Standards

The semiconductor industry continues to push the envelope to meet demands of key applications such as advanced computing, consumer electronics, and defense, as well as environmental sustainability. There remain several critical challenges that our industry is working diligently to address, but how can these issues be tackled more effectively and at a pace that can keep up with this ever-evolving landscape?SEMI sat down with Supika Mashiro, Advisor at Tokyo Electron, where she shares her perspective on the importance of strengthening industry collaboration and what SEMI is doing through its first-ever SEMI Global Standards Summit – “Innovating Tomorrow: Standards for Future Factories” – of which she chairs the Planning Committee responsible for organizing this Summit.Trio: What is the SEMI Global Standards Summit and why is this event timely?Mashiro-san: Topics such as advanced packaging, cybersecurity, as well as supply chain and materials innovation (and their impact to the environment) are considered strategic areas requiring more industry collaboration. Many of these areas also greatly benefit from standards, and the next generation specifications and guidelines will need to be engineered to meet the technical challenges we face today and in the future. The magnitude of these standardization efforts will require engagement from all stakeholders in the design-to-manufacturing value chain as well as multiple Standards Developing Organizations (SDOs) coordinating and collaborating with each other.This is the driving force behind the Summit, and the need to bring together industry stakeholders to identify standards-critical areas and align on developing an industry standardization strategy for the next 3- and 7-year time horizons. We are excited to host this inaugural event on December 12, 2024, in conjunction with SEMICON Japan 2024. Trio: What is the focus of the Summit?Mashiro-san: The Global Standards Summit will cover three main themes: Smart Manufacturing for Future Factories, Packaging Architectures Materials, Environmental Sustainability.Factories are increasing their use of digital twins, predictive maintenance, and AI/ML to improve productivity and yield across the entire manufacturing environment. To take full advantage of these approaches, factories must reduce cybersecurity risks and secure the transfer of “smart” data across the entire supply chain while protecting IP. There is a need for standards to address these risk areas, as well as help diverse advanced analytics systems interoperate to assist personnel in increasing factory productivity. In the Smart Manufacturing for Future Factories session, we will be focusing on autonomous fabs, cybersecurity, and flow-oriented manufacturing.Similarly, packaging technologies have been progressing since the early stages of semiconductor device development more than 70 years ago. More recently, where packaging occurs in the semiconductor process has evolved, and some of the packaging processes are now done as an extension of front-end manufacturing. Moving forward, packaging architecture and materials are becoming increasingly important, driven by the adoption of heterogenous integration to address demands for more complex functionality and reduced power consumption as well as enabling chiplet integration. In the Packaging Architecture Materials session, we will discuss what kind of standardization our industry requires for copper-copper (Cu-Cu) direct interconnection, hybrid bonding, and panel-level packaging. We will also explore glass substrates as well as standards needed to enable semiconductor assembly and test automation.Our third session recognizes that the semiconductor industry is heading into an era of NetZero, in which quantification of environmental performance can have meaningful financial impact. The methods of measuring and accounting the environmental impact such as carbon emissions and the presence of substances of concern in manufacturing and products are not uniformly consistent across the industry. In order for the semiconductor industry to better navigate and make a positive impact in this arena, a consistent set of standards will be crucial. In the Environmental Sustainability session, thought leaders will present on communicating substance of concern (SOC), reporting of process emissions from factories, as well as lifecycle assessment of materials and substances used in semiconductor manufacturing, including equipment.Last but not the least, we will feature a panel session where we will explore all of these topics in a discussion with our panelists.Trio: Who should attend the Summit and why?Mashiro-san: The Summit is intended for leaders who are interested in these standardization topics to come and engage. Attendees will hear and learn about the issues critical to the future advancements of semiconductor manufacturing, what’s happening to address them, as well as new standards development. Attendee engagement is critical as we want our participants to influence and be able to contribute to the direction of standards development by providing valuable insights to help optimize future factories. To facilitate industry collaboration, we have organized networking events with other stakeholders from suppliers and solutions providers to end customers. The Summit is just one of many compelling reasons for industry stakeholders and thought leaders to come to SEMICON Japan. There are several sessions on many related topics that we are covering in the Global Standards Summit. Ultimately, at the conclusion of the Summit, we expect to have identified lists of critical standards areas, and we would like for those leaders to be able to assign and dedicate resources to these standardization efforts.For more information about the inaugural SEMI Global Standards Summit, please visit the SEMICON Japan 2024 site and register today!Supika Mashiro works as an Advisor for Strategic Planning of Industry Initiative Group at Tokyo Electron Limited.She has been involved in Factory Integration (FI) IFT of IRDS since its inauguration in 2016 and a co-chair since 2017. Her area of interest and involvement encompasses “smart” technology applications in manufacturing equipment, its co-optimization with Fab operation as well as ESH/S (Environment, Safety, and Health/ Sustainability) road-mapping and related industry standard development. For the latter, she has taken a couple of leadership roles in SEMI Standards Program as well as IEC TC/44.Paul Trio is Director of the SEMI Standards program.

