Internet of Things

Electric mobility, renewable energy and other technology innovations like IoT, 5G, smart manufacturing and robotics all require reliability, efficiency, and compact power systems, fueling the adoption of Silicon Carbide (SiC) and Gallium Nitride (GaN) to support lower voltages in significantly smaller devices. But chip designers must overcome the technological and economical challenges of integrating the two semiconductor materials into power systems.SEMI spoke with Elisabeth Brandl, Business Development Manager at EV Group about trends and new developments within the power electronics industry and the devices' application in smart mobility. Brandl shared her views ahead of her presentation at the SEMI SMART Mobility Forum, 18 February, as part of the SEMI Technology Unites Global Summit, 15-19 February 2021, online event. Join us to meet experts from EV Group and other key industry influencers. Registration is open. SEMI: What is driving new developments in power electronics?Brandl: Globally there are significant changes in infrastructure requirements for communication, automotive and power conversion. We need to look no further than the rising adoption of 5G, electric and hybrid vehicles, and renewable energy as examples of drivers of these changes. The device level, particularly in the field of power electronics, figures prominently in these shifts.The power electronics industry faces a growing number of scenarios where conventional silicon power devices are no longer suitable and are easily outperformed by new architectures mainly based on wide bandgap semiconductor materials like Silicon Carbide (SiC) and Gallium Nitride (GaN).SEMI: What industry challenges is power electronics innovation aiming to solve? Brandl: Power conversion efficiency is very important and needs further improvement as the related losses significantly contribute to the overall power consumption. For green power and a better environmental footprint, renewable energy is crucial, but so is overall power-consumption efficiency, yet the role of power devices is often underestimated. High-frequency and high-power applications, such as data center applications and inverters for renewable energy, where silicon power electronics are reaching their limits, are also important areas in power electronics.SEMI: How will the transition from silicon to compound semiconductor materials help?Brandl: The superior material properties of several compound semiconductors can tackle the need for lower losses in power conversion or better high-frequency behavior. Today, we mainly talk about GaN and SiC power devices as they are materials well-suited to address these needs. However, other materials like diamond and gallium oxide are in development for these applications. Material properties of SiC that enable thinner materials with lower power losses and better thermal behavior address power conversion efficiency as well as form factor challenges. GaN, especially in a high electron mobility transistor (HEMT), can be used for high-frequency applications.SEMI: What enables a better and more cost-effective manufacturability of SiC and GaN power devices?Brandl: For the end customer, a typical figure of merit regarding the cost effectiveness is $ per Ampere or Watt. While this seems simple, the reality is of course more complex. It is important to understand the main cost contributors within the manufacturing area. For SiC, this is clearly the substrate cost. In my presentation, I will show a way to reduce this cost via wafer bonding. For GaN, epitaxy – a method for growing or depositing mono crystalline films on a substrate – is the critical parameter. And of course, yield has a very big impact on cost effectiveness too, which means that good process control including metrology is very important.SEMI: Many semiconductor companies are already transitioning to silicon carbide and gallium nitride. Can you give us an example of a success story?Brandl: All the big power device manufacturers have either acquired or developed their SiC and/or GaN power device technology, so they also see a bright future for these wide bandgap semiconductors in the power device market. The most prominent success story is STMicroelectronics with its SiC MOSFET power devices, which have been implemented by Tesla in its Model 3 vehicles since 2018.SEMI: What is coming next?Brandl: New materials for power devices are being explored, such as diamond and gallium oxide. For SiC, the trend is moving toward 8-inch substrates, which is the focus of the funded EU project REACTION under the coordination of STMicroelectronics. Cost reduction and substrate availability also play a big role. All major power device manufacturers have contracts to secure the supply chain for SiC substrates because material availability is the main uncertainty at this time. Finally, collaborations along the supply chain are crucial and generally beneficial for all parties, as development requirements are better communicated and prioritized.Elisabeth Brandl is Business Development Manager at EV Group. She received her master in technical physics from the Johannes Kepler University Linz, Austria in Semiconductor and Solid State Physics. Since 2014, she has been responsible for Product Marketing Management for temporary bonding and compound semiconductors at EVG. The SMART Mobility Forum is the digital platform of SEMI Europe’s Global Automotive Advisory Council (GAAC) for industry stakeholders along the automotive and electronics value chains, from Design, Semiconductor Equipment and Materials Suppliers to Automotive OEMs.Smart Mobility is one of four SEMI initiatives focused on building communities, content, and activities around critical and emerging electronics markets. Read more about our Regional Chapters.Serena Brischetto is senior manager of Marketing and Communications at SEMI Europe.

