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Smart technologies have gripped the world’s imagination with their promise to revolutionize the way we live and work. With the semiconductor supply chain central to these advances, SEMI Japan in October hosted 200 members for SEMI Japan Members Day as speakers from three of the world’s top device manufacturers – Denso, Sony and Kioxia – offered their perspectives on the strides the semiconductor industry needs to make in three key areas: automotive, smart manufacturing and 3D flash memory manufacturing technology. Automotive Evolution and Electronics – DensoThe automotive industry is re-inventing itself to innovate across connectivity, autonomy, sharing and electric (CASE) and ensure safe, comfortable and environmentally friendly autonomous driving, said Nobuaki Kawahara, executive fellow and director of the Advanced Research and Innovation Center at Denso. Key focus areas of Denso in CASE innovation are Extraordinary Safety and Everyday Confidence. The company’s goal is to minimize damage to vehicles involved in collisions or one-car accidents by making it easier for drivers to detect and steer clear of objects in their path.To improve automobile safety and security, the company is developing advanced driver-assistance systems (ADAS) and autonomous driving technologies as it promotes the confluence of four areas of technology – HMI (Human Machine Interface), environmental recognition, vehicle control assistance, and information and communications. One use case Denso sees as a significant opportunity is deploying sensors such as millimeter-wave radar, cameras and LiDAR to monitor a vehicle’s surroundings, using GPS and precision mapping to pinpoint its location and determine the best route for safety and distance, and then transmitting that information to a motion-control system.Denso is also out to solve the hard challenges associated with autonomous driving in dynamic road conditions. Kawahara pointed out that road conditions vary and that rules for "driving at certain intervals in a certain lane" vary depending on the time of day. Also, on public roads in Abashiri, Hokkaido, where the company is currently conducting field tests, snowfall makes it difficult to recognize road images and gather sensor information. In Asia, it is also common for motorcycles and automobiles to speed along with very little space between them.Image Sensors to Accelerate Development of Smart Manufacturing – SonyTo fulfill the promise of smart manufacturing, the semiconductor supply chain must continue to invest in sensor and imaging technology innovation, said Shigeo Ohba, deputy senior general manager of the Imaging System Business Division at Sony Semiconductor Solutions. For its part, Sony is developing imaging sensors that help network and automate factories to achieve new production and cost efficiencies. For example, the company plans to design devices to increase equipment uptime through predictive maintenance, reduce defect rates and drive other manufacturing efficiencies. The challenge with today’s factory lines that produce a number of different devices is that they are highly complex to manage and therefore prone to human error, undercutting manufacturing efficiency. In the future, AI-powered machines will leverage data analysis to help streamline operations. Adapting an image sensor with AI to machine vision applications can simplify key processes such as measurement and inspection processes while reducing safety and security costs.Of the vast amount of information on all machines connected to the cloud, only essential details will be processed at the edge since edge data processing offers stronger security and reduces data transfer time. Ohba said image sensors will evolve based on edge AI, adding that "AI will be a paradigm shift for image sensors if it’s economically feasible."3D Flash Memory Manufacturing Technology Challenges – KioxiaIncreasing connectivity in factories for smarter, more efficient operations places huge demands on memory since networked devices typically store duplicate data, said Hideshi Miyajima, head of the Advanced Memory Development Center (AMDC) at Kioxia. To meet demand for higher networking speed and capacity, 2d NAND flash memory is moving to 3D and, in particular, three 3D techniques: multivalued memory, cell partitioning and layer stacking.To increase storage capacity, the third-generation 64-layer BiCS FLASH™ stacks layers to form nearly two trillion holes with a diameter of 100nm and a depth of 5μm on a wafer and places a uniform 2-3nm thin film on the inner wall of each 5-μm hole. For its BiCS FLASH™, Kioxia uses a dry etching technique that forms a straight, elongated through-hole and atomic layer deposition (ALD) technology, which creates a uniform laminate atomic layer on the wafer surface to grow materials uniformly and with high precision on large, complex substrates.In order to meet the cost expectations of high-volume 3D flash memory manufacturers, outlays across fabs must be reduced by better monitoring plasma control, enhancing yield through particle control, speeding film formation, and reducing gas, power and water usage, Miyajima said.SMART Transportation and SMART Manufacturing in the Spotlight at SEMICON JapanPlease join us at SEMICON Japan 2019, December 11-13 at Tokyo Big Sight, for the latest developments and trends in SMART Transportation and Smart Manufacturing. There are also a few other great reasons to attend. We look forward to seeing you in Tokyo!Jim Hamajima is president of SEMI Japan.

