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Member Press Release
SEMI ESD Alliance Adds Axiomise to Member Roster
The Electronic System Design Alliance, a SEMI Technology Community, today announced Axiomise, a leading provider of cutting-edge formal verification training, services and custom solutions, is the...
Blog
Top 10 Reasons to Join New Semiconductor Climate Consortium
To accelerate efforts to reduce the climate impact of the semiconductor value chain, SEMI members from the equipment, materials and service sectors, as well as several device manufacturers are...
SEMI Press Release
SEMICON Japan 2022 to Spotlight Innovations Driving Semiconductor Industry Growth
TOKYO – October 11, 2022 – With Japan accounting for more than 30% of semiconductor manufacturing equipment and materials sales worldwide, the stage is set for SEMICON Japan 2022 as Japanese and...
SEMI Press Release
Global 300mm Semiconductor Fab Capacity Projected To Reach New High in 2025, SEMI Reports
MILPITAS, Calif. — October 11, 2022 — Semiconductor manufacturers worldwide are forecast to expand 300mm fab capacity at a nearly 10% compound average growth rate (CAGR) from 2022 to...
Member Press Release
Samco Unveils Plasma Enhanced ALD System for SiC and GaN Power Devices
Samco, a leading manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, launches the new Plasma Enhanced...
Blog
SEMI Invites Industry Stakeholders to Join New Semiconductor Climate Consortium as Founding Members
In a drive to bring together the semiconductor value chain to address climate challenges, SEMI welcomes members and other industry stakeholders to join the Semiconductor Climate Consortium...
Blog
Celebrating National Hispanic Heritage Month – Diverse Voices in the Microelectronics Industry
Recruit outside the box. This is the simple advice Arianna Avellán Jaramillo would give to industry leaders and recruiters on how to increase diversity in the microelectronics industry. Avellán...
Blog
FLEX 2022 Highlights Additive Techniques for Flexible Hybrid Electronics Packaging and Integration with Human Body
Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component...
SEMI Press Release
Mark Templeton Inducted into Phil Kaufman Hall of Fame by the ESD Alliance and IEEE CEDA
Templeton Recognized Posthumously for Technical and Business Innovation
MILPITAS, CALIF. –– October 3, 2022 –– Mark Templeton, the former managing director of investment firm Scientific...
SEMI Press Release
Dr. Giovanni De Micheli Honored with 2022 Phil Kaufman Award Presented by ESD Alliance and IEEE CEDA
EPFL and former Stanford professor recognized for his significant impact on the electronic system design industry through pioneering technical contributions
MILPITAS, Calif. –– September 28, 2022 ––...
Member Press Release
PEER Group to showcase expertise at APCSM 2022
Kitchener, Ontario, September 27, 2022 – PEER Group®, the largest supplier of innovative factory automation software products, is a proud sponsor and participant at this year’s Advanced Process...
Blog
Adding More Data Isn't the Only Way to Improve AI
Artificial Intelligence (AI) has the potential to transform society and business in the 21st century. AI has already been deployed to in smart homes, online shopping, natural language processing...