silicon wafer

The global economy has started down a gradual path to recovery from COVID-19 in recent months as the world continues to combat the virus. Yet one sector – semiconductors – has shown impressive growth powered by a transformation hastened by the pandemic across industries ranging from education and work-from-home to healthcare.Semiconductor sales increased 12% in September to mark a second consecutive month of double-digit growth, and year-to-date semiconductor receipts as of September jumped 5.5% compared to the same period in 2019, according to SIA/WSTS.While this upward trajectory is encouraging, it pales compared to 2020 semiconductor equipment billings growth, with results from SEMI showing worldwide global chip equipment billings in September soaring to a new high of $7.6 billion this year. During the first nine months of 2020, aggregate equipment billings logged a 23.6% rise compared to the same stretch in 2019, surpassing $51 billion. Better still, the total semiconductor equipment market in 2020 is on track to beat the previous high of $64.5 billion set in 2018.Investments in China, Taiwan and Korea are fueling the chipmaking equipment spending surge. With big domestic and international fab projects in the works, China this year is projected to become the world’s largest capital equipment market for the first time, surpassing Taiwan, which will follow at a close second. Korea will rank third in equipment investments. Taiwan and Korea growth will come on the strength of equipment spending for manufacturing leading-edge semiconductors.Equipment billings in North America and Europe declined year-over-year as the automotive and industrial sectors suffered the heaviest blows from COVID-19. Investment momentum in both regions is expected to pick up in 2021 after automotive production recovers to pre-pandemic levels while factory automation will boost industrial demand.For more information about monthly equipment billing trends by region and equipment segment, please see the SEMI Equipment Market Data Subscription.Clark Tseng is director of Industry Research and Statistics at SEMI.

SEMI spoke with Thomas Fries, founder and CEO of FRT GmbH, about how hybrid metrology is shaping multi-sensor metrology tools to enhance measurement precision as the industry moves away from a single-sensor approach.Fries offered his views ahead of the SEMI MEMS Imaging Sensors Summit, 25 to 27 September 2019 in Grenoble, France. Join us at the event to meet experts from FRT Metrology and many other MEMS, imaging and sensors companies. Registration is open. SEMI: Metrology in front-end used to be straightforward. But then, as the number of tasks to be implemented increased, we moved to a multi-sensors approach. What drove this transition?Fries: I believe it´s more about software than about sensors. But of course the basis is the hardware. So, most metrology tools were designed around a specific sensor, e.g. a white light interferometer.A rigid frame, wafer fixtures, scanning tables etc. were then added to develop a complete system. In manufacturing more machinery was added, like handling systems, cleanroom equipment and more sensors, mainly for additive functions such as reading IDs or measuring temperature. The center was still the one and only sensor, being pimped more and more by some hardware features and a lot of software.SEMI: How are sensors and software shaping the way metrology is applied today?Fries: Today a huge number of optical sensors are available to provide various measurement options. But sometimes there are only very slight differences from one sensor to the other. A tiny variation may determine whether we solve a problem or end up fishing in troubled waters.And of course using different machines with those sensors requires high budgets for capital investment, used floor space, measuring time, etc. A multi-sensor platform solves all these problems. But again, it is the software that makes the real difference.SEMI: What lead to those advancements in metrology? What problems did they set out to solve?Fries: Metrology has been evolving ever since the measurement standards were established. The first challenge was to create a flexible mechanical platform that was also reliable and stable. All components were designed to be integrated into one system, mechanically, electrically and of course in the software.This level of integration requires not only an appropriate user interface, but also data formats and evaluation algorithms that leverage multi-sensor hardware. Today every metrology tool in the fab is justified by the application, not by specific sensors or specs. Of course the application leads to a set of specs, but the solution for the metrology task is realized within the software.New developments in metrology combine expertise in system design, physical knowledge in metrology and materials, mechanical engineering and also mathematical and software skills.The last step was the implementation of hybrid metrology functionality into a multi-sensor system that opens totally new doors in metrology. Before multi-sensors development, quite a few hitches could