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SEMI Press Release
Industry’s Only Worldwide OSAT Manufacturing Sites Database Now Tracks 320 Facilities, Adds Top 20 OSAT Companies by Revenue
SEMI and TechSearch International Database Also Revises Facility Technology Capabilities and Offerings
Milpitas, Calif. – Sept. 4, 2018 – SEMI and TechSearch International today announced a new...
SEMI Press Release
SEMICON Taiwan Opens With AI, IoT, Automotive in the Spotlight
Taipei, Taiwan – September 5, 2018 – Semiconductor industry growth drivers artificial intelligence (AI), Internet of Things (IoT) and automotive take center stage as more than 45,000 visitors gather...
SEMI Press Release
China’s Semiconductor Fab Capacity to Reach 20 Percent Worldwide Share in 2020, Region’s Equipment Market Expected to Rise to Top
MILPITAS, Calif. ─ September 4, 2018 ─ The China IC Ecosystem Report, a comprehensive report for the IC manufacturing supply chain, reveals that front-end fab capacity in China will grow to account...
Member Press Release
Brewer Science Unveils BrewerBOND® Dual-Layer Temporary Bonding System and BrewerBUILD™ Material for RDL-First Fan-Out Packaging
Rolla, Missouri – Sept. 4, 2018 – Brewer Science, Inc. today from SEMICON Taiwan introduced the latest additions to its industry-leading BrewerBOND® family of temporary bonding materials, as well as...
SEMI Press Release
SEMI Europe and AENEAS Collaborate to Support European Electronics Industry Growth
Brussels, BELGIUM – 3 September 2018 – SEMI Europe and AENEAS today announced that they have signed a Memorandum of Understanding (MOU) to form a strategic partnership to support the European...
SEMI Press Release
“Dreams Start Here” at SEMICON Japan 2018 in Era of AI
TOKYO – September 4, 2018 – Japan is at the heart of the semiconductor industry as the era of artificial intelligence (AI) dawns. SEMICON Japan 2018 will highlight AI and SMART technologies in...
Member Press Release
MRSI Systems Announces "One Stop Shop" Die Bonding Solutions at CIOE and ECOC
STOCKHOLM, Aug. 30, 2018 --
MRSI Systems (Mycronic Group) will be demonstrating our "One Stop Shop" capabilities at the 20th China International Optoelectronic Exposition (CIOE) at...
Member Press Release
Rudolph Technologies Launches Second-Generation Dragonfly Inspection and Metrology System for Advanced Packaging
Dragonfly G2 system delivers greater than 50 percent higher 2D inspection speed and accommodates multiple sensor options, including Clearfind™ Technology
Wilmington, Mass. (August 29,...
Member Press Release
MRSI Launches new MRSI-H3TO Die Bonding Product Family Targeted at the 5G Wireless Network Supply Chain
MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3μm high speed die bonder which will be the first of its kind to address the multi-die and multi-process requirements, delivering...
Member Press Release
MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market
MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3μm high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced photonics such as...
Member Press Release
Edwards to expand Semiconductor offering with the planned addition of Brooks Automation’s cryogenic business
BURGESS HILL, UK. (28th August 2018) - Atlas Copco Group has announced its agreement to acquire the cryogenic business of Brooks Automation, Inc through its wholly owned US entity Edwards Vacuum...
Member Press Release
Versum Materials to Exhibit Materials and Delivery Systems for Semiconductor Manufacturing at SEMICON Taiwan
TEMPE, Ariz. (August 28, 2018) ‒ Versum Materials, Inc. (NYSE: VSM), a leading materials supplier to the semiconductor industry, announced today it will showcase its next-generation CMP slurries,...