SEMI spoke with Tom Doyle, founder and CEO of Aspinity, about the challenges of packing more localized intelligence into portable Internet of Things (IoT) devices without draining their batteries. Doyle shared his views on Aspinity’s system-level approach – solve the power problems by performing machine learning in analog – ahead of his presentation at the SEMI MEMS Imaging Sensors Technology Showcase, 18 February, as part of the SEMI Technology Unites Global Summit, 15-19 February 2021, online event. Join us to meet experts from Aspinity and other key industry influencers. Registration is open. SEMI: Why is power efficiency so important for IoT devices? Doyle: Hundreds of millions of IoT devices are improving our lives at home and at work. Always on and always sensing the environment for data, these smart devices have traditionally been wall-powered and have relied on the cloud for their data processing needs, but clogged networks, as well as privacy and performance issues, have necessitated the migration to edge processing.Spanning consumer, medical and industrial, these IoT devices are becoming smaller and more portable. And a portion of them is operating remotely in hard-to-access locations. So now we are packing more functionality into the device and we are moving to battery power and the batteries need to last a long time. That is a big challenge before us, and to answer it, we need to find the most power-efficient ways to integrate always-on sensing capability into IoT devices because we cannot afford to have short battery life limit market adoption.SEMI: Why is it so challenging to deliver low-power, always-on solutions and how can sensors suppliers achieve improvements in system power? Doyle: In today’s always-on IoT devices, all sensor data – which are naturally analog – is immediately digitized at high resolution, and then it’s analyzed to determine whether a wake word has been spoken, a specific motion has been made, or some other anomaly has occurred. But since most of the data collected will not contain the information for which the device is waiting, this digitize-first approach wastes significant battery life by continuously running irrelevant data through the ADC and the digital processor.Sensors suppliers have some options to consider for reducing power. If they are satisfied achieving incremental improvements in battery life, both sensors and digital processor suppliers can continue to drive down the power of each individual component in the system. But to achieve revolutionary power savings, we must look at a more holistic system solution.The fundamental problem is that moving data through a system costs power. That is why the most efficient way to save power is to reduce the amount of data down to what’s actually important as early as possible, right at the start of the signal chain, where the physical world becomes data. If we can minimize the amount of data that require downstream processing, then we can maximize battery life.SEMI: Aspinity aims to solve the battery-life problem in IoT devices by introducing a new system architecture. Could you explain how your approach differs from digitize-first?Doyle: Aspinity’s solution, called the Reconfigurable Analog Modular Processor (RAMP), is an analog processing technology that combines analog machine learning (analogML™) and analog compression to enable accurate, ultra-low-power analog event detection and system wake-up. RAMP technology enables a new system architecture, which we call analyze-first, that allows an always-on system to spend just a little bit of analog power up front at the sensor to determine whether sensed data are relevant to the task at hand before waking the digital system for further processing. The analyze-first architecture can extend battery life by months or years over digitize-first architectures because it keeps the higher-power digital components asleep unless important data require digitization and analysis, which in some applications – such as voice-first or acoustic event detection – may occur very rarely. Aspinity RAMP voice activity detection with preroll from Aspinity on Vimeo. SEMI: Can you give us an example?Doyle: Here is a practical example of how this works: For most voice-enabled systems, such as smart speakers, voice-activated TV remotes and hearables, voice is only present 10%-20% of the time – but the digitize-first architecture on which these devices are traditionally based is digitizing 100% of the sound data captured by the microphone, even when most of that data are irrelevant and could not possibly contain a wake word.In contrast, the RAMP-based analyze-first architecture is highly efficient since it uses feature extraction and a neural network to analyze the sound at the microphone, right where it enters the device, to determine if the sound contains voice before waking the digital wake word engine. Additionally, the accuracy of most wake word engines relies not just on waking up and analyzing the wake word, but also on analyzing the 500ms of sound prior to the wake word (preroll). To support wake word engine performance, the RAMP also continuously compresses 500ms of preroll that can be stored in just 2k of memory and delivered to the wake word engine along with the voice data. So, this new analyze-first approach using RAMP technology can extend battery life by 10 times over older digitize-first designs, without sacrificing performance and accuracy.SEMI: What solutions can Aspinity bring to address the current market needs? Doyle: Aspinity offers the only analogML chip for always-on IoT devices that run on battery: the RAMP chip.The RAMP is trainable and programmable to detect many different types of sensor events directly from the raw analog sensor data. One application that benefits from a RAMP chip are devices that are always-listening for voice, for glass break or alarms, or for some other type of sound. Other examples include vibration sensors that monitor industrial equipment for predictive and preventative maintenance, and heartrate sensors that are used to detect anomalies in wearables and other biomedical applications.Aspinity just recently introduced our voice-first evaluation kit – which we will be demonstrating during the Technology Showcase at Technology Unites – to enable our customers to get first-hand experience with our RAMP-based analog voice wake-up solution. With this complete hardware and software kit, customers can experience all of the benefits of analogML and analog data compression – 10x power savings without a reduction in wake word detection accuracy –for their next generation of voice-enabled devices.SEMI: How can technology unite us? What do you expect from your participation at SEMI Technology Unites Global Summit?Doyle: I think this past year has shown us that when time gets tough – and for many of us, the COVID-19 pandemic has been one of the most difficult challenges we have faced – that innovation is critical to solving major problems. The microelectronics industry has played an important role in providing critical components for COVID-19 testing, ventilators, air-purification systems, and other equipment used in healthcare settings. COVID-19 has also accelerated the move to voice as a preferred interface to many devices in an effort to stem the spread of germs on surfaces.The biotech industry is gearing up to provide the vaccines that we hope will restore more normalcy to our daily lives. We can thank the successful collaborations between R D innovators and established companies in many different markets for the new devices and drugs now going into production.With traditional in-person conferences still on hold until the pandemic eases up, attending industry conferences with exceptional speakers presenting interesting content is more important than ever. SEMI Technology Unites Global Summit provides that opportunity, and I’m genuinely looking forward to participating.Tom Doyle, Founder and CEO of Aspinity, brings over 30 years of experience in operational excellence and executive leadership in analog and mixed-signal semiconductor technology to Aspinity. Prior to Aspinity, Tom was group director of Cadence Design Systems’ analog and mixed-signal IC business unit, where he managed the deployment of the company’s technology to the world’s foremost semiconductor companies. Previously, Tom was founder and president of the analog/mixed-signal software firm, Paragon IC solutions, where he was responsible for all operational facets of the company including sales and marketing, global partners/distributors, and engineering teams in the US and Asia. Tom holds a B.S. in Electrical Engineering from West Virginia University and an MBA from California State University, Long Beach.Serena Brischetto is senior manager of Marketing and Communications at SEMI Europe.

