Is your company working on the next big thing in flexible, hybrid and printed electronics – a breakthrough or innovation that will make the world safer, healthier or more productive for years to come? If so, we want to hear from you.You’re invited to deliver a technical presentation at virtual FLEX 2021, February 22-26, 2021. The call for abstracts is now open! Celebrating its 20th year, the online event will gather executives, product managers, business development professionals, and engineering directors as well as leading industry analysts and media for the latest developments, trends and innovations in flexible hybrid electronics (FHE). More than 400 companies, universities, R D labs, and government agencies from around the world have participated in FLEX conferences.Technical presentations should focus on the conference theme, 20 Years of Driving Innovation to Make the World Safer, covering flexible hybrid or printed electronics products, equipment, processes, materials, and the applications they enable. FLEX 2021 also takes aim at the future of the planet, so presentations on global sustainability in areas such as impacts, strategies, tactics, successes and progress area also a great fit. To submit your abstract, please complete the online form: Upload your abstract (100-300 words) describing the topic of your presentation and how it applies to the flexible, hybrid, and printed electronics products. Preference is given to original research and advancements in process and materials as they relate to end users. We also invite students from research universities to submit posters describing their work and results for the popular FLEX Poster Competition. As in the past, a panel of industry and academic experts will evaluate the posters and recognize the top three students and their work. Here are key deadlines and dates for industry experts and students to keep in mind: September 30, 2020 – Submit your abstract. October 31, 2020 – We’ll notify you whether your presentation has been accepted by this date. November 15, 2020 – Sign a Speaker Agreement and provide a bio and headshot. February 1, 2021 – Send us an electronic copy of your presentation. We’re looking for presentations in these topic areas: Flexible Hybrid Electronics Systems Materials Processing Sustainability and Power MEMS and Sensors Applications Presentations should include the following: Why the technology presented matters and to whom Practical recommendations for addressing commercialization issues or applications. This includes providing innovative technological or market solutions driven by a use case, the integration challenges you faced, and the system-level architecture decisions you made. Descriptions of how you overcame each challenge Ideas for what as an industry we should be working on and what are you working on to demonstrate sustainability For a full rundown on topics and other information, please visit the FLEX 2021 Call for Papers web page.Michelle Fabiano is a program and event manager for SEMI Americas.

If you bought a new car recently, you must have noticed that it warns you if one of its functions needs your attention. It even alerts the factory if repairs or major adjustments are needed. Wouldn’t it be nice to have similar capabilities for our bodies that will call for a “service” before we end up in an emergency room – or worse? The United States invests almost 18 percent of its Gross Domestic Product (GDP) in healthcare. Such a significant part of our economy deserves our industry’s attention – and it gets it. SEMI’s recent Smart MedTech webinar series tells not only patients and healthcare providers how electronic products can impact their lives, but also offers device makers plenty of ideas for developing new solutions.SEMI Gets SmartIn addition to working on many important topics with more than 2,200 member companies across the semiconductor supply chain, SEMI focuses on special areas: Smart Mobility (as covered here), Smart MedTech (covered below), Smart Manufacturing, and Smart Data. Smart MedTech was the topic of four recent webinars, organized by Melissa Grupen-Shemansky, executive director Nano-Bio Materials Consortium (NBMC), and Chief Technology Officer, SEMI. NBMC’s mission is to enable flexible, wearable human performance monitoring. In her introduction, she emphasized that healthcare will shift from today’s provider-centric approach to a personalized care model, with the following characteristics: Outcome-based Decentralized, not limited to geographies Specific to your personal health and medical needs With a team of providers, connected like never before To achieve all these characteristics, microelectronics will be an essential contributor. That is why SEMI and member companies are working on platforms to fund and commercialize R D as well as to educate potential users and beneficiaries. Grupen-Shemansky engaged a series of experts and organized four webinars to address this broad and complex field, and outline their contributions to meeting the above criteria. They have been recorded and are available to SEMI members. Call your SEMI contacts to find out where and how you can access slides and recordings of more than a dozen presentations.From Biomarkers to BioChemical Sensors Physiological RelevancyTo monitor a human body’s performance, researchers have to first understand which biomarkers indicate specific conditions of the body, then learn how to capture and process the data. Grupen-Shemansky moderated this August 5th session. Christina Davis from UC Davis, Jennifer Martin, and Sean Harshman from the Air Force Research Lab (AFRL), and Kenneth Ward from Pacific Diabetes Technologies presented their ongoing efforts in this field.Davis talked about the challenges of analyzing exhaled breath, which contains 99% water and 1% biomarkers. She showed a hand-held analyzer her team has developed (Figure 1). She also elaborated on how to interpret the captured data and, if needed, decide which follow-up treatments are advised.Figure 1: Palm-sized µCON exhaled breath micro-condenser used to analyze biomarkers. (Courtesy: UC Davis) AFRL’s Martin and Harshman outlined how ongoing and future minimally invasive techniques are being used to monitor airmen, and give them advice for self-treatment to maximize their performance. The Pacific Diabetes Technologies speaker, Ward, showed how to use minimally invasive, subcutaneous (=under the skin) oxygen sensors to detect hemorrhage (= blood loss) and control it.En Route Care (ERC) and Point of Care (POC) DiagnosticsTreating injuries right away and correctly shortens not only a patient’s suffering, but also improves his or her chances for a full recovery. AFRL’s