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A 500,000 ft2 (~47,000 m2) state-of-the-art cleanroom facility still towers as the largest U.S. high-technology investment in Vietnam 10 years after starting operations in Saigon High Tech Park in District 9, Ho Chi Minh City. The structure built by Intel Products Vietnam (IPV) on the back of a $1 billion investment is the largest assembly and test manufacturing facility (ATM) in the Intel assembly and test network. IPV turns out products that are helping power cutting-edge applications along with the next wave of semiconductor industry growth as it homes in on 5G, Internet of Things (IoT), desktop and mobile. And it has been a boon to the local economy, generating more than 5,000 high-skill jobs across a number of assembly and test disciplines since launching operations in 2010. It has also contributed to over US$37 billion in exports from 2010 to 2019, accounting for over 60% of Saigon High-Tech Park’s annual export values in 2019. With its vision “to create the future of Intel and Vietnam,” Intel continues to be a strong long-term partner in Vietnam. I recently spoke with Kim Huat (KH) Ooi, vice president of Manufacturing and Operations and General Manager at Intel Products Vietnam (IPV), about the facility’s vital role in Intel’s overall manufacturing operations, its support for the E E ecosystem in Ho Chi Minh City, and measures it has implemented to reduce the impact of the COVID-19 pandemic on the facility and protect employees. Ooi leads and manages the site to support Intel’s business in Vietnam. His responsibilities include overseeing factory operations and employee relations; enriching the Intel image and brand; building strategic relationships with communities, media, governments, and local authorities; and working with the industry ecosystem and government. IPV employees celebrate Intel’s 50th anniversary in 2018. Ng: How does IPV campus complement the rest of Intel manufacturing sites and be nearer your customers and supplier base?Ooi: Intel Vietnam is an important part of Intel’s manufacturing presence worldwide. IPV has been operating for nearly 14 years in Vietnam and has celebrated multiple milestones along the way. As a site, we have matured and grown over the years. In March this year, we celebrated a proud milestone – the rollout our 2 billionth unit – that reflects the value of IPV to Intel Corporation as these Made in Vietnam products support its customers worldwide. One of our philosophies is to work with and grow local ecosystems in countries where we operate. In Vietnam, Intel has been offering technical and managerial expertise to many local suppliers in Vietnam to help them expand their business and services to other foreign direct investment (FDI) customers in the industry. Over the past 10 years, Intel’s supplier list has grown 10-fold from 20 in 2010 to about 180 suppliers in 2020.In today’s world of fast-changing consumer preferences and expectations, we need to help drive development of the latest products and technologies to support strong customer demand and new product portfolios such as 5G. To support evolving customer requirements, our workforce frequently upgrades its skills to work on new products and technologies.Intel as a company is also evolving as it transforms from a PC-centric to a data-centric organization, a shift behind the more than US$70 billion in record revenue Intel posted in 2019. Intel’s data-centric business accounted for more than half of that revenue. IPV plays a key role in Intel’s expansion into new market segments.Ng: What are the key differentiating elements (talent, tax, technology, trade, EHS) in Vietnam that have been instrumental in supporting the E E ecosystem in Ho Chi Minh City?Ooi: Vietnam’s stable political environment and increasingly liberalized trade and investment policies are great for businesses. The region’s young, talented workforce is also one of many competitive advantages that enables it to attract foreign investment. Intel’s announcement to invest in Vietnam in 2006 has played a large part in helping put Vietnam on the map of the global IT and semiconductor industry. The news helped attract industry suppliers and service providers, bolstering Vietnam’s economy and creating jobs. The Vietnam government also figured prominently in sparking the boon by establishing the right policies and incentives to attract foreign investment. Since starting operations, we have seen significant improvements in infrastructure such as roads, ports, airports, broadband and power supply. Vietnam’s standing in the global business community is even stronger today