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The semiconductor industry is in the final throes of its most recent cyclical downturn, but clear demand drivers on the horizon, such as 5G and autonomous driving, have created a decidedly upbeat mood at SEMI’s Strategic Materials Conference, held this week in San Jose, California. Increased connectivity in daily lives will not only dramatically boost semiconductor volumes, but the physical challenges of improving chip performance have positioned materials as the key enabling technology of the fourth industrial revolution – creating opportunities for suppliers to capture significant value. Most speakers were quick to underscore the importance of materials innovation. According to Dave Anderson, president of SEMI Americas, “We are entering the era of the material scientist,” and the role of materials in semiconductor manufacturing “has never been more important.” Carlos Diaz, senior director, corporate research at foundry major TSMC, said that the future “belongs to new materials and processes,” while Bertrand Loy, president and CEO, Entegris, told attendees the world is on the brink of the fourth industrial revolution, where technology will be fusing “physical, digital, and biological worlds and transforming our collective lives.” Len Jelinek, senior director/semiconductor manufacturing, IHS Markit, noted that 2019 has been a challenging year for semiconductor revenue – expectations are for a 12.5% decline YOY – but said he is not forecasting “doom and gloom” because of positive consumer demand trends beyond 2019. These include the rollout of 5G networks, internet of things (IoT), artificial intelligence (AI), and autonomous vehicles. Jelinek emphasized the foundational impact of 5G in particular. “Don’t think of 5G’s impact only in terms of handsets. It’s an enabling technology that will have broad-based impact” and will be key to creating a sustainable recovery in semiconductor demand in the second half of 2020. The current semiconductor downturn – the industry’s 10th – was initiated by an imbalance in memory supply and demand, and the lack of resolution of trade issues between China and the US is threatening to amplify volatility. Smartphones, the number-one application for semiconductors, are currently challenged by extended replacement cycles, and total handset shipments are set for its second year of decline. “We, as consumers, are waiting for revolutionary features such as 5G speeds, biometrics, foldable handsets and AI capabilities,” Jelinek says. Recent iterations have been merely evolutionary, and premium handset costs have escalated, he adds. Automotive electronics, which account for about 10% of global semiconductor demand, will eke out slight growth in 2019, Jelinek says. “Long-term semi component revenue growth within the Auto segment will focus on increasing content within cars supporting advanced safety features.” During his session, Duncan Meldrum, chief economist and founder of Hilltop Economics, addressed recent threats of a recession. “Underlying economic fundamentals are strong, but we are at that point in the business cycle where it doesn’t take much to knock the economy into recession,” he says. “I am telling people to have a contingency plan in place.” Nevertheless, Meldrum laid out reasons for optimism. Most economies have plenty of jobs, and consumers have been confident despite negative headlines. “For the average person, a tariff trade war gets to be noise. If they don’t see immediate impact, they tend to eventually discount all the headline noise. The same goes for Washington politics or Brexit.” There are no serious signs of inflation pressures in the US or other major economies, he adds. Beyond the cycleLonger-term, explosive growth in connected devices will create a runway for semiconductor volume growth. According to SEMI, over 30 billion devices are currently connected and another 200 million are added daily. By 2020, the number of connected devices will reach 1 trillion. “The growth profile for industry will be very strong and a multiplicity of drivers will bring more stability to this industry,” Loy adds. “But before this future becomes a reality we have a lot of work to do.” Current chips need to be faster and cheaper. “Physical scaling is not going to get us there, we’ve hit those limits,” Loy adds. “We have to look at new architectures and materials.” Loy called on the materials sector to need to “up our game” and spend more on R D. “Customers want us to make our products in very tight process window and ship to control. They want extreme purity for everything. It’s a long list of to-dos and it’s going to cost us a lot,” he adds. Among the needed innovations are photoresist hard masks to hand high aspect ratio, new etch chemistries for better rates and higher selectivity, and new cleaning chemistries for high aspect ratio geometry with high selectivity.Loy also identified contamination control as a key challenge for material suppliers. “When you think about purity and contaminants, you need to think about size, concentration levels, and classes. To optimize yields and lower wafer defectivity, our customers expect materials to be very pure and exhibit low variability.” The payoff for customers is large; a 1% yield improvement can mean $150 million in annual net profit for a leading-edge logic fab, Loy says. For a 3D NAND fab, that figure can be around $110 million per year. But these requirements are getting exponentially tighter. From 28 to 7 