The inaugural CHIPS Research and Development (R&D) Standards Summit will bring together thought leaders from industry and academia across the globe to help shape the future and drive innovation of semiconductor and microelectronics standards.

Industry associations serve a vital role in amplifying the collective voice of its members for much greater impact than individual companies going it alone.

What’s next for smarter, more connected electronics manufacturing - Part 1The fast-maturing infrastructure now enabling applications for big data and artificial intelligence means disruptive change not just at individual companies but also in data connections among companies across the microelectronics manufacturing value chain. SEMI expands its smart manufacturing program with a Smart Manufacturing Pavilion with displays and three full days of talks to address these industry-wide developments at SEMICON West, July 10-12 in San Francisco.Autonomous autos’ demand for zero-defect systems and 100 percent traceability back to the manufacturing data for each die is driving a push to traceability across the chip sector. “Far more chips are being used by the automotive sector, and its very different requirements are driving demand for traceability,” says Tom Ho, president of BISTel America. “Our chipmaker customers are looking for traceability solutions and the trend is the same in backend packaging and assembly – automotive applications are driving the sector to traceability.”Traceability is also driven by the growth of systems in a package as fabless chipmakers look to connect back to the packaging companies’ fault analysis labs and die interconnect history to diagnose and fix the cases where known-good die are failing in the system, adds Mike Plisinski, CEO of Rudolph Technologies. Plisinski adds that makers of consumer products like phones that can also see harsh conditions are demanding higher quality and traceability as well. The electronic manufacturing services (EMS) sector also must establish an architecture for traceability to collect critical manufacturing-related data and to interface with OSATs and semiconductor fabs. The reason is that EMS companies are adding traditional OSAT processes such as assembly of products with bare die and complex optics modules requiring clean rooms. “A unified sand-to-smart-phone smart manufacturing roadmap should be established,” says Dan Gamota, vice president of Engineering and Technology Services at Jabil. “We need to identify protocols for manufacturing data communications that can be adopted across the supply chain.”To enable smart manufacturing, vendors need to collaborate on getting their production equipment to interoperate and support factory analytics and data management systems. Source: SEMI One big challenge, of course, is how to format this diverse data so it can be linked and used by various supply chain stakeholders. “Smart data needs to be contextual and it needs data standards across the supply chain so it’s easy to link from the front end to the back end, follow common lot IDs front and back end, and have a way to map streaming data from sensors to a discrete lot ID,” notes Ho. New approaches to metrology, analysis and test that increasingly exploit machine learning on simulations will also be needed to help predict which die and connections that test well now may fail in the future as conditions change.Another issue is how to securely share the needed data across companies without jeopardizing IP. “On the equipment side we collect data across customers on how the tool is running to improve the equipment,” notes Neal Callan, ASML VP Silicon Valley. “Next we need to integrate performance and reliability data that today is not as well shared.”The other big hurdle is how to pay for data sharing. “The challenge is that the final manufacturers reap the benefit of traceability, but since they expect their suppliers to deliver good die, they don’t want to pay more for it,” notes Plisinski. He suggests that over the next two to three years, traceability and predictive fault prevention will become the norm as the automotive sector is compelled to invest in it to assure safety. Meanwhile, fabless companies will face so much complexity in integrating different die from different suppliers in SiP that they will no longer be able to afford to simply use the cheapest supplier, potentially driving a fundamental shift in relations and division of labor among fabless chipmakers, OSATs and fabs. Standards extend across supply chainSEMI member committees are collaborating to build the infrastructure to enable these developments. Standards committees are updating standards for higher bandwidth data exchange and extending semiconductor-like vertical and two-way horizontal equipment communication standards to flow shops to enable assembly players to optimize and trace back results across players. The SMT/PCBA community is integrating its smart manufacturing work into SEMI standards, and the SEMI A1 standard was a key reference document in the development of the Japan Robotics Association’s Equipment Link Protocol.Speakers addressing these issues at SEMICON West include Active Layer Parametrics, Applied Materials, Applied Research Photonics, ASML, Bosch Rexroth, Cimetrix, Coventor, ECI Technologies, Edwards Vacuum, Final Phase Systems, GE Digital, Infineon, Jabil, Lam Research, Osaro, Otosense, PEER Group, Qualcomm, Rockwell Automation, Rudolph Technologies, Schneider Electric, Seagate, Siemens, Stanford University, TEL, TIBCO Software. See semiconwest.org.What’s next for smarter, more connected electronics manufacturing - Part 2What’s next for smarter, more connected electronics manufacturing - Part 3Paula Doe, SEMI

