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SPCC 2026 Bio Jim De Boer
TTV Optimization in Wet Chemical Thinning Using Integrated MetrologyWet chemical thinning is essential for enhancing substrate uniformity by removing subsurface damage from prior mechanical...
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SPCC 2026 Bio Siddarth Sampath
BIOGRAPHY
Siddarth Sampath is a technology leader and subject‑matter expert in liquid filtration, contamination control, and purification for the semiconductor...
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SPCC 2026 Bio Sangita Kumari
Wet Cleaning of Sulfur Residues Post RIE for Advanced BEOL IntegrationIn this study, we investigate traditional wet cleaning methods for removing sulfur residues after RIE etching. The effectiveness...
SEMI Press Release
SEMI Reports Global Semiconductor Equipment Billings Reached $135 Billion in 2025, Up 15% Year-on-Year
AI Demand, Advanced Logic and Memory Drive Record Semiconductor Equipment Billings in 2025MILPITAS, Calif. – April 7, 2026 – Worldwide sales of semiconductor manufacturing equipment increased 15% to...
SEMI Press Release
European Chips Skills Academy Launches the ECSA Learning Platform
Offers Skills Development Resources and Career Opportunities for European Semiconductor WorkforceBRUSSELS — April 6, 2026 — The European Chips Skills Academy (ECSA), an European Union...
Member Company
HPT, Inc.
Member Company
Handotai India Pvt Ltd
India Handotai has developed and is manufacturing the adhesive tapes used in the semiconductor OSAT/ATMP industry and selling them on 3 continents.
It is also a distributor of strategic materials and...
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ISS Japan 2026 Biography
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Arizona Chapter Breakfast Forum Speaker Bio - Lee Short
BIOGRAPHYLee Short serves as the General Manager of the Service Technology Centers (STC) within Edwards’ Semiconductor Service Division, overseeing operations throughout the Americas. In this role,...
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SPCC 2026 Bio Wei-Shang Lo
Impact of Wet Bevel Etching on WDC Films and Advanced Interconnect Structures As BEOL scaling continues, the introduction of new interconnect materials such as tungsten-doped carbon (WDC)...
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SPCC 2026 Bio Sina Kaabipour
Verifying PFAS Abatement in Fab-Relevant Waste Matrices Using Complementary Analytical Characterization TechniquesPer- and polyfluoroalkyl substances (PFAS) are integral components in...
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SPCC 2026 Bio Shih-Chih Lin
WSDL: AI-Enabled Wafer Surface Defect Localization for Cleaning Process OptimizationIn advanced semiconductor manufacturing, wafer surface integrity is strongly influenced by cleaning efficiency,...