Matthew Dalton moderated this August 12th session. Derek M. Sorensen from AFRL, Zheng Yan from the University of Missouri-Columbia, Melinda Eaton from the Virtual Health Program Management Office at the U.S. Department of Defense (DoD), and Azar Alizadeh from General Electric (GE) Research outlined their contributions to achieving instant and professional care.AFRL’s Sorensen described the many challenges a Critical Care Air Transport Team (CCATT) deals with when performing their work inside a noisy, dark, hot, or cold, shaking airplane, discussed their equipment and personnel constraints, and explained how difficult it is, even for experienced doctors, to perform emergency surgeries under these conditions.Professor Yan takes low cost very seriously and demonstrated how he and his students have developed on-skin wearable sensors that can be manufactured by using only pencil and paper.Eaton outlined the DoD’s strategy for assuring its medical force is ready to support soldiers. Then she discussed a broad range of the DoD’s traditional health management responsibilities and added that Covid-19 is now an important factor.Alizadeh addressed how GE microelectronic solutions improve the efficiency of care, reduce medical errors and length of hospital stays as well as improve workflows of caregivers. In addition to GE’s well-known, large/stationary medical equipment and communications infrastructure (Figure 2), Alizadeh showed that GE is also providing skin patches and other wearable sensors to capture data.Figure 2: The Future of Monitoring: In 2017, Mercy Hospital served 800,000 patients with telemedicine including those with chronic diseases. Patient:doctor ratio: US average 300:1. Mercy = 1100:1. (Courtesy: GE) Human Wearables Enabling Rapid Decision Making in the Integrated Care ContinuumAs Figure 2 above shows, microelectronic equipment can improve patient care and efficiency of medical personnel, but only if sufficient data can be captured timely and accurately – increasing the importance of wearables. AFRL’s Jeremy Ward moderated this August 17th session. Christopher Scully from the U.S. Food and Drug Administration (FDA), Ashleigh Coker from the AFRL’s Sensors Directorate, Ted Harmer from the AFRL’s Airman Systems Directorate, and AFRL’s Regina Shia presented for Oxana Pantchenko from NextFlex how they develop wearables jointly. Scully introduced the FDA’s organization and its responsibilities, described the high-value accurate data can provide, warned about the damage false alarms and equipment failures can cause, and explained the regulatory role the FDA plays in this context.AFRL’s Coker highlighted the essential role sensors play in modern warfare with several examples, described her directorate’s operations and showed their warfighter-centric design process (Figure 3).Figure 3: Warfighter-centric design process steps and the need to engage multiple heads/perspectives in this process. (Courtesy of AFRL) AFRL’s Harmer addressed the importance of good communications architecture and protocols to capture and compute data to assure efficient cooperation between land/air/sea/space-based forces.NextFlex’ Pantchenko prepared a presentation about standards-compliant wearable electroencephalography (EEG), electromyography (EMG), and electrooculography (EOG) devices, jointly developed with AFRL and several other companies. It was delivered by AFRL’s Regina Shia.Automation, Augmentation and AINatalie Wisniewski, Founder of Profusa, Inc. a and consultant in Wearables and Digital Health, moderated the fourth webinar, held on August 26. She emphasized SEMI’s role in this context, then introduced the speakers: Michael Kirby from Colorado State University, Kevin Zhao from Harmonize Health, Mary Clare McCorry from armi/biofab USA, and Andreas Caduff from ETH Zuerich.Professor Kirby outlined several mathematical principles that need to be applied to get meaningful results when analyzing data. He emphasized that genetic factors influence if an individual is susceptible, tolerant, or even resistant to certain pathogens and warned that bacteria can develop resistance to today’s antibiotics.Zhao from Harmonize talked about the importance of predictive analytics in remote care, how to filter out false alarms, and how to deliver the best available care cost-effectively. In closing, he emphasized that computers and algorithms are not replacing clinical staff.McCorry outlined how biofab USA, a program of armi, uses sensors and automation to grow replacement tissue and organs (Figure 4). She explained how they use engineering principles and life sciences to make guide cells grow into replacement tissue. The company’s plan is to expand the currently lab-based capabilities into an industrial scale tissue foundry.Figure 4: Growing ear cartilage in the lab. (Courtesy: armi/biolab USA) SummaryMcCorry summarized her presentation, and actually the entire webinar series, with these statements: The human body is a 3D, highly complex, dynamic, and multi-faceted biological construct Skin lends itself well as an interface between body and wearable sensors Connecting physiology (e.g. vital signs), behavior, and external factors is important for getting good results Verification, validation, and FDA involvement are important for making methods and devices successful Sensors, communication computing (AI/ML) are complementing, not replacing, medical personnel Today’s methods and devices will be outperformed by tomorrow’s solutions – stay up to date Personal CommentsSummarizing eight hours of presentations in a few pages requires a very high and lossy compression factor – please understand. I suggest you call on your SEMI contact to get access to these previous and following webinar recordings. Excellent contacts across the electronics supply chain enable SEMI to win experts in many areas to convey valuable information in these webinars.I am impressed that the USA military, specifically the AFRL, invests so much effort in medical support for airmen/women. They demonstrate that only healthy and fit personnel can take full advantage of the sophisticated weapon systems at their disposal if/when they are called upon to deploy them.This Smart MedTech webinar series confirms what many medical experts told me during exams and/or before and after surgeries: The human body is a masterpiece of bioengineering. These webinars also reminded me of what I learned at a brain-health class at Stanford University: Our brains only need about 20 Watts to perform computing and memory tasks that fairly quickly approximate the results of today’s computers – a benchmark for computer architects and AI/ML experts.Republished with permission from 3D InCites.

