Revision to SEMI S23 Published
By Kevin Nguyen, SEMI HQ
The latest version of SEMI S23, Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment, published in October 2021, provides concepts related to energy, utilities, and materials use efficiency of semiconductor manufacturing equipment (SME).
As described in the June 2021 article, the previous SEMI S23-1216 version only provides guidance for chiller-cooled process cooling water (PCW-C), which is the traditional facility-supplied cooling water available in semiconductor manufacturing facilities.
The new version, a significant improvement, provides guidance for tower-cooled cooling water (PCW-T) where heat is removed through a cooling tower system. By not using a refrigeration system, energy consumption is very minimal, which translates to reduction of utility cost.
To address all semiconductor manufacturing locations with different scenarios, the new SEMI S23 also provides the concept of dual-cooled process cooling water (PCW-D). Heat is removed from PCW-D through a cooling tower system (to the extent permitted by weather) and a chilled water system (to the extent, if any, needed to achieve the supply temperature).
The next project for the SEMI S23 Revision Global Task Force will be writing a Test Method for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment. The goal is to come up with procedures for energy conservation which will complement with guidance provided in SEMI S23. Though the new activity has not been formalized, the proposal will be brought up for discussion at the next meeting in conjunction with SEMICON West in December 2021 in San Francisco, CA.
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December 2, 2021