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DRESDEN, Germany — June 26, 2023 — 3D integration and systems for semiconductor manufacturing applications will take center stage at SEMI 3D & Systems Summit as the event opens today with leading experts sharing the latest developments and insights into the 3D roadmap, heterogeneous integration and system-in-package (SiP) technologies for smarter systems. Registration is open for the 26-28 June summit in Dresden, Germany.

Logo“We’re excited to welcome industry leaders to Dresden to share perspectives on near-term packaging solutions and explore how deeper collaboration can drive innovation for emerging heterogeneous integration applications and European semiconductor industry growth,” said Laith Altimime, President of SEMI Europe.

Advanced packaging technologies have become critical enablers of continuing semiconductor innovation and extending Moore’s Law. Heterogeneous integration architectures such as chiplets combine separately manufactured electronics components into a higher level assembly to enhance semiconductor functionality and operating characteristics.

Themed Smarter Systems through Heterogeneous Integration, this year’s summit will feature a broader scope of topics including: 

  • Advanced Packaging: Enabling Moore’s Law, The Next Frontier
  • Market Briefing and Technical Roadmap
  • Industrialization and Mass Adoption of 3D Technologies
  • Hybrid Bonding Developments
  • Chiplet Design Packaging: Architectures and Challenges
  • Novel Processes and Interconnect Solutions for 3D
  • Photonics Integration
  • Sustainability
  • Applications Enabled by 3D

3D & Systems Summit Highlights

Global Leaders to Present

Distinguished speakers will address new technology challenges and requirements across the entire 3D IC supply chain.

Experts from the following global leaders will also present:

  • ASML
  • Besi
  • CEA-Leti
  • EPIC
  • EV Group
  • Fraunhofer Group for Microelectronics
  • Fraunhofer IIS-EAS
  • Fraunhofer IZM-ASSID
  • imec
  • Intel
  • KLA
  • MKS-Atotech
  • Research Fab Microelectronics Germany (FMD)
  • Siemens EDA
  • SPTS Technologies Ltd., a KLA company
  • SÜSS MicroTec

Exhibition

The most prominent names in 3D integration for microelectronics manufacturing will showcase their latest products and technologies at the exhibition area, including:

  • Adeia
  • Amkor
  • ASE Global
  • Besi
  • Carl Zeiss Research Microscopy
  • CEA-Leti
  • Comet Yxlon
  • Confovis
  • DISCO Hi-TEC Europe
  • ERS electronic
  • Evatec
  • Fraunhofer IZM-ASSID
  • Koh Young Europe
  • Lidrotec
  • LPKF Laser & Electronics
  • OPTIM Wafers
  • ProSys
  • Racyics
  • SUSS MicroTec
  • ULVAC
  • Win Source

Exclusive Networking Opportunities

The 3D & Systems Summit will feature business-to-business matchmaking and networking for participants to explore new partnerships and other business opportunities. This year’s networking reception will take place at the Hilton Dresden on the first day of the event, and the annual networking dinner will be held on the Elbe River cruise. To reserve a seat, contact [email protected].

For more details, please visit the 3D & Systems Summit website and connect with SEMI Europe onTwitter or LinkedIn – @SEMIEurope, #3DSummit

Premium Sponsors

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

MILPITAS, Calif. — June 13, 2023 — Global 300mm fab equipment spending for front-end facilities next year is expected to begin a growth streak to a US$119 billion record high in 2026 following a decline in 2023, SEMI highlighted today in its quarterly 300mm Fab Outlook Report to 2026. Strong demand for high-performance computing, automotive applications and improved demand for memory will fuel double-digit spending in equipment investments over the three-year period.

LogoAfter the projected 18% drop to US$74 billion this year, global 300mm fab equipment spending is forecast to rise 12% to $US82 billion in 2024, 24% to US$101.9 billion in 2025 and 17% to US$118.8 billion in 2026.

“The projected equipment spending growth wave underscores the strong secular demand for semiconductors,” said Ajit Manocha, SEMI President and CEO. “The foundry and memory sectors will figure prominently in this expansion, pointing to demand for chips across a wide breadth of end markets and applications.”
 

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Regional Growth

Korea is expected to lead global 300mm fab equipment spending in 2026 with US$30.2 billion in investments, nearly doubling from US$15.7 billion in 2023. Taiwan is forecast to invest US$23.8 billion in 2026, up from US$22.4 billion this year, and China is projected to log US$16.1 billion in spending in 2026, an increase from US$14.9 billion in 2023. Americas equipment spending is expected to nearly double from US$9.6 billion this year to US$18.8 billion in 2026.

