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Member Press Release
MRSI Systems' New Product MRSI-HVM3 Die Bonder Has Entered Volume Production Driven by Fast and Wide Customer Adoptions
NORTH BILLERICA, Mass., March 6, 2018 (Newswire.com) - MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to...
SEMI Press Release
Smart Manufacturing, Big Data to Highlight ASMC 2018
MILPITAS, Calif. — March 5, 2018 — SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2018) will bring together more than 100 industry experts and feature 35 hours of technical...
Member Press Release
Well established advanced packaging manufacturer in Taiwan selects Trymax
NIJMEGEN, The Netherlands (March. 02, 2018) - Semiconductor equipment manufacturer Trymax announced today that a Taiwanese establishes advanced packaging manufacturer selects Trymax for their...
Member Press Release
Photon Control to Unveil Wider Temperature Measurement Ranges at SEMICON China
Photon Control to Unveil Wider Temperature Measurement Ranges at SEMICON China
Vancouver, BC, March 1, 2018 – Photon Control Inc. (“Photon Control” or the “Company”) (TSX-V: PHO), a...
Member Press Release
ClassOne Equipment Selected to Upgrade Major UK Fab
Atlanta, GA – February 27, 2018 – ClassOne Equipment, Atlanta-based provider of refurbished name-brand semiconductor processing equipment, has announced the sale of multiple systems to a major global...
SEMI Press Release
SEMI Showcases Achievements in Flexible Hybrid Electronics, MEMS and Sensors at 2018FLEX and MSTC Conferences
Technology trail-blazers explore business insights, new technologies, integration strategies at co-located events, held February 12-15, 2018 in Monterey, CA
MILPITAS, Calif. ─ February 22, 2018 — A...
SEMI Press Release
North American Semiconductor Equipment Industry Posts January 2018 Billings
MILPITAS, Calif. — February 22, 2018 — North America-based manufacturers of semiconductor equipment posted $2.36 billion in billings worldwide in January 2018 (three-month average...
SEMI Press Release
SEMICON China 2018 Keynotes Announced As Attendance Soars
SHANGHAI ─ February 19, 2018 ─ SEMICON China 2018 today announced keynote speakers from semiconductor industry powerhouses and an event record of more than 74,000 square meters of exhibition space –...
SEMI Press Release
2018FLEX Japan Targets Flexible Hybrid Electronics Technology and Applications
TOKYO – February 14, 2018 – 2018FLEX Japan, the leading Flexible Hybrid Electronics (FHE) conference and exhibition in Japan, will assemble top experts April 19-20, 2018, in Tokyo for the latest in...
SEMI Press Release
Frank Shemansky To Lead SEMI’s MEMS & Sensors Industry Group
Milpitas, Calif. – February 13, 2018 – SEMI today announced the appointment of Frank A. Shemansky, Jr. PhD, as Executive Director and Chief Technology Officer (CTO) of the MEMS & Sensors Industry...
SEMI Press Release
2018 FLEXI Awards Innovation and Leadership in Flexible Hybrid Electronics
Monterey, CA – February 13, 2018 – The 2018 FLEXI Awards today recognized groundbreaking accomplishments in the Flexible Hybrid Electronics (FHE) sector in 2017. Presented at the opening session of...
Member Press Release
Process Technology Completes Acquisition of Dynatronix, Inc.
MENTOR, OH, Feb. 12, 2018 - Process Technology, a global leading manufacturer of thermal solutions for surface finishing, high-purity, and aquaculture applications, is excited to announce that...