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Blog

Modernizing OT Cybersecurity: Addressing Technical Debt in Semiconductor Manufacturing

At SEMICON West, Accenture’s Bradford Hegrat offered a candid assessment of one of the semiconductor industry’s most persistent—and least visible—cybersecurity challenges: operational technology (OT)...
By SEMI
May 4, 2026
Blog

A Human-Centered Approach to R&D Security: Lessons from imec

At SEMICON West, imec leaders Tom Palmaers and Giselle Van Tornout addressed a seldom-discussed but deeply consequential reality: traditional security models often fail in research and development...
By SEMI
May 4, 2026
Blog

Strengthening Semiconductor Supply Chain Integrity: Strategies to Counter Trojans, Compromise, and Global Manufacturing Risk

At SEMICON West, Qualcomm’s Daniel O’Loughlin delivered one of the most wide-ranging examinations of semiconductor supply chain security presented at the conference. His session underscored a...
By SEMI
May 4, 2026
Blog

Silicon Provenance: Building Trust Through Traceability, Authenticity, and Lifecycle Auditability

At SEMICON West, Prabhu Jayanna from AMD presented a compelling vision for how the semiconductor ecosystem can strengthen trust in the devices it produces. His focus was silicon provenance—a...
By SEMI
May 4, 2026
Blog

Stopping Counterfeits with Physics: Inside the Future of Semiconductor Fingerprinting

At SEMICON West, Dr. Bertrand Cambou of High Entropy Security explored a fast-evolving challenge in the semiconductor ecosystem: the rise of counterfeit and cloned devices. His session introduced a...
By SEMI
May 4, 2026
Blog

Navigating Global OT Cybersecurity Regulations: What Semiconductor Leaders Must Know

At SEMICON West, experts from Sun Square, Moxa, and NY CREATES underscored a pivotal reality: regulatory pressure in the semiconductor industry has reached a historic tipping point. For the first...
By SEMI
May 4, 2026
Blog

Sensing Tomorrow: Emerging Applications for MEMS & Sensor Technologies

At SEMICON West, the SEMI MEMS and Sensors Industry Group (MSIG) showcased how advances in sensor miniaturization, integration, and edge intelligence are reshaping mobility, automation, and the...
By SEMI
May 4, 2026
Blog

Building the Digital Twin Backbone: Why Scalable Data Platforms Are No Longer Optional

At SEMICON West, industry leaders agreed: Scalable, secure data platforms are now essential for AI-driven semiconductor manufacturing. Federated data sharing, traceability, and edge-to-cloud...
By SEMI
May 4, 2026
Blog

Imaging Across Assembly and Test: Enabling Manufacturable Complexity

Insights from SEMICON West APHI Sessions On Advanced Package Assembly, Test Visibility, and Closed-Loop ManufacturingThe Advanced Imaging sessions highlighted imaging’s expanding role beyond...
By SEMI
May 4, 2026
Blog

From Inspection to Intelligence: Imaging as a Driver of AI-Era Manufacturing

Insights from the SEMICON West Session “Reimaging and Transforming Package Assembly and Test Manufacturing in the AI Era”Across the Advanced Imaging track, speakers consistently described imaging’s...
By SEMI
May 4, 2026
Blog

When Materials Meet Imaging: Dielectrics as a Defining Constraint

Insights From APHI Sessions Exploring The Interaction Between Advanced Materials, Imaging Fidelity, and ReliabilityAdvanced Imaging sessions at SEMICON West underscored a subtle but critical shift:...
By SEMI
May 4, 2026
Blog

Advanced Imaging: A Foundational Enabler for AI-Era Semiconductor Packaging

Insights from SEMICON West APHI Sessions on Advanced Imaging, Heterogeneous Integration, and Manufacturability at Scale.At SEMICON West, the Advanced Imaging sessions reinforced a pivotal industry...
By SEMI
May 4, 2026