not be properly solved. SEMI: This is especially true when we consider applications in advanced packaging and MEMS manufacturing. What is in your opinion the main challenge?Fries: Specifically, in MEMS and advanced packaging we face multiple metrology challenges, as various processes run in one step and conditions on the wafer may vary quite often. In this case, a high degree of flexibility, up to the option to upgrade the metrology tool at any time or place, is a priceless advantage. Besides, cost effects for footprint, throughput and investment play a key role.A central task for nearly every customer application is to combine global measurements (complete wafer) and local measurements (per die) within one recipe. This is a perfect case for a multi-sensor platform. Measuring step heights and film thickness in one take is also an everyday routine. Combining those characteristics to measure hidden structures (hybrid metrology) is unique.SEMI: How will hybrid metrology enhance measurement precision and where do you expect the multi-sensor approach to be more applicable?Fries: The first advantage is the ability to measure properties that you cannot access directly. On top of that, all the previously mentioned features such as facing multiple metrology tasks, the combination of complete wafer and per die measurement are playing key roles. The precision of specific measuring tasks can be optimized by calibrating sensors against each other or combining results to get rid of noise or artefacts.MEMS and advanced packaging are natural playgrounds for hybrid metrology. But already today we see applications in high volume manufacturing in the 300mm fabs. As structures on wafers shrink, wafers are getting thinner and the whole process is becoming more and more complex. The classic one-sensor metrology tool is running out of gas. SEMI: What are your expectations regarding the summit in Grenoble, and for the future of the MEMS Sensors technology?Fries: FRT has always been very strong in MEMS and sensors and we have attended and exhibited at the SEMI MEMS Imaging Sensors Summit from the very beginning. The summit is always a very good meeting point for the community, and a perfect training session that gives participants extended updates in all fields. And of course, it grows our network and gives us the opportunity to show our latest products and applications.If you really want to know how the future of MEMS and sensors will look like, join the summit and don´t miss the chance to pass by the exhibition to meet FRT and many other industry leaders.Dr. Thomas Fries lives with his family close to Cologne. He is engaged in a variety of activities: as technical advisor to various ministries, supervisory board of PlanOptik AG, board and advisory board of IVAM, board member of COPT.NRW e. V., just to name a few. FRT supports many social projects as well as kindergartens and schools. Motorcycles and cars are still a great passion alongside his family.Serena Brischetto is senior marketing and communications manager at SEMI Europe.

Imagine a world where there are chips in about everything we touch on a daily basis. It is not hard to do with semiconductors already at the core of many leading-edge electronic devices. These sophisticated chips are hidden from sight, but their functions are vitally significant to our daily lives.Manufactured in multibillion-dollar facilities, the production process of chips is one of the riskiest, costliest, and most technically complex feats in business. Consider the difficulties of managing contaminants during device manufacturing: A single speck of dust on a lens could cause the entire output of the plant to be scrapped.For years, these exotic fabrication facilities, called fabs, have been packing more efficiency into ever smaller chips. As new technologies continue to emerge, chip manufacturers face constant pressure to continually refine and improve their operations to meet the challenge of rising device performance and yield goals. Fab managers must optimize tool performance, improve fabrication techniques, safely handle toxic materials and design better integration flows. Layer on top of those requirements customer demand for greater innovation and quality of service, it can be difficult for manufacturers to handle everything on their own while consistently meeting necessary requirements.Align for CollaborationWith the help of the Fab Owners Alliance (FOA), a SEMI technology community, manufacturers and their suppliers don’t have to travel this road alone. Membership in this international group allows semiconductor and MEMS fab managers and industry suppliers to come together to solve common non-competitive manufacturing issues and improve business results.Founded in 2004, the group consists of 25+ device manufacturers (DMs) with over 120 semiconductor manufacturing facilities and 60+ solution providers (SPs) who supply equipment and services. Through quarterly meetings, study teams, benchmarking surveys, case studies and online forums, FOA successfully provides a collaborative, non-competitive platform to the fab management and operations community. FOA