September 22, 2026 - September 23, 2026
Strengthen your knowledge and skills by learning about IC packaging, assembly, and package/substrate and Heterogeneous Integration & Chiplets.
Pricing
Early Bird Pricing $100 off
- Members: $
845$745 - Non-Members: $
945$845
Any questions, please contact [email protected]
Time
7:30 am - 11:30 am PDT
Location
United States
Course Description
This course will stress the impace of the IC and End product requirements, i.e., smaller, better, cheaper" and their influence on the manufacturing processes. Topics include area packaging - ball grid arrays, flip chip, fanout, attaching dies and chip scale packages, and the assembly technologies - chip & wire, tape automated bonding, and flip chip, as well as emerging technologies, namely, 3-D and stacked die, and packaging reliability issues.
Who Should Attend
This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:
- Engeineers
- Managers
- Process Engineers
- R&D Engineers
- Sales and Application Engineers who supply packaging materials and tools
Learning Objectives
- Identify the wide variety of package types and how they align with different application uses.
- Understand chip interconnection technologies (such as wirebond, flip chip, or thin film) and chip encapsulation
- Identify the materials and processes used in packaging.
- Summarize the current state of the art packages, such as chiplets and heterogeneous packaging.
Gain a foundational understanding of what packaging is and its importance to the microelectronics industry.
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Featured Speakers
Dr. Terry Alford
PT International LLC
Biography