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Member Press Release
MRSI Systems, Mycronic Group announces a new collaboration to provide LiDAR solutions for the Automotive Industry
MRSI Systems is delighted to announce a new collaboration with Lumentum Operations LLC (“Lumentum“, NASDAQ: LITE), a leading global photonic chip and module supplier for the automotive LiDAR...
Blog
Podcast: Q1 2022 EDMD Report Highlights With Dr. Walden Rhines
Dr. Walden Rhines, former CEO of Mentor Graphics (now Siemens EDA), and current CEO of Cornami, recently joined Dan Nenni of SemiWiki.com for a podcast to discuss the latest Electronic Design Market...
Member Press Release
RoodMicrotec N.V. publishes the unaudited Interim Report for 2022
RoodMicrotec N.V. publishes the unaudited Interim Report for 2022
• Total income EUR 7.3 million (HY1 2021: EUR 7.3 million)
• EBITDA EUR 1.4 million (HY1 2021: EUR 1.3 million)
• Net profit EUR 0.6...
Member Press Release
Sikama International Celebrates 40th Anniversary
Established in July of 1982 by Sig, Kail, and Mariellen Wathne (hence the name, “SiKaMa”), Sikama was founded to design, develop, and manufacture high quality reflow soldering and curing systems...
SEMI Press Release
SEMI Applauds Senate Progress on CHIPS Act of 2022, Urges Timely Congressional Approval
MILPITAS, Calif. – July 19, 2022 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded progress in the United States Senate...
Member Press Release
Moov Secures David Arkow as Head of Global Sales to Further Leadership in Used Semiconductor Equipment Market
TEMPE, Ariz. and Austin, Texas—July 19, 2022—Moov, a data-fueled marketplace for used semiconductor manufacturing equipment, today welcomed David Arkow as the company’s head of global sales. The...
Member Press Release
CITC and Henkel forge partnership to accelerate high-thermal die attach solutions
Chip Integration Technology Center (CITC) and Henkel announced today that the organizations have formalized an agreement to collaborate on the development of high-thermal die attach solutions for RF...
Member Press Release
Russ Sanchez Joins YES as VP of Quality and Managing Director of YES Technology Center
Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that Russ...
Member Press Release
Micron to Select Athinia™ for Pioneering Data Collaboration
A long-term, strategic, enterprise-level technology collaboration aims to further increase production efficiencies and reduce costs for Micron and its suppliers.
Cambridge, MA, July 13, 2022 – Today,...
SEMI Press Release
SEMI FlexTech Announces 2022 FLEXI Award Winners for Outstanding Achievements in Flexible Electronics
SAN FRANCISCO — July 14, 2022 — Recognizing innovations and other outstanding accomplishments in flexible hybrid electronics (FHE), SEMI FlexTech, a SEMI Technology Community, yesterday...
Member Press Release
PEER Group employees recognized for contributions to the semiconductor industry
Kitchener, Ontario, July 13, 2022
PEER Group®, the largest supplier of innovative semiconductor factory automation software, is proud to share that two members of its engineering team have been...
Member Press Release
RoodMicrotec N.V.: Invitation to the presentation of the first half-year’s results for 2022
Deventer, July 13, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, will publish the Company’s first half-year report for 2022 before stock...