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ISS Speaker Bio - Naga Chandrasekaran, Intel
The Race to A Trillion: Scaling Technology, Capacity, And Culture in The AI EraABSTRACTArtificial intelligence is transforming the way we lead our lives and, in the process, it is driving...
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ITPC Speaker Bio - Naga Chandrasekaran
BIOGRAPHY
Naga Chandrasekaran is executive vice president, chief technology and operations officer, and general manager of the Intel Foundry organization at Intel...
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ISS Speaker Bio - Handel H. Jones, IBS
How AI is Impacting the Supply Chain Ecosystem for SemiconductorsABSTRACTThe high-growth segment of the semiconductor market is AI-based, and while wafer capacity is being added, there will be...
Member Press Release
Beneq Unveils Beneq Transmute™ – High-Throughput ALD for Power, RF, and μLED Device Production
New platform delivers ALD film quality at production throughput for Wide Bandgap and other specialty device manufacturing
Espoo, Finland, November 19, 2025 – Beneq, a global leader in Atomic Layer...
SEMI Press Release
European Chips Skills Academy Publishes 2025 Skills Strategy Report
Updated Assessment Provides Insights Into Europe’s Semiconductor Talent GapBRUSSELS – November 19, 2025 – The European Chips Skills Academy (ECSA), an European Union (EU)-funded initiative...
Member Company
Sichuan Future Carbon New Material Technology Co.,Ltd
Member Company
Kardex Malaysia Sdn Bhd
Kardex is a leading global partner for intralogistics solutions in an attractive and growing market. The Group offers premium automated products, standardised systems, and life cycle services that...
Event
SEMICON Europa 2025
SEMI Press Release
SEMI Europe Publishes 30 Recommendations for a Forward-Looking European Chips Act
Report Outlines Analysis and Strategic Policy Proposals to Strengthen Europe’s Semiconductor AmbitionsMUNICH – November 18, 2025 – Following the official approval of the SEMI European Advisory Board,...
Member Press Release
Agileo Automation Launches Agil’SECS-II to Enable Semiconductor OEMs, Multi-Industry Fabs, and Labs to Accelerate Equipment Integration on Production Lines
New SECS-II library helps fabs and OEMs integrate semiconductor tools with the MES in hybrid manufacturing sites, ensuring faster time to market and limiting integration costs
MUNICH, November 18,...