Shanghai Dongxu Electronic Technology Co., Ltd
Member Since
Nov 18, 2014
Member ID
257769
Website
Location
218 Huashen Road,
Waigaoqiao free Trade Zone,
Pudong New Area,
China
Primary Industry
Semiconductor
Primary Product Category
Materials
Primary Product Sub Category
Assembly/Packaging Materials
Company Profile
我司主营半导体封装制程中所用到的硅片减薄用的减薄膜，芯片切割与产品切单用到切割膜，各种等级的硅片以及相关设备。Our Company primary services is for semiconductor assembly process, just like GB tape for wafer backgrinding process, dicing tape for wafer sawing and package singulation, various grades of silicon wafers, and related machines.
我司主营半导体封装制程中所用到的硅片减薄用的减薄膜，芯片切割与产品切单用到切割膜，各种等级的硅片以及相关设备
我司主营半导体封装制程中所用到的硅片减薄用的减薄膜，芯片切割与产品切单用到切割膜，各种等级的硅片以及相关设备