While Artificial Intelligence (AI) emerged in the 1950s, only in recent years have AI applications proliferated with the explosion of data and continuing improvements in Moore’s law that have driven rising processing speeds. Voice assistants, image analysis software, search engines, and speech and facial recognition systems were among the first applications to use AI. Today, adoption has spread to sectors such as agriculture, cybersecurity, healthcare, software development, e-government and the intelligent enterprise to generate jobs and help spur economic growth. The Edge AI Opportunity and the Microelectronics IndustryAI can be embedded in hardware devices such as advanced robots, autonomous cars, drones or Internet of Things (IoT) applications. Today, according to the EU’s digital strategy, data centres and other centralized computing facilities account for the vast majority – 80% – of AI data processing and analysis, with smart connected objects such as automobiles, home appliances and manufacturing robots that bring the compute function closer to the user representing 20%. The latter, known as Edge AI applications, are powered by edge-based machine learning chipsets, not the AI chipsets designed to run cloud-based machine learning algorithms.The EU’s white paper on AI published in February 2020 anticipates that the way data are stored and processed for AI applications will change significantly over the coming five years as edge computing applications proliferate. Most AI applications need to connect with devices that collect data and manage data flows. When the applications connect with cloud infrastructures to train large volumes of data for a machine learning model, the interface devices often require hardware support. Edge AI can minimize data transport by processing data directly from local devices to accelerate data analysis and decision-making and make data transport or accelerator hardware unnecessary, critical in reducing power consumption and enhancing data security for applications such as autonomous driving. Over the past 40 years, the ICT sector has been continuously increasing greenhouse gas (GHG) emissions despite efforts to shift to renewable energy. Cloud-based AI applications require an ICT infrastructure for high-performance computing and high-speed connectivity. According to MIT Technology Review, data centres’ AI workloads could account for a tenth of the world’s electricity usage by 2025. a mass update of cloud-based AI applications may significantly increase energy consumption, unlike with Edge AI. This is why the strategy for developing Edge AI is well-aligned with the EU’s Green Deal objectives. Europe aspires to play a leadership role in Edge AI to strengthen the sector’s competitiveness and protect the European digital sovereignty. Europe’s strong industrial competencies in embedded systems and microcontrollers will help the region promote development of European domestic AI solutions for emerging high-value IoT applications in industrial processes such as Industry 4.0, Connected and Automated driving (CSA), smart cities, climate action, healthcare, and national defence and security. With this strong strategic position in technology, Europe is well-positioned to invest to become the leader in the Edge AI global market.Preparing the Workforce for the Microelectronics IndustryTo design and manufacture leading Edge AI chipsets, European education providers and industry will need to work closely together to train the current and future workforces. Within the framework of the METIS project, a four-year project co-funded by the European Commission through the Erasmus+ programme, SEMI and imec deployed experts in the field to survey and interview focus groups. The survey identified the following key focus areas for workforce development: 1. True Capability of AI and Data Science With AI’s heavy dependence on data, the workforce of the future must be trained in areas of data science including data integrity to ensure quality, unbiased sourcing, collection and accurate analysis necessary to interpret huge volumes of data. Europe also needs to train the next generation of AI chip designers in data security and privacy – key challenges to the widespread deployment of Edge AI chips. 2. Climate Change, Sustainable Development Goals (SDGs) and Social Inclusion TrainingSince the industry must be able to develop Edge AI solutions to enable the digital transformation while limiting GHG emissions, microelectronics engineers need to be schooled in climate change and understand how their work contributes to meeting the United Nation’s Sustainable Development Goals (SDGs). Workplace diversity and social inclusion are also important target areas for education since Edge AI applications should serve various groups of people with different needs.3. EthicsChip industry workers must also be educated in ethical issues of AI related to the technology’s potential societal impact in the near future[1]. With AI applications capable of monitoring Internet searches based on users’ personal preferences and biases to deliver tailored advertising, news and other information, developers must recognize how the technology can influence thinking and behaviour of individuals and groups. This awareness can help developers strike a balance between supporting commercial interests and societal good so the microelectronics industry can ensure ethical implementation of AI. 4. Cross-disciplinary Skills Required for AIAI development requires a comprehensive, cross-disciplinary skill-set to be able to integrate the work of specialists from diverse educational, cultural and professional backgrounds critical to developing non-biased AI solutions. For example, in addition to technical expertise, microelectronics AI developers must be able to communicate clearly and work in close-knit teams with non-technical experts from business, law, medicine and the social sciences.What’s Next?The microelectronics industry has a tremendous opportunity to develop new chip-based solutions for AI architectures, and apply AI techniques to improve operational efficiencies of design and manufacturing. To seize this opportunity, the industry must work closely with education providers to groom the next generation of skilled workers. This tight collaboration is critical to designing and delivering specialised courses to college and university students as well as engineers now working in the chip sector. The stakes are high. By preparing workers to develop Edge AI chipsets, the microelectronics industry can help the world confront some of the greatest challenges it faces today.For more information, see SEMI Responds to European Commission White Paper on Artificial Intelligence.METIS is a Sector Skills Alliance project co-funded by the European Commission’s Erasmus+ Program and coordinated by SEMI. The four year project, launched in November 2019, will develop a Microelectronics Skills Strategy. Based on the strategy, the METIS project will design 43 training modules for 1,100 hours learning in four key areas of the microelectronics sector.We thank Patrick Blouet (STMicroelectronics) and Jeroen Geusens (imec) for their valuable contributions to this article.[1] Ethics of Artificial Intelligence and Robotics, Stanford Encyclopedia of PhilosophyDr. Yanying Li is senior manager of Collaborative Projects at SEMI Europe.Dr. Pushkar P. Apte is the strategic technology advisor for the Smart Data AI Initiative at SEMI

A 500,000 ft2 (~47,000 m2) state-of-the-art cleanroom facility still towers as the largest U.S. high-technology investment in Vietnam 10 years after starting operations in Saigon High Tech Park in District 9, Ho Chi Minh City. The structure built by Intel Products Vietnam (IPV) on the back of a $1 billion investment is the largest assembly and test manufacturing facility (ATM) in the Intel assembly and test network. IPV turns out products that are helping power cutting-edge applications along with the next wave of semiconductor industry growth as it homes in on 5G, Internet of Things (IoT), desktop and mobile. And it has been a boon to the local economy, generating more than 5,000 high-skill jobs across a number of assembly and test disciplines since launching operations in 2010. It has also contributed to over US$37 billion in exports from 2010 to 2019, accounting for over 60% of Saigon High-Tech Park’s annual export values in 2019. With its vision “to create the future of Intel and Vietnam,” Intel continues to be a strong long-term partner in Vietnam. I recently spoke with Kim Huat (KH) Ooi, vice president of Manufacturing and Operations and General Manager at Intel Products Vietnam (IPV), about the facility’s vital role in Intel’s overall manufacturing operations, its support for the E E ecosystem in Ho Chi Minh City, and measures it has implemented to reduce the impact of the COVID-19 pandemic on the facility and protect employees. Ooi leads and manages the site to support Intel’s business in