Thanks to you and the more than 5,000 other industry experts who contribute your time and brainpower, the SEMI Standards Program is celebrating its 45th anniversary in 2018. The first SEMI Standards meeting was held in 1973 to create a dimensional specification for silicon wafers. At the time, the proliferation of more than 2,000 different wafer specifications had led to major inefficiencies as the industry was just getting underway. To address this problem, wafer suppliers gathered under the auspices of SEMI and quickly developed consensus specifications for 2-inch wafers, and by the mid-1970s over 80 percent of wafers being shipped conformed to the new standard.Since that time, the SEMI Standards Program has expanded both geographically and technically. The program now has 20 technical committees in China, Europe, Japan, Korea, North America, and Taiwan, tackling manufacturing challenges across the electronics supply chain. Critical milestones include the development of SEMI S2, the comprehensive safety guideline that has drastically reduced industry incidents and continues to be updated to keep up with the hazards associated with semiconductor manufacturing, and the SECS/GEM and EDA suites of equipment communication standards, which are the backbone of modern day semiconductor “Smart Manufacturing.”As we commemorate our 45th year, there has never been a more diverse and active agenda as we look to solving issues in new areas such as Fan-Out Panel Level Packaging, Electron Microscopy Workflow, and flexible hybrid electronics. Of course, the Standards Program owes its success and longevity to you. I am repeatedly amazed by the dedication of Standards Members, and look forward to continuing the industry collaboration – together we can make the next 45 years as fun and productive as the first!As SEMI president and CEO Ajit Manocha has stated, “SEMI Standards is the oxygen of the industry.”SEMI Standards has saved the industry untold billions of dollars by defining interoperability specifications, guidelines and test methods that have streamlined semiconductor manufacturing and ensured the smooth operation of hundreds of pieces of equipment – all working automatically 24X7.What's more, SEMI Standards has enabled the production of more than 2.2 billion wafers and 1.8 trillion IC devices. Referenced more than 10 million times in production fab purchases, more than 25 SEMI Standards, on average, are cited in each purchase order for semiconductor equipment and materials in the electronic manufacturing ecosystem.