Segment Growth

Foundry is projected to lead other segments in equipment spending at US$62.1 billion in 2026, an increase from US$44.6 billion in 2023, followed by memory at US$42.9 billion, a 170% increase from 2023. Analog spending is forecast to increase from US$5 billion this year to US$6.2 billion in 2026. The microprocessor/microcontroller, discrete (mainly power devices), and optoelectronics segments are expected to see spending declines in 2026, while investments in logic is forecast to rise.

The SEMI 300mm Fab Outlook Report To 2026 report lists 369 facilities and lines globally, including 53 high-probability facilities expected to start operation during the four years starting in 2023.

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI US
Phone: 1.408.943.7940
Email: [email protected]

Chih-Wen Liu/SEMI Taiwan
Phone: 886.3.560.1777
Email: [email protected]

MILPITAS, Calif. — June 13, 2023 — Global semiconductor materials market revenue grew 8.9% to $72.7 billion in 2022, surpassing the previous market high of $66.8 billion set in 2021, SEMI, the global industry association representing the electronics manufacturing and design supply chain, reported today in its Materials Market Data Subscription (MMDS).

LogoWafer fabrication materials and packaging materials revenue in 2022 reached $44.7 billion and $28.0 billion, respectively, increasing 10.5% and 6.3%. The silicon, electronic gases, and photomask segments showed the strongest growth in the wafer fabrication materials market, while the organic substrates segment largely drove packaging materials market growth.

For the 13th consecutive year, Taiwan, at $20.1 billion, was the world's largest consumer of semiconductor materials on the strength of its foundry capacity and advanced packaging base. China continued to register strong year-over-year results, ranking second in 2022, while Korea finished as the third largest consumer of semiconductor materials. Most regions registered high single- or double-digit growth last year.
 

 

2021**

2022

Year-Over-Year

Taiwan

 $17,715

 $20,129

13.6%

China

 $12,082

 $12,970

7.3%

South Korea

 $12,134

 $12,901

6.33%

Rest of World

 $7,896

 $8,627

9.3%

Japan

 $7,275

 $7,205

-1.0%

North America

 $5,713

 $6,278

9.9%

Europe

 $3,961

 $4,580

15.6%

Total

 $66,776

 $72,691

8.9%

Source: SEMI (www.semi.org), June 2023

Note: Summed subtotals may not equal the total due to rounding.
* Rest of World includes Singapore, Malaysia, Philippines, other areas of Southeast Asia and smaller global markets.
** 2021 data reflects current updates.

 

The Materials Market Data Subscription (MMDS) from SEMI provides annual revenue with 10 years of historical data and a two-year forecast. The annual subscription includes quarterly updates for the materials segment and reports revenue for seven market regions (North America, Europe, Japan, Taiwan, South Korea, China and Rest of World). The report also features detailed historical data for silicon shipments and revenues for photoresist, photoresist ancillaries, process gases and lead frames.

For more information about the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. More details are also available on the SEMI Market Data webpage.

Download a sample of the MMDS report.

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

MILPITAS, Calif. – June 6, 2023 – Global semiconductor equipment billings increased 9% year-over-year to US$26.8 billion in the first quarter of 2023, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report. Quarter-over-quarter billings slipped 3%. 

Logo“Semiconductor equipment revenue in the first quarter was robust despite macroeconomic headwinds and a challenging industry environment,” said Ajit Manocha, SEMI president and CEO. “The fundamentals remain healthy for the long-term strategic investments needed to support major technology advancements for AI, automotive, and other growth applications.”

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. 

Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year changes by region:

Region

1Q2023

4Q2022

1Q2022

1Q (QoQ)

1Q (YoY)

Taiwan

6.93

7.98

 4.88

-13%

42%

China

5.86

6.36

 7.57

-8%

-23%

Korea

5.62

5.80

 5.15

-3%

9%

North America

3.93

2.60

 2.62

51%

50%

Japan

1.90

2.25

 1.90

-16%

0%

Europe

1.52

1.46

 1.28

4%

19%

Rest of World

1.06

1.32

 1.29

-20%

-18%

Total

 26.81

 27.78

 24.69

-3%

9%

Sources: SEMI (www.semi.org) and SEAJ (www.seaj.or.jp), June 2023
Note: Summed subtotals may not equal the total due to rounding.


The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. The subscription includes three reports:

  • Monthly SEMI Billings Report, a perspective on equipment market trends
  • Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
  • SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

Download a sample of the EMDS report.

For more information about the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. More details are also available on the SEMI Market Data webpage.