nm, the metal impurity concentration limit became 1,000 times lower, Loy notes. Contamination control is even more vital when the potential impacts of latent defects – which are difficult to detect in a fab and during electrical testing – are considered, particularly in emerging applications like autonomous driving, Loy says. “The cost of yield loss is expensive, but failure in a critical optical sensor of a car could be significantly greater, in terms of recalls or even human loss of life.” To meet tightening purity requirements, Loy recommends throwing out traditional thinking about contamination control. “In the past, we could get away with simple filtrations,” he says. “That’s no longer going to work. We need to collectively, up and down the supply chain, migrate to better filtration and purification and also rethink chemical delivery systems and packaging solutions to preserve the integrity of our products.”Metrology will also be key, but analytical capability is lagging. “We all like to believe that we cannot control what we cannot see, but that is exactly what we have to do.” The need for innovation is also being felt at the wafer level. Kevin Light, director, Applications Technology Americas at Siltronic Corp., said that as semiconductor markets become more diversified, silicon suppliers must recognize the distinct challenges each segment faces. Better wafer properties are required for next-generation chips, he adds. “Excessive wafer geometry can cause errors during lithography, especially when printing even smaller linewidths,” he says. The end result can be defocus and placement errors. When dealing with “More than Moore” architectures, wafer requirements are driven by other factors than defects. “More than Moore applications do not benefit from scaling, but instead drive capabilities of separate silicon parameters,” Light says. “In some cases you need high doping, in others the doping needs to be precise.” Czochralski crystal growth is suitable for high dopant levels, but the concentrations vary at the top and bottom of the ingot. Float Zone crystals avoid oxygen incorporation and provide consistent doping. These variations make Czochralski process suitable for PowerMOS, and Float Zone appropriate for IGBT. Compound semiconductor layers, such as GaN-on-Si, offer potential advantages owing to higher switching speeds and critical breakdown fields, he adds. “Silicon wafer requirements are diversifying as the devices themselves find increasing use outside of traditional logic,” Light adds. “Moore’s law is alive and next-gen computing will continue to push the limits of flatness and cleanliness. Meanwhile, demands of energy efficiency, electrification, IoT, and 5G drive wafer requirements other than scaling, including extremely high doped or ultra-low oxygen growing techniques, high lifetimes, and substrates engineered for compounds semiconductors.” Driverless futureAutonomous driving was a frequent discussion topic at SMC. Although IHS Markit does not see it really rolling out until past 2025, the disruption to the auto industry’s status quo is very much being felt now. Dragos Maciuca, executive technical director, Palo Alto Research and Innovation Center at Ford Motor Company, says cars of the future will be autonomous, connected, electrified, and shared. “The biggest transformation will be the shift from mechanical hardware to software,” he says. “Currently [a car] is a mechanical thing that has some electronics. Going forward, it will be a software-driven system that happens to control some mechanical elements.” The transition is already way under way, so much so that autonomous technology developed for the automotive industry is already being spun off into other sectors, such as mining and agriculture, and the auto industry’s competitive landscape is already seeing changes. OEMs and carmakers are entering the market from the traditional auto industry side, while companies such as Google are participating from the software side. “Others, like Uber and Lyft, are coming in from the business plan point of view to eliminate drivers and improve margins,” Maciuca adds. Autonomous driving will require numerous innovations, many of which will require new electronic materials and production processes. “We need weight savings, space savings, and advanced architecture,” Maciuca says. “We also need customization to print circuits as the vehicle comes down the line.” The tech community is proving up to the task. For LIDAR, there were just two technologies available a few years ago, he adds. The impact on chipmakers is also already being felt. “The automotive industry used to buy older chips,” Maciuca says. “Now we are moving to a stage where we need the very first chips at the most advanced node. And we are using them for safety-critical operations. If an AI chip that is supposed to detect a human fails, the consequences can be very severe.”Rebecca Coons is a senior editor at Chemical Week. Republished with permission from Chemical Week.The SEMI Electronic Materials Group (SEMI EMG) is the backbone of the Strategic Materials Conference. EMG is a technology community representing SEMI member companies that provide substrates, polymers, metals, organic and inorganic materials, chemicals, and gases that are developed or in use for the manufacturing of electronics. The group is open to SEMI Members involved in materials manufacture, distribution, and services throughout the microelectronics industry. For more details, please visit the website.