after the government successfully combatted the COVID-19 pandemic early on and introduced policies to help businesses restart operations. We expect all these factors to continue to make Vietnam an attractive relocation target for companies around the world. Ho Chi Minh City People’s Committee Vice Chairman Mr. Duong Anh Duc (center) visited Intel Vietnam to tour the state-of-the-art facility. Ng: What measures have you implemented to reduce the impact of the COVID-19 pandemic and protect employees? Ooi: COVID-19 has taken the world by storm and changed the way we work and live in many ways. It has unquestionably pushed the world to build stronger partnerships among individuals, organizations, businesses and communities. Intel’s manufacturing operations have continued to run at full capacity. Since the outbreak emerged, we have strictly followed required Intel safety measures as well as the Vietnam’s health guidelines. We have also implemented a number of other safety initiatives and protocols to ensure our business runs smoothly. We’re doing everything possible to ensure the well-being of our employees and help them better respond to the pandemic.In coordination with our strategic partners, we have been donating thousands of Personal Protective Equipment (PPE) to the Fatherland Front and Department of Health (DoH) since early March. Recently, in partnership with AmCham Vietnam, Intel donated an imported ambulance with built-in essential equipment to the Ho Chi Minh City 115 Emergency Center. Intel has also teamed with Saigon Hi-Tech Park management to donate two ventilators and N95 masks to DoH.Our employees are also helping out by donating to Vietnam’s Coronavirus Donation Matching campaign. We collected US$13,000 from Intel employees and included matching funds from Intel Foundation to support three non-profit organizations (NPOs) – Saigon Children’s Charity, Kidspire Vietnam and Teach for Vietnam. All told, Intel Products Vietnam has donated US$200,000 to COVID-19 relief efforts, demonstrating our long-term commitment to communities where we operate. Intel Products Vietnam teamed with AmCham Vietnam to donate a fully equipped ambulance to Ho Chi Minh City’s 115 Emergency Center, demonstrating IPV’s long-term corporate social responsibility commitment. In early May, Intel unveiled our 2030 Corporate Strategy and goals to accelerate progress against the world’s critical challenges and help drive positive global outcomes. Part of our 2030 goals, our RISE (Responsible, Inclusive, Sustainable, Enabling) strategy focuses on the company’s commitment to its corporate social responsibility (CSR) initiatives to create a more responsible, inclusive, safe and sustainable world through technology and collective action. IPV has also committed to implementing the RISE strategy in Vietnam with local community initiatives and technology interventions. Bee Bee Ng is president of SEMI Southeast Asia.
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Emerging applications powered by 5G and artificial intelligence (AI) are expected to be a boon to the semiconductor industry, but only once chipmakers overcome a key challenge: Architecting chips that meet the exacting performance, power consumption, size and cost requirements of devices for mid- to high-end applications. One technology – heterogeneous integration – promises to meet these demands and help drive future leaps in semiconductor innovation in the post-Moore era. To help the industry better grasp the technology challenges and business opportunities associated with deploying highly integrated chip and packaging technologies, SEMI and AI on Chip Taiwan Alliance recently gathered industry leaders from organizations including ASE, Unimicron, Dialog Semiconductor, Cadence and AITA to discuss technology trends and the vital importance of building a cross-industry exchange platform to advance next-generation manufacturing processes critical to heterogeneous integration. Following are key takeaways from the forum, Heterogeneous Integration Enables 5G and AI. Overcoming Heterogeneous Integration Technology Challenges Key to Advances in Taiwan High-End Semiconductor Manufacturing The introduction of the Heterogeneous Integration Roadmap (HIR) by the International Technology Roadmap for Semiconductors team in 2016 was an important first step, Dr. C.P. Hung, Vice President of ASE Group, noted in his opening remarks. The HIR is designed to stimulate pre-competitive collaboration to advance heterogeneous integration technology development and accelerate electronics innovation. The roadmap provides a long-term vision for the electronics industry, identifying