Vietnam. His responsibilities include overseeing factory operations and employee relations; enriching the Intel image and brand; building strategic relationships with communities, media, governments, and local authorities; and working with the industry ecosystem and government. IPV employees celebrate Intel’s 50th anniversary in 2018. Ng: How does IPV campus complement the rest of Intel manufacturing sites and be nearer your customers and supplier base?Ooi: Intel Vietnam is an important part of Intel’s manufacturing presence worldwide. IPV has been operating for nearly 14 years in Vietnam and has celebrated multiple milestones along the way. As a site, we have matured and grown over the years. In March this year, we celebrated a proud milestone – the rollout our 2 billionth unit – that reflects the value of IPV to Intel Corporation as these Made in Vietnam products support its customers worldwide. One of our philosophies is to work with and grow local ecosystems in countries where we operate. In Vietnam, Intel has been offering technical and managerial expertise to many local suppliers in Vietnam to help them expand their business and services to other foreign direct investment (FDI) customers in the industry. Over the past 10 years, Intel’s supplier list has grown 10-fold from 20 in 2010 to about 180 suppliers in 2020.In today’s world of fast-changing consumer preferences and expectations, we need to help drive development of the latest products and technologies to support strong customer demand and new product portfolios such as 5G. To support evolving customer requirements, our workforce frequently upgrades its skills to work on new products and technologies.Intel as a company is also evolving as it transforms from a PC-centric to a data-centric organization, a shift behind the more than US$70 billion in record revenue Intel posted in 2019. Intel’s data-centric business accounted for more than half of that revenue. IPV plays a key role in Intel’s expansion into new market segments.Ng: What are the key differentiating elements (talent, tax, technology, trade, EHS) in Vietnam that have been instrumental in supporting the E E ecosystem in Ho Chi Minh City?Ooi: Vietnam’s stable political environment and increasingly liberalized trade and investment policies are great for businesses. The region’s young, talented workforce is also one of many competitive advantages that enables it to attract foreign investment. Intel’s announcement to invest in Vietnam in 2006 has played a large part in helping put Vietnam on the map of the global IT and semiconductor industry. The news helped attract industry suppliers and service providers, bolstering Vietnam’s economy and creating jobs. The Vietnam government also figured prominently in sparking the boon by establishing the right policies and incentives to attract foreign investment. Since starting operations, we have seen significant improvements in infrastructure such as roads, ports, airports, broadband and power supply. Vietnam’s standing in the global business community is even stronger today after the government successfully combatted the COVID-19 pandemic early on and introduced policies to help businesses restart operations. We expect all these factors to continue to make Vietnam an attractive relocation target for companies around the world. Ho Chi Minh City People’s Committee Vice Chairman Mr. Duong Anh Duc (center) visited Intel Vietnam to tour the state-of-the-art facility. Ng: What measures have you implemented to reduce the impact of the COVID-19 pandemic and protect employees? Ooi: COVID-19 has taken the world by storm and changed the way we work and live in many ways. It has unquestionably pushed the world to build stronger partnerships among individuals, organizations, businesses and communities. Intel’s manufacturing operations have continued to run at full capacity. Since the outbreak emerged, we have strictly followed required Intel safety measures as well as the Vietnam’s health guidelines. We have also implemented a number of other safety initiatives and protocols to ensure our business runs smoothly. We’re doing everything possible to ensure the well-being of our employees and help them better respond to the pandemic.In coordination with our strategic partners, we have been donating thousands of Personal Protective Equipment (PPE) to the Fatherland Front and Department of Health (DoH) since early March. Recently, in partnership with AmCham Vietnam, Intel donated an imported ambulance with built-in essential equipment to the Ho Chi Minh City 115 Emergency Center. Intel has also teamed with Saigon Hi-Tech Park management to donate two ventilators and N95 masks to DoH.Our employees are also helping out by donating to Vietnam’s Coronavirus Donation Matching campaign. We collected US$13,000 from Intel employees and included matching funds from Intel Foundation to support three non-profit organizations (NPOs) – Saigon Children’s Charity, Kidspire Vietnam and Teach for Vietnam. All told, Intel Products Vietnam has donated US$200,000 to COVID-19 relief efforts, demonstrating our long-term commitment to communities where we operate. Intel Products Vietnam teamed with AmCham Vietnam to donate a fully equipped ambulance to Ho Chi Minh City’s 115 Emergency Center, demonstrating IPV’s long-term corporate social responsibility commitment. In early May, Intel unveiled our 2030 Corporate Strategy and goals to accelerate progress against the world’s critical challenges and help drive positive global outcomes. Part of our 2030 goals, our RISE (Responsible, Inclusive, Sustainable, Enabling) strategy focuses on the company’s commitment to its corporate social responsibility (CSR) initiatives to create a more responsible, inclusive, safe and sustainable world through technology and collective action. IPV has also committed to implementing the RISE strategy in Vietnam with local community initiatives and technology interventions. Bee Bee Ng is president of SEMI Southeast Asia.

Even though microchips continue to get smarter, vital security gaps continue to be exposed through such hack attacks as Meltdown, Spectre, and in recent weeks, Plundervolt. Researchers continue to discover open doors in chip architectures for malicious players to steal increasingly sensitive data, hide the identity of counterfeits, or tamper with electronics systems most anywhere along the global microelectronics supply chain. Today, it’s impossible to have full visibility of the distributed chip making process – from design and fabrication to packaging, testing and delivery. That’s why our industry’s future hinges to a large degree on establishing a hardware root of trust throughout the silicon’s operational lifecycle. Trust but verify! It’s easy to say, but how do we do it?To gain insights, SEMI interviewed Dr. Mark Tehranipoor, currently the Intel Charles E. Young Preeminence Endowed Chair Professor in Cybersecurity at the University of Florida’s Electrical and Computer Engineering Department. A foremost authority on microelectronics security and trust, counterfeit electronics detection, and supply chain risk management, Dr. Tehranipoor will be a keynote speaker at the SEMICON Taiwan Security on Chip Summit, Friday, September 25, where a full program of industry leaders will address key security challenges and solutions involving IoT, systems on a chip (SoCs), integrated circuits, physical unclonable function (PUF) technology, future design, certifications, managed services, and more.For additional insights and to hear Dr. Tehranipoor’s full presentation, register for SEMICON Taiwan 2020, which SEMI is holding as a hybrid event with both a virtual format and an in-show program September 23-25.SEMI: What are the major uncertainties in providing the hardware root of trust within the cyber domain?Tehranipoor: One of the most critical issues we’re dealing with now is loss of control over the process of designing and fabricating integrated circuits and systems. This has happened along with globalization and the movement of supply chain operations overseas to lower costs of nearly all goods, including electronics products and semiconductors. As skill sets, talent, design and fabrication have all shifted offshore, concerns have also risen about security controls across the many different segments of the microelectronics supply chain.For example, when you think about the security of military, space, transportation, power grids, financial or other networks, it becomes a major concern if you cannot trust the underlying electronics system that runs them. New SoCs are also holding more sensitive data around encryption keys, biometrics, personal information or banking data. And as reports escalate about cybersecurity gaps at the electronics part level, it’s increasingly important to establish a hardware root of trust. Today, it’s not enough for a buyer to just call up the design house and verify the electronic ID of an asset. The ID might match, but the device could