Automotive original equipment manufacturers (OEMs) and their direct suppliers of parts and systems share a vision: Next-generation vehicles will be more electric, autonomous and connected. At a market size of more than $1 trillion, automotive is steadily becoming a high-tech market as cars morph into advanced technology platforms with partially or fully autonomous features. Call them semiconductors on wheels. Big players such as Google and many carmakers are investing heavily in chip advances to help drive increases in silicon content in automobiles.At SEMICON Europa, Pierrick Boulay, Solid State Lighting and Lighting Systems analyst at Yole Développement, will provide a market update on autonomous automobile trends including the state of sensors, radars, cameras and LiDARs as the industry works to increase the level of autonomy and electrification.Autonomous vehicle design can only thrive with the development of an industry standard for chip and device traceability across the supply chain. The importance of chip traceability to the automotive industry is reflected in its central role in driving a chip traceability standard.According to Heidi Hoffman, senior director of technology communities marketing at SEMI, “chip traceability is one of the next big things for the technology industry. The benefits are enormous, and the upsides – including yield enhancements, counterfeiting safeguards, and support for new applications – are plentiful. But the implementation challenges of chip traceability are also big and will require considerable effort to overcome. The biggest hurdle of all? We need to transcend industry fears by demonstrating that we can secure IP when it is shared across the hardware supply chain.” The Importance of Standards, Data Collection and Collaboration Across the Supply ChainThe automotive industry has long embraced tracing the sources of defects. Now, as the automotive and semiconductor supply chains increasingly overlap, traceability has taken on greater importance in the semiconductor industry. SEMI committees, task forces and events such as the Smart Transportation Forum at SEMICON Europa are ideal platforms for collaborating to develop new standards and best practices for the automotive industry.Earlier this year, German luxury automobile maker Audi AG became the first automotive original equipment manufacturer (OEM) to join SEMI as member, strengthening alignment across automotive supply-chain segments. At SEMICON Europa, the SMART Transportation Forum and Pavilion, staged by the SEMI Global Automotive Advisory Council (GAAC) and bolstered by the Electronic System Design Alliance, a SEMI Strategic Association Partner, will gather key stakeholders across the automotive value chain, from design and semiconductor equipment to materials and carmakers, to explore innovation opportunities in automotive electronics. SEMI Global Automotive Advisory Council (GAAC) “If the industry wants to reach the goal of zero defects, a new collaborative approach is necessary,” observed Antoine Amade, senior regional director EMEA at Entegris. At SEMICON Europa, Amade will present new ways to collaborate in reducing chip defectivity and meet other challenges in the automotive industry.More than half of semiconductor failures on the automotive assembly line today (so-called 0km failures) are traced to semiconductor fab defectivity. “The increasing semiconductor content in automobiles – driven by growth in ADAS, electrification and autonomy – has put a growing focus on the quality and reliability of these devices and their implications for consumer safety and satisfaction,” said Oreste Donzella, senior vice president and CMO at KLA.The smart manufacturing (Industry 4.0) revolution is already spurring higher performance and great efficiencies throughout the supply chain and will also be crucial to driving innovation in automotive. Smart manufacturing makes possible significant improvements in factory key performance indicators (KPI) for cycle time, on-time delivery, overall equipment effectiveness, cost and product quality.“These KPI gains are key to meeting quality levels the automotive industry must reach to support the deployment of autonomous driving vehicles,” said John R. Behnke, general manager of Final Phase Systems at INFICON. In his talk at SEMICON Europa, Behnke will provide an overview of existing, in-progress, and future smart manufacturing solutions for the semiconductor industry and their impact on the automotive supply chain. The SMART Transportation Forum, 13 November, 2019 (9:30-15:30 at ICM Munich, room 14c) at SEMICON Europa is the premier platform for key stakeholders to connect, collaborate and innovate across the automotive value chain. Automotive and semiconductor industry experts will offer insights into trends in design, semiconductor equipment and materials, and automotive innovation and the roadmap to 2030. The SMART Transportation Forum will also showcase innovations in imaging, sensing, artificial intelligence (AI), smart manufacturing and L5 mobility.Other SEMICON Europa highlights: Advanced Packaging Conference: Packaging and Test Challenges Towards High Reliability (12-13 November 2019) 23rd Fab Management Forum: Game Changers for Semiconductor Operations(11-12 November 2019) Strategic Materials Conference: Strategic Materials Enabling Industry Roadmaps(12-13 November 2019) SEMICON Europa registration is open for visitors and exhibitors. For more details, please visit the SEMICON Europa website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (use #SEMICONEuropa).Learn more about the SEMI chip traceability standard – SEMI T23 - Specification for Single Device Traceability for the Supply Chain – and SEMI Technology Communities.Serena Brischetto is a marketing and communications manager at SEMI Europe.

