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Event
Arizona CHIPS Act Support: Leveraging State Government Incentives
Co-sponsored by SEMI and Arizona Commerce Authority
The Arizona CHIPS Act webinar will outline the customized support and advantageous programs that companies can leverage for more...
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MSTC 2023 Speaker Bio - Nigel Beddoe, Cohu Inc.
BIOGRAPHY
Nigel Beddoe is the Director Product Marketing Management – MEMS and Sensors for Cohu Inc. and is based out of Melaka, Malaysia.
After graduating from the University of Wales in...
Member Company
Beijing Sequential Technology Co.,LTD
Sequential Technology Co.,LTD is a high-tech manufactuting enterprise specializing in organic polymer materials with independent R&D dep. We offer advanced packaging materials and technical...
Member Company
Shenzhen Therlicon Technology Co.,Ltd
Based on more than 20 years of electronic thermat technology of JT Co.,Ltd. Therliconfocuses on the R&D and manufacturing of welding process equipment in the semiconductor thermal field,providing...
Member Company
Zhen Ding Technology Holding Limited
Zhen Ding Tech. Group Technology Holding Limited is a professional service provider that offers one-stop solutions for the design, development, manufacturing, and sales of all types of printed...
Member Company
SAS Technology (Shanghai) Co., Ltd
赛芈半导体科技业务范围包括：1.产品代理销售与服务：是FAITH, K-PATENTS, LEVITRONIX, MEI, PCT中国独家代理：2.设备移机项目管理，3. 二手设备翻新及买卖，专精于湿法清洗及干法刻蚀设备。
SAS Semiconductor Technology business territory includes: 1. Product representative...
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Secondary Equipment & Applications Technology Community
Renewing Technologies
The Secondary Equipment & Applications (SE&A) group supports members in the global secondary market for semiconductor equipment. SEMI provides both the forum and...
Member Company
Solar Applied Material Technology Corporation
Solar Applied Materials Technology Corporation, is the top material supplier for Semiconductor,FPD, LED, PV, ODS and MDS. Based on the concepts of “Value-added Close-Loop Model” and...
Member Company
Shanghai Dongxu Electronic Technology Co., Ltd
我司主营半导体封装制程中所用到的硅片减薄用的减薄膜，芯片切割与产品切单用到切割膜，各种等级的硅片以及相关设备。Our Company primary services is for semiconductor assembly process, just like GB tape for wafer backgrinding process, dicing tape for wafer...
Event
Advanced Packaging incl. Heterogeneous Integration & Chiplets (Americas/EU)
Strengthen your knowledge and skills by learning about IC packaging, assembly, and package/substrate and Heterogeneous Integration & Chiplets. Pricing ...
Member Company
Cheng Mei Instrument Technology Co., Ltd.
CMIt Cheng Mei Instrument Technology Co., Ltd. was founded in 1995.Initially, its primary business was the sales and distribution of high-end measurement equipment. In 2010, CMIt began independent...