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The Executive Forum at SEMICON Europa in Munich on November 16 was a welcome opportunity to demonstrate the strategic importance of our vital industry.Executives across the entire electronics and applications value chain rightly pointed out the contribution that the semiconductor supply chain made to supporting the efforts to control COVID-19, which sparked explosive demand for semiconductors and led to the chip shortage and supply chain disruptions. The pandemic has heightened the urgency to establish the manufacturing capacity needed to support the global recovery and onward rapid growth of the semiconductor industry, which is projected to exceed $1.2 trillion in revenue by 2030.Semiconductors are the heartbeat of the way we work and live, and their vital importance is now recognized by governments worldwide including European Commission officials, as well as by the wider population.So far, so good. However the rapid industry growth brings opportunities and challenges. If we continue on the path we are now on, there will simply not be enough energy in the world to feed our data appetite in the so-called 5th wave of digital expansion. Many speakers at SEMICON Europa referred to the importance of sustainability and diverse skills, and many companies have put in place comprehensive programmes that will enable industry growth and lead toward net zero carbon emissions. The semiconductor industry is central to efforts to control climate change. Collaboration and cooperation across the European microelectronics ecosystem are essential.Europe is a world leader, and many stunning advances in technology have resulted from many collaborative projects, large and small, over the years. Many of the executives at SEMICON Europa stressed that these efforts must continue, and indeed be expanded, across the entire electronics and applications value chain. However, the focus remains on ever more capable technologies to match the needs of the digital age: data management, communications, computing capability and improving important application areas such as healthcare.(Clockwise) Laith Altimime, president of SEMI Europe; Luc Van den hove, president and CEO of imec; and Lars Reger, Executive VP and CTO of NXP Semiconductors present at SEMICON Europa 2021. But where are the programmes to drastically reduce carbon emissions and air pollution, eliminating the use of scarce resources and acting as a catalyst to keep 1.5 alive? SEMI is doing its part by establishing a sustainability initiative. To help the industry building the talent pipeline crucial to its future growth, SEMI has also developed workforce diversity programs. Both initiatives are bringing together leaders from across the semiconductor supply chain to address these critical challenges. These changes require major disruptions. Time and again, our industry has demonstrated that it can overcome tremendous challenge.Of course, many chip companies are already devoting significant time and effort to help meet the moment, and projects are underway across our industry focused on these great causes. Yet, we can’t rely on individual efforts to fix these global problems. Our industry, with so much capability and history of rapid innovation, needs to take the lead in changing the way we meet these industrial and social imperatives.Contact [email protected] to learn more about the SEMI Environmental, Health, Safety Sustainability initiative and help the semiconductor industry take action today.Learn more about SEMI Diversity and Workforce Development initiatives.Peter Connock is Chair of SEMI Europe Industry Strategy Symposium Committee and Chairman of memsstar Limited.Serena Brischetto is senior manager of Marketing and Digital Engagement at SEMI Europe.
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As monolithic scaling slows down, the semiconductor industry is increasingly relying on advanced packaging technologies to extend Moore’s law through heterogeneous integration. Higher on-package bandwidth, improved yield resiliency and the need to integrate diverse IP from multiple foundries are driving demand for advanced packaging technologies that address these issues but introduce challenges of their own such as efficient power delivery to all the different domains in a heterogeneous system. SEMI spoke with Kaladhar Radhakrishnan, Intel Fellow at Intel, about heterogeneous system integration trends and new developments in the semiconductor industry. Radhakrishnan shared his views ahead of his keynote at the SEMI Connecting Heterogeneous Systems Summit, 1-3 September 2021, an online event. Join the summit to meet experts from Intel and other key industry influencers. Registration is open. SEMI: What is driving the adoption of electronics and semiconductor devices nowadays and why is the development of new and innovative technologies important? Radhakrishnan: We are living in an increasingly data-driven world where devices have become an integral part of our lives. A recent study estimated that in the United States alone, 13.6 connected devices per capita consume an average of 300 gigabytes worth of data every month. In the workplace, COVID-19 has driven fundamental business changes that has sped up the adoption of digital technologies such as virtual conferencing, remote work, and e-commerce. Organizations are realizing that a high-quality video conference can be an adequate substitute for many in-person meetings. As a result, businesses are accelerating the digital transformation in order to adapt and thrive in this new environment. Five decades of sustained exponential growth in semiconductor performance has conditioned the average digital consumer to expect more from their devices. However, there are some headwinds ahead as traditional scaling slows down and power density rises. Because consumers and businesses are now generating data at a faster rate than they can consume it, technologists need to scale compute, storage, and bandwidth even faster to keep pace. Without investments in research and development of new and innovative technologies to address these challenges, the full potential of this data will go unrealized. SEMI: What forces are heightening the importance of heterogeneous system integration? What are the