Vincentelli, the Edgar L. and Harold H. Buttner Chair of Electrical Engineering and Computer Sciences at the University of California at Berkeley and previous Phil Kaufman Award honoree. “His ability to anticipate critical technology trends well ahead of the curve, combined with his deep understanding of the innovation ecosystem, allows him to bridge early-stage innovation with industry-scale impact. Lip-Bu's visionary leadership continues to accelerate the growth of startups, drive collaboration across the value chain, and define the future of semiconductor design and manufacturing.” 

“I have the deepest respect for Lip-Bu Tan, both for his dedicated industry leadership and for our shared belief in the central role semiconductors play in technology innovation and the impact it can have on humanity,” said Ajit Manocha, SEMI President and CEO. “Lip-Bu truly puts his heart and soul into his work to advance the semiconductor industry, and SEMI congratulates him on being named the Phil Kaufman Award recipient for his efforts throughout his career. He oversaw vital EDA advancements at Cadence that underpinned industry growth and has been an ongoing supporter of SEMI and the ESD Alliance as platforms for industry collaborations to foster innovation.”

Walden Rhines, Chairman former CEO of Mentor Graphics (now Siemens EDA), previous Phil Kaufman Award recipient, and member of the board of numerous electronic design automation (EDA) companies, added, “Lip-Bu has served as a true ambassador for the broader semiconductor and EDA industries. Through his active participation in industry forums and his leadership in educational and philanthropic initiatives, he has advanced the visibility and impact of EDA across the tech ecosystem. His support for startups and emerging technologies has helped catalyze innovation across the semiconductor value chain and reinforced the critical role of design automation in driving the industry forward.” 

“As a former ESD Alliance board member, Lip-Bu actively encouraged and supported educational and business activities aimed at advancing the entire EDA ecosystem,” said Bob Smith, Executive Director of the ESD Alliance. “On behalf of the ESD Alliance, I congratulate Lip-Bu on being honored with the well-deserved 2025 Phil Kaufman award.”

L. Miguel Silveira, Full Professor in the Department of Electrical and Computer Engineering at Instituto Superior Técnico (IST), Universidade de Lisboa and President of the IEEE Council on EDA added, “Lip-Bu Tan’s dedication to technical leadership, mentorship, and business acumen has made him a key contributor to the advancement of the EDA and semiconductor industries. The IEEE Council on EDA congratulates Lip-Bu on being selected for the 2025 Phil Kaufman Award.”

About Lip-Bu Tan

Lip-Bu Tan is chief executive officer of Intel Corporation and serves on the company’s board of directors. He was appointed to his position in March 2025 and is driving a transformation of Intel to develop a new generation of industry-leading products, deliver new AI systems, and build a trusted, U.S.-based, leading-edge foundry.

Tan is an accomplished executive with more than two decades of semiconductor and software experience and deep relationships across the technology ecosystem. He has received several accolades for his significant contributions to the industry, including the 2022 Robert N. Noyce Award, the Semiconductor Industry Association’s highest honor, and was named one of Forbes’ Top 50 Venture Capitalists.

Tan previously served as chief executive officer of Cadence Design Systems Inc. and was also a member of its board of directors. During his 12 years as Cadence’s chief executive officer, he led a reinvention of the company and drove a cultural transformation centered on customer-centric innovation that enabled Cadence to more than double its revenue, expand operating margins and significantly outperform the market.

Tan is a founding managing partner of Walden Catalyst Ventures and chairman of Walden International, a leading venture capital firm. He has also served on the boards of public companies Credo Technology Group and Schneider Electric.

Tan holds a Bachelor of Science in physics from Nanyang Technological University in Singapore, a Master of Science in nuclear engineering from the Massachusetts Institute of Technology and an MBA from the University of San Francisco. He was awarded an Honorary Doctorate in Science and Technology from Carnegie Mellon University in 2025.