How are flexible electronics impacting the automotive sector? How will medical diagnostics and life sciences be changing with the advent of flexible, conformable electronics? How does space exploration intersect with the continued development of flexible sensors and Internet of Things (IoT) systems? The upcoming 2019FLEX Japan / MEMS SENSORS FORUM in Shinagawa, Tokyo, May 22-23, 2019, will explore these questions and more. The event, the third FLEX Japan, is expected to gather 300 designers, technologists, researchers, analyst and product developers to hear presentations, discuss their approaches, and create connections. The transformation of the automotive industry will receive special attention with speakers from Yole Développement and a deep exploration of the new sensor form factors and capabilities. Professor Shoji Kawahito of Shizuoka University will discuss the impact of image sensors on automotive LIDAR, night vision and monitors for the driver and passengers. Dr. Yoshifumi Sakamoto of IBM Japan will share his views on key trends in smart transportation and what they mean for the supply chain. Beck Oh, president and CEO of PNI Sensor, will share how parking sensors are transforming our driving – and parking – experience. Hideo Fukunaga, project manager for Velodyne LiDAR, will discuss his work using LIDAR, often seen as the most promising and the most difficult and expensive component of autonomous driving. Jerome Joimel, CTO of ISORG, will discuss integration of organic image sensor behind display.Medical and home electronics devices are moving out of their boxes and hospitals, and flexible electronics, new sensor designs and new power options are playing a major role in that transformation. Jenax, Kobe University, Toyo University, Osaka University, and Daiwa House are just some of the presenters in this area. Researchers are steadily overcoming key technology hurdles, such as electronic interconnects between soft and rigid surfaces, and energy harvesting techniques for no-power devices, as well as ultra-thin RF components, and advanced microfluidic systems. Space, the final frontier, will be the backdrop for the general keynote talk of Mayya Mayyappan, chief scientist for exploration technology at NASA’s Ames Research Center. His team is investigating new printed and flexible sensors and electronics that can be printed in zero-gravity and how these devices will enable IoT.The only event in Japan focused on flexible and printed electronics, with special focus on the complementary areas of sensors and MEMS, 2019FLEX Japan / MEMS SENSORS FORUM provides an excellent opportunity to meet with industry players considering integration and application of new form factor electronics. More than 20 exhibitors will showcase the building blocks for conceptualizing and designing new products immediately.Register now!

The Japan semiconductor manufacturing supply chain is a global semiconductor industry workhorse, producing about one third of world’s chip equipment and more than half of its semiconductor materials. In contributing the vast majority of these products, SEMI Japan member companies hold the high distinction of enabling continuous development of the worldwide semiconductor industry. Aptly, then, technology powerhouses IBM, Nissan Motors and Toshiba offered insights into the latest trends and innovations in computing and smart cars at the late-May SEMI Japan Members Days in Tokyo with 133 technologists from member companies in attendance. As the audience discovered, chip innovation never sleeps and, as futuristic as it can be, invariably gives rise to possibilities beyond the human imagination. That was the message of kickoff presentation “Computing Reimagined – AI/Quantum/IoT” – by Dr. Shintaro Yamamichi, Senior Manager, Science Technology at IBM Research-Tokyo. Dr. Yamamichi cited three examples of how semiconductors uncover new technology frontiers. Computational materials discovery, a novel methodology, is the application of theory and computation to unearthing new materials and the key to enabling an ongoing stream of semiconductor innovation. In particular, using cognitive technology to mine huge volumes of literature reveal new insights into materials that uncover even more functionality such as greater conductivity and heat resistance. With new materials the oxygen of ever more advanced