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Blog
The Decade Ahead: Emerging MEMS & Sensors Technologies to Watch
Most of today’s blockbuster MEMS products – from pressure sensors and resonators to accelerometers and microphones – originated from academic research, a trend that Alissa M. Fitzgerald, Founder...
Blog
All-New SEMI Member Directory Makes Searches Faster, Easier
With the semiconductor industry moving at light speed, manufacturers need a fast, easy way to find suppliers as they grow their businesses. So SEMI has just made searches for you, our members,...
Blog
Don’t Miss SOI Consortium’s Japan Event: 30-31 October '19, Yokohama
The SOI Consortium’s next annual event in Japan takes place on the 30th and 31st of October in Yokohama. Both days of the SOI Design Symposium will take place in the Yokohama Landmark Tower. The...
Member Company
Shenzhen Tete Semiconductor Equipment Co.,Ltd.
Laser Marking, Plasma cleaning, Laser cutting
Webinar Replay
Blockchain & Manufacturing: A 'Smarter' Way to Drive Efficiency in the Semiconductor and Electronics Supply Chains
SEMI Smart Manufacturing:
Blockchain & Manufacturing: A 'Smarter' Way to Drive Efficiency in the Semiconductor and Electronics Supply Chains
Pushkar Apte, Consultant, SEMI
Nelson...
Event Presentation
Positioning, Navigation and Timing (PNT) Workshop
Positioning, Navigation and Timing (PNT) Workshop
Page
Sara Brown
As Vice President of Marketing Sara Brown is responsible internal and external marketing and communications at MultiTech. She brings 20 years of technology marketing experience, with more than ten...
Event
3D Packaging & Integration Japan TC Chapter
SEMI® International Standards Program
3D Packaging & Integration Japan TC Chapter meeting
Friday, October 11, 2019, 15:00 – 17:00
SEMI Japan office, Tokyo,...
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Zsolt Pulai
Zsolt Pulai joined HZO in 2017 as Vice President of Engineering. Prior to HZO, Zsolt was the CEO of ZPL Technologies–a manufacturing system deployment partner that proved critical in the development...
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Lauren Boteler, PhD
Dr. Lauren Boteler is currently the Technical Assistant to the Director of the U.S. Army Research Laboratory. Previous to this position, she led the thermal and packaging research programs as part of...
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Tingfang Ji, PhD
Tingfang Ji joined Qualcomm in 2003 and is currently a senior director of engineering in Wireless R&D. From 2003 to 2014, he made instrumental technical contributions towards the development of...