About the Phil Kaufman Award

The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. The 2024 recipient was Dr. Jason Cong, Distinguished Professor and Volgenau Chair for Engineering Excellence at the University of California, Los Angeles (UCLA). 

About the IEEE Council on Electronic Design Automation (CEDA)

The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: the Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer-Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWEEK). The Council also publishes IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). The Council boasts a prestigious awards program in order to promote the recognition of leading EDA professionals, which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters. 

Stay in Touch with IEEE CEDA

About the Electronic System Design Alliance

The ESD Alliance, a SEMI Technology Community, offers initiatives and activities that bring value to our entire industry including:

  • Coordinating and amplifying the collective and regional voices of the industry.
  • Continually promoting the value the industry delivers to the global semiconductor and electronics industry.
  • Addressing and defending threats and reducing risks to the industry.
  • Achieving efficiencies for the industry.
  • Marketing the attractiveness of the design ecosystem as an ideal industry for pursuing a career.
  • Enabling networking, sharing and collaboration across the industry.

Contact Paul Cohen at [email protected] or Bob Smith at [email protected] for more details.

Follow the ESD Alliance

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

All trademarks and registered trademarks are the property of their respective owners.

Association Contacts

Nanette Collins/ESDA                                                                                                 
Phone: 1.617.437.1822                                  
Email: [email protected]        

Sherrie Gutierrez / SEMI
Phone: 1.831.889.3800
Email: [email protected]

Laura Paul/IEEE-CEDA
Phone: 1.352.872.5544 Ext. 805
Email: [email protected]

Stephanie Quinn/Kiterocket (Media Inquiries)
Phone: 1.480.316.8370
Email: [email protected]  

MILPITAS, Calif. — July 15, 2025 — Electronic System Design (ESD) industry revenue increased 12.8% to $5,098.3 million in the first quarter of 2025 from the $4,521.6 million registered in the first quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average rose 12.6%, based on a comparison of the most recent four quarters to the prior four.

SEMI & ESDA“The electronic design automation (EDA) industry once again reported strong year-over-year revenue growth in Q1 2025,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “Product Categories CAE, IC Physical Design and Verification, and PCB & MCM reported single digit increases, with Semiconductor IP and Services reporting significant double-digit increases. All geographic regions reported growth in Q1, with Americas, EMEA, and Japan reporting double digit growth.”

The companies tracked in the EDMD report employed 64,403 people globally in Q1 2025, a 4.5% increase over the Q1 2024 headcount of 61,653 and up 2.5% compared to Q4 2024.

The quarterly EDMD report contains detailed revenue information within the following category and geographic breakdowns. 

Revenue by Product and Application Category – Year-Over-Year Change

  • Computer-Aided Engineering (CAE) revenue increased 7.8% to $1,747.6 million. The four-quarter CAE moving average increased 11.4%.
  • IC Physical Design and Verification revenue decreased 9.9% to $693.5 million. The four-quarter moving average for the category increased 2.3%.
  • Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue rose 5.5% to $399.8 million. The four-quarter moving average for PCB and MCM rose 8.9%.
  • Semiconductor Intellectual Property (SIP) revenue increased 29.6% to $2,044.8 million. The four-quarter SIP moving average rose 18.7%.
  • Services revenue jumped 22.3% to $212.6 million. The four-quarter Services moving average rose 26.0%.

Revenue by Region – Year-Over-Year Change

  • The Americas, the largest reporting region by revenue, procured $2,208.3 million of electronic system design products and services in Q1 2025, a 14.0% increase. The four-quarter moving average for the Americas rose 17.0%.
  • Europe, Middle East, and Africa(EMEA) procured $651.5 million of electronic system design products and services in Q1 2025, a 12.5% increase. The four-quarter moving average for EMEA grew 11.4%.
  • Japan’s procurement of electronic system design products and services grew 11.9% to $314.2 million. The four-quarter moving average for Japan increased 12.1%.
  • Asia Pacific (APAC) procured $1,924.2 million of electronic system design products and services in Q1 2025, an 11.6% increase. The four-quarter moving average for APAC grew 8.2%. 