members enjoying an engaging discussion and networking event during the recent Q1 2019 Collaborative Forum at the Double Tree Resort in Scottsdale, Arizona One of the most popular FOA platforms is the annual Collaborative Forum early in the year. The goal is to bring together DMs and SPs from around the world for an open dialogue under one roof. For two days, they share success stories and discuss issues facing their fabs and the industry in general and develop collective strategies to address them.The success stories are particularly engaging as they accentuate the value and benefits of FOA membership. Presented as case studies, these stories outline how the DMs and SPs work together to improve fab efficiency and increase yields. Often, the ideas for the case studies are conceived during networking events, fab tours and programs organized by the FOA.The case studies shared at the 2019 Collaborative Forum, held at the Double Tree Resort in Scottsdale, Arizona, February 13-14, 2019, illustrate the power of collaboration within the FOA. Following are a few examples.Scheduling System Implementation Broadcom was facing a steep ramp when it decided to engage with FPS, an INFICON product line. In addition, the manual decision making, and limited real-time visibility of factory data was negatively impacting their production in its 150mm and 200mm environment. By deploying an integrated Smart Manufacturing software solution and its digital twin, FPS was able to retrofit Broadcom’s manual factory with automated decision-making capabilities.This solution offered many benefits. Constraint tool utilization increased by more than 15 percent. The automated WIP management system also eliminated many manual wafer handling issues such as lost lots, WIP storage constraints, building transfers, and time spent looking for lots. Pushing Tool Performance BoundariesAs tools in the 200mm space are hard to find, GLOBALFOUNDRIES is always looking to squeeze every wafer out of its existing resources. To drive continuous improvement and increase equipment throughput, GLOBALFOUNDRIES leveraged MAX’s knowledge with Machine Rate Models. Together, they were able to employ a modelling technique that helped them model key toolsets and develop actions to increase intrinsic machine rate performance.Based on this knowledge, 10 capacity constraints were selected, and speed models were developed for all of them. This win-win collaboration allowed GLOBALFOUNDRIES to find some real opportunities that translated into CAPEX and cost savings. On average, the companies identified a 12 percent potential improvement opportunity per toolset and created engineering task force teams to prioritize and drive the improvements.Simplifying the Chamber Matching Process Using Trace AnalyticsThe collaboration between NXP and BISTel resulted from a shared vision of achieving Smart Manufacturing using analytic solutions enabled by artificial intelligence and other advanced technologies. Chamber matching is critical in identifying process variation to ensure manufacturing quality. Traditional tools like Fault Detection Classification (FDC) often do not provide clear enough insights to pinpoint the issues and require extensive time to collect data from each chamber.Through several use cases, NXP and BISTel successfully illustrated the effectiveness of using a trace analytic solution to quickly and accurately quantify and monitor chamber-to-chamber mismatches as well as changes within a chamber over time. The full trace analyses of all parameters allowed NXP to generate better FDC models to more quickly detect similar issues in the future. In addition, NXP was able to identify the cause of a parametric shift by comparing performance of the same chamber between two different time periods. All in all, the trace analytics solution brought together and analyzed the process data efficiently, thereby reducing analysis time from days to minutes.Eagleview Inspection of SiC and Transparent Wafers X-FAB challenged Microtronic to develop a new capability for its high-throughput recipe-less macro defect inspection systems. Microtronic’s EagleView machine vision macro defect inspection system is well known for its versatility in the semiconductor industry due to its wide deployment as well as its recognition as winner of the 2017 Best of West Award at SEMICON West. But X-FAB’s requirements to inspect and image transparent wafer substrates were novel. After working closely to understand X-FAB’s needs, Microtronic made extensive hardware and software enhancements to enable high-throughput macro inspection of Silicon Carbide (SiC) and other transparent wafer substrates.Get InvolvedThe FOA meetings are held at device manufacturing sites twice a year. The next meeting will be graciously hosted by MACOM in Lowell, Massachusetts, May 22-23, 2019. The DMs and SPs will meet again at SEMICON West at the Moscone Center in San Francisco on July 11, 2019.To attend these meeting and be part of this high-impact group, please email us at [email protected]. For more information about FOA, please visit our website.Nishita Rao is a marketing manager at SEMI.