In the long unfolding arc of technology innovation, artificial intelligence (AI) looms immense. In its quest to mimic human behavior, the technology touches energy, agriculture, manufacturing, logistics, healthcare, construction, transportation and nearly every other imaginable industry – a defining role that promises to fast track the fourth Industrial Revolution. And if the industry oracles have it right, AI growth will be nothing shy of explosive.“The gains these days are not incremental,” said Ajit Manocha, SEMI president and CEO, said to a gathering in July of the Chinese American Semiconductor Professional Association (CASPA) for its Summer Symposium at SEMI’s headquarters in Milpitas. “They are hockey stick – exponential – with AI semiconductors growing in market size from $4 billion this year to $70 billion in 2025.”Manocha left little doubt that AI is remaking the semiconductor industry and, in the process, the world at large. Internet of Things (IoT) and 4G/5G, both key AI enablers, will account for more than 75 percent of device connections by 2025.“Today, 30 billion devices worldwide are connected,” Manocha said, citing an Applied Materials prediction that the number of connected devices globally will grow to between 500 billion and 1 trillion by 2030. Those devices will generate stunning amounts of data collected, interpreted and used to reason, solve problems, learn and plan, leading to the holy grail of autonomous machine behavior.To process this colossal amount of data central to the promise of AI, the industry must break through the limits of a key technology: memory. Memory a Critical AI BottleneckThe challenge for memory starts with performance. Historically, every decade gains in compute performance have outpaced improvements in memory speed by 100 times, and over the past 20 years that gap has grown, said Steven Woo, a fellow and distinguished inventor at Rambus, presenting at the symposium. The upshot is that memory has bottlenecked compute and, in turn, AI performance. The industry has responded with new ways to implement memory systems on AI chips. Each is suited to unique performance requirements and, of course, comes with trade-offs. Among the frontrunners: On-chip memory delivers the highest bandwidth and power efficiency but is limited in capacity. HBM (High Bandwidth Memory) offers both very high memory bandwidth and density. GDDR balances trade-offs among bandwidth, power efficiency, cost and reliability. Since 2012, AI training capability has grown 300,000 times, besting Moore’s law by 25,000 times in doubling every 3.5 months, a blistering pace compared to the 18-month doubling cycle of Moore’s law, Woo said. The staggering improvements have been driven by parallel computing capacity and new application-specific silicon like Google’s Tensor Processing Unit (TPU).These specialized silicon architectures and parallel engines are key to sustaining future gains in compute performance and combatting the slowing of Moore’s Law and the end of power scaling, Woo said. By rethinking the way processors are architected for certain markets, chipmakers can develop dedicated hardware capable of operating with 100 to 1,000 times greater energy efficiency than general purpose processors to overcome another big limiter to scaling compute performance – power.For its part, the memory industry can improve performance by signaling at higher data rates and using stacked architectures like HBM for greater power efficiency and performance, and by bringing compute closer to the data.Memory scaling for AIA key challenge is scaling memory for AI. Demand for better voice, gesture and facial recognition experiences and more immersive virtual reality and augmented reality interactions is tremendous, said Bill En, senior director at AMD, speaking at the symposium. These capabilities require more processing power across both high-performance computing (HPC) for big data analytics and machine learning as it relies on AI and machine intelligence to generate meaningful insights. Emerging machine learning applications include classification and security, medicine, advanced driver assistance, human-aided design, real-time analytics and industrial automation. And with 75 billion IoT-connected devices – all generating data – expected by 2025, there will be no shortage of data to analyze, En said. The wings alone of a new Airbus A380-1000 feature some 10,000 sensors.Mountains of this data are stored in massive data centers on magnetic hard drives, then transferred to DRAM before moving to SRAM within the CPU for the handoff to the compute hardware for analysis.With data growing at an exponential clip, the question is how to make sure all other memory systems can handle the flood of data. AMD’s answer is a chiplet architecture featuring eight smaller chips around the edge that drive the compute and a large chip in the center that doubles the IO interface and memory capability to in turn double chip bandwidth.AMD has also moved from a legacy GDDR5 memory chip configuration to HBM to bring memory bandwidth closer to the GPU for more efficient processing of AI applications. The HBM provides much higher bandwidth while reducing power consumption. Compared to DRAM, AMD’s HBM delivers a much faster data rate and far greater memory density, En said.Over the next decade, look for more performance improvements from multi-chip architectures, innovations in memory technology and integration, aggressive 3D stacking and streamlined system-level interconnects, he said. The industry will also continue to drive performance gains in devices, compute density and power through technology scaling.Michael Hall is a global marketing communications manager at SEMI.