About the EDMD Report

The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) report presents Electronic Design Automation (EDA), SIP and Services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows: 

  • Revenue by product category (CAE, IC Physical Design and Verification, SIP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
  • Revenue by geographic region (Americas, EMEA, Japan and APAC)
  • Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Association Contacts                                                                                    

Paul Cohen
Phone: 978-769-2106 
Email: [email protected]

Jack Taylor
Phone: 512-560-7143 
Email: [email protected]

MILPITAS, Calif. — April 14, 2025 — Electronic System Design (ESD) industry revenue increased 11% to $4,927.3 million in the fourth quarter of 2024 from the $4440.9 million reported in the fourth quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 12.8%.   

SEMI & ESDA“The electronic design automation (EDA) industry reported substantial revenue growth in Q4 2024,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “All product categories increased significantly, with all categories except Semiconductor Intellectual Property posting double-digit growth. Regionally, the Americas, along with Japan and Asia Pacific, reported double digit growth. The four-quarter moving average increased for all product categories and regions.”

The companies tracked in the EDMD report employed 61,827 people globally in Q4 2024, a 2.9% increase over the Q4 2023 headcount of 60,106, but down 0.9% compared to Q3 2024. 

The quarterly EDMD report contains detailed revenue information within the following category and geographic breakdowns. 

Revenue by Product and Application Category – Q4 2024 Year-Over-Year Change

  • Computer-Aided Engineering (CAE) revenue rose 10.9% to $1,696.9 million in Q4 2024. The four-quarter CAE moving average increased 12.3%.
  • Integrated Circuit (IC) Physical Design and Verification revenue increased 15.4% to $797.9 million. The four-quarter moving average for the category increased 8.1%.
  • Printed Circuit Board (PCB) and Multi-Chip Module (MCM) revenue jumped 15.9% to $476.2 million. The four-quarter moving average for PCB and MCM rose 8.3%.
  • Semiconductor Intellectual Property (SIP) revenue increased 7.9% to $1,760.7 million. The four-quarter SIP moving average rose 15.7%.
  • Services revenue rose 11% to $195.6 million. The four-quarter Services moving average rose 26.2%.

Revenue by Region – Q4 2024 Year-Over-Year Change

  • The Americas, the largest reporting region by revenue, procured $2,171.8 million of electronic system design products and services in Q4 2024, a 12.9% increase. The four-quarter moving average for the Americas rose 17.1%.
  • Europe, Middle East, and Africa (EMEA) procured $622.3 million of electronic system design products and services, a 2.3% increase. The four-quarter moving average for EMEA grew 10.6%.
  • Japan’s procurement of electronic system design products and services increased 21.7% to $318.4 million. The four-quarter moving average for Japan increased 10.8%.
  • Asia Pacific (APAC) procured $1,814.8 million of electronic system design products and services, a 10.2% increase. The four-quarter moving average for APAC grew 9.3%. 

About the EDMD Report

The ESD Alliance Electronic Design Market Data report presents Electronic Design Automation (EDA), SIP and Services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows: 

  • Revenue by product category (CAE, IC Physical Design and Verification, SIP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
  • Revenue by geographic region (Americas, EMEA, Japan and APAC)
  • Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance

The ESD Alliance, a SEMI Technology Community, offers initiatives and activities that bring value to our entire industry including:

  • Coordinating and amplifying the collective and regional voices of the industry.
  • Continually promoting the value the industry delivers to the global semiconductor and electronics industry.
  • Addressing and defending threats and reducing risks to the industry.
  • Achieving efficiencies for the industry.
  • Marketing the attractiveness of the design ecosystem as an ideal industry for pursuing a career.
  • Enabling networking, sharing and collaboration across the industry.

Contact Paul Cohen at [email protected] or Bob Smith at [email protected] for more details.