semiconductor chip manufacturing, the semiconductor industry will surely benefit from this methodology. The opportunity to accelerate quantum computing innovation is now. Launched in May 2016, the IBM Quantum Experience gives students, researchers and general science enthusiasts hands-on access to IBM’s experimental cloud-enabled quantum computing platform. The online platform features a forum for discussing quantum computing topics, tutorials on how to program IBM Q devices, and other educational material about quantum computing. Dr. Yamamichi encouraged the audience to join the program. The world’s tiniest computer, unveiled by IBM at the company’s Think 2018 conference in Las Vegas, packs several hundred thousand transistors and, IBM claims, the equivalent power of a 1990s x86 chip into a package smaller than a grain of salt. The computer’s small form factor (less than 1mm x 1mm) and low manufacturing cost means it can be embedded in product price tags and packages as an anti-fraud device using blockchain technology. Vehicles need to be both electric and intelligent as countries become more populous and traffic density increases. More drivers extend average drive time, boost greenhouse emissions, devour precious energy resources and lead to more traffic congestion and accidents. Dr. Haruyoshi Kumura, fellow at Nissan Motor, highlighted these issues in stressing the importance of a new era of intelligent mobility. To mitigate these problems, Nissan is focusing on the electrification and intelligence of its vehicles: Nissan’s electric vehicle, Leaf, reduces accidents with electric intelligence systems such as e-Pedal, which uses an accelerator pedal only for both acceleration and deceleration, and ProPILOT Park, a feature that automatically parks the car by using multiple cameras and ultrasonic sonars to detect pedestrians and other objects around the vehicle. With more than 90 percent of traffic accidents caused by driver error, Nissan plans to introduce autonomous driving on multi-lane highways by the end of 2018 and on city streets by 2020. By 2022, the company plans to roll out full autonomous driving to reduce traffic accidents caused by inattentive drivers. For full autonomous driving to materialize, sensor fusion technology must incorporate a combination of technologies – radar systems, light detection and ranging (LiDAR) systems and cameras – to identify the shapes and locations of nearby moving objects and measure their speed. Sensed information is then processed by a 3D graphic analyzer to make electric throttle, braking and steering decisions. The outlook for automotive industry includes car sharing and more electrification – both insights from Yoshiki Hayakashi, general manager, automotive solution strategic planning division at Toshiba Electronic Devices Storage, who offered his perspectives on trends in Japan’s automotive industry and beyond. To meet the requirements of the COP21 Paris agreement, the global automotive industry is shifting to electrification. Toshiba estimates 60 percent of new cars will be electric vehicles by 2040 to meet the International Energy Agency’s global EV outlook. In Japan, autonomous driving or advanced driver assistance systems (ADAS) will be offered in certain areas by 2020, the year of the Tokyo Olympic games. Growth of these advanced driving systems hinges on infrastructure development. Supporting data centers, intelligent transport systems, vehicle-to-everything connections, and smart city are all necessary components. Car ownership will begin to cede ground to car sharing with technology elites such as Tesla, Apple and Google leading the way. To expand the car-sharing industry, new alliances will take shape between new and old-guard automotive companies and electronics manufacturing services (EMS) providers. Autonomous driving requires precise 3D renderings of actual roadways using sensors for route mapping. While sensor fusion must be deployed for these capabilities, LiDAR offers better sensing range and space resolution precision than ultrasonic sonars, radars, and cameras. The next SEMI Japan members day is scheduled for October 30 in Tokyo. SEMI holds similar events in most regions where SEMI and its members operate. For the members events in your region, contact the SEMI office nearest you. Yoichiro Ando is a marketing director in SEMI Japan.

