MEMBER DIRECTORY

Founded in 1990, Stanton Chase Inc. is a top-ranked global retained executive search and leadership advisory firm, offering bespoke and innovative leadership solutions to clients worldwide. With over 70 offices in 45 countries and a team of 350 consultants, we combine global perspective with local insight to help organizations attract blue-chip leadership, unleash high-potential talent, and build robust talent pipelines. Our expertise spans across various segments in the semiconductor industry, including: · Chip manufacturers · Fabless chip companies · Chip equipment manufacturers · Semiconductor device manufacturers For more information, please contact the following: Jan-Bart Smits Global Practice Leader Semiconductor [email protected] +31 655 384 971

NADAtech has a line of inspection and metrology equipment developed with tier one MEMS manufacturers. Equipment is targeted at the needs of wafer bond and wafer saw areas.

Headquartered in Dresden, GermanySYSTEMAhas offices in Regensburg, Germany and Bend, OR.SYSTEMAprovides automation IT solutions to the private and public sectors around the globe. Our lean and solid solutions are the result of very precise and thorough work, delivered by our engineers, developers, scientists, professionals and industry experts.

ProTec Carrier Systems GmbH (PCS) is a young, highly innovative company specialized in the development, production, and marketing of systems and components for processing and handling of thin and ultra-thin substrates for e.g. thin wafer, glass and foil. These applications are designed for the semiconductor, plastic (flexible) electronic, photovoltaic, and Display industries in form of the worldwide patented Transfer ElectroStatic Carrier (T-ESC®) Technology, which is a temporary bonding system and works without adhesiive use, as well as Electrostatic Chuck (e-chuck) Technology. PCS enlarged its application portfolio in the field of III/V semiconductors, display, plastic electronic, and photovoltaic technology. Advanced process steps require additional substrate support in order to work reliably. Thus, based on using electrostatic clamping force (Coulomb force) the T-ESC® Technology is a good means to accomplish such a temporary support in an economical way. Furthermore, electrostatic clamping of thin foils for e.g. OPV (Organic PV) or OLED applications will improve the process results by enabling cooling possibilities, especially in vacuum processes. Manufacturing tools can be enhanced by introducing PCS’s electrostatic substrate holders instead of vacuum or mechanical clampi(more...)

Enabling resurgence in US Semiconductor manufacturing leadership through innovative next-generation chips research, workforce development, industry collaborations, and commercialization.

Manufacturer of PVD and Ion Beam Etch systems, thin film coating services, contract process development

SRP has a long and rich history of supporting the economic development of the Phoenix metropolitan area and Arizona. SRP has helped improve life in the Valley for more than 100 years. Today, SRP is one of the largest public power entities in the nation. We're here to assist you as you consider locating or relocating your business to the Phoenix metropolitan area. With more than 100 years of experience operating in the Phoenix metropolitan area, we have access to a vast array of resources to help ease your decision-making process. SRP, itself, is two entities: the Salt River Project Agricultural Improvement and Power District, a political subdivision of the State of Arizona; and the Salt River Valley Water Users' Association, a private corporation. The District provides electricity to 2 million people living in central Arizona.

Teledyne MEMS offers an unmatched MEMS and microfabrication capability, from design to prototyping right through high volume 150 or 200 mm production. With state-of-the-art facilities, mastery of materials from silicon to specialty metals to non-conventional substrates, Teledyne MEMS (formerly Teledyne DALSA Semiconductor and Teledyne Micralyne) collaborates with customers, offering decades of experience across a vast process portfolio.

UTAC Holdings Ltd and its subsidiaries (“UTAC”) is a leading independent provider of assembly and test services for a broad range of semiconductor chips with diversified end uses, including: In-communications Devices, Consumer Devices, Computing Devices, Automotive Devices, Security Devices, Devices for Industrial & Medical Applications. We offer our customers a full range of semiconductor assembly and test services in the following key product categories: analog, mixed-signal and logic, and memory. Our customers are primarily fabless companies, integrated device manufacturers and wafer foundries. UTAC is headquartered in Singapore, with production facilities located in Singapore, Thailand, China and Indonesia. Our global sales network is broadly focused on five regions: the United States, Europe, China and Taiwan, Japan, and the rest of Asia, and we have sales offices located in each of these regions.

State University of Delaware

Sandia conducts research in MEMS, photonics, quantum computing, and heterogenious integration, and engages in small-scale production of application-specific integrated circuits for DOE and DOD partners.

1.Emergency Power & Power Quality Integrated System2. Waste to Energy Application3. Distributed combined heat/cold & electricity production solutions

ViewMove Technologies, Inc. was established in 2000 and has long been dedicated to the core technologies of semiconductor equipment automation and control systems in Taiwan. The company continuously invests in the development and system integration of equipment for advanced processes, advanced packaging, and 3DIC applications. Since its establishment, ViewMove has been deeply involved in the R&D and volume production deployment of GPTC’s Single Wafer Spin systems, covering key technologies including electrical control architecture, motion control, process integration, human–machine interfaces, and equipment communications. For more than two decades, ViewMove has continuously supported stable operation of production equipment, accumulating extensive hands-on experience in single-wafer process tools and developing a strong understanding of the requirements of advanced packaging processes. ViewMove has developed its own automation software core platform based on the PLCopen IEC 61131-3 architecture(TwinCAT), integrating motors, robots, and real-time EtherCAT/CANopen communications. The company has also independently developed a SECS Driver compliant with semiconductor industry standards, supporting SECS/GEM and GEM300 equipment communication protocols. In addition, ViewMove provi(more...)