Semiconductor Equipment

The International Monetary Fund (IMF) just raised its regional GDP growth forecasts. For the world it predicts a 4.4% global GDP decline this year followed by a 5.2% expansion next year. This economic turnaround hinges on being guided by good science, political leadership and popular acceptance.

Semiconductor equipment spending is mounting a strong recovery on the strength of explosive chip demand for work-at-home and study-at-home electronics fueled by the COVID-19 pandemic. Despite the growth, the 2017-2018 memory boon that triggered a critical subsystems shortage is still fresh on the minds of equipment suppliers as they worry whether critical subsystem providers can keep pace with the rebounding chip industry while managing the fallout from the COVID-19 pandemic.Hideyuki Koishi, president of HORIBA STEC, Co., Ltd., a leading supplier of mass flow controllers (MFCs), one subsystem critical to semiconductor production, recently spoke with SEMI about the company’s response to the COVID-19 outbreak, the pandemic’s impact on the global supply chain and the company’s ability to meet the demand for MFCs. SEMI: What COVID-19 countermeasures has HORIBA STEC taken?Koishi: To ensure employee safety and security while maintaining a stable supply of products to our customers, we started to deploy company-wide countermeasures when the Japan government declared a nationwide state of emergency to curb COVID-19 infections on April 16.HORIBA STEC and the entire HORIBA group formed a global COVID-19 task force and centralized all local outbreak decision-making to drive a rapid and effective global response. We quickly implemented work-at-home practices for our office staff and provided a safe environment for our factory workers, who are essential to maintaining product supplies, by establishing social distancing protocols and restricting site visits to essential workers. We also distributed face masks to all employees and placed disinfectant dispensers near the door of every room so employees could wash their hands before entering.To help on-site employees follow our social distancing guidelines, we reduced seating at cafeterias and converted meeting rooms to offices to give employees ample work space. We also established invisible walls in manufacturing facilities with multiple collocated divisions to restrict workers to their assigned areas, a containment measure that helps with social distancing while minimizing the risk of an entire factory shutdown if a worker contracts the virus. SEMI: Have you experienced supply chain disruptions due to COVID-19 outbreak?Koishi: Even though our supply chain extends overseas and includes China, fortunately we have not experienced any significant disruptions thanks to the broad geographic distribution of our supply chain. In addition, because many of our critical components are sourced in Japan, pandemic-related impacts to our business have been limited.Long before the COVID-19 outbreak, we organized a community called Rakuraku-kai with our suppliers in Japan to build and maintain close relationships. Although the community name suggests it is exclusive to Kyoto-based suppliers, its reach is a nationwide. After the declaration of state of emergency in June, the supplier community gathered for an ad hoc meeting to exchange information and share perspectives on the COVID-19 crisis.SEMI: Did you have any pandemic protocols in place before the COVID-19 outbreak?Koishi: In 2014, HORIBA group launched Stained Glass, a project designed to increase workforce diversity at HORIBA group companies through initiatives such as placing more women in decision-making roles and encouraging working at home to help employees better balance job demands with their family lives. As part of Good Place, the project’s program to increase the work-at-home rate, HORIBA group deployed a web-based meeting system and encouraged workers to transition from physical to online meetings. Good Place has helped our IT team and workers smoothly implement our work-at-home practices.Working at home is a beneficial practice regardless of its effectiveness in curbing infections. Employees can reduce commute time, increasing their quality. And it’s much easier and more affordable for international participants to join meetings since they’re spared the time and cost of travel. This year HORIBA group also moved its three-day bi-annual global meeting online to make them safer and more economical. The meeting is attended by about 100 leaders of group companies and business units.SEMI: Do you have any concerns about meeting demand for mass flow controllers?Koishi: We doubled the capacity of our main mass flow controller factory in Kumamoto prefecture in 2018 and with more floor space available for further expansion, we see no major barriers to meeting the growing demand from international customers in 2021 and beyond. Nonetheless, we must sustain the best possible COVID-19 countermeasures to maintain production while ensuring the safety of our employees.SEMI: Are you make any social contributions to combat the virus?Koishi: Semiconductors are not only indispensable for the electronics behind remote work, education and healthcare but they also play a critical role in developing COVID-19 therapies and vaccines. Thus, at HORIBA STEC, we believe our most important contribution is to maintain steady a supply of our mass flow controllers and other key semiconductor equipment components.HORIBA group also participates in two important pandemic initiatives. The Open COVID-19 Declaration program calls on intellectual property owners to make their patent rights, utility model rights, design rights and copyrights freely available in the fight against COVID-19. The program’s sole purpose is to stop the spread of COVID-19. HORIBA is among the 20 founders1 of this initiative.In June, HORIBA joined a push by the National Institute of Advanced Industrial Science and Technology (AIST) to develop a simple and rapid COVID-19 antibody test chip system. We’re contributing our expertise in immunoassay analysis and clinical laboratory equipment to help develop the system. SEMI: What have you learned from the COVID-19 outbreak?Koishi: The COVID-19 crisis has posed unprecedented challenges. Everyone hopes to return to normal soon but in reality things will never be exactly the same