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Member Company
吉盛微（上海）半导体技术有限公司
吉盛微，初创于2021年，专注于半导体关键零部件和服务国产化，保障国内半导体制造厂商生产连续性，努力成为一流半导体制造综合解决方案提供商，总部位于上海，在绍兴、宁波、武汉等有研发中心和制造基地，现有员工270余人。
吉盛微，积极把握半导体关键零部件及材料国产替代机遇，已经布局石英部件、硅部件、碳化硅材料及部件，真空泵维修等业务。
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Innovating in the MEMS Foundry Business - Recording
AbstractScience Foundry innovates on the traditional MEMS foundry business in three key ways: robust Multi-Project Wafer (MPW) offerings, a custom Manufacturing Execution System (MES), and a modular...
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2025 EHS Summit Proceedings Download Page
Thank you for attending the 2025 SEMI EHS Summit. Click on the title of the presentation below to view the presentation.SEMI EHS OverviewJames Amano, Sr. Director, EHS, SEMIUS Regulatory...
Member Press Release
DuPont to Discuss Development of EUV Photoresists at SPIE Advanced Lithography + Patterning Conference
WILMINGTON, Del., Feb. 12, 2025 – DuPont today announced its participation in the 2025 SPIE Advanced Lithography + Patterning conference, taking place Feb. 24–28 in San Jose, California. DuPont will...
Member Company
MADDE Inc
MADDE is a company spun off from Hyundai Motor’s in-house startup, established as a corporation in June 2023.
MADDE offers 3D Printing-based product manufacturing services using ceramic materials...
Member Company
Advanced Material Engineering S/B
We are dealing in
Quartz Ingot & Quartz Parts
Silicon Parts
Silicon Carbide Ceramic Parts
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MEMS & Sensors Technical Congress—MSTC 2025 Speaker Bio & Abstract - Matt Weimer
Replacement of PFAS Anti-Stiction Films in Inertial Sensors with Atomic Layer DepositionABSTRACT Stiction presents a significant challenge in the MEMS and sensor industry, restricting design...
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MEMS & Sensors Technical Congress—MSTC 2025 Speaker Bio & Abstract - Andrew Stewart
AI Applications to Enhance MEMS Inertial Sensors in AerospaceABSTRACT The aerospace community is growing at an exponential rate. Uncrewed Aerial Systems and Advanced Air Mobility vehicles are...
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MEMS & Sensors Technical Congress—MSTC 2025 Speaker Bio & Abstract - Sung Jin (SJ) Kim, PhD
Next-Gen Glass-Based Packaging: Transforming MEMS and Sensor PerformanceABSTRACT The evolution of semiconductor packaging is driven by the need for enhanced performance, miniaturization, and...