have been tampered with or replaced with a counterfeit somewhere along its end-to-end journey. Unlike software or networks where problems can be automatically identified, upgraded and fixed, verifying electronic hardware is a costly and time-consuming process, especially when they’re as complex as microchips. It can take months to deconstruct, reverse engineer, inspect, and authenticate a chip. By then, discovery of any security breaches is too late.When addressing the security of electronics systems, there are three important features to keep in mind. First, there’s confidentiality. The device shouldn’t leak information to an unauthorized user. Second, there’s integrity. Unauthorized users should not be able to manipulate an SoC’s sensitive data. The third feature is availability, which can be a result of Denial of Service (DoS) attacks. If the device is under attack and can’t access your online service or network, you must still have security measures for your electronics system to be available in a safe mode while you simultaneously identify the problem, recover from it, and return to normal functions.SEMI: What framework should be followed to establish greater trust and confidence across the entire microelectronics supply chain?Tehranipoor: In the United States, we recognize it may not be possible to bring all manufacturing, design, and delivery teams back to this country and have them certified by the U.S. Department of Defense. You could do some of it, but it would be very costly and complex to bring back all the design, fab, testing, and packaging operations involved with electronics systems and still have complete control.The most practical approach is to make sure we design electronic systems with security and trust in mind from the start. We need to provide security features up front throughout the extended supply chain – into the design flow, fab flow, and out into the field to make it easier and faster for anyone at any point to verify the authenticity of an electronic system as well as identify and mitigate a problem. Finally, we have to remember that we are all in this together – designers, developers, packaging facilities and fabs. We can’t just blame semiconductor manufacturers or any other single entity. As a result, we must be cooperative and collaborative by focusing on this issue as a consortium. Everyone in this ecosystem must come to the table, share best practices, establish standards, and initiate best practices for device to system authentication.SEMI: How can SEMI and the SEMI Electronic System Design (ESD) Alliance help the industry meet these challenges?Tehranipoor: It’s certainly of utmost importance for members of organizations like SEMI and its ESD Alliance committees to jointly develop and adhere to standards or guidelines that establish hardware root of trust across all participants in the global supply chain. At the same time, such alliances should make it a high priority to protect each company’s intellectual property (IP). Collectively, we need resolutions that allow us to develop unique IPs and more easily trace, identify, and verify the authenticity of electronics systems as they flow throughout the end-to-end electronic supply chain. Great efforts are under way and progress is being made. But it’s not enough. Clearly, more needs to be done to establish root of trust standards at the chip level.I can’t emphasize enough the importance of consortia like the SEMI ESD Alliance to create an environment where industry, government, and academia can come together, share best practices and even case studies on how they handled security vulnerabilities and breaches. We understand that not everyone wants to share their security problems, vulnerabilities, or attack surfaces, but learning from each other’s experiences can have a tremendous impact on industrywide progress. If you don’t know what you need to address, you won’t be able to address it when it happens.I also encourage organizations like SEMI to create standards or guidelines that reduce the complexity of microchip designs for security purposes. Realtors often say there are three things to consider in finding a home that will appreciate in value: Location, location, location. To build more secure electronics systems, my mantra is: Automation, automation, automation. Complexity is the enemy of security. By using automation to simplify security mechanisms and detect inconsistencies, it will be easier to find and fix security problems, not to mention lower costs at the same time. SEMI: What will an attendee take away from your talk at SEMICON Taiwan?Tehranipoor: I have a large team of researchers who day and night spot vulnerabilities by attacking and assessing data from different electronic systems set up in our labs. Attendees will see real-world examples and lab animations that show how electronics systems can be hacked most anywhere across the supply chain. They will also learn about step-by-step security solutions we have developed at the microchip level. We need to do a better job of protecting the security of our semiconductor assets and the electronic solutions or services they power. My call to action will be that we need to invest more in research and foster an environment of more open trust and cooperation. We can do this by bringing together different countries, companies, and organizations in the microelectronics ecosystem to overcome this major challenge.Dr. Mark Tehranipoor is currently the Intel Charles E. Young Preeminence Endowed Chair Professor in Cybersecurity at the ECE Department, University of Florida. He is currently serving as Director for Florida Institute for Cybersecurity Research (FICS), National Microelectronics Security Training Center (MEST), CYAN Center of Excellence, and ECI Transition Center. He also serves as Program Director of Cybersecurity for UF Herbert Wertheim College of Engineering. His current research interests include IoT security, hardware security and trust, and reliable circuit design.Samer Bahou is senior manager of corporate communications at SEMI.

Teck Khiong, WOI, senior manager of Factory Integration at Infineon Technologies Asia Pacific Pte Ltd, recently shared with me how the Infineon backend plant in Singapore has benefited from its journey to qualify for the lighthouse certification.WOI is driving Infinion smart manufacturing projects with a strong focus in the area of connect and control using IoT (Internet of Things) and analytics technologies. Ng: How did the Infineon backend plant in Singapore distinguish itself to qualify for lighthouse certification? WOI: The Infineon Singapore backend manufacturing plant is proud to be a Lighthouse Certified Smart Manufacturing site as part of the World Economic Forum’s (WEF) Fourth Industrial Revolution platform. Our Industry 4.0 (I4.0) implementation reduces labor costs by 30% and improves capital efficiency by 15%. We drove this successful digital transformation continuously investing in our people development and digital backbone.Of the many initiatives under our I4.0 Smart Factory platform, five were selected for WEF Lighthouse submission and certification. Digital foundation with integrated connectivity and workflow execution We implemented an Internet of Things (IoT) framework to connect machines to manufacturing system more than two years ago. The digitization of our Work-in-Progress (WIP) management systems provides full traceability and gives us better control of the four Ms (Man-Machine-Method-Material). Material handling and process automation We progressively deployed automated solutions starting six years ago using autonomous transport, robotic material management systems and automation of packing processes. This eliminated non-value touches in areas of WIP storage and retrieval. Advanced algorithms enabled WIP scheduling and dispatching As our product mix and volume grew in complexity, our advanced algorithms has enabled us to increase our machine uptime, thus reducing idle and set-up time. Manufacturing control tower Our control tower provides a real-time pulse of the entire manufacturing process, from machine efficiency to quality. The tower also improves data integrity and collaborative information sharing while issuing early-warning alerts that enable exception management and timely decisions. Running a global virtual factory Our Global Production Network deployments allows us to connect and manage a growing contract-manufacturing network in real time, with the same transparency, traceability and control as if the manufacturers are our internal sites.About Teck Khiong, WOITeck Khiong, WOI graduated from Loughborough University in the UK with a Master of Science degree in Computer Integrated Manufacturing (CIM). For more than 20 years he has delivered manufacturing IT solutions to global backend (assembly and test) semiconductor manufacturing, ranging from equipment, factory, process control, material handling automation and manufacturing execution systems (MES).