Making Strides TogetherKnowledge is power – especially when it is shared. This principle formed the foundation for Micron’s Go and See virtual visit of its Singapore manufacturing plant on 26 August 2020 as 27 companies including GLOBALFOUNDRIES, ST Microelectronics, Infineon, TEL, ViTrox , IBM, HP and UTAC joined the first-of-a-kind virtual factory visit. The chip industry powerhouses gathered to see how Micron’s Lighthouse frontend wafer fabrication facility leverages Fourth Industrial Revolution technologies to drive new production and cost efficiencies.They saw clear markers of a transformed organisation and spoke with working-level staff, managers and front-line employees. Company representatives also met virtually with Micron management teams from organisations that led its digital transformation – from pilot programs to integration at scale – to realise significant financial and operational benefits. The mix of technologies they deployed to make it all happen included artificial intelligence (AI), big data analytics and the Industrial Internet-of-Things (IIoT).Micron’s Singapore-based fab facility earned Lighthouse certification earlier this year from the World Economic Forum’s Global Lighthouse Network. The Go and See tour was co-sponsored by SEMI Southeast Asia and McKinsey Company.Transformation is CrucialBy embracing Lighthouse principles, semiconductor sectors and companies can accelerate their digital transformation to boost operational and financial efficiency while helping increase productivity across the electronics supply chain. It will take time for Southeast Asia semiconductor manufacturers to transform to digital operations, though we’re seeing growing interest in Industry 4.0 practices as they begin to understand that the deployment of new technologies and applications will help them better understand real-world benefits of smart manufacturing use cases and solutions. SEMI believes shining the spotlight on companies like Micron can illuminate the way forward for other companies to help drive the industry’s digital transformation. We look forward to seeing companies build on this momentum as they start to leverage leading-edge technologies to improve efficiencies and promote sustainability.Bee Bee Ng is president of SEMI Southeast Asia.

METIS, a Sector Skills Alliance project co-funded by the European Commission’s Erasmus+ Program and coordinated by SEMI, recently launched an online questionnaire aimed at gauging the skills and expertise the industry needs to drive continued growth over the next five years. The survey, which will stay online until 15 October 2020, is a part of the METIS project’s efforts to involve a broad range of stakeholders in the microelectronics industry to assess workforce, future technology and economic trends influencing talent development and the skills needed most today and in the next five years. The survey aims to highlight the skill mismatches in specific job profiles that are of increasing importance to the microelectronics industry. It elaborates on the upskilling and reskilling needs for design engineers. Given that semiconductor design is becoming increasingly crucial for Europe’s competitiveness and technological sovereignty, the new skills required from design engineers are a priority area for the METIS project. Other examples are the manufacturing and maintenance technicians, two job profiles that are currently experiencing significant shifts in their skillsets, as COVID-19 has thoroughly transformed their way of work.While the microelectronics industry has been very aware of the importance of the high level of investment in R D, it is equally crucial to ensure that the workforce of the industry is equipped with knowledge and skills for the rapid technological developments. Maintaining high levels of investment in workforce including attracting talent, updating their knowledge and skills with the latest technological development, and supporting them to lead innovations, is essential for this industry. There is a growing demand for specific requirements for this sector to support innovation in many other sectors such as automotive, energy, healthcare, and government, to foster benefits from emerging digital technologies such as Cloud Services, Internet of Things (IoT), Artificial Intelligence (AI), Digital Reality, and Blockchain.In addition to the online questionnaire, the METIS project consortium is interviewing top experts from leading microelectronics companies, education representatives from universities and training academies, and experts from government agencies and industry associations. The interview outcomes provide inputs on what kind of employee profiles are the most difficult to find, what skills this sector is looking for in a candidate, and what kind of training and policy frameworks are needed to improve employers’ skills. Those inputs are essential to develop the skill strategy and form recommendations on training modules.Furthermore, the METIS project consortium is organizing 10 focus groups. Each of the focus groups is dedicated to a key topic, such as SC design, SC materials, semiconductor manufacturing equipment, etc. For example, one of the METIS focus groups is dedicated to Edge AI, a top priority for the microelectronics industry. Strengthening the AI talent pipeline is essential to harness the potential of Edge AI in Europe and to facilitate the shift from the Cloud to the Edge when possible in order to meet specific demands (e.g. for autonomous driving), reduce energy consumption for data communications, and to increase efficiency. The EU’s White Paper “Artificial Intelligence - A European approach to excellence and trust”[1] , published this February, also emphasizes the importance of upskilling and reskilling to position Europe among the global leaders in AI. Hence, the focus group will work towards pinpointing the skills necessary for the semiconductor workforce to capture the potential of the trend.The results of the survey, interviews and focus groups will be used to form the Microelectronics Skills Strategy. Based on this strategy, the METIS project will design 43 training modules for 1,100 hours learning in four key areas of the microelectronics sector:Component designSystem designBasic of manufacturingKey competencies and innovative thinkingThe METIS project is planning to recruit 2,000 learners in companies and education and training institutes to participate in the trainings and validate the impact. The METIS project will also work with companies, education and training providers to ensure continuity of the initiative and foster cooperation.During the METIS project course (2019 – 2023), the Skills Strategy will be updated yearly to reflect the latest technology and market trends. To enable the Skills Strategy to continue serving the industry, METIS is working on forming a permanent instrument, named Observatory and Skills Council, to continue developing the skills strategy, update the training and facilitate cooperation between industry and education and training providers.Laith Altimime, president of SEMI Europe, and 50 members of the Microelectronics Training, Industry and Skills (METIS) consortium The METIS consortium invites companies and associations involved in microelectronics training and education provision, human resources and career services professionals, technology strategists and policy makers to complete the online questionnaire. Stakeholders are also welcome to subscribe to the METIS newsletter for the latest on METIS programs. For more details, please contact Yanying Li at [email protected].[1] EU’s White Paper on Artificial Intelligence available at: https://ec.europa.eu/info/sites/info/files/commission-white-paper-artificial-intelligence-feb2020_en.pdfDr. Yanying Li is senior manager of Collaborative Projects at SEMI Europe.