AI vs. energy. Quantum for everyone. Biofabrication of human organs on a mass scale. Slowing advancements from Moore’s law.In the midst of a market dip, optimism reigned as keynote and AI Design Forum speakers addressed both looming challenges and explosive market opportunities during July 9-10 presentations at SEMICON West 2019 in San Francisco. SEMICON West again proved to be a magnet for visionaries who laid out the path to electronics innovation over the coming years.“The current business environment demands that the industry looks ahead toward issues that need attention sooner, not later – especially since we are approaching a once-in-a-generation inflection point that has the potential to be a $10 trillion opportunity,” observed SEMI Americas president Dave Anderson.Market forecasts punctuate the point: The microelectronics supply chain is on the verge of what has the potential to be the longest-lived electronics era.“Inflection points like this are rare, but not unprecedented,” Anderson added, citing 2007 as the inflection of the growth curve from new technologies that led to last year’s historic high semiconductor sales.SEMICON West squarely focused on the future, with a number of industry leaders noting that chip, tool and materials makers need to look beyond their immediate suppliers and customers in developing strategic partnerships. Dr. Cliff Young, data scientist with the Google Brain Team, for one, invited semiconductor and equipment firms to explore chip codesigning opportunities with his Google.The recently formed Quantum Economic Development Consortium – and its 50 members including Boeing, Google and IBM – debuted roadmapping activities devoted to the pursuit of U.S. leadership in the rapidly emerging global quantum computing industry. IBM’s Jeff Welser showcased the IBM Q Computer model built upon decades of semiconductor industry advances. Markets that could see staggering leaps from a quantum computational capacity include automotive, medical, financial and energy. Today, anyone can dabble with the future quantum computing capabilities by connecting online with IBM’s 16-qubit quantum computer. Dr. Aart de Geus, chairman and co-CEO of Synopsys, suggested that software and other programming tends to develop more quickly if it is open sourced. He recommends an open source model that allows semiconductor and equipment companies to work together in the cloud to speed chip development.Nate Baxter, TEL development and production group general manager, advocated sharing big data with competitors in pre-competitive spaces to ensure data quality, improve measurement and solve problems faster. The key is security. “Yes, we can share data while protecting it,” he said. “We’re quickly seeing opportunities that we didn’t know existed.”Gary Dickerson, Applied Materials president and CEO, said that embedding artificial intelligence (AI) in chips will drive significant long-term industry growth by processing far more big data computations much faster than humans can.That is, if there is enough electricity. Almost invisibly, AI-enabled machines already are crunching massive amounts of data while gulping power in the process. As AI use rapidly expands, current power grids will be stressed as never before. Dickerson added that speed of innovation, societal acceptance, security and safety will guide how well and quickly AI is adopted. A potential hurdle, however, is sustainability. He warned power constraints could be “very high” and a “barrier to AI adoption if we don’t drive innovation” in substantially reducing the power draw of power-hungry AI chips.Of the five members of a venture capitalist panel, four agreed that Moore’s Law as we knew it is dead. The promising news is that the average age of a first-time mobile phone user is 10, more than 40 percent of the world population is now under 25 and about to wield considerable market influence, and 5G is on the cusp of helping connect trillions of devices. AMD CEO Lisa Su noted “there’s a tremendous amount of innovation