Engage with the ESD Alliance

www.esd-alliance.org
X: @ESDAlliance
LinkedIn
Facebook

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Association Contacts                                                                                  

Paul Cohen
Phone: 508-769-2106 
Email: [email protected]

Jack Taylor
Phone: 512-560-7143 
Email: [email protected]

MILPITAS, Calif. — January 14, 2025 — Electronic System Design (ESD) industry revenue increased 8.8% to $5,114.5 million in the third quarter of 2024 from the $4,702.4 million registered in the third quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 13.7%.   

SEMI & ESDA“The electronic design automation (EDA) industry reported significant revenue growth in Q3 2024,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “Product categories Computer-Aided Engineering and Services posted double-digit growth, with Printed Circuit Board and Multi-Chip Module, and Semiconductor Intellectual Property also posting growth. Regionally, the Americas along with Europe, Middle East, and Africa reported double digit growth. The four-quarter moving average increased for all product categories and regions.”

The companies tracked in the EDMD report employed 62,417 people globally in Q3 2024, a 4.5% increase over the Q3 2023 headcount of 59,737, but down 1.2% compared to Q2 2024. 

The quarterly EDMD report contains detailed revenue information within the following category and geographic breakdowns. 

Revenue by Product and Application Category – Q3 2024 Year-Over-Year Change

  • Computer-Aided Engineering (CAE) revenue jumped 16% to $1,922.2 million in Q3 2024. The four-quarter CAE moving average increased 14.5%. 
  • Integrated Circuit (IC) Physical Design and Verification revenue decreased 5.5% to $854.4 million. The four-quarter moving average for the category increased 4.3%. 
  • Printed Circuit Board (PCB) and Multi-Chip Module (MCM) revenue rose 5.8% to $450.8 million. The four-quarter moving average for PCB and MCM rose 9.1%.
  • Semiconductor Intellectual Property (SIP) revenue increased 7% to $1,686.2 million. The four-quarter SIP moving average rose 17.5%.
  • Services revenue rose 45.2% to $200.8 million. The four-quarter Services moving average rose 30.8%.

Revenue by Region – Q3 2024 Year-Over-Year Change

  • The Americas, the largest reporting region by revenue, procured $2,325.4 million of electronic system design products and services in Q3 2024, a 17.2% increase. The four-quarter moving average for the Americas rose 17%. 
  • Europe, Middle East, and Africa (EMEA) procured $645.6 million of electronic system design products and services, a 17.1% increase. The four-quarter moving average for EMEA grew 15.4%. 
  • Japan’s procurement of electronic system design products and services decreased 3.5% to $298.5 million. The four-quarter moving average for Japan increased 7.6%. 
  • Asia Pacific (APAC) procured $1,845 million of electronic system design products and services, an 0.7% decrease. The four-quarter moving average for APAC grew 10.6%.  

About the EDMD Report

The ESD Alliance Electronic Design Market Data report presents Electronic Design Automation (EDA), SIP and Services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows: 

  • Revenue by product category (CAE, IC Physical Design and Verification, SIP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
  • Revenue by geographic region (Americas, EMEA, Japan and APAC)
  • Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance

The ESD Alliance, a SEMI Technology Community, offers initiatives and activities that bring value to our entire industry including:

  • Coordinating and amplifying the collective and regional voices of the industry.
  • Continually promoting the value the industry delivers to the global semiconductor and electronics industry.
  • Addressing and defending threats and reducing risks to the industry.
  • Achieving efficiencies for the industry.
  • Marketing the attractiveness of the design ecosystem as an ideal industry for pursuing a career.
  • Enabling networking, sharing and collaboration across the industry.

Contact Paul Cohen at [email protected] or Bob Smith at [email protected] for more details.