Never before had we expected that SEMICON SEA 2020 would go virtual.The COVID-19 crisis abruptly halted our ability to hold our premier Southeast Asia electronics manufacturing exposition as we typically do – in the physical realm. The pandemic tested our adaptability, challenged our willingness to experiment and, perhaps above all, accelerated not only our own but the world’s digital transformation. We had to change our way of doing business and learn to connect virtually like we had never had before. SEMI continues to believe that virtual interaction is no replacement for face-to-face engagement. But, like the rest of the world, we fast-tracked our digital education and staged the virtual event 20 July to 21 August 2020 to gather supply chain players and help fulfill the tremendous potential of our great industry. For all the suffering the COVID-19 has caused, the pandemic has underscored an important truth – that we need innovation through collaboration now more than ever to help solve the world’s greatest problems. We thank all our event sponsors as we turned what started as a grand experiment into a successful event that drew nearly 3,000 attendees to our webinars, business matching sessions and other online offerings designed to help them uncover new business opportunities. Following are other highlights. Southeast Asia Pavilion at Virtual SEMICON West 2020 In our first collaboration with SEMICON West, our Southeast Asia Pavilion at the event welcomed virtual visitors from around the globe to help them form new connections and grow their businesses. Business Matching Sessions Technical buyers from more than 15 multinational companies along with 141 pre-qualified suppliers attended more than 50 meetings across four online business matching sessions.Technical WebinarsCompany representatives from regions including Malaysia, Singapore, Vietnam, Taiwan, the United States, the UK, Israel, China and Japan shared their expertise and industry insights at SEMICON Southeast Asia 2020 webinars. In addition, experts from leading semiconductor companies such as Micron Semiconductor Asia Operations, ViTrox Corporation Berhad and A*STAR took part in our technical exchange by sharing the latest trends in the rapidly evolving semiconductor industry. Talent Development: Inspirational University Program Talks With building the talent pipeline critical to sustaining growth of Southeast Asia semiconductor manufacturing dynamics, talent champions from Lam Research and GLOBALFOUNDRIES highlighted career opportunities and pathways for young engineers while generating recruiting leads. More than 750 students from Malaysia and Singapore engaged panelists with questions during the sessions. The SEMICON Southeast Asia team extends its tremendous thanks to sponsors and attendees for their support. As we all navigate the pandemic and hope in the near future to awaken to a brighter day, we will continue to connect virtually and, whenever possible, in person as the semiconductor industry evolves and flourishes. The SEMICON SEA 2020 team In the meantime, we will all continue to pull together to support our resilient industry as it outperforms most other manufacturing sectors. Semiconductor capital equipment shipments were up 23% globally in the second quarter of 2020 versus the same period in 2019 and semiconductor chip growth remains in positive territory. Our team has already started planning for SEMICON SEA 2021, scheduled to take place at the Setia Spice Convention Centre in Penang, 18-20 May 2021.We look forward to seeing you again soon as we continue to strengthen the microelectronics ecosystem!Bee Bee Ng is president of SEMI Southeast Asia.