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

SEMI, TECHCET and TechSearch International Highlight Diverse Growth Drivers in New Report

MILPITAS, Calif. – May 23, 2023 – Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022, SEMI, TECHCET and TechSearch International announced today in their new Global Semiconductor Packaging Materials Outlook report.

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High-performance applications, 5G, artificial intelligence (AI) and the adoption of heterogeneous integration and system-in-package (SiP) technologies are increasing demand for advanced packaging solutions. The development of new materials and processes to enable chips with higher transistor density and greater reliability are also contributing to market growth.
 

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“The semiconductor packaging materials industry is undergoing significant changes as new technologies and applications are driving demand for more advanced and diverse materials,” said Jan Vardaman, President and founder of TechSearch International. “Advances in dielectric materials and underfill are driving strong demand for fan-in and fan-out wafer level packaging (FOWLP), flip chip, and 2.5D/3D packaging. New substrate technologies such as silicon interposers and organic interposers using RDL (Re-Distribution Layer) are also key growth drivers of packaging solutions. At the same time, research on laminate substrates with finer features continues with the development of glass cores for build-up substrates.”

The Global Semiconductor Packaging Materials Outlook report provides a comprehensive analysis of the current and forecast market for semiconductor packaging materials, covering substrates, leadframes, bonding wires, encapsulation materials, underfill materials, die attach, wafer level package dielectrics, and wafer-level plating chemicals.

Features of the report include:

  • Technology trends
  • Regional market size
  • Five-year market forecast to 2027
  • Market size in revenue and units
  • Excel workbook file summarizing market information
  • Supplier market share
  • Capacity and utilization trends

The report is available for purchase from SEMI. 

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

MILPITAS, Calif. — May 22, 2023 — SEMI today announced the election of two new members to the SEMI North America Advisory Board (NAAB): Maheen Hamid, co-founder, CFO and COO of Breker Verification Systems, and Michael Lercel, Senior Director of Global Strategic Marketing at ASML. 

LogoThe Board appointments took effect April 18, 2023. Members serve a three-year term. The principal advocate for member companies located in North America, the NAAB provides guidance on SEMI Americas programs designed to advance their business interests and address significant challenges in the electronics manufacturing and design supply chain.

“The SEMI North America Advisory Board is committed to broad representation of SEMI member companies,” said Joe Stockunas, president SEMI Americas. “With Breker Verification Systems a strong up-and-coming player in the design community and ASML a leading lithography supplier, the addition of Maheen and Michael furthers our diversity to give voice to a wider range of SEMI members.”

As Senior Director of Global Strategic Marketing at ASML, Michael Lercel guides corporate strategy. He joined ASML in 2015 and is based in Wilton, Conn. Lercel’s wide experience in semiconductor manufacturing is highlighted by his emphasis on lithography and patterning. He helped develop a number of next-generation lithography techniques and was involved in pioneering EUV work in 1998.

Lercel holds a Bachelor of Science degree in physics from MIT and a Ph.D. in physics from Cornell University. After graduation, he joined IBM Microelectronics, working in positions in advanced photomask development, lithography research, and microelectronics equipment strategy. In 2010 he joined Cymer as Senior Director of EUV Product Marketing and later at SEMATECH held various positions including Lithography Director and Chief Technologist.

As CFO and COO of Breker Verification Systems, a cutting-edge San Jose, Calif.-based software company, Hamid oversees the company’s operational growth as it moves from startup to established software supplier. She drives the company’s strategic direction, corporate communications and branding.

Over the past two decades, Hamid has been instrumental in establishing Breker as a key player in the Electronic Design Automation (EDA) industry. She was recently named one of Silicon Valley’s 100 most influential women by the Silicon Valley Business Journal. Hamid is a Governing Council member of the Electronic System Design (ESD) Alliance, a SEMI Technology Community. Hamid holds a Bachelor of Business Administration degree from North South University and a Masters of Business Administration from the University of Texas at Austin.

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

PENANG, Malaysia — 22 May 2023 — SEMICON Southeast Asia, the region’s premier event for the global electronics manufacturing and design supply chain, opens tomorrow with critical semiconductor industry topics including supply chain resilience, sustainability, Smart Manufacturing, Smart Mobility, Smart MedTech, and workforce development in focus. Themed Boosting Agility and Resiliency for the Electronics Supply Chain, the May 23-25 exhibition and conferences at the Setia SPICE Convention Centre and Arena in Penang are expected to draw nearly 300 exhibitors and more than 10,000 attendees.

LogoSEMICON Southeast Asia 2023 will gather experts and visionaries for insights into the latest semiconductor industry developments, trends and innovations. With the industry’s sights set on reaching $1 trillion in revenue by 2030, the event will also bring together chip manufacturing and equipment companies, private and public partners, and other key industry stakeholders to explore new collaboration and growth opportunities.