yet to come” from microarchitectural advances, chiplets and die stacking, and heterogenous platforms.And there’s nothing more innovative – or intriguing – than regenerating human organs in mass volume. Legendary inventor Dean Kamen laid out his well-funded plans to biofabricate the viscera of human existence but warned of two crucial missing pieces – scale and talent. “I’m here at SEMICON West to beg for high-tech’s help in getting artificial human organs out of labs and ramped up for volume manufacturing and widespread distribution,” Kamen said during his keynote. “The basic science already exists, but researchers can’t bring it to scale like Silicon Valley can.”The talent Kamen needs to fulfill his dream will come from the pool of skilled workers the microelectronics industry is feverishly working to recruit to make good on its own ambitions. As if on cue, SEMI endorsed Kamen’s FIRST Global program, establishing a united effort to encourage young people worldwide to pursue engineering careers. “Together, we can better help provide a path to success for generations to come,” SEMI’s Anderson said.Scott Stevens, SEMI

We are living in a digital world where semiconductors are taken for granted, AI is bringing semiconductors back into the deserved spotlight, and now we are witnessing the dawn of the Cognitive Era enabled by semiconductors,” SEMI president and CEO Ajit Manocha said to an audience of more than 500 during his presentation – Rebirth of the Semiconductor Industry – at the First Global IC Entrepreneur Conference.Speaking at the Shanghai event in mid-December, Manocha recalled how, when he first entered the semiconductor industry in the 1980s, semiconductors revenue topped out at about $10 billion. Now, with sales having swelled to a staggering $450 billion, the industry is on a much faster growth track. Revenue could reach $500 billion by the end of 2020 and trillions of dollars by 2030. Over the past two decades, chips have given rise to social media and e-commerce powerhouses such as Google, Facebook, and Alibaba. All rely on heavily on chips, the engines of data centers across all industries. Wave after wave of technology innovation have been powered by semiconductors – from mainframe computers in the 1970s, personal computers in the 1980s, the Internet in the 1990s, and mobile and social networking in the early 20th century, to the current shining stars of technology such as IoT, big data, new memory, virtual reality, autonomous driving and artificial intelligence, Manocha said. New applications across areas such as smart manufacturing and digital healthcare are stoking the latest round of semiconductor growth.The rise of AI, like all the technologies before it, has renewed the semiconductor industry once again with its promise to drive growth of all industries worldwide, Manocha said. Five years ago, IoT was but a gleam in a technologist’s eye, more hype than reality with doubt about its viability running deep. Today, with about 60 percent of people in the world connected to the Internet, the enormous promise and potential of IoT is flowering. Industry growth will explode as the melding of AI and IoT birth countless applications and innovations in SMART transportation (0 emissions; 0 fatalities; 0 congestion), smart sensors (agriculture, infrastructure, healthcare) and SMART “Everything” (people, devices, homes, cities, industries, and the list goes on). Indeed, AI is now widely recognized as a chief growth driver of the semiconductor industry well into the future, with semiconductor technology at the core of AI innovation, he said. Semiconductors are thrusting the fifth industrial revolution into the fast lane. China’s much-anticipated rise as an industry powerhouse over the next few years will only accelerate industry growth, turning current disruptions into future opportunities as SEMI China continues to cultivate connection, collaboration and innovation in China’s fast-growing semiconductor sector.Cherry Sun is a marketing manager at SEMI China.