as before the crisis.Japan might have lagged other countries in its use of IT to improve business efficiency, but as we deal with the new coronavirus, both companies and their employees have been tirelessly considering reforms to the way we work through digitalization. I believe it will be difficult for companies to survive in the new normal unless they can incorporate these types of changes into their operations.On the other hand, I've also been reminded of the importance of traditional, analog communication. While we conducted all of our hiring interviews online this year, face-to-face meetings are a much richer experience that gives the prospective employee and the hiring company a much better sense of each other. In addition, as a company we need to continue to improve our ability to supply products so we can overcome challenges like the pandemic. COVID-19 has taught us our change needs to be more robust. We also need to evolve our business continuity plan to extend well beyond countermeasures to natural disasters such as typhoons and earthquakes. What matters most is that we apply the lessons of COVID-19 to make our business more resilient.[1] Ajinomoto Co., Inc., Canon Inc., Chanel G.K., GenoConcierge Kyoto, Inc., Honda Motor Co., Ltd., Horiba, Ltd., Konica Minolta Inc., Kyoto University, LSI Medience Corporation, Mitsui Knoledge Industry Co., Ltd., NEC Solution Innovators, Ltd., Nikon Corporation, Nissan Motor Co., Ltd., Rohm Co., Ltd., SRL, Inc., Shimadzu Corporation, Teijin Limited., Toyota Motor Corporation, Tsubakimoto Chain Co., and Yahoo Japan Corporation.Yoichiro Ando is a marketing staff member at SEMI Japan.

Sandia National Laboratories just finished updating equipment in its microelectronics fab, marking the completion of the first phase of a 3-year fab upgrade program. The transition from 6-inch to 8-inch wafer sizes will align the Department of Energy national lab with industry standards to ensure easier access to tools, spare parts and raw materials.Sandia is a prestigious member of the SEMI Fab Owners Alliance (SEMI FOA), an international group of semiconductor and MEMS fab managers and industry suppliers that meet regularly to solve common non-competitive manufacturing issues and improve their business results. SEMI spoke with Michael Holmes, senior manager of microfabrication at Sandia, about its approach to revitalizing the fab while developing new production processes and technologies.SEMI: What were the main challenges in moving into production with 8-inch wafers?Holmes: The goal of the conversion is to reestablish our 6-inch production processes on 8-inch wafers including our radiation hardened 350nm CMOS and MEMS technologies. This requires tuning hundreds of interrelated parameters to get the same end result as before but with different equipment and at a larger scale. In addition, during the conversion we are developing a new 180nm radiation hardened CMOS production process and re-establishing research work on 8” in our silicon photonics and ion trap technologies. Modifications to the facility have also been required including raising the ceiling to install the new implanter and relocating our gowning area to facilitate installation of new CMP tools. In addition to converting our Silicon fabrication facility, we are also converting select equipment in our compound semiconductor facility. We are one large team working toward these goals.SEMI: Were there any roadblocks in sustaining production of the 6-inch wafers while planning and implementing processes for the upgrade to 8-inch?Holmes: Six years of planning ensured the conversion would not affect production of components needed for national defense. This planning window was required to ensure production commitments were completed in advance of conversion start in August of 2018 and return to production for commitments starting in July 2021. This period provides time to complete the hardware conversion and steps review and requalify the production line to ensure products made using the new equipment are identical to ones produced by the old equipment. The hardware conversion phase completed on schedule and the fabrication of prototype and research components on 8-inch started in November of 2018.SEMI: Can you shed some light on the development of gold antennas that promise to improve the thermal infrared radiation capabilities in systems?Holmes: Sandia developed a new infrared detector design that breaks away from relying on thick layers of detector material and instead uses a subwavelength nanoantenna – a patterned array of gold square or cross shapes – to concentrate light on a thinner layer of material. This design uses just a fraction of a micron of detector material, whereas traditional thermal infrared detectors have a thickness of 5 to 10 microns. The nanoantenna-enhanced design increases the amount of an infrared radiation a detector can see while also reducing image distortion caused by background noise. It also allows for the invention of new detector concepts.SEMI: Sandia is known for producing high-reliability components. Several SEMI FOA members have customers in the automotive domain, where reliability is critical. Do you have any advice for them on their path to high-reliability, zero-defect systems?Holmes: High-reliability microdevices at Sandia’s MESA facility are paramount. A structured quality program is rigorously realized in each facet of the production process. Our processes and design rules are constructed around reliability, and we extensively leverage in-line metrology and electrical test to validate devices throughout production. SEMI: Are there any examples of how the FOA peer-to-peer dialogue and knowledge sharing helped in your upgrade from 6-inch to 8-inch?Holmes: Sandia is new to the FOA. Our initial interactions have been very valuable, and members have shared insights into metrics and process improvements that will benefit MESA moving forward. Relative to the 6-inch to 8-inch conversion, as part of our planning process, we did engage other foundries within the FOA to solicit feedback and lessons learned.The mission of the Fab Owners Alliance is to provide value to the fab management and operations community through collaborative platforms for device makers and solution providers.Nishita Rao is marketing manager for technology communities at SEMI.