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About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Association Contacts                                                                    

Paul Cohen
Phone: 508-769-2106 
Email: [email protected]

Jack Taylor
Phone: 512-560-7143 
Email: [email protected]

MILPITAS, Calif. October 7, 2024 — Electronic System Design (ESD) industry revenue increased 18.2% to $4,685.5 million in the second quarter of 2024 from the $3,962.7 million registered in the second quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 18%. 

SEMI & ESDA “The electronic design automation (EDA) industry reported substantial revenue growth in Q2 2024,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “All product categories reported increases, with IC Physical and Semiconductor IP and Services posting double-digit growth. Further, all geographic regions reported double-digit growth.”

The companies tracked in the EDMD report employed 63,188 people globally in Q2 2024, a 6.8% jump over the Q2 2023 headcount of 59,160 and up 2.5% compared to Q1 2024.

The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.

Revenue by Product and Application Category – Q2 2024 Year-Over-Year Change 

  • Computer-Aided Engineering (CAE) revenue increased 8.9% to $1,646.4 million in Q2 2024. The four-quarter CAE moving average increased 16%.
  • IC Physical Design and Verification revenue grew 13.1% to $779.3 million. The four-quarter moving average for the category increased 17.1%.
  • Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue rose 8.2% to $399.2 million. The four-quarter moving average for PCB and MCM rose 13.6%.
  • Semiconductor Intellectual Property (SIP) revenue jumped 33.9% to $1,680.7 million. The four-quarter SIP moving average rose 21.7%.
  • Services revenue rose 30.8% to $179.8 million. The four-quarter Services moving average rose 18.4%.

Revenue by Region – Q2 2024 Year-Over-Year Change

  • The Americas, the largest reporting region by revenue, procured $2,034.9 million of electronic system design products and services in Q2 2024, a 25% increase. The four-quarter moving average for the Americas rose 18.3%.
  • Europe, Middle East, and Africa (EMEA) procured $584.6 million of electronic system design products and services, a 14.8% increase. The four-quarter moving average for EMEA grew 16.3%.
  • Japan’s procurement of electronic system design products and services grew 26.4% to $305.4 million. The four-quarter moving average for Japan increased 16.5%.
  • Asia Pacific (APAC) procured $1760.6 million of electronic system design products and services, an 11.2% increase. The four-quarter moving average for APAC grew 18.5%.

About the EDMD Report

The ESD Alliance Electronic Design Market Data report presents Electronic Design Automation (EDA), SIP and Services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows:

  • Revenue by product category (CAE, IC Physical Design and Verification, SIP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
  • Revenue by geographic region (Americas, EMEA, Japan and APAC)
  • Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI 

SEMI ® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners. 

Association Contacts

Paul Cohen
Phone: 978-769-2106 
Email: [email protected] 

Jack Taylor
Phone: 512-560-7143 
Email: [email protected]

Dr. Jason Cong to be Honored With 2024 Phil Kaufman Award

 

Recognized for Significant Contributions to FPGA Design Automation Technology and Electronic System Design Education and Industry

 

MILPITAS, Calif. –– September 5, 2024 ––Dr. Jason Cong, Distinguished Professor and Volgenau Chair for Engineering Excellence at the University of California, Los Angeles (UCLA), will be honored with the 2024 Phil Kaufman Award for distinguished contributions to Electronic System Design (ESD). 

 

The annual award from the Electronic System Design Alliance (ESD Alliance), a SEMI technology community, and the Council on Electronic Design Automation (CEDA) of the Institute of Electrical and Electronics Engineers (IEEE) will be presented at the Phil Kaufman Award presentation and banquet, November 6 in San Jose, Calif. The organizations are honoring Dr. Cong for his sustained fundamental contributions to Field-Programmable Gate Array (FPGA) design automation technology, from circuit to system levels, with widespread industrial impact. 

 

“Dr. Jason Cong is highly regarded in the industry for his work in FPGA synthesis and interconnect optimization and is recognized as a top researcher in the field,” said Dr. Anirudh Devgan, President and CEO of Cadence Design Systems and the 2021 Phil Kaufman Award honoree. “Along with his passion for teaching and mentoring the next generation of innovators, Jason has had a significant impact on the FPGA and EDA industries.”