About 70% of the U.S. Gross Domestic Product (GDP) is driven by consumer demand. What consumers are looking for is influenced by, for example, fashion trends, product innovations, environmental forces, and personal interests. Regarding personal interests: Sales of electronic components at Fry’s are poor. Radio Shack stores even vanished completely. Today’s consumers do not like to tinker; they want to buy software-enabled, user-friendly systems with over-the-air updating that serves their current and future requirements well – e.g. smartphones. System vendors followed the same transition, and so did semiconductor vendors. Instead of offering (low margin) components, they develop and manufacture big portions of, if not complete, (high value) hardware and software solutions for electronic systems, targeted at specific markets.Mid-August, two SEMI webinars outlined the Smart Mobility market and what it expects from system and semiconductor vendors.SEMI's Smart Initiative“None of us knows as much as all of us,” “Connect – Collaborate – Innovate,” and other strategic considerations have motivated SEMI to become the gateway for the $2 Trillion (= 2,000 Billion) global electronic design and manufacturing supply chain. Figure 1 shows how many companies and organizations have joined this large industry organization, to work together efficiently and serve customer demands cost-effectively. Especially in four high-growth markets/application areas – Smart Data, Smart Mobility, Smart MedTech, and Smart Manufacturing – SEMI enables highly rewarding cooperation. Figure 1: Overview of SEMI members, technology communities, and areas of focus. (Courtesy: SEMI) MEMS and Sensors for Smart Mobility Tim Brosnihan, executive director of MEMS Sensor Industry Group (MSIG), moderated the webinar on MEMS and sensors for Smart Mobility. Bettina Weiss, Chief of Staff and Global Smart Mobility Lead at SEMI, presented the overview. In addition to Figure 1 above, she showed how many companies are now supporting SEMI’s Smart Mobility efforts and have joined the Global Automotive Advisory Council (GAAC). The European GAAC was founded in 2018, based on requests from VW and Audi. Regional chapters have also been formed in the U.S., China, Taiwan, and Japan. Figure 2 shows the current members of the American GAAC – new members are welcomed in all five regions. Figure 2: Current GAAC members in the Americas. (Courtesy: SEMI) Market Trends and Technology Innovations in MEMS Sensors Andreas Breiter, Partner at McKinsey Company, addressed markets, and Armen Mkrtchyan, Associate Partner at McKinsey Company, spoke about technology. Breiter addressed both vehicle and infrastructure changes required, as well as many ongoing and planned activities to enable Smart Mobility. He outlined autonomy, connectivity, electrification, and shared mobility of vehicles as the major opportunities for MEMS sensors. Mkrtchyan showed which technologies enable Smart Mobility and which regions will invest how much in software, hardware, and services by 2030, to capture data and process it in partially/fully autonomous vehicles’ Domain Control Units (DCUs) – see Figure 3. Figure 3: Pre-COVID market estimates. (Courtesy: McKinsey Company) MEMS-based sensors are used in vehicles to monitor pressures and perform as accelerometers or gyroscopes. Non-MEMS-based sensors capture light (e.g. for time-of-flight distance measurements) or magnetic fields (e.g. for RPM measurements). Regarding the many infrastructure upgrades needed for enabling autonomous vehicles on the roads, in Figure 4, Breiter gives road planners a lot of food for thought and planning work. City planners face much more complex challenges. That’s why electronic systems will also be needed to make these large infrastructure investments earn returns. Figure 4: Smart roads are essential for autonomous driving. (Courtesy: McKinsey Company) EDA and Smart Mobility The second Smart Mobility webinar focused on how Electronic Design Automation (EDA) tool vendors, Intellectual Property (IP, System Building Blocks) vendors, and system/IC Design Services can contribute to the success of Smart Mobility. Bob Smith, executive director of Electronic System Design Alliance (ESDA), moderated the webinar, highlighting where the relatively small but essential ESDA and its members fit in the semiconductor ecosystem – see Figure 5. Figure 5: EDA, IP, and design services enable the entire electronics ecosystem. (Courtesy: ESDA) Bettina Weiss explained how SEMI and the Smart Mobility Team are working to bring together stakeholders in the semiconductor ecosystem in general and the Smart Mobility segment specifically, to jointly address topics of common interest, work on solutions and agree upon standards where and when needed. Market Trends and Technology Innovations in EDA, IP and Design Services Andreas Breiter and Armen Mkrtchyan presented McKinsey’s perspectives regarding these topics. In addition to the above-mentioned market data, Breiter emphasized that DCUs are playing an increasingly important role in capturing the data provided by smart sensors, are processing it, and initiating appropriate actions. Together with application-specific software, these DCUs perform tasks like sensor fusion, manage creature comfort, assure safe operation of the vehicle, and secure communication with the outside world (Figure 6). Figure 6: High growth for DCU; likely shift in business models. (Courtesy: McKinsey Company) Mkrtchyan addressed EDA, IP, and services for Smart Mobility from 10 different technical perspectives. Here are the highlights. Component failures can and will have severe consequences in Smart Mobility. Therefore screening, testing, and exhaustive verification are extremely important. Software content is likely to increase at 10% CAGR during this decade. To increase the productivity of software and middleware developers, he emphasized that standards need to be agreed upon. Over-the-air (OTA) updating capabilities are needed. That’s why cybersecurity is important to keep vehicles current and safe. Power train electronics need to function at up to 150°C. New materials will be needed to increase reliability, reduce cooling efforts, and lower unit costs. Last, but not least, Mkrtchyan emphasized that every city needs to design its own infrastructure, not only to enable Smart Mobility but also to monetize the large investments needed; EDA, IP and design support will help to achieve both. In summary, he stated that Design and IP as well as packaging and test will be the most impacted areas in the transition to Smart Mobility. Personal Comments After having attended several MSIG events, I am impressed by how MEMS, NEMS (Nano…), and sensors can lend machines in many ways sight, smell, taste, touch, and hearing. They can replicate these human senses, often better than found in us. If you, like me, celebrated when your first modem enabled your PC to communicate with the entire world, you’ll appreciate the value MEMS and sensors can and will add to machines’ “communication skills.” Also, I can assure you that innovative engineers in this field will find many new ways to capture data in the physical, chemical, and biological domains and enable machines to keep humans safe. (I look forward to a handheld Covid-19 sensor that provides results within a few seconds!) Having worked for a small, then a large EDA vendor, many years ago, and for the ESD Alliance several years ago, I know how difficult it is to motivate innovative software developers to work together or agree upon standards. I am glad that the ESD Alliance is now working closely with SEMI. Most SEMI member companies, and their innovative employees, have learned over the years how important standards are to reduce development cost, processing, and test time, as well as time to profit. I wish Bob Smith and the ESDA members all the best for cooperating closely to define design standards, bi-directional hand-off points up and down the entire supply chain, primarily at the interface between design and manufacturing. I want to encourage EDA and IP experts to work closely with the experienced and knowledgeable people in materials, equipment, manufacturing, and test. 5G mm-wave communication, artificial intelligence/machine learning (AI/ML), reliable solutions for Smart Mobility, and development/characterization of new materials offer great opportunities and challenges for design AND manufacturing. Together, these two big camps can monetize required solutions much better and faster, than on their own. Your contact at SEMI can tell you how and where you can watch the webinar recordings and/or download all the slides. P.S.: Having two eCars and one eBike in our garage encourages me to appreciate SEMI’s efforts in advance Smart Mobility! Republished with permission from 3D InCites.