Driven by the adoption of evermore electronic components in end products, the semiconductor industry is facing a new era in which device scaling and cost reduction will no longer continue on the path followed for the past few decades. Advanced nodes no longer bring the desired cost benefit, and R D investments in new lithography solutions and devices below 10nm nodes are rising substantially. In order to satisfy market demands, the industry is looking for technology solutions to bridge the gap and improve cost/performance while at the same time adding more functionality through integration.More than-Moore devices (including MEMS and sensors, CMOS Image Sensors, power electronic, along with RF devices) represent this new functional diversification of technologies, combining performance, integration and cost not limited to CMOS scaling, and their importance will become more and more preponderant.In 2017, wafer demand for More than Moore devices1 reached almost 45 million 8-inch eq. wafers. This figure is expected to reach more than 66 million 8-inch eq wafers by 2023, showing an almost 10 percent growth during this period.This increase is supported by the famous megatrends detailed in the new analysis, Wafer Starts for More Than Moore Applications2, performed by Yole Développement (Yole). This analysis is relevant to the following markets: 5G with wireless infrastructure and mobile segments, mobile including additional functionalities, voice processing, smart automotive and electrification, AR/VR3, and AI4.For the first time, the market research and strategy consulting company presents a dedicated technology and market analysis focused on the overall wafer demand for More than Moore devices. The aim of this report is to give an overview of wafer shipments for More than Moore devices, from wafer size to semiconductor material substrate type including silicon, glass, SOI5, SiC6, SiGe7, GaN8, InP9, GaAs10, sapphire and ceramic, and thus identify business opportunities in the More than Moore industry.For over 20 years, Yole has been analyzing the industry evolution, discussing with leading companies to understand market challenges, and identifying technical breakthroughs. The Wafer Starts for More Than Moore Applications report is the result of this 20-year research. Yole’s analysts combine technical and market expertise to describe the More than Moore world. Market size (volume and value), substrate sizes and formats, value chain, technology processes and market drivers, business opportunities and competitive landscape are all part of Yole’s analysis.The various research teams at Yole, encompassing power electronics, imaging and sensing, RF and semiconductor manufacturing, collaborate to present an in-depth understanding of the current market evolution, taking into account innovations and emerging businesses. This methodology allows Yole to cover the overall megatrends and illustrate the links between wafer substrate, device, module, sub-system, system and high-end product.Under this dynamic ecosystem, the deployment of renewable energy sources and industrial motor drives as well as the electrification of the automotive industry are good examples of the impact of megatrends on the semiconductor industry development. They are directly impacting the power devices’ wafer market, resulting in an expected 13 percent CAGR between 2017 and 2023. Already in 2017, this market represented more than 60 percent of the overall wafer market for More than Moore devices, and is currently still dominating the More than Moore industry.5G is one megatrend driving wafer demand. 5G is leading the More than Moore evolution, bringing any service to any user, anywhere. Antennas and filtering functionalities are two of the key innovations of this evolution.Without doubt, the stringent requirements of 5G are driving increasing demand for RF components like RF filters, power amplifiers (PAs), and low-noise amplifiers (LNAs) to ensure access to tomorrow’s radio network.This year, Corning and Menlo Micro announced a major agreement to develop a DMS[11] product platform. Both partners propose an innovative approach based on TGV12 packaging technology. According to both partners, this technical choice allows them to cover operation of frequencies beyond 50GHz. Amongst the numerous megatrends, mobility