 

“Jason Cong has made sustained, seminal contributions to design automation for FPGA designs, from chips to systems, across logic, layout, compilation, and applications, over a remarkable 30-plus-year span,” said Rob Rutenbar, Senior Vice Chancellor for Research, Distinguished Professor of CS and ECE at the University of Pittsburgh, and the 2017 Phil Kaufman Award recipient. “He is an inspiring and well-accomplished educator, mentor, and role model for generations of students who became successful faculty members, co-founders of startups, and key contributors to major EDA and semiconductor companies.”

 

“Dr. Cong has been a key innovator and EDA educator with outstanding technical contributions in design automation for FPGA designs, including logic, layout, compilation, and applications,” said Georges Gielen, Professor at KU Leuven and past Chair of the IEEE Council on EDA Awards Committee. “He has founded numerous successful startups, and with over 30 years on the faculty of UCLA, he and his numerous Ph.D. students continue to enhance the semiconductor industry.”

 

“The EDA industry would not be where it is today without Dr. Cong’s fundamental contributions to design automation for FPGA design and his strong role as an educator and mentor,” said Bob Smith, Executive Director of the ESD Alliance. “On behalf of SEMI and the ESD Alliance, I congratulate Dr. Cong on being honored with the 2024 Phil Kaufman award.”
 

About Dr. Jason Cong

Dr. Jason Cong is the Volgenau Chair for Engineering Excellence Professor at the UCLA Computer Science Department, and a former department chair, with joint appointment from the Electrical and Computer Engineering Department. He is the director of the Center for Domain-Specific Computing (CDSC) and the director of VLSI Architecture, Synthesis, and Technology (VAST) Laboratory. Dr. Cong’s research interests include novel architectures and compilation for customizable computing, synthesis of VLSI circuits and systems, and quantum computing.

 

He has over 500 publications in these areas, including 18 best paper awards, and four papers in the FPGA and Reconfigurable Computing Hall of Fame. He and his former students co-founded AutoESL, which developed the most widely used high-level synthesis tool for FPGAs. The tool was renamed to Vivado HLS and Vitis HLS after Xilinx’s acquisition. Dr. Cong is member of the National Academy of Engineering and the American Academy of Arts and Sciences, and a Fellow of ACM, IEEE, and the National Academy of Inventors. He is recipient of the Semiconductor Industry Association (SIA) University Research Award, the EDAA Achievement Award, and the ISPD Lifetime Achievement Award, and he received the IEEE Robert N. Noyce Medal for “fundamental contributions to electronic design automation and FPGA design methods.”

 

He received his Bachelor of Science degree in Computer Science from Peking University in Beijing, China, in 1985, and his Master of Science and Ph.D. degrees in Computer Science from the University of Illinois at Urbana-Champaign in 1987 and 1990, respectively. 

 

About the Phil Kaufman Award

The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. The 2023 recipient was Dr. Lawrence T. Pileggi, Coraluppi Head and Tanoto Professor of Electrical and Computer Engineering at Carnegie Mellon University. 

 

About the IEEE Council on Electronic Design Automation (CEDA)

The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: the Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer-Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWEEK). The Council also publishes IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). The Council boasts a prestigious awards program in order to promote the recognition of leading EDA professionals, which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters. 

 

Stay in Touch With IEEE CEDA

 

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

Follow the ESD Alliance

 

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

 

All trademarks and registered trademarks are the property of their respective owners.

 

Association Contacts

Nanette Collins/ESDA                                                                                                

Phone: 1.617.437.1822                                  

Email: [email protected]       

 

Samer Bahou/SEMI

Phone: 1.408.943.7870

Email: [email protected] 

 

Laura Paul/IEEE-CEDA

Phone: 1.352.872.5544 Ext. 805

Email: [email protected]