Inertial sensors have continued to underpin the success of wearables in increasingly important ways. Propelled by evolutionary advancements in inertial sensors, wearables have strayed from their humble beginnings in simple activity and wellness, which defined the user experience over the past decade. What started with the simple act of telling people their daily step count has morphed to provide deeper insights into swim stroke and run cadence, all the way to mapping out a person’s off-piste ski route. Layered on top of this foundation of inertial sensors, we’ve fused optical, temperature and other sensor technology to provide clinical-grade healthcare snapshots available previously only by visiting the doctor’s office.Inertial sensors today are again leading the way in improving health and wellness. Instead of humans, however, this time the patients are machines. In fact, the health of critical assets – whether factory-based equipment, windmills, train bogies or aircraft – has been assessed through sophisticated analysis of their vibration signatures for many years. The sensors used for these applications have depended on piezoelectric technology because their vibration amplitude signals are very small and difficult to detect and because of the importance of understanding their spectral content over a wide bandwidth. When it comes to noise and bandwidth, bulk piezoceramics have had a major advantage over electrostatic MEMS technology – until recently.Using bulky expensive piezoelectric sensors for condition-based monitoring has been akin to going to the doctor’s office to have an MRI. The equipment required (sensors, receivers) is expensive and requires highly trained specialists to operate the machine and to interpret the information. For this reason, only mission-critical assets are instrumented. For nearly all other equipment, we tend to use inefficient schedule-based maintenance approaches to cover the gap of not having continuous data. Condition-based monitoring leverages real-time sensing of critical machine parameters to reduce system downtime and improve efficiency. Evolving machine healthMEMS started to democratize machine health several years ago, when suppliers began switching from piezoelectrics to capacitive MEMS. While the performance was still not on par with piezoelectric sensors, MEMS technology could already capture a wide array of faults. One example, the ADXL001, started making its way into Integrated Electronics Piezo-Electric (IEPE) and 4-20 mA sensors, which form the backbone of the vibration monitoring market. Although the bandwidth and noise of the sensor did not allow for very early detection and prescriptive monitoring, it did allow the tracking of faults as they progressed and became more imminent.Other digital accelerometers started finding their way into new wireless prototype systems with the goal to simplify and increase deployment to a greater population of assets. The thinking was that self-contained digital wireless sensor nodes could be deployed more economically and quickly, and that these digital sensors would bring the power of computing to the edge node.Unfortunately, even the lowest-noise MEMS products did not have the bandwidth needed to diagnose and predict faults early enough to influence how and when machines are maintained most economically. Instead, such devices were used to detect imminent failure to prevent irreparable harm. As we all know, however, the earlier the doctor spots a problem, the better the probable outcome. That’s because early detection increases the likelihood that the doctor will have access to the full spectrum of treatment options available to fix the problem.Inertial MEMS is blazing a new frontier with the introduction of next-generation capacitive MEMS such as the ADXL100x portfolio. Offering ultra-low noise density and high-frequency response, these newer capacitive MEMS devices fit the bill. With 3dB bandwidths up to 25 kHz and flat response curves within 0.4dB all the way to 10kHz, these accelerometers demonstrate compelling enabling characteristics such as better DC performance, improved robustness, lifetime stability, linearity, and of course, cost, making capacitive MEMS a better choice than piezoelectrics.With high-bandwidth capacitive MEMS much easier to use and deploy – as well as more affordable – the market is starting to respond. Condition monitoring equipment and instrumentation is becoming more accessible to a larger base of manufacturers. In turn, a wealth of data is being created and mined to develop better and timelier predictive and prescriptive maintenance approaches that rely heavily on machine learning and artificial intelligence (AI).It’s worth paying attention to the sizable condition-based monitoring market. Estimated at $3.5 billion and growing, condition-based monitoring reduces downtime and increases equipment utilization in quantifiable ways. And it’s not just manufacturers who stand to benefit. More sustainable and efficient industrial processes, safer trains that crisscross continents at ever increasing speeds, autonomous cars and trucks that know what’s happening under the hood as well as on the road, and modern infrastructure to support our evolving lives show us that condition-based monitoring has something for everyone.Learn more about Analog Devices’ condition-based monitoring signal-chain options that help customers on the journey from sensor to solution. View ADI’s whole portfolio of condition-based monitoring solutions online or download Next-Generation Condition-Based Monitoring brochure.Tzeno Galchev is product marketing manager in the Inertial Sensor Technology Group at Analog Devices Inc. He oversees the strategic marketing and product definition of the inertial sensor component portfolio. He received B.S. degrees in both Electrical and Computer Engineering in 2004, and M.S. and Ph.D. degrees in Electrical Engineering in 2006 and 2010 respectively from the University of Michigan, Ann Arbor. He has over 30 publications in the area of MEMS, holds multiple patents, and is a frequent lecturer and speaker on topics related to MEMS, energy harvesting and sensors.Analog Devices is a longtime member of MEMS Sensors Industry Group (MSIG), a SEMI technology community that enables the MEMS and sensor industry to address common challenges, innovate and accelerate business results.