Semiconductor Industry Agility and Resiliency

The CxO Summit at SEMICON Southeast Asia 2023 will convene industry thought leaders to discuss modernizing supply chain strategies in response to ongoing industry disruptions and geopolitical instability. Focusing on building a more agile and resilient semiconductor industry supply chain, the summit will feature the following speakers:

Speakers will also participate in the panel discussion Boosting Agility and Resiliency of the Electronics Supply Chain in Southeast Asia to culminate the CxO Summit. The panel will include Tan Yew Kong, Senior Vice President and General Manager, GlobalFoundries.

Other SEMICON Southeast Asia 2023 Highlights

  • SEA Investment Forum will explore opportunities in the Southeast Asia semiconductor supply chain.
  • Workforce and Talent Development Pavilion will feature a career fair and presentations, the SEMI University Bootcamp, and SEMI University, a new online learning management system with courses for professionals in the semiconductor and electronics industries.
  • Forums
    • Market and Industry Trends
    • Sustainability
    • SMART Mobility
    • SMART Enterprise
    • SMART MedTech
    • Advanced Packaging
    • Advanced Product Testing
  • SMART Innovators Showcase will spotlight Industry 4.0 best practices, while the Startups Showcase will feature leading-edge semiconductor manufacturing solutions.
  • Industry VIP Networking Night will gather attendees to connect with industry leaders and experts.

Visit the SEMICON Southeast Asia 2023 website for more information.

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Media Contacts

Ryan Teo/SEMI Southeast Asia
Phone: +65 9859 0883
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

Reshvinder Kaur/Din Communications
Phone: +6017 275 7985
Email: [email protected] / [email protected]

MILPITAS, Calif. ─ May 22, 2023 – Advances driving the next generation of medical, environmental and mobility applications will take center stage at the SEMI MEMS & Sensors Technical Congress (MSTC 2023), opening tomorrow at the Samberg Conference Center, Chang Building, at Massachusetts Institute of Technology (MIT) in Cambridge.

LogoThemed Technology to Better Survive and Thrive, MSTC 2023 will feature keynotes, panels and technical sessions as industry visionaries and experts gather to discuss the latest MEMS and sensors trends and innovations. Highlights at the May 23-24 conference also include business networking opportunities and posters showcasing novel applications from the next generation of innovators.

Sponsored by the SEMI MEMS & Sensors Industry Group (MSIG), MSTC 2023 will offer a deep dive into how to bring sensor products to market, from design through fabrication and testing and packaging to end-use applications. Industry experts will explore the software and systems needed to expand both legacy and emerging MEMS and sensors to open new markets and business opportunities.

MSTC 2023 Keynotes

HS

Joshua Windmiller, Ph.D., Head of New Analytes and Sensing Platforms
Dexcom

Empowering People to Take Control of Health

 Logo

 
HS

Doruk Senkal, Ph.D., Head of Motion Sensors Reality Labs
Meta

MEMS & Sensors in the Metaverse

 Logo

 

MSTC 2023 Technical Sessions

MSTC 2023 will also showcase MEMS and sensors applications in the following areas:

  • Automotive including electric vehicle sensors
  • Augmented reality (AR) and virtual reality (VR) metaverse technology
  • Positioning, navigation and timing
  • Smart environmental sensors 
  • Health and biotechnology sensors and wearables
  • Innovations in emerging applications

More MSTC 2023 Session Highlights

  • Market and technology trends, forecast and CHIPS and Science Act
  • MEMS and sensors testing process showdown  
  • MIT lab tours
  • Networking reception showcasing technology application posters created by students from MIT and Northeastern University

See complete agenda for MSTC 2023. Follow MSTC 2023 on Twitter and LinkedIn.

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

MILPITAS, Calif. – May 15, 2023 – FlexTech, a SEMI Technology Community focused on driving flexible hybrid electronics (FHE) innovations, today issued a Request for Proposals (RFP) for advances in materials, FHE design tools, additive-enabled processing, hybrid electronics packaging, FHE manufacturing, AI/ML applications, soft robotics, and power solutions. Selected projects will receive cash awards ranging from $250,000 to $1 million. The program is funded by the Army Research Laboratory (ARL).

LogoOrganizations submitting proposals will be evaluated based on their capabilities, experience, and strengths including team diversity. See the SEMI FlexTech 2023 Request for Proposals for more details on the evaluation process.