The world’s most advanced manufacturing factories are leading the way in driving efficiency and sustainability.In advance of its 2020 meeting, the World Economic Forum welcomed Micron into its Global Lighthouse Network, a group of advanced manufacturers “that are showing leadership in applying the technologies of the Fourth Industrial Revolution to drive operational and environmental impact.”For years, Micron has been helping clients integrate artificial intelligence (AI), big data analytics and the industrial internet of things (IIoT) into their factories. And now Micron’s factory is one of the first facilities in Singapore, along with Infineon, to be recognized by the Global Lighthouse Network.In a recent interview with Channel News Asia, Manish Bhatia, executive VP of Global Operations, explained how Micron has been practicing what it preaches: “Our products enable new technology trends such as IoT, 5G, cloud computing and autonomous driving. Applying these technologies in our own manufacturing facilities demonstrates the enormous potential in driving business value. Industrial IoT and artificial intelligence are part of the biggest revolution since the advent of robotic manufacturing productivity 50 years ago.”For Micron, this journey started with the need to “keep pace with the technological advancement of our semiconductor processes,” Manish said. “We wanted to provide higher-capacity, higher-performance, lower-cost and lower-power chips.”This meant embarking on the same journey they guide clients through: “We started by focusing in 2014 on simple statistical analysis to improve our production processes,” Manish said. “Following that, we developed more complex deep learning and AI capabilities to draw insights from our data. Most recently, we introduced IoT sensors — like cameras and acoustic sensors — to gather even more data that allows us to further improve our production processes.”The Singapore factory plays a critical role in developing leading-edge NAND. Micron’s Singapore presence, composed of two wafer-fabrication facilities and one assembly and test facility, serves as the base for worldwide operations. With over 500,000 square feet of cleanroom space, the location is also a designated NAND Center of Excellence, driving the implementation of the company’s leading-edge 3D NAND production for use in mobile phones, solid-state drives, digital cameras and more. Micron employs approximately 8,000 people in Singapore.The World Economic Forum says the results of the Singapore transformation have been spectacular: Micron’s “semiconductor fabrication facility has integrated big data infrastructure and IIoT to implement artificial intelligence and data science solutions, raising product quality standards and doubling the speed at which new products are ramped.”Below are notable achievements that Micron was recognized for: Automation of production and maintenance produced a 4% tool availability improvement. The IIoT-enabled smart factory led to a 22% scrap and product downgrade reduction. Advanced analytics for process optimization with OEMs reduced time to ramp new products by 50%. Deep learning optical-defect detection created a 2% yield improvement. The integrated deviation management platform reduced time to resolve quality issues by 50%. Micron was a natural choice for the Global Lighthouse Network, an organization whose creation is timely. The World Economic Forum points out that “global production industry is lagging in its adoption of Fourth Industrial Revolution manufacturing technologies, with more than 70% of companies stuck in pilot-phases … [There is] a need for a neutral learning platform to showcase top-use cases, roadmaps and organizational approaches to adopting and scaling technologies from which other companies globally could benefit.”As part of the Global Lighthouse Network, Micron will be able to share knowledge and best practices with peers, support new partnerships and help other manufacturers deploy technology, adopt sustainable practices and transform their workforces. We can all build on this community of like-minded organizations, levering technology to improve efficiencies and promote sustainability.This recognition from the World Economic Forum is a win-win. We look forward to joining the club of lighthouse factories around the world and to helping propel the entire global manufacturing industry into the Fourth Industrial Revolution. At Micron, we are at the forefront of this transformation and welcome the opportunity to serve as a lighthouse.Koen De Backer is responsible for driving Micron’s smart manufacturing initiatives and digital operations including capabilities with IoT, artificial intelligence, advanced analytics, cognitive computing and machine learning to enhance Micron’s business, global operations and product development. Prior to joining Micron, Mr. De Backer led large-scale operations projects for more than a decade to help clients reduce inefficiencies and achieve excellence in manufacturing, procurement, supply chain and support functions.Most recently, De Backer was a partner at McKinsey Company, where he steered the semiconductor consulting practice in Southeast Asia and was one of the firm’s leading experts on applying artificial intelligence and automation techniques across operations and support functions such as finance, human resources and procurement. Additionally, Mr. De Backer consulted with high-tech global clients while working at Deloitte Consulting, Altran Europe and CSC. Mr. De Backer holds a master’s degree in business administration from INSEAD and a master’s degrees in both industrial management and electromechanical engineering from Katholieke Universiteit Leuven.De Backer is also chairman of the SEMI Southeast Asia Smart Manufacturing Chapter. For information on participating in the chapter, contact Shannen Koh at [email protected].