future technology requirements and potential solutions. Today, the HIR working group focuses on high-performance computing (HPC), 5G and other leading-edge technologies.Dr. Hung predicted that heterogenous integration will reshape traditional collaborations between the semiconductor ecosystem and supply chain in order to clear I/O bottlenecks that hamstring high-performance applications. The retooled industry connections will also need to enable high I/O pin counts, ultra-thin devices, and high-frequency signal shields. In an important step forward, the chip industry today is developing a platform that enhances wafer-level advanced packaging services and deepens cooperation with Oversea Assembly and Testing (OSAT) and substrate supply chain partners. Overcoming the current limits of IC substrates – the connection between IC chips the PCB – is one key for heterogeneous integration technology to flourish, said Dr. Yu-Hua Chen, Vice President, Carrier SBU, RD Division of Unimicron. He noted that the industry must tackle limits to PCB thickness, substrate density, fine pitch and automation to meet the needs of high-end packaging customers. Another barrier the industry must be surmounted is to make the currently inscrutable confidentiality requirements for patents of foreign materials – key to improving chip yields – easier to access and understand for substrate engineers. Chen said partnerships across the entire industry will be necessary to break through this and other technology breakthroughs. Supply Chain and Cross-Border Ecosystem to Strengthen Partnerships for Further DevelopmentTaiwan has long invested heavily in advancing semiconductor manufacturing and application engineering technologies to become a top global chipmaking hub and, in the process, has been behind significant leaps in optimizing chip functionality, said Leroy Liu, General Manager, Asia Headquarters, of Dialog Semiconductor (Germany). With its semiconductor manufacturing prowess, Taiwan can also play a central role in maturing advanced heterogeneous integration packaging technology while managing development costs by partnering with its international supply chain community to overcome technical challenges more effectively, Liu said. The region can also help forge partnerships, even among competitors, to build the ecosystem essential for heterogeneous integration technology to shine.EDA tools will be critical in understanding and resolving heterogeneous integration technical issues since IC substrate, packaging and chip design all pose interdisciplinary engineering challenges, said Julian Sun, Product Marketing Director at Cadence. To help the industry navigate these challenges, Cadence has launched intelligent system design products – solutions that address a wide range of design problems with semiconductor nanometers, micrometers on packaging and testing, and PCB level micro/millimeters to Pin/Pitch, I/O models, and thermals and electricity. By supporting various technical designs, Cadence helps customers shorten the design cycle to strengthen design quality and reduce costs.Sun also pointed to the vital importance of overcoming the significant challenge of designing silicon interposers for heterogeneous integration. Today’s EDA tools are capable of optimizing the design of complex structures including 5GAiP and HBM and are instrumental in aiding Taiwan’s semiconductor ecosystem players to quickly adapt to shifts in the evolving heterogeneous integration market.Heterogeneous Integration Enables 5G and AI speakers (L-R): Julian Sun, Product Marketing Director at Cadence, Dr. Yu-Hua Chen, Vice President, Carrier SBU, RD Division of Unimicron, Dr. C.P. Hung, Vice President of ASE Group, Leroy Liu, General Manager, Asia Headquarters, of Dialog Semiconductor (Germany), Dr. Shih-Chieh Chang, AITA Executive Secretary Designing AI chips is particularly difficult as semiconductor makers struggle with high costs and low yields, said Dr. Shih-Chieh Chang, AITA’s Executive Secretary. That’s why the chip industry now uses FPGAs for small-volume production of AI chips, which makes it easier to improve manufacturing yield through redundant design. For its part, AITA has formed a special interest group (SIG) to help form connections among the chip industry, academia and research institutes. The association’s goal is to build a platform for mass production of AI chips.To get involved in SEMI Taiwan Heterogeneous Integration related events, please contact Ula Huang, outreach senior specialist, at [email protected] Fang is a coordinator and Ashley Huang is a specialist in marketing and public relations at SEMI Taiwan.