The fast-growing automotive semiconductor market means big change for the IC supply chain. Beyond the obvious demands for reliability and traceability, the sector is moving towards simpler and lower-cost solutions while facing the daunting challenge of automating driving in a complex world. The need for simpler and cheaper automotive intelligence will likely drive acquisitions to build complete platform solutions that are easier to integrate. This demand has already spawned a market for pre-configured test cars to save developers time and money, and is driving LiDAR (Light Detection And RADAR) towards lower-cost, solid state solutions. “The growth of the automotive electronics market provides a great opportunity for the IC supply chain to differentiate on specialty processes and quality for the high-volume automotive business with its long design cycles,” says Scott Jones, principal, strategy, at KPMG, who will speak in the automotive program at SEMICON West. “This differentiation is a chance to reduce chip suppliers’ dependence on scaling volume for the mobile phone world with its short-cycle volatility of winning and losing sockets.” He notes that increasing demand for automotive ICs is also reinvigorating the eight-inch supply chain and spurring opportunity for specialty products such as compound semiconductor devices for power efficiency. Supplying the automotive market also means addressing automotive reliability requirements, which can be 10 times more stringent than for consumer devices. At the same time, the industry must sustain fast-paced development cycles required for the volume and diversity of low-cost IoT devices, manage the segmented supply chain for both those markets, and still spread development costs. Another big challenge for the supply chain will be to automate testing and update vast amounts of embedded software in these automotive devices. “The more complete solution a company can put together, the more the automakers will gravitate to it. They want simplicity,” Jones suggests. Smaller players will need to differentiate with IP and acquire other IP provider to build a broader platform, or be acquired and folded into an all-in-one solution.AutonomouStuff helps accelerate and simplify development of autonomous driving solutionsAutonomouStuff is helping to speed development of these platforms. The company has grown from a sensor distributor into a supplier in the emerging niche of vehicles preconfigured with key interfaces for sensors and controls. These interfaces can then be customized by integrating different components for developers to test their applications. AutonomouStuff offers developers a lineup of vehicle models pre-configured with the interfaces needed to add desired chips, sensors and software to develop their autonomous vehicle systems. Source: AutonomouStuff.“Whether they’re major chipmakers or AI software startups, they don’t have a year to build their own vehicle platforms themselves for developing autonomous vehicle systems,” says Wolfgang Juchmann, VP sales and business development at AutonomouStuff. Juchmann, a SEMICON West speaker, will bring a demonstration vehicle to the show. “In four to six weeks we can prepare a custom test car with selected sensors, enabling users to start testing their computer platforms and software. It’s faster and more cost-effective for us to supply the car with the needed interfaces.” He notes that developers are using some 300 AutonomouStuff vehicles in the field. AutonomouStuff customers are starting to transition from testing on a single car or two to testing on mini-fleets with 50 to 100 vehicles. Beyond sensors and pre-configured vehicles, the next step will be to add more data intelligence services to help with capabilities like tagging the data for training, Juchmann says. AutonomouStuff already offers hardware to support Baidu’s Apollo open-source software stack and data set. The company was recently acquired by the Swedish holding company Hexagon to help support expansion.CMOS silicon LiDAR nears automotive qualificationInnovations in the hyper-competitive LiDAR market, where burgeoning demand is driving the race to develop various types of solid-state devices, may also help reduce the cost of autonomous vehicles. Among the roughly 40 LiDAR suppliers, at least one – Quanergy – is taking advantage of 45nm and 32nm foundry CMOS volume production. The company uses voltage through the semiconductor stack to change the refractive index, controlling the phases of optical beams and the resulting interference patterns of light exiting the chip to quickly steer the laser beam without the need for moving parts, much like the phased array radar its team developed earlier. Solid state LiDAR image with object recognition software. Source: QuanergySo far, most of the small LiDAR units have shipped to the security, industrial automation, drone, robots and 3D mapping markets. However, Quanergy CEO Louay Eldada, another SEMICON speaker, says the company is also winning automotive designs and expects automotive shipments to take off early next year, once automotive certification testing is completed. “We can get design wins because standard CMOS production at TSMC makes us a known entity,” says Eldada. To prevent component misalignment, the company produces its own specialized packaging to secure the laser, phase control ASIC, optical phased-array emitter, detector array, and receiver readout ASIC at its plant in Silicon Valley or the facility of its automotive partner Sensata. Through its software business, Quanergy offers an artificial intelligence (AI) perception program for object recognition and LiDAR tracking. The solution uses the people-tracker software the company acquired from Raytheon.SEMICON West this year expands to three full days of automotive electronics programming and features a Smart Transportation Pavilion. Other companies with experts who will speak as part of the program include XPT/NIO, Infineon, McKinsey, Voyage, GM Cruise, Bosch, Deepen AI, Airbus A3, Nvidia, Excelfore, Byton, Macronix, SK Hynix, SAP, Xilinx, Achronics, California Fuel Cell Partnership, Velodyne, Lam Research, KLA-Tencor, SCREEN, Rockwell, Versum Materials, TechSearch International, Entegris, ASE, Amazon, Continental and Wind River. www.semiconwest.orgPaul Doe, SEMI