Five young dancers bathed in a striking rainbow of colors with their silhouettes cast in the background dazzled SEMICON Japan 2018 attendees at the opening ceremony in mid-December. Gone were the standard opening keynotes and ribbon cutting, replaced by live performance and media art set against a dramatic black backdrop. There was no mistaking the wide-eyed looks of wonder in the audience.In its sheer vibrance, the opening ceremony thrilled with an excitement that seemed to embody the extraordinary growth expectations for the global semiconductor supply chain over the next five years, with the industry poised to double sales from $2 trillion to a staggering $4 trillion – a phenomena SEMI president and CEO Ajit Manocha has called The Rebirth of the Semiconductor Industry. Driving this unprecedented growth will be SMART applications that are transforming industries and applications worldwide, powered by artificial intelligence (AI) and Internet of Things (IoT) technologies.The dramatic scene at SEMICON Japan 2018 was staged by Rhizomatiks, a media arts company that produced the Rio Olympic Games closing ceremony and is famous for its pop music spectacles. The company’s CTO, Motoi Ishibashi, the event’s first keynote speaker, described his team’s development of drones and vehicles guided by motion and precision-control technologies. It was some of these SMART vehicles that maneuvered the opening ceremony performers from the dance company Elevenplay onstage. Only Rhizomatiks, Ishibashi said, has this capability. In its mission to enrich people’s lives through new media arts, Rhizomatiks uses the latest virtual and mixed-reality technologies to orchestrate not only dance performances but music videos, commercials, fashion shows and festivals.Toru Nishikawa, the second keynote speaker and CEO at Preferred Networks, a leading Japan-based developer of deep learning software programs, surprised the SEMICON Japan audience with his discussion of his company’s work to develop a specialized chip for deep learning processing, joining technology giants Apple, Google, Alibaba and Microsoft in chip design. As more IT and software companies develop specialized, differentiated chips, the devices are quickly becoming the heartbeat of SMART technologies. The company’s approach has taken hold. Only four years old, Preferred Networks is enjoying rapid growth by working with global powerhouses including Toyota, NTT, Panasonic, Fanuc, NVIDIA, Intel and Microsoft. Ishibashi’s and Nishikawa’s fresh visions and the media arts extravaganza reflected the success of SEMICON Japan, held again at Tokyo Big Sight: The event’s 1,881 booths – filled by 727 exhibitors from 14 regions – was the highest count in six years. With Japan home to companies that supply about 40 percent of semiconductor equipment and materials worldwide, top suppliers historically have occupied the largest spaces on the SEMICON Japan show floor.According to IDC, personal computers and smartphones, long the largest revenue sources for the semiconductor industry, will remain top revenue drivers in the coming years. But revenue from new SMART technologies for applications such as automotive and factory automation is growing, a trend expected to continue with a 2018-2022 CAGR of 9.5 percent for automotive and 5.2 percent for manufacturing, compared to 1.1 percent for PCs and 2.9 percent for smartphones.SEMICON Japan’s new SMART Applications zone highlighted these and other new market opportunities for semiconductor growth with product and technology exhibits from companies including Bosch, IBM, Microsoft, NEC, Preferred Networks, Sony, SAS, Siemens, Tesla and Toyota. But the zone wasn’t all work and no play. The ROBOT SQUARE and SPORTS x IOT robot exhibits took visitors back to their school days, with robot anime – from Astro Boy to Gundam and Evangelion – that they could ride and control! As the World Gets Smarter, So Must SEMICON and the IndustryWe all agree the world is getting smarter at a fast pace. New cars are easier to drive – some models are almost fully autonomous on highways and streets. Your SMART speaker has gone well beyond an audio playback device and is more like a home AI platform. Almost all storefronts are equipped with video cameras. Your workplace, whether an office or a factory, is driven by automation. The reliance of these environments and devices on semiconductors is driving exponential chip and changing the world. Businesses need to adapt and so do SEMICON events. We’re doing just that as SEMICON Japan 2018 demonstrated – from an opening ceremony enabled by technology innovation to new faces of the industry to the SMART Application zone. As the SEMICON Japan presidents’ reception concluded the first day of the show, a robot from the ROBOT SQUARE suddenly appeared in the reception hall in front of about 250 executives from the global industry. Everyone at the reception was impressed and stepped forward to the stage, reflecting the overall excitement about SEMICON Japan, which for many years showcased only chip manufacturing equipment and materials. This year, to keep pace with the changing world, it was much more than that.SEMICON Japan 2019 will again take place in December at Tokyo Big Sight. However, organizers of the Tokyo Olympics will be using the East Exhibit Hall usually occupied by SEMICON Japan to prepare for the games. As a result, SEMICON Japan will be held in the West and South Halls instead. Look for more changes to the event. I hope to see you next year!Jim Hamajima is president of SEMI Japan.