implications for increased on-package bandwidth, improved yield resiliency and the need to integrate diverse IP from multiple foundries? Radhakrishnan: The semiconductor industry increased transistor density and scaled performance through classical Dennard scaling until the turn of the century. By then, the gate oxide thickness had scaled down to atomic dimensions and the exponential increase in sub-threshold leakage signaled the end of scaling through traditional methods. Since that time, the chip industry has been relying on innovations in transistor materials and structures such as high-k metal gate, strained silicon, and FinFETs to keep pace with Moore’s law. However, this alone will not be sufficient to continue scaling and the industry needs to explore other vectors to augment improvements in transistor technology. Heterogeneous integration through advanced packaging is one key technology that can help drive these gains. Technologies like Foveros can enable device density scaling by creating a 3D stack of multiple die using high-density interconnects. Heterogeneous integration enables chipmakers to move from a monolithic system designed on a single large chip to a heterogeneous system comprised of a number of smaller chiplets. The main benefit of using smaller chiplets is that they improve yield and enable application based customization of the foundry processes. However, if the disaggregation to smaller chiplets is not accompanied by an increase in on-package bandwidth, the power and performance penalties associated with chiplet-to-chiplet communication will hobble system performance. This is why advanced packaging technologies that improve die-to-die communication are key enablers for heterogeneous integration. SEMI: What are some of the key technology challenges in developing heterogeneous systems? Radhakrishnan: The obvious challenge that most people focus on is the need for improved on-package bandwidth. However, as we rely on 3D stacking to continue device scaling at the package level, it is important to comprehend power delivery and thermal challenges as well. Power to the top die has to be delivered through TSVs on the bottom die, which not only adds resistance but also reduces the useful area available on the bottom die. This problem is further exacerbated when we stack more than two die. Excessive noise on the power delivery network can cause timing issues that limit the maximum operating frequency of the transistor. Similarly, when we stack multiple die, we must take into account associated thermal challenges. For example, each interface of the multi-die stack adds thermal resistance, which makes it harder to cool the chips at the bottom. SEMI: What are some of the key global market trends that driving demand for heterogeneous and system-level integration? Radhakrishnan: The number of artificial intelligence (AI) and machine learning applications have grown dramatically due to their ability to solve highly complex problems across a wide range of segments. AI and machine learning models require more memory bandwidth and compute capabilities that are difficult to achieve without some form of heterogeneous integration. Another market trend driving demand for heterogeneous integration is the increasing reliance on custom hardware accelerators. To combat the slowdown in frequency scaling and single-core performance, we have moved to multi-core architectures by tackling the inherent parallelism in our workloads. However, Amdahl’s law tells us that such an approach will hit a bottleneck when we reach the limits of the serial portion of the workload. As these constraints slow the performance of general-purpose processors, the reliance on custom hardware accelerators to boost performance for specific workloads is growing. Heterogeneous integration at the system level with a combination of CPUs, GPUs, FPGAs and other accelerators can optimize system power and performance. SEMI: What solutions is Intel developing to address these market needs? Radhakrishnan: Intel is actively involved in the development of the industry ecosystem for heterogeneous integration. We have developed a number of innovative advanced packaging solutions such as the EMIB and Foveros that are used in products today. Intel is also developing the next generation of advanced packaging technologies, Foveros Omni and Foveros Direct, which will dramatically scale the IO density by using direct Cu-Cu bonding technology. Foveros Omni is a crucial building block technology to enable high-voltage power conversion on the package for efficient power delivery. Intel is uniquely positioned to predict the design needs for future systems and deploy its resources to develop the technology building blocks needed to continue performance scaling. Our IDM 2.0 strategy enables us to leverage our leadership in packaging technologies to design the best products and use the best IP to deliver leading products across a broad range of categories. SEMI: What do you expect from your participation at SEMI Connecting Heterogeneous Systems Summit? Radhakrishnan: I’m hoping to shed some light on some of the new technologies we have been developing at Intel to enable heterogeneous system integration. I also want to bring awareness to the power-related challenges we are facing with heterogeneous systems. I also look forward to listening to what other industry leaders have to say on the topic. Kaladhar Radhakrishnan is an Intel Fellow and a Power Delivery Architect with the Technology Development group at Intel. He plays a significant role in shaping and driving power delivery technologies for Intel microprocessors. His areas of expertise include integrated voltage regulators, advanced packaging and passives technologies. Kaladhar is a two-time recipient of the Intel Achievement Award, the highest Intel honor an individual or small team can receive. He has authored four book chapters, over 40 technical papers in peer-reviewed journals, and has been awarded 35 U.S. patents. He has also served as an adjunct professor at Arizona State University. Kaladhar joined Intel in 2000 soon after receiving his Ph.D. in Electrical Engineering from the University of Illinois at Urbana-Champaign. Serena Brischetto is senior manager of marketing and communications at SEMI Europe.