Thanks to developments in science and technology, artificial intelligence (AI), cloud computing, big data and other technologies have been used to establish smart healthcare systems that helps societies respond more effectively to disease outbreaks. The spread of novel coronavirus starting in late 2019 has revealed how not only traditional medicine but also Smart MedTech applications can be instrumental on the anti-epidemic front lines.To give updates on the development of Smart MedTech and how it shines during the fight against COVID-19, SEMI invited Dr. Pei-Yuan Lee, Honorary Superintendent of Show Chwan Memorial Hospital, to share with MSIG (MEMS Sensors Industry Group) and Flex-Tech members how the international community and Taiwan are bringing their best in Smart MedTech to the table and how their collective efforts are helping tackle COVID-19 challenges.Taiwan’s COVID-19 rapid screening reagents and antibody testing help curb coronavirus transmissions Taiwan’s medical community has demonstrated its prowess in responding to the COVID-19 outbreak. Using its nucleic acid extraction reagent, Taiwan Advanced Nanotech Inc. tested 128 specimens from passengers aboard the SuperStar Aquarius cruise ship in only eight hours in early February. Taiwan’s leading research institute Academia Sinica successfully synthesized the first group of monoclonal antibodies capable of recognizing the new coronavirus protein on March 8, enabling testing to be completed in 15 minutes. The College of Medicine of National Taiwan University announced on March 27 that its 30-second screening device had helped identify asymptomatic carriers. The devices detect COVID-19 in people with no symptoms if they have pulmonary infiltration and edema. It took only 14 days for Academia Sinica to successfully synthesized the first group of monoclonal antibodies capable of recognizing the new coronavirus protein. On April 22, three biomedical companies in Taiwan launched a COVID-19 test that produces results from samples of patient mucus in less than 10 minutes to greatly enhance testing speed. Once the test method is approved by the Taiwan government, it will take Taiwan’s medical strategy against COVID-19 to the next level.Artificial Intelligence: the key to upgrading traditional healthcare practicesAI is a key enabler of the transition from traditional medical practice to Smart MedTech. To help fight the COVID-19 outbreak, a National Cheng Kung University medical team developed a 30-minute coronavirus testing procedure that uses AI to read pulmonary X-ray images and automate medical records. Taiwan AI Labs leveraged AI to simulate how drug molecules combine with viruses to reduce research time by three to four years. AI ​​diagnostic technology from the Alibaba DAMO Academy (Academy for Discovery, Adventure, Momentum and Outlook) and Alibaba Cloud interprets CT images of COVID-19 patients with 96 percent accuracy in 20 seconds. AI-powered algorithms improve diagnostic test accuracy, allowing clinicians to quickly analyze scans of pulmonary lesions and quantify the severity of lung damage.Startups have also joined the fight against COVID-19. Taiwan's Internet of Things (IoT) startup iWEECARE invented the world's smallest smart thermometer patch. Heroic-Faith Medical Science launched a device that uses IoT and AI to monitor lung sounds. With Smart MedTech expected to be fertile ground for future venture investments, enterprises must find their niches in establishing new technologies in a much more systemic way. Taiwan startup Health-Faith Medical Science developed a respiratory diagnostics device that uses IoT and AI technology to monitor chest sounds in real time. Anti-epidemic technology to help fulfill smart medtech vision Many AI and big data technologies previously deployed in hospitals and healthcare systems are helping regions around the world speed their pandemic response. The United States and China have started to develop facial mask recognition systems powered by AI, while a team in the Department of Bioinformatics and Medical Engineering at Asia University has devised a facial recognition system combining IoT and AI technology with infrared thermal imaging cameras. At Johns Hopkins University, the Center for Systems Science and Engineering is using AI to create big data models that track global cases, people and traffic flow, and other variables for real-time data analysis that enables epidemiologists to more accurately predict COVID-19 transmission paths. Graphen, Inc., a New York-based provider of next-generation AI platforms, launched the world's first AI COVID-19 genetic evolutionary path analysis systems to gauge the virus’s transmission route and accelerate pandemic response. Both the United States and China are also using robots and drones to improve epidemic research and patient treatment. For the first confirmed case in the United States, robots were used to assist with medical care. In China, robots facilitate deliveries of disinfectants to makeshift hospitals built to expand the nation’s capacity to treat COVID-19 patients. While Taiwan’s robots are traditionally used for hospitality, transportation and disinfection purposes, future robotics research and development will focus more on medical applications that shift more work from medical staff to technology. With abundant technological resources and expertise, Taiwan can join hands with the rest of the world to combat the COVID-19 pandemic. Emerging technologies are pointing the way toward a new paradigm for healthcare community. Biotech, artificial intelligence, and robotics have given rise to new applications that increase virus screening accuracy and efficiency. This growing wave of technological defenses against the pandemic will become a long-term force for stability and strength in healthcare systems across the world.To get involved in SEMI Taiwan Smart MedTech Community, please contact Helen Chen, Outreach Manager, at [email protected] Huang and Winnie Chang are marketing and public relations specialists at SEMI Taiwan.

The seemingly simple act of commanding consumer devices by voice is a choice that nearly 118 million Americans now make every day, according to a recent report from eMarketer, the digital marketing research firm.While the voice interface is convenient for users, its implementation comes at the potential loss of individual privacy. The reason? Always-on, always-connected voice-first devices such as Amazon Alexa and Google Home require a wall plug and an internet connection to powerful cloud processors, making it possible for cloud companies — however benignly — to collect data on personal habits, location and conversation that were never intended for sharing. Move processing to the edgeTo address concerns over user privacy, device designers are attempting to do more of the audio processing within the consumer device, rather than sending users’ voices into the cloud. Moving more processing to the edge is a trend across the Internet of Things (IoT) industry, and not just for voice data but for other types of sensitive or proprietary data as well.Yet designers have realized limited success because the conventional approach to always-listening edge processing is notoriously inefficient: It digitizes and processes 100% of incoming sound data even though up to 90% of the data is irrelevant noise. This digitize-first approach wastes vast amounts of system power digitizing and analyzing the audio signal as it searches for a wake word when there isn’t even speech present, making it impractical for use in small, battery-operated devices.Workarounds don’t workTackling this power issue is critical to keeping private data secure. Unfortunately, it’s also exceptionally difficult. Design engineers have tried workarounds to decrease power consumption in an always-listening system, including duty cycling and reducing the power of each individual component in the audio signal chain that handles the data. The reality is that these kinds of approaches don’t address the root cause of the problem: too much data.To truly tackle the problem, we need to change our approach to a system solution, not a component solution. By moving to a more efficient edge architecture that intelligently minimizes the amount of data that moves through the system, we can focus the system’s energy resources on analyzing voice and not on searching for a wake word in irrelevant noise. Analyze, THEN digitize It’s time to move away from the digitize-first approach that has dominated voice wake-up device architecture since the invention of voice-first applications.Inspired by the way the human brain efficiently filters incoming information, differentiating, for example, a dog bark from a baby’s cry, an ultra-low-power analog machine learning technology is changing this paradigm. For the first time, device designers can use low-power analog machine learning to detect which data are important for further processing and analysis prior to data digitization.Leveraging an analyze-first architecture, a new analog neuromorphic semiconductor platform allows the higher-power-processing components in the system to stay asleep until voice has actually been detected, and only then does it wake them to listen for a possible wake word.Delivering a post-microphone audio chain that draws as little as 25µA of current when always-listening and collecting preroll data, this analyze-first architecture allows designers to extend battery lifetime significantly. That’s the difference between smart earbuds that run for weeks instead of hours or a battery-powered smart speaker that runs for months instead of weeks.More importantly, it’s the difference between the current always-listening devices that indiscriminately record and send all sound data to the cloud, and one that has the localized intelligence to select and send only the relevant data, reducing the user’s vulnerability to the loss of private data.Balance convenience with privacyThe trade-off between making our lives easier and keeping our personal information private is a choice that we are asked to make throughout our day in a hundred different ways. Bringing more audio processing capability to the mobile device without draining the battery is the first step toward delivering more secure voice-first solutions. But to succeed in this effort, we must shift to a bio-inspired architecture that determines which data are important and requires further processing at the earliest point in the signal chain. Once we move to the analyze-first approach, only a small fraction of the tens of zettabytes of data collected by the forthcoming generation of always-on IoT devices will require further processing in the device and in the cloud.A better balance between cloud and edge processing is a better balance between convenience and privacy, and that’s a win for everyone.About the AuthorTom Doyle is CEO and founder of Aspinity. He brings over 30 years of experience in operational excellence and executive leadership in analog and mixed-signal semiconductor technology to Aspinity. Prior to Aspinity, Tom was group director of Cadence Design Systems’ analog and mixed-signal IC business unit, where he managed the deployment of the company’s technology to the world’s foremost semiconductor companies. Previously, Tom was founder and president of the analog/mixed-signal software firm, Paragon IC solutions, where he was responsible for all operational facets of the company including sales and marketing, global partners/distributors, and engineering teams in the US and Asia. Tom holds a B.S. in Electrical Engineering from West Virginia University and an MBA from California State University, Long Beach. For more information, please visit https://www.aspinity.com/Technology.Aspinity is a member of MEMS Sensors Industry Group (MSIG), a SEMI technology community, that enables the MEMS and sensor industry to address common challenges, innovate and accelerate business results.