White paper submissions, the first step in responding to the RFP, are due June 5, 2023. To help organizations prepare their proposals, FlexTech staff will review the RFP topics and the submission and review process during a live webinar on May 25, 2023, at 10:00 a.m. PDT. The webinar is open to organizations considering submitting a proposal. A recording will be available for registrants unable to attend the event. Registration for the event is open. 

Following the review of white papers by the RFP Review Committee, consisting of FlexTech Council members and other subject matter experts (SMEs), FlexTech will invite selected organizations to submit full proposals. The evaluation criteria include:

  • Rationale
  • Budget
  • Collaboration value
  • Dual-use (industry and military) applicability
  • Relevance to the FHE ecosystem
  • Schedules and milestones
  • Reasonable and stretch deliverables
  • Overall proposal quality

FlexTech supports technical approaches that are revolutionary or have a significant element of risk, as well as approaches that are evolutionary improvements upon existing capability, which tend to be less risky and involve shorter development and delivery intervals. Research and development efforts funded by FlexTech are in the U.S. government’s Technology Readiness Level (TRL) and Manufacturing Readiness Level (MRL).

FlexTech encourages partnerships among industrial companies, R&D organizations, and university teams. ARL funding will be matched with contributions by grant recipients to cover the total project cost. Development partners retain ownership of intellectual property developed under FlexTech contracts.

About SEMI FlexTech

SEMI FlexTech is an industry-led public/private partnership that brings together scientists, engineers, and business development professionals from industry, government, and universities to collaboratively initiate research and the development of the infrastructure required to develop world-class flexible hybrid electronics (FHE) devices and products. Learn more.

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

SEOUL, South Korea — May 16, 2023 — Market forecasts, insights into the latest semiconductor materials developments, and the key role of materials in sustainability will take the spotlight at SMC (Strategic Materials Conference) Korea 2023 tomorrow at the Suwon Convention Center in Suwon-si, Gyeonggi-do, South Korea.

LogoWith advanced materials a key driver of innovation, and sustainability a top SEMI and semiconductor industry priority, SMC Korea 2023 will feature the following presentations focused on reducing the industry’s carbon footprint:

  • Namsung Kim, Senior Director, Applied Materials – GAA (Gate-All-Around) Technology to Enable Continuous CMOS Transistor Scaling for Energy-Efficient Computing
  • Sung-Ho Kim, Head of Global Marketing, Merck KGaA, Darmstadt, Germany – Materials Innovation for Low-Global Warming Potential (GWP) Gas Development
  • WonSeob Cho, Head of Electronic Materials R&D Center, BASF – Aiming for CO2 Neutrality: Sustainable Solutions for IC Applications
  • Sang Uk Nam, Associate Research Fellow, KIET – Carbon-Neutral Strategy of Korean Government and Role of Materials Companies

In addition, experts from leading memory producers Samsung and SK hynix will discuss the vital importance of collaboration in advanced packaging and sustainable materials innovations.

The following experts will highlight other semiconductor materials market trends:

  • Jeongdong Choe, Senior Technical Fellow, TechInsights – Market & Technology Trends for Memory Devices Including Materials
  • Inji Yeom, Associate Partner, McKinsey & Company – Global Supply Chain
  • Mark Thirsk, Managing Partner, Linx Consulting – Materials Still Matter. Trends in Materials Demand and Supply
  • Jan Vardaman, President and Founder, TechSearch International – Advanced Packaging Technology & Market Trends

SMC Korea 2023 will also feature the following session:

  • Advanced Materials Enabling Next-Generation Devices – Experts from Air Liquide, Dongjin Semichem and Lam Research will discuss materials crucial to driving semiconductor innovations.

The global wafer fab materials market is projected to see a strong rebound in 2024 after softening this year, the March 2023 SEMI Materials Market Data Subscription (MMDS) report shows. Key semiconductor materials market drivers include artificial intelligence (AI), applications such as ChatGPT, and the growing automotive chip market.

SMC Korea 2023 Sponsors

· Aether CT· DuPont· Linx Consulting
· Corbion· Entegris· Merck KGaA, Darmstadt, Germany
· Dongwoo Fine-Chem· JSR· SK Inc. Materials
· Dongjin Semichem· KC Tech· Wonik Materials

 

SEMI Sustainability Initiative
The SEMI Sustainability Initiative brings together semiconductor industry leaders to accelerate the development of climate solutions and reduce the industry’s carbon footprint through collaboration, communications, alignment and standards. The initiative includes working groups focused on developing solutions to sustainability challenges. Learn more about the SEMI Sustainability Initiative or become involved by contacting us at [email protected].

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Jaegwan Shim/SEMI Korea
Phone: 82+2.531.7804
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

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