MEMS and image sensors are shining stars in the chip industry as technology companies worldwide accelerate innovation in the fight against COVID-19. The tiny devices are behind advances in areas of electronics ranging from thermal imaging and faster point-of-care testing to microfluidics-based polymerase chain reaction (PCR) tools and techniques to detect SARS-CoV-2.SEMI recently spoke with Yole Développement analysts Dimitrios Damianos and Chenmeijing Liang about MEMS and imaging sensors market trends and how microelectronics-enhanced technologies are supporting the worldwide push to contain the spread of COVID-19.For additional insights on the technologies, join the SEMI MEMS Imaging Sensors Summit, held for the first time at SEMICON Europa, 12-13 November 2020 in Munich, Germany. Registration is open.SEMI: Despite the global pandemic, the MEMS and sensors market is still growing and is one of the healthiest industries, not only in Europe, but globally. What is driving this growth?Damianos: MEMS have been continuously evolving from the first sensors that were measuring pressure and acceleration to rotation sensing and visible light management followed by light sensing beyond visible and the expansion to ultrasound and multi-spectral. Now we are heading towards an era where we want to sense every aspect of our environment, with more processing and eventually analytics bringing more quality to the data.COVID-19 has impacted various global markets in very different ways. While automotive, mobility and civil aviation have suffered, the impact on telecommunications and medical has been positive. The effects on the consumer, mobile and industrial markets have been moderate. Moreover, COVID-19 is changing the perception of the current global supply chain in manufacturing, potentially leading to more localized value chains and further regionalization in order to minimize similar risks posed by the pandemic and the first lockdown.SEMI: Who are the main MEMS players based on your research? Damianos: For MEMS players, the picture in 2019 was not the same as 10 years ago, when Texas Instruments (TI) and Hewlett-Packard (HP) were leading the scene, with Bosch and ST Microelectronics following, all at comparable revenue levels. Now, Broadcom and Bosch lead with almost $1.4 billion in revenue each, and the rest of the MEMS key stakeholders compete in the $400 million to $600 million league. Microphone players profited from the voice interface adoption trend, while players active in MEMS for mobility and smartphones suffered slightly due to weak end-system demand.SEMI: What scenarios can we expect for each market with regard to the impact of COVID-19 on MEMS for 2020? Damianos: For 2020, at Yole Développement we expect the consumer market to contract slightly by 2.6%, with the automotive market to dip by 27.5%, and defense and aerospace by 20.5%. For the defense market, no major effect is expected, as all major programs still run for the year. The market may experience some slight delays in deliveries due to supply chain and logistics problems. However, sensors integrated in commercial/civil aerospace applications will suffer due to the general paralysis of the air travel industry. On the positive side, telecommunications could increase by 4.7%, medical applications by 10.6%, and industrial by 11.5%.Due to the global pandemic, some types of MEMS have spiked in demand this year. For example, demand for thermopiles and microbolometers used in temperature guns and thermal cameras has increased because of the need for contactless monitoring of people’s temperatures. Moreover, microfluidics for DNA sequencing and real-time polymerase chain reaction (PCR) diagnostic tests for detecting COVID-19 are gaining market relevance, with the latter serving as a premier method of detecting a bacteria or virus on the molecular level with high degrees of accuracy. Furthermore, pressure and flowmeters in ventilators will grow because of huge demand by hospital intensive care units (ICUs).SEMI: What growth trends do you predict for the long haul?Damianos: In the longer term, we expect global MEMS volumes to almost double, from 24.4 billion units in 2019 to 50.8 billion units in 2025, with a 13% CAGR during the same period. The global MEMS market could reach $17.7 billion in revenue by 2025.We see a trend to more wearable devices integrating a lot of sensors but also a move to a more consumer-oriented healthcare. Moreover, everything related to voice interfaces and voice/virtual-personal assistants (VPAs) will continue to see strong growth, increasing demand for MEMS mics with better quality and high-fidelity voice capture. MEMS devices are shifting to higher accuracy, ultra-low power, embedded intelligence and possibly some bio-compatibility for medical applications.MEMS players will try to escape the commoditization cycle and deliver more value by increasing the value of the data, either grouping many sensors to create sensor hubs or by adding processing, algorithms and software. Industry players are employing strategies such as adding extra processing close to the sensor (e.g. Knowles) or ameliorating the use cases of their applications of their clients (e.g. Bosch or ST). AI on the edge seems very alluring for extra value acquisition, with many startups already working on it. Some examples include always-on-sensing (Aspinity in collaboration with Infineon, Syntiant), echolocation (IMERAI) and predictive maintenance using inertial sensors (Cartesiam). This