Next-Gen Glass-Based Packaging: Transforming MEMS and Sensor Performance
ABSTRACT
The evolution of semiconductor packaging is driven by the need for enhanced performance, miniaturization, and reliability. Conventional organic and ceramic substrates face limitations, necessitating a shift in packaging methodologies. MEMS and sensor packaging, in particular, encounter challenges such as warpage, limited dimensional stability, and suboptimal thermal conductivity.
Absolics is pioneering glass-based substrate technologies that redefine performance benchmarks for advanced semiconductor packaging. Originally developed for AI, high-performance computing, and high-speed communication applications, Absolics' glass substrates offer superior signal integrity, dimensional stability, and high-frequency performance. These advantages present significant opportunities for MEMS and sensor packaging, enabling enhanced integration and miniaturization.
Recognizing this potential, Absolics has secured funding from the U.S. CHIPS Act and the National Advanced Packaging Manufacturing Program (NAPMP) to explore the application of its glass-based technologies. This presentation will introduce Absolics' proprietary methodologies for Through-Glass Via (TGV) formation and cavity structuring, which enable ultra-fine interconnect pitch, optimized component embedding, and superior electrical performance. By addressing industry challenges, Absolics' glass substrates establish a transformative material for MEMS and sensor packaging, offering superior performance, scalability, and manufacturability.
BIOGRAPHY
Sung Jin Kim, Ph.D., is the CTO of Absolics, a recently spun-off semiconductor packaging business from SK Group in the USA. With 29 years of experience in the semiconductor and microelectronic packaging industry, Dr. Kim leads new technology and business development for advanced semiconductor packaging solutions at Absolics. Prior to Absolics, he held executive positions in various companies and countries, including SKC, Georgia Institute of Technology, Foxconn Advanced Technology, Daeduck Electronics, UTAC, and Amkor Technology. Throughout his career, Dr. Kim managed package engineering, substrate manufacturing, and embedding component microelectronic package engineering. He has over 100 US patents and holds a doctorate in electrical engineering from the Technical University of Dresden, Germany.