There is a glimmer of light at the end of the tunnel. But most electronic industry time series will likely struggle at least though autumn.

OSATs (outsourced assembly and test companies) currently handle the bulk of assembly and test activity for the worldwide semiconductor industry. These companies’ factories have a manual operation legacy: Decision-making is manual. Materials and WIP (work in process) movement is manual. Practically everything in these factories is done manually. In addition, OSAT factory environments typically present many physical constraints with respect to equipment layout, material carriers and storage. All of these constraints present challenges when trying to automate material handling in these factories. OSATs also operate with far smaller gross and operating profit margins than IDMs, yet the percentage of worldwide semiconductor product handled by OSATs is currently increasing from year to year while the IDM share is decreasing. The combination of increased business volume with lower margins encourages OSATs to automate their factories, but there are challenges that must be overcome. Technical challenges abound OSATs face many technical challenges when trying to automate production. First, installed legacy equipment in these factories is typically 25 to 30 years old. This older equipment was simply not designed to accommodate automated materials handlers. For example, access doors on older equipment make automated WIP delivery and pickup nearly impossible without significant modifications to the equipment. Second, these factories are not equipped with the infrastructure needed to support automation. To start with, most of this older equipment is not SECS/GEM compliant. (SECS/GEM is the semiconductor industry's standard equipment interface protocol for equipment-to-host data communications.) This capability must either be retrofitted to the existing equipment or some other means of extracting required data from the equipment – getting it from the PLCs controlling the equipment, for example – must be employed. Similarly, the WIP carriers currently in use – wafer carriers, trays, magazines, and the like – are not designed for automation. In contrast to the semiconductor wafer fab industry, it seems that almost every company in the OSAT domain has a different idea concerning what a carrier should look like. In particular, there’s no such thing as the standard 300mm FOUP (Front Opening Unified Pod), which carries wafers from one tool to the next inside of semiconductor fabs. The variations in carrier shapes, configurations, and even gripping handles in the OSAT domain thwarts progress in OSAT factory automation. How do you design a materials-handling robot with the grippers and flexibility needed to adapt to all of these different carriers? It’s a difficult question and an expensive proposition. OSAT facilities themselves are designed for human-based materials handling, not automated materials handling, simply because they were designed at a time when automation was not contemplated. As a result, the equipment in these facilities is packed very closely together (to reduce floor space costs), as shown in Figure 1. Figure 1: Equipment in a test facility is often tightly packed, which impedes the adoption of automated materials handling. It’s very difficult to add automated materials handling equipment at floor level or even at ceiling level in these OSAT factories, as is frequently done inside of a semiconductor wafer fab. You will not see AGVs (automated guided vehicles) moving around inside of legacy OSAT factories because there’s simply no room for them to move around. Tackling the challenges So, what can be done to handle these all of challenges? You must start by understanding the nature of the operations taking place inside of the factory. As stated above, most of these operations are currently performed manually. All of the decisions and the materials transport is performed by humans. There’s simply no way to transition from a fully manual operation to a fully automated operation in one jump. It’s too far a reach. A significant amount of work is needed just to reach the level where automated decision making is possible. Key systems must be added to enable this level of automation. Many companies tried and failed to automate assembly and test in OSAT facilities about 25 years ago. They failed because the required data could not be extracted from the equipment in use and, therefore, there was no data to drive good decision-making. Too many required systems were simply lacking. For example, when AGVs were added, one or two operators had to walk along with the AGV to tell it what to do. There was no benefit from the automation in this example. There was no successful path to automation at the time. Standards needed One of the major obstacles to automating assembly and test in OSAT facilities is a lack of standards for carriers, robotics, layout, and facilities. Many front-end standards exist. The SEMI-E82, SEMI-E84, and SEMI-E88 standards designed for semiconductor fab front ends might apply, but they need to be adapted to requirements for OSAT back-end facilities. In addition, OSATs have special needs that may demand new standards. This is a real opportunity for SEMI and its constituents. An architecture for full assembly and test automation involves four layers, as shown in Figure 2. Figure 2: Full automation for assembly and test involves four layers. Starting with the data layer at the top of Figure 2, a fully automated facility needs to have database systems in place that can supply all of the data needed for making smart scheduling and dispatch decisions. These databases then feed smart, automated scheduling and dispatch applications in the logic layer. The scheduling and dispatch applications then send control