2026 Global Semiconductor Market Insight Forum

The rapid expansion of AI is fundamentally reshaping the semiconductor industry, driving unprecedented investment in AI data centers, accelerating technological transitions, and redefining competitive dynamics across the ecosystem. At the same time, growing debates around the sustainability of AI-related investments and the potential risks of an AI bubble are creating new uncertainties for industry players.

Changwook Kim, Managing Director and Partner at BCG and leader of the semiconductor practice in Korea, will present on the “AI-Driven Restructuring of the Semiconductor Industry and the Opportunities it creates.” The session will cover AI data center investment trends and outlook, the impact of AI on the memory semiconductor market, recent changes across the semiconductor ecosystem including fabless, foundry, packaging, and memory technologies, and the strategic implications and opportunities for semiconductor companies.

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AI is moving from large-scale model training toward inference and agent-based services. GPUs, HBM, and 2.5D interconnects have powered the first wave of AI acceleration, but the future is diversifying—bringing AI accelerators, CPUs, general-purpose memory, and on-die AI semiconductors into play. From a memory-centric view, the demand for massive capacity, ultra-fast speed, and wide I/O bandwidth is clear. Yet the most urgent challenge is low power. This talk will explore the current limits of DRAM core die technology in HBM and highlight new device structures designed to break through these bottlenecks. We will look at the shift beyond the traditional 1T1C DRAM cell toward oxide-semiconductor-based 2T0C architectures, advances in bonding methods, and the potential of glass substrates. We will also examine strategies for achieving low-power operation—from smarter architectures to heterogeneous integration of processors and memory—and discuss how these innovations open opportunities across devices, materials, equipment, and packaging. By framing these breakthroughs within a broader AI semiconductor technology framework, the session will provide a clear view of both the technical challenges and the strategic directions shaping the next era of global semiconductor innovation.

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AI is reshaping the semiconductor industry from both the demand side and the infrastructure side. While AI accelerators, HBM, advanced logic, and data-center infrastructure continue to drive strong growth, the broader market remains uneven, with consumer-driven segments recovering more gradually and macro uncertainty still shaping investment decisions. This presentation will review the key market forces behind the current semiconductor cycle and examine how AI demand is translating into fab investment, capacity expansion, and equipment spending.
The discussion will highlight SEMI’s latest view of global fab investment, capacity growth, and regional expansion. It will also address why the next phase of growth depends not only on headline demand, but also on qualified capacity, technology migration, packaging and test readiness. With Korea’s leadership in memory and manufacturing execution, the presentation will place Korea’s role within the broader global infrastructure buildout supporting the AI era.

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As monolithic scaling approaches the physical and economic limits of Moore’s Law, Advanced Semiconductor Packaging (ASP) has transitioned from a routine backend process to the primary driver of microelectronic innovation. Driven by an unprecedented surge in demand for Artificial Intelligence (AI), high-performance computing (HPC), and 5G infrastructure, ASP has emerged as the new strategic layer in the global technology ecosystem, reshaping hardware architecture and market competition.
Through heterogeneous integration, advanced packaging techniques—such as 2.5D/3D stacking and fan-out wafer-level packaging—bypass single-die fabrication constraints. By combining disparate, optimized chiplets into a unified system, ASP fulfills the skyrocketing commercial need for massive interconnect densities, ultra-low latencies, and extreme thermal efficiencies.
Ultimately, semiconductor leadership is no longer defined solely by front-end lithography nodes, but by the ability to architect complex, multi-die systems. Packaging has effectively become the critical differentiator, supply chain constraint, and the ultimate bottleneck for future technological supremacy.

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