SEMI Standards FHE North America TC Chapter Welcomes Four New Task Forces
By Laura Nguyen, SEMI
In a significant stride towards fostering innovation and standardization in the field of Flexible Hybrid Electronics (FHE), the SEMI Standards FHE North America Technical Committee (TC) Chapter has recently approved the formation of four new task forces (TF) at their inaugural meeting in September. These task forces, dedicated to Assembly, Design, Inks Characterization, and Reliability and Testing, are positioned to play a pivotal role in shaping the future of FHE technologies. The scope of each TF is described below.
FHE Assembly Task Force
The Assembly TF will aim to develop standards on assembly techniques including but not limited to conductive adhesives, anisotropic conductive adhesive (ACA), anisotropic conductive films (ACF), solders, and printed conductors. In this scope we will define the testing for determining acceptable ranges for assembly of passives, connectors, packaged actives, bare die, etc., for the different assembly techniques in the context of application needs (electrical, mechanical, thermal). This will factor in the full stack of materials needed in the assembly, including: underfills, encapsulants, and rigid modifiers to support assembly.
FHE Design Task Force
The Design Task Force will aim to explore and develop standards that pertain to design for substrates, interfaces, interconnects, and interdependencies at a system level. This TF will also consider testing required for successful design (i.e., material characterization data), analytical methods, modeling tools for design, and design tools for automating and streamline the design process.
FHE Inks Characterization Task Force
The Inks Characterization TF will aim to utilize established tests to develop standards that pertain to reliability and testing of incoming inks. This TF will also consider designs required for successful testing (e.g., test vehicles and integral test structures), analytical methods, and instruments.
FHE Reliability and Testing Task Force
The Reliability and Testing TF will aim to explore and develop standards that pertain to reliability and testing of incoming components, materials and fabricated FHE Integrated Systems. This TF will focus on design required for successful testing (e.g., test vehicles and integral test structures), tools for assurance of consistency of the incoming material, variables to be measured and reported as part of reliability test or screen, analytical methods and modeling tools for predicting reliability, and hardware and software tools for automating and streamlining the testing process.
The approval of these new task forces under the SEMI Standards FHE North America TC Chapter marks a significant milestone in the advancement of Flexible Hybrid Electronics. As the industry continues to evolve, these task forces will play a fundamental role in shaping the standards that focus on the design, assembly, inks characterization, and reliability testing of FHE devices. Their collective efforts are set to drive the FHE industry into a new era of innovation, collaboration, and quicken the adoption of FHE technologies into diverse consumer end markets.
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For more information, please visit our main Web site and current events page. If you have any questions regarding SEMI Standards activities, please contact your local SEMI Standards staff. For a listing of Standards relevant to FHE manufacturing, visit the SEMI FHE Standards web page.
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December 18, 2023