will be the next pit stop for MEMS technology for sure. SEMI: The CMOS Image Sensor (CIS) is a cornerstone technology in the development of devices powered by machine sensing and artificial intelligence (AI) for applications such as advanced driver assistance system (ADAS). CIS powers many of the ongoing revolutions in new technical products and use cases. What is the status of the image sensors industry? Liang: Last year was exceptional with a combination of high demand and high prices due to capacity limitations. Q4 2019 went way above the forecast, and, in the end, the CIS industry reached $19.3 billion for the full year. This year, we think it will return to normal, and, despite the pandemic impact, we expect significant growth in the range of 7% to 12%. Last year’s 25% year-over-year (YOY) growth was the highest we’ve seen over the past decade. Mobile still dominates the marketplace for CIS with 69% market share. Two markets, computing (8%) and consumer (5%), are adjacent to the mobile market but progressively losing ground due to the smartphone disruption.Security, at 6% market share, will probably be the second largest CIS market in the future. Although this is an area of excellence for the emerging Chinese players, unfortunately, they could be hit by the current trade war. The automotive market did very well from 2018 to 2019 because of the numerous applications recently developed for ADAS, viewing, and in-cabin applications. Lastly, the industrial camera applications benefited from large investments in automation, especially in the semiconductor and automotive industries, but here again many uncertainties remain as these markets will reshuffle in the post COVID-19 world. SEMI: Which CIS markets are most susceptible to seasonality and the impact of COVID-19?Liang: According to our quarterly CIS monitor, automotive and security were both negatively impacted by the pandemic beyond what we expected in terms of seasonality. For computing, the situation improved just prior the lockdown. Q1 got a positive impact with high sales results for laptops and tablets, but no significant impact was seen for security equipment. For automotive, the demand for cameras was very high in Q1, which is seasonally normal, despite the decrease of car shipments that followed later. The automotive CIS market in 2020 should remain relatively flat compared to 2019 due to the higher attachment rates of cameras despite the lower number of cars produced. Consumer and industrial segments dropped in Q1, which is typical early in the year.The next five years might be a bit slow, and although we forecast growth for the next year, in the future the market share will be lower in mobile. In fact, mobile CIS growth will fall below the CIS growth average, but we will see an increase of market share for the security, automotive and industrial segments. The CIS market could reach $28 billion in 2025.At first, COVID-19 had a limited impact on the production side, as factories in China are usually closed for the New Year holiday, when the pandemic started. While supply is currently recovering, we still consider the limited impact on demand. Smartphone production for 2020 will be down 6%, but camera shipments for mobile should increase about 10% this year. Another positive trend for the mobile market is optical fingerprint implementation. Currently, high-end Android phones use this kind of technology. For 2023, we estimate optical fingerprint technology revenue to be over $1 billion.The roadmap for the automotive market is driven by camera proliferation. We’ll see 10 cameras per car and more for some high-end vehicles. Increasing demand for safety and convenience will mean more cameras per car in the future. With a strong attachment rate, the market average in automotive is around 2.0 cameras per car nowadays, and we expect the market average to reach 3.5 cameras per car in 2025. In security, Charge Coupled Device (CCD)-based cameras are nearly out of the market, as CMOS-based IP cameras are most important now.SEMI: What are current key technology trends?Liang: 3D semiconductor technology is the hot topic. CIS wafer staking technology is indeed at the center of the CIS technology race. Future applications could be AI analytics or recently developed applications on new types of CIS. So far, we have seen the introduction of variants of the CIS pixel. Global shutter (GS) and indirect Time of Flight (iToF) were recently introduced, and now direct time-of-flight (dTOF) pixels are being used in high volume. 3D semiconductor technology is a bonanza for the industry, as it allows to pack more value in a single chip. While the surface of silicon is still increasing, additional silicon is added through stacking.With COVID-19 still a problem, the endpoint for smartphones in 2020 remains uncertain. The short-term impact for CIS will be slower growth with respect to the 25% YoY of last year. The downturn in car production will be mitigated by an increased attachment rate for automotive cameras. The security market will also help maintain CIS growth.For more insights, see the following reports: Status of the MEMS Industry 2020 3D Imaging and Sensing 2020 CIS Market Monitor Q2 2020 Dimitrios Damianos is a technology and market analysts at Yole Développement covering MEMS, Sensors, Photonics and Imaging. Chenmeijing Liang is a technology and market analysts at Yole Développement covering Imaging. Serena Brischetto is senior manager of Marketing and Communications at SEMI Europe.