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COVID-19 has likely had a greater impact on healthcare than on any other industry sector, said Glenn Snyder, Principal and Lead Analyst for MedTech at Deloitte, and a featured speaker at a recent SEMI webinar that offered a glimpse into the Future of MedTech in the run-up up to the SEMI Global Smart MedTech Symposium, kicking off tomorrow and running through August 5th. Snyder said medtech growth may appear muted in its early years but is poised to begin a steep climb as innovation continues, harkening back to the super-charged growth of circuitry on a wafer (aka Moore’s Law), which also saw a seemingly slow, flat start. Medtech enjoy its own exponential growth powered by 5G implementations, consumer demand, and the development of a robust ecosystem of bio-sensors, data standards, and regulatory improvements. Consumer-Driven Future and COVID-19 Impact Snyder noted that the future of medtech will be consumer-driven – enabled by open, highly interoperable data and secure platforms geared toward end users. A case in point: Detecting disease early through sensor systems will rely on not only on-body and environmental sensors, marking a fundamental shift from the today’s today’s hospital-centric system to improve health outcomes. Telemedicine growth during the pandemic is a notable example. In one case study of a health system, Snyder noted that telehealth usage skyrocketed from 1% to 60% of all patient visits over the early months of the pandemic but has since dropped to 10% due to the lack of charting, billing and other support systems needed to sustain the high rate of telehealth visits. Even so, hospitals expect to see a steady rise in consumers’ use of telehealth in the coming years. One driver are pilot programs for healthcare-at-home services for post-surgical patients. The programs have delivered better health outcomes and are more personalized and family-friendly than medical clinic or hospital visits. They also cost less. Digital monitoring using remote biometrics sensors are one key to driving the long-term success of these programs. Health Systems Changing Their Business Model In the medtech sector, changes in health system business models lag consumer adoption. What’s more, policy changes aren’t keeping pace with new models for medtech products. For medtech products to thrive, a solid foundation of data gathering, transmission and management capabilities that tie into traditional healthcare systems must be formed. Companies considering a vertically integrated approach to the medtech market can steer clear of healthcare providers – but only at the risk of having less access to patients and their historical healthcare data. Snyder said companies that control vertically integrated healthcare products and patient data can make support systems more efficient and robust but may struggle to deepen their market penetration. Companies such as Intuitive Surgical have found success with this model by offering highly differentiated products. Supply Chain Alarmingly Thin for Medtech Devices In a recent Deloitte survey of medtech companies, 60% reported that at least half of their products are powered by semiconductors, yet 70% noted pointed to high supply chain risks with most of their products because they have only a single source. Risk management and creating a resilient supply chain will remain key for medtech providers to adapt on a global scale. Partnerships and Collaborations During the event roundtable, Snyder mentioned that bio and pharma companies have partnered successfully to grow their businesses. Doug Kiehl of Eli Lilly, the moderator of the discussion, added that traditional healthcare providers should look outside of their usual business circles for medtech innovation. COVID-19 highlighted how new multi-disciplinary healthcare partnerships risk assessment processes have opened several paths to innovation previously unexplored. Both Snyder and Kiehl expect to see more collaboration between health systems and medtech innovators as they uncover synergistic business models. SEMI Global Smart MedTech Symposium Kicks Off Today Explore the gaps in the supply chain at the Global Smart MedTech Symposium and join the conversation with medtech device companies and health systems providers. Sessions include: Realtime Continuous Diagnostics and Monitoring Decentralized DNA Sequencing and Molecular Diagnostics Data Science and Infrastructure – AI/Data Fusion Applications in Rural and Decentralized Healthcare in the Digital Age The four-day symposium features three sessions at different times each day to cater to participants in Taiwan/Asia, Europe and North America. Register today! Heidi Hoffman is senior director of Technology Communities marketing at SEMI.