In the two months since the COVID-19 outbreak in January, the Chinese economy has shifted from shock to ongoing recovery under the guidance of the Chinese government. China has worked tirelessly to restore production at its chip manufacturing facilities, a core strategic industry in the region, and the effort is paying off. Operations at several fabs and OSATs – the domestic semiconductor industry’s chief growth engines – have begun to stabilize.As of mid-March, SMIC had restored its manufacturing lines to over 90% of production capacity and expects to be operating at full bore in the next few weeks, while the company’s R D line has returned to full operation. Huahong Grace reestablished normal supplies of various equipment parts and production raw materials. At Huahong Fab2, 12 new pieces of equipment went online to help increase production capacity, and production at Huahong Fab1 and Huahong Fab3 is now stable. JCET said the company's overall return rate has exceeded 90%. Meanwhile, IDM maker Silan Microelectronics' 6-inch and 8-inch lines maintained 90% production.Production lines at Huahong Group, SMIC, CanSemi, GTA Semiconductor, Samsung (Xi'an) and other mainland China chip manufacturers have been generally operating at normal capacity since the Spring Festival. Lines at YMTC, Tianma, CSOT, and BOE, all in the Coronavirus epicenter of Wuhan, have also returned to normal operations. China’s chip industry is finding its footing, and an impressive host of semiconductor companies are gearing up to participate at SEMICON China 2020, rescheduled to June 27-29. The list includes the major domestic wafer foundries such as Huahong, the major packaging and testing companies such as JCET, TFME, Huatian, and large domestic and foreign equipment companies, among them TEL, ASMPT, DISCO, ULVAC, VAT, ASML, KLA, NAURA, AMEC, Anji, CETC, Sinyang, SMEE, CAS, CANON and SPIROX.DigiTimes, a daily newspaper covering the semiconductor, electronics, computer and communications industries in Asia, interviewed SEMI China President Lung Chu in mid-March about what’s ahead for China’s semiconductor industry. Following is an English translation of the interview. DigiTimes InterviewAs China continues to ramp back up to normal activity, SEMI China is making every effort to hold SEMICON China 2020, a leading international semiconductor industry platform for promoting growth and innovation in China's semiconductor industry supply chain. SEMI China president Chu emphasized that the strong support of SEMICON China 2020 exhibitors and the Chinese government made rescheduling the event to June possible.Chu, a semiconductor industry veteran who has experienced numerous economic and industry upheavals over his career including the SARS shock in 2003, said current global economic uncertainty stems from two black swans – the global COVID-19 pandemic and how long it will take to contain it, and the sharp drop in oil prices triggered by the recent geopolitical dispute between Russia and Saudi Arabia. In China, the government responded with strict containment actions and promoted public awareness of self-isolation, resulting in effective domestic containment as of mid-March. As a major oil consumer, China sees the lower prices as relatively favorable to its economy. Those dynamics should allow China to recover sooner than many other regions, and it could emerge even stronger once the pandemic is contained, despite the current slump in global semiconductor demand, Chu said. Once the epidemic has passed, China is in a position of "turning crisis into opportunity," and the semiconductor industry will recover from the trough, he said. Companies in semiconductor supply-chain sectors face various challenges in restoring normal operations. IC design companies experienced relatively low impact since employees can work from home and most companies are located in major cities in China, where epidemic prevention control is strict. For most chip manufacturers, production has not stopped but is hampered by manpower shortages from restrictions on employees returning to work. IC packaging and testing companies are suffering bigger impacts because of the more labor-intensive nature of their operations. However, all companies in the supply chain will be affected by the decline in demand for electronic products and ICs in 2020. As the COVID-19 threat recedes in China, the region remains unwavering in its commitment to semiconductors as a strategic industry with its continuing efforts to evolve sustainable and reliable localized supply chains, Chu said. Investments in “new Infrastructure” for 5G, the Internet of Things (IoT), data centers, as well as public health services should help drive semiconductor demand for smart applications and devices associated with the new infrastructures as are all powered by ICs, benefiting companies in the global supply chain. The COVID-19 outbreak triggered a slowdown in new factory construction after the Chinese government implemented restrictions on the flow of people resulting in a worker shortage. SEMI has revised downward its forecast of wafer equipment spending in China to just a 3% increase this year.Market analysts revised downward forecasts for 2020 annual global semiconductor revenue growth from 7-10% to 0-5%, while some expect negative growth. The recent COVID-19 outbreaks in Europe, the United States and other regions have created more uncertainty. Declining end-user demand for electronics will drive down spending on upstream equipment for both memory and logic IC device makers. For Chu and his SEMI China staff, the postponement of SEMICON China 2020 has been a “major challenge,” he said. “It is a huge project to communicate and coordinate with the government and to reconfirm with exhibitors and industry leaders.”As a leading industry platform, SEMICON China attracts a large number of global customers and suppliers each year. The major China domestic suppliers, leading foundries and OSATs have confirmed their attendance in SEMICON China 2020. Most key foreign suppliers are planning to staff the event with local teams in case some executives are unable to enter China by June due to travel restrictions if the COVID-19 virus has not been brought under control in the United States, Europe and other regions. To assure the success of the concurrent Forums, SEMI has prepared multiple contingency plans, including live broadcast, video and slide presentations. SEMI will also hold the grand opening session at a larger venue than last year’s event to accommodate more attendees with more sitting distance apart. SEMI will follow government guidelines to implement appropriate public health and safety measures during SEMICON China. "Ensuring the welfare of all exhibitors and guests and providing a safe exhibition environment is SEMI’s top priority," Chu said.Cherry Sun is a marketing manager at SEMI China.