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Back in February of this year, we launched SEMI Works™, a landmark SEMI program designed to grow and sustain the electronics industry talent pipeline from the ground up. But it was much more than a program launch. The introduction was a resounding statement of our passionate commitment to workforce development and its incontrovertible importance to the future of the microelectronics industry. No one’s passion for workforce development burns brighter than SEMI CEO Ajit Manocha’s. In April, he reiterated SEMI’s focus to make good on this commitment and laid out the broad outlines of SEMI Works. From the outset, our sights have been firmly fixed on execution. The National Science Foundation (NSF), a United States government agency that supports fundamental research and education in science and engineering, recently lent its support to SEMI Works with a $6 million investment to develop a scalable, sustainable apparatus to meet current and future talent requirements of the end-to-end electronics manufacturing industry. And more financial backing – this time from abroad – could well be in the offing. We are pressing ahead to develop the infrastructure to connect talent, industry and education providers at scale. We are expanding proven programs for exciting and engaging students in experiential learning opportunities at a young age. And we are paving the way to offer career and educational pathways through high school, college and adult and veteran training. Regional partners are essential to scaling these programs, and to date we have identified three regions for pilots to develop the infrastructure and business model that will be heartbeat of SEMI Works.Moore’s Law is losing steam, raising hard questions about the semiconductor industry’s ability to maintain its swift pace of innovation. The clarion call for chipmakers is to design ever smaller electronic circuits with higher processing power for devices with shrinking form factors. More computing muscle is crucial to advances in smart manufacturing, medtech, quantum computing, artificial intelligence (AI), 5G and the IoT – all technologies that generate and consume staggering amounts of data.Yet no obstacle to industry growth stands as tall as the brick wall of the talent shortage. A highly skilled workforce is essential to invention. As an industry, we’ll only be equal to the world’s greatest challenges by recruiting, training and retaining the best and brightest.At this critical juncture in what is the world’s most strategic industry, the public and private sectors must work collaboratively to leverage their collective strength to produce the talent required to power technology development today and well into the future.In 2020 SEMI will mark 50 years of facilitating collaborations to mint new technologies and markets. We are uniquely positioned, with our members, to lead what history may one day record as our most important effort to date, a push that could impact the world for decades to come. The industry needs a lasting solution to expand and sustain its talent pipeline. SEMI is taking decisive action with SEMI Works. Mike Russo is vice president of Global Industry Advocacy at SEMI.
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The world of work is transforming. I believe digitalization can be a force for better quality work, unleashing higher productivity and opening up new opportunities to work in different ways. For this to happen, we must set the right framework. We must set the right conditions to enable everyone to reap the benefits from the digital era.One crucial condition is that people have the right skills. That's why the European Commission launched a "Skills Agenda for Europe" in 2016. It sets out 10 actions to make the most of Europe’s human capital, which is crucial to keep Europe on a competitive edge and growing. One of its focus areas for example is better skills intelligence – understanding skills bottlenecks and anticipating needs, including through stronger business-education partnerships. Education needs to be more responsive to labour market needs.The microelectronics industry is one such area in Europe that faces an acute talent shortage. But this technology is crucial for Europe’s competitiveness. Microelectronics enable many of the key technologies and innovations required for advancing a secure, sustainable and digital economy. Data centers, online platforms, autonomous spacecrafts, blockchain algorithms and 5G infrastructure may serve different purposes but share one vital element: microelectronics. The deepening penetration of electronics in the digital economy and new applications is giving rise to industry requirements for a workforce pool with soft skills and expertise in production technologies, software and data science.This is why the European Commission encourages new collaboration models between the worlds of education and industry across all business sectors, including in microelectronics. I welcome the fact that SEMI, the industry association representing the electronics manufacturing supply chain, is fully committed to building and maintaining the needed talent pipeline in Europe. I wish you best of luck in your endeavors. Marianne Thyssen is European Commissioner for Employment, Social Affairs, Skills and Labour Mobility.
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