commands to the automated transport and materials controllers and the automated equipment handlers in the control layer. You need to start at the top of the diagram to put all of this automation in place. The automated equipment and equipment controllers need commands from the scheduling and dispatch applications, which in turn need data from the databases to make smart decisions. So it’s the data layer and the systems that feed data to this layer that constitute the starting point for the journey to full automation. A significant amount of simulation is needed to develop optimal facility workflows. These simulations are driven by data extracted from the databases. One of the frequently ignored facets of automation is the need for backup plans. For example, what is the backup plan when an AGV fails and cannot deliver material as scheduled? Simulation helps create contingency plans for such events. A case study Applied Materials has worked with assembly and test factories in deploying full automation. Towards this objective, the factories have worked on many modifications (physical and systems) to enable this automation. For example, a die-attach machine was retrofitted for automation by removing all of its equipment doors so that an AGV could load the machine and extract completed work. Additional modifications permitted the mounting of multiple magazines on the die-attach machine’s input and output to provide the buffering needed to smooth the flow of work through the machine. Finally, simple instrumentation and networking was added to the machine to aid in making WIP delivery and pickup decisions. These machine modifications addressed only the bottlenecks in this particular machine, but even these simple modifications helped to reduce the incidence of manual handling errors, such as the misalignment of magazines or trays. Modifications like these also reduce the need for human operators, which in turn reduces operating costs. Such types of incremental enhancements in automation capability have been implemented by leading-edge companies over the past few years. Conclusion Deploying full automation for assembly and test is not only feasible, it’s necessary for future profitability. OSATs must address the challenges of rising manufacturing volumes and thin margins by reducing manufacturing errors and increasing quality. (The quality requirement is increasingly driven by the automotive industry.) Trailblazing deployments have shown that it’s possible to automate these manufacturing lines successfully. While IDMs have a longer history for manufacturing automation, OSATs are now traveling along the same path due to their rising share of worldwide manufacturing volumes. On that path, they’ll need to develop experience and new standards tailored to their unique needs. Shekar Krishnaswamy is a senior manager at Applied Materials responsible for business development and pre-sales of factory automation products and solutions. He has over 27 years of experience in all aspects of semiconductor manufacturing including wafer fab manufacturing, bump, assembly and test. His specific areas of expertise are traditional industrial engineering methods as well as systems-related methodologies such as modeling, scheduling, dispatching and factory automation. Prior to Applied Materials, Shekar held senior technical and management positions at IBM, Motorola and AMD, including management of corporate operations research departments supporting factory and service groups. Shekar has a bachelor’s degree in mechanical engineering and a master’s degree in industrial engineering and operations research. Note: SEMI has a Smart Manufacturing Technology Community. For more information or to get involved, click here.

Can it be that no more new semiconductor fabs are being built in the U.S.?The last new volume fab known is Micron’s Building 60 in Utah, according to the SEMI World Fab Forecast report published in February 2018. The catch is Building 60 is not a new or greenfield facility but rather an existing structure being retooled for 3D NAND. Fab equipment spending for this fab is expected to be high in 2018.Then there is Fab 42 from Intel. Construction started in 2011 before it was shelved. It is expected to begin equipping by end of this year, with equipment spending expected to be high next year.Other fabs built many years ago are still ramping such as Globalfoundries Fab 8 phase 3 (TDC) and D1X (module 1 and module 2). D1X is a research and development pilot, not a high-volume fab. And Globalfoundries’ plans for a second fab in Malta have been pushed out.Samsung in Austin has space for more modules, but there is no indication they will ever be added.The SEMI World Fab Forecast shows five smaller facilities either planned or under construction, but these have little impact in this U.S. fab construction trend.And that’s basically it! No more volume fabs!If we divide fab equipment spending into two categories – investment in new capacity versus upgrades – we see a declining trend for fabs adding capacity. See chart below. (Compare 2005-2011 with 2017-2019). If we look at 2017, 2018 and 2019, Globalfoundries, Intel, and Micron are the big investors in new capacity.This year 60 percent of all fabs are expected to invest in equipment to add capacity, but just one or two volume fabs (Micron and Globalfoundries) account for the bulk of this growth. Same story for 2019, with two volume fabs (Intel and Globalfoundries) representing the lion’s share of the growth. Strike the Intel and Globalfoundries fabs from the equation, and investments in additional capacity would fall below upgrade spending levels.Once these fabs have reached full capacity, additional equipment investments will significantly lag spending increases for upgrades, signaling the end of new fabs in the U.S.