Showing 121-132 of 2598
SEMI Press Release
ECS Summer School 2026 Empowers the Next Generation of Microelectronics Talent
ECS Summer School Applications Open for Undergraduate STEM Students in EuropeBrussels, Belgium —February 12, 2026 —The European Chips Skills Academy (ECSA), a European Union (EU)-funded...
SEMI Press Release
SEMICON Korea Opens to Strengthen Innovation and Connectivity Across the Global Semiconductor Ecosystem
SEOUL, South Korea ─ February 10, 2026 ─ Fueled by the rapid advancement of AI and the widespread adoption of advanced applications, the semiconductor industry has moved beyond a traditional...
Blog
Meet D2S’ Aki Fujimura Whose Career Spans Manhattan to Curvilinear Design
Aki Fujimura has been at the forefront of chip design innovations from the beginning of his career and his technology leadership continues today. He serves as Chairman and CEO of D2S,...
SEMI Press Release
SEMI Reports 2025 Annual Worldwide Silicon Wafer Shipments and Revenue Results
Shipments Increase in 2025 Amid Strong AI-driven Demand, While Revenue SoftensMILPITAS, Calif. — February 10, 2026 — Worldwide silicon wafer shipments in 2025 increased 5.8% to 12,973 million square...
Member Press Release
EMASS Tapes Out 16nm ECS-DoT, Advancing Always-On Edge AI
LOS ANGELES (Jan. 28, 2026) – EMASS, a Nanoveu subsidiary specializing in next-generation semiconductor technology, today announced the successful tape-out of its 16nm ECS-DoT system-on-chip (SoC)....
Member Press Release
OXFORD INSTRUMENTS TEAMS WITH AOI TO BOOST ITS OPTOELECTRONIC DEVICE MANUFACTURING WITH NEXT-GEN INDIUM PHOSPHIDE
Oxford Instruments, a leading provider of advanced plasma processing solutions, today announced a plasma equipment supply agreement with Applied Optoelectronics Inc. (AOI) (Nasdaq: AAOI), a leading...
Blog
EDA—Giving Design and Manufacturing the Capability to Predict How a Design Will Perform
Presentations from SEMICON West’s “The Convergence of Semiconductor Manufacturing and Design” offer great insights into the collaboration between the two, as I was recently reminded by presenter...
SEMI Press Release
SEMI ISS Europe 2026 to Spotlight Navigating Geopolitics and Shaping Europe’s Semiconductor Future
SOPOT, Poland — January 30, 2026 — Leading industry experts, economists, policymakers, and technology leaders will gather at the SEMI Industry Strategy Symposium Europe (ISS...
SEMI Press Release
SEMI Outlines 2026 U.S. Policy Priorities to Support Semiconductor Growth, Innovation, and Supply Chain Stability
Policy Priorities Focus on Trade, Workforce, Investment Certainty, CHIPS Act Implementation, and Supply Chain ResilienceMILPITAS, Calif. — January 28, 2026 — SEMI, the industry association serving...
Blog
SEMI Standards Update: Takeaways from the International Standards Summit in Q4 2025
2025 was a fast-paced, exciting, and impactful year for the SEMI Standards team. We developed 14 new standards on crucial topics like supply chain traceability, defect mitigation, compound...
Member Press Release
Heidelberg Instruments — Beta Site Installation of NanoFrazor with Parallelization Capabilities at EPFL
Advancing Thermal Scanning Probe Lithography
Zurich, Switzerland — Following the successful introduction of the modular NanoFrazor nanolithography system in 2024, Heidelberg Instruments is proud to...
Blog
Addressing Cybersecurity Across the Semiconductor Manufacturing Supply Chain
Cybersecurity vulnerabilities within the semiconductor supply chain are a growing concern, ranging from individual threats to whole supply chain cyber resilience. It is imperative that the...