The Japan semiconductor manufacturing supply chain is a global semiconductor industry workhorse, producing about one third of world’s chip equipment and more than half of its semiconductor materials. In contributing the vast majority of these products, SEMI Japan member companies hold the high distinction of enabling continuous development of the worldwide semiconductor industry. Aptly, then, technology powerhouses IBM, Nissan Motors and Toshiba offered insights into the latest trends and innovations in computing and smart cars at the late-May SEMI Japan Members Days in Tokyo with 133 technologists from member companies in attendance. As the audience discovered, chip innovation never sleeps and, as futuristic as it can be, invariably gives rise to possibilities beyond the human imagination. That was the message of kickoff presentation “Computing Reimagined – AI/Quantum/IoT” – by Dr. Shintaro Yamamichi, Senior Manager, Science Technology at IBM Research-Tokyo. Dr. Yamamichi cited three examples of how semiconductors uncover new technology frontiers. Computational materials discovery, a novel methodology, is the application of theory and computation to unearthing new materials and the key to enabling an ongoing stream of semiconductor innovation. In particular, using cognitive technology to mine huge volumes of literature reveal new insights into materials that uncover even more functionality such as greater conductivity and heat resistance. With new materials the oxygen of ever more advanced semiconductor chip manufacturing, the semiconductor industry will surely benefit from this methodology. The opportunity to accelerate quantum computing innovation is now. Launched in May 2016, the IBM Quantum Experience gives students, researchers and general science enthusiasts hands-on access to IBM’s experimental cloud-enabled quantum computing platform. The online platform features a forum for discussing quantum computing topics, tutorials on how to program IBM Q devices, and other educational material about quantum computing. Dr. Yamamichi encouraged the audience to join the program. The world’s tiniest computer, unveiled by IBM at the company’s Think 2018 conference in Las Vegas, packs several hundred thousand transistors and, IBM claims, the equivalent power of a 1990s x86 chip into a package smaller than a grain of salt. The computer’s small form factor (less than 1mm x 1mm) and low manufacturing cost means it can be embedded in product price tags and packages as an anti-fraud device using blockchain technology. Vehicles need to be both electric and intelligent as countries become more populous and traffic density increases. More drivers extend average drive time, boost greenhouse emissions, devour precious energy resources and lead to more traffic congestion and accidents. Dr. Haruyoshi Kumura, fellow at Nissan Motor, highlighted these issues in stressing the importance of a new era of intelligent mobility. To mitigate these problems, Nissan is focusing on the electrification and intelligence of its vehicles: Nissan’s electric vehicle, Leaf, reduces accidents with electric intelligence systems such as e-Pedal, which uses an accelerator pedal only for both acceleration and deceleration, and ProPILOT Park, a feature that automatically parks the car by using multiple cameras and ultrasonic sonars to detect pedestrians and other objects around the vehicle. With more than 90 percent of traffic accidents caused by driver error, Nissan plans to introduce autonomous driving on multi-lane highways by the end of 2018 and on city streets by 2020. By 2022, the company plans to roll out full autonomous driving to reduce traffic accidents caused by inattentive drivers. For full autonomous driving to materialize, sensor fusion technology must incorporate a combination of technologies – radar systems, light detection and ranging (LiDAR) systems and cameras – to identify the shapes and locations of nearby moving objects and measure their speed. Sensed information is then processed by a 3D graphic analyzer to make electric throttle, braking and steering decisions. The outlook for automotive industry includes car sharing and more electrification – both insights from Yoshiki Hayakashi, general manager, automotive solution strategic planning division at Toshiba Electronic Devices Storage, who offered his perspectives on trends in Japan’s automotive industry and beyond. To meet the requirements of the COP21 Paris agreement, the global automotive industry is shifting to electrification. Toshiba estimates 60 percent of new cars will be electric vehicles by 2040 to meet the International Energy Agency’s global EV outlook. In Japan, autonomous driving or advanced driver assistance systems (ADAS) will be offered in certain areas by 2020, the year of the Tokyo Olympic games. Growth of these advanced driving systems hinges on infrastructure development. Supporting data centers, intelligent transport systems, vehicle-to-everything connections, and smart city are all necessary components. Car ownership will begin to cede ground to car sharing with technology elites such as Tesla, Apple and Google leading the way. To expand the car-sharing industry, new alliances will take shape between new and old-guard automotive companies and electronics manufacturing services (EMS) providers. Autonomous driving requires precise 3D renderings of actual roadways using sensors for route mapping. While sensor fusion must be deployed for these capabilities, LiDAR offers better sensing range and space resolution precision than ultrasonic sonars, radars, and cameras. The next SEMI Japan members day is scheduled for October 30 in Tokyo. SEMI holds similar events in most regions where SEMI and its members operate. For the members events in your region, contact the SEMI office nearest you. Yoichiro Ando is a marketing director in SEMI Japan.