is not far behind 5G. Demand for advanced mobile applications integrating more and more functionality is growing. In order to compete companies are developing smart combinations of devices such as fingerprint sensors, ambient light sensors, 3D sensing, microphones, and inertial MEMS devices. As an example, impressive developments focused on SOI-based NIR sensors have been released by SOITEC for front-side imager applications including advanced 3D image sensors. This technical evolution will clearly contribute, in the near future, to strong growth of the wafer market for MEMS and sensors. Additionally, the automotive industry, with the development of smart cars, has reached a new level of complexity requiring the development and integration of new sensors. In this context, many companies are aiming to extend their capabilities in ADAS13 and autonomous driving. Recently the leading company On Semiconductor acquired SensL Technologies, the leader in SPAD and LiDAR sensing products for automotive. This acquisition is one sign among many highlighting the evolution of this historic industry, searching for new expertise and welcoming new players, more aware of consumer habits and needs.Yole’s analysts expect smart automobiles to drive consistent growth of CIS14 and sensor wafer production over the next five years. It is fueled by the increasing integration of high-value sensing modules like RADAR, imaging, LiDAR and more. Although automotive will be mainly supported by these growth areas, historic MEMS and sensors such as MEMS pressure sensors and inertial MEMS will continue growing at a reasonable rate, supporting the standard automotive world.Yole Group of Companies including Yole, System Plus Consulting, KnowMade, PISEO and Blumorpho follows and analyzes the industry continuously. The Group has developed in-depth expertise and knowledge focused on the semiconductor manufacturing process and markets. Companies of the Group work together to understand the technical issues, identify business opportunities and propose valuable analyses.Yole invites you to an overview of the Wafer Starts for More Than Moore Applications report during the exclusive online event, titled “Wafer Starts for More than Moore Applications – Webcast”. This hourlong webcast takes place on June 28 at 5:00 PM CEST. The market research company will present key results of this report including megatrends, wafer market evolution and technical trends. Moderated by David Jourdan, Sales Coordination Customer Service at Yole, it welcomes the two leading companies, SPTS (an Orbotech Company) and Corning Precision Glass Solutions: "Trends in Wafer Processing Technologies for RF MEMS" – Speaker David Butler, Executive Vice President and General Manager at SPTS Technologies "Benefits of Through Glass Vias for RF applications" – Speaker: Ravij Parmar, New Product Development Manager for Corning Precision Glass Solutions These results will be also presented by the Semiconductor Software team at SEMICON West (Booth #1320), SEMICON Taiwan and SEMICON Europa (Booth #A-4667). Make sure to meet Yole’s analysts and get a valuable overview of the More than Moore industry. Agenda and more information are available on i-micronew.com. Stay tuned!About the authors:Amandine Pizzagalli is a Technology Market Analyst, Equipment Materials - Semiconductor Manufacturing - at Yole Développement (Yole). Amandine is part of the development of the Semiconductor Software division of Yole with the production of reports and custom consulting projects. She is in charge of comprehensive analyses focused on semiconductor equipment, materials and manufacturing processes. Emilie Jolivet is Director of the Semiconductor Software Division at Yole Développement, part of Yole Group of Companies, where her specific interests cover package assembly, semiconductor manufacturing, memory and software computing fields. 1 Including: MEMS sensors, CIS, and power, photonics and RF devices2 Yole Développement, March 20183 AR/VR : Augmented Reality/Virtual Reality4 AI : Artificial Intelligence.5 SOI : Silicon On Insulator6 SiC : Silicon Carbid7 SiGe: Silicon Germanium8 GaN: Gallium Nitride9 InP: Indium Phosphide10 GaAs : Gallium Arsenide111 DMS : Digital-Micro-Switch12 TGV : Through Glass Via13 ADAS : Autonomous Driving Assistance Service14 CIS : CMOS Image Sensor