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U.S. consumers are flush with cash, the American economy is hurtling back from the depths of the COVID-19 pandemic, and the semiconductor industry is flying high on skyrocketing chip demand, with chip equities soaring since the initial outbreak in early 2020 as virus outbreaks worldwide supercharged demand for the digitization of everything from factories to home offices. “Wow, what a difference a year makes,” said Jennie Raubacher, Global Head of Semiconductor Electronics Investment Banking at Wells Fargo, speaking at a recent SEMI webinar. The two rounds of government stimulus payments in 2020 and 2021 gave many U.S. households the safety net to withstand the heaviest blows dealt by the COVID-19 pandemic and stoked consumer spending that has helped lift a hobbled economy. Durable goods spending in the U.S. has also seen a sharp rebound, surging more than 60% from its April 2020 trough, Raubacher said. The twin forces have driven a blistering U.S. economic recovery after GDP shrunk about 10% by the second quarter of 2020 only to bounce back in the first quarter of this year to roughly $19 trillion, regaining the lost ground to match the GDP charted at the end of 2019. With the U.S. economy continuing to gain steam, inflation has, as expected, edged higher, with price increases particularly acute in used vehicle and lumber markets. Despite surging prices, Wells Fargo sees inflation moderating as durable goods demand slows, easing pressure on interest rates, Raubacher said. Equity Valuations at Record Highs Heady semiconductor stock prices are not new. Over the past 15 years, equity prices of chip companies in the S P 500 have grown more than 460%, outpacing the 230% jump in value of the S P 500 index overall, Raubacher said. And chip stocks continue to shine. Since early 2020, when the spread of COVID-19 hit its rapid clip, the recognition of the growing importance of chips to economies around the world has exploded. That dynamic joined secular technology trends including autonomous driving development, industrial and factory automation, 5G infrastructure buildouts, data center expansions, and smart city and smart home innovation fueled by the Internet of Things (IoT) as key drivers of semiconductor stock valuations. With its price/earnings (PE) ratio now at more than 21x, the S P 500 is well above its historical average of 15x PE. “The S P 500 valuation is at record high any way you look at it, and valuation multiples across the board, currently at 3x Next Twelve Months revenue, have increased dramatically from historical averages,” Raubacher said. Semiconductor stock valuations are on similar trajectory, with the SOXX index now at 15x Next Twelve Months EBITDA (earnings before interest, taxes, depreciation and amortization). “While semiconductor stocks may seem highly valued compared to historical levels, the chip industry has grown faster and expanded profitability by a wider margin than S P 500 companies,” Raubacher said. With that differential, “semiconductor equities are not as expensive as they may seem at first glance.” Earnings expansion and valuation multiple increases for the chip industry over the past 15 years have translated into a more than 500% jump in market capitalization, compared to a 300% increase for the S P 500 excluding chip companies, she said. Chip company revenue growth in the first quarter of 2021 was predictably low due to seasonality, dipping 2.4%, though dropped less than the historical average, Raubacher said. Second-quarter revenue growth for the industry is expected to hew to the historical average of 6%. Semiconductor growth forecasts by market analysts for 2021 range widely from 6% to 17% year-over-year, she added. Chip Companies Raise Capital at Record Pace In 2020 and 2021, semiconductor companies have raised an unprecedented $82 billion in capital to finance maturing debt and acquisitions, a wave that will “likely catalyze further consolidation in the sector,” Raubacher said. None of the financing has stemmed from liquidity crunches. Since Raubacher joined Wells Fargo 10 years ago to lead its semiconductor practice, the group has executed more than 175 transactions including $40 billion in mergers and acquisitions and $360 billion of financing for its semiconductor industry clients. “With a strong macroeconomic backdrop and demand environment, relatively low interest rates, semiconductor companies showing strong business fundamentals and robust valuations, we expect a pickup in M A activity,” she said. Growth Forecast Across Most Semiconductor Applications The next four years will see the chip industry grow across most applications including wireless communications, consumer electronics, transportation and medical. Automotive and industrial/aerospace will lead the way, expanding at an expected compounded annual growth rate of 14% and 10%, respectively, from 2020 to 2025 to “drive a significant portion of the TAM expansion during that period,” Raubacher said. Across all applications, the semiconductor industry is expected to grow at a 6.8% CAGR from 2020 through 2025, adding $183 billion in revenue by the end of the forecast period, she said. ESG Rises in Importance For their part, investors now focus on more than pure business performance when valuing individual companies. The ability of businesses to reduce their carbon footprint, promote workplace diversity and take other steps to serve the greater good as part of Environmental, Social and Governance (ESG) programs are carrying more weight in valuation models. “Investors are paying more and more attention to ESG initiatives and targets,” Raubacher said. “On the debt side, we’re seeing things like green bonds and interest rate reductions tied to ESG targets. Only a few semiconductor companies have incorporated ESG measures into their financing, so it’s still early days. It really comes down to the metrics you can track in your companies and the goals and targets you can commit to. It will be a very company-specific approach rather than an industry standard.” In the chip industry, Raubacher noted that ESG targets are geared not only to manufacturing equipment and processes in fabs and other semiconductor facilities throughout the supply chain, but increasingly also to chips themselves. As technology innovation continues to spur the development of chips to power more electronics for consumers and businesses, their proliferation comes at a cost: greater energy consumption. The upshot is that semiconductor makers are becoming more focused than ever on power-efficient designs to bolster their ESG initiatives, Raubacher said. Many semiconductor players across the supply chain are reducing their carbon footprint by switching to energy-saving equipment and reducing water waste, Raubacher said. At the same time, more semiconductor executives are recognizing the rising importance of highlighting corporate achievements across all aspects of ESG. More Governments See Vital Importance of Semiconductors As shelter-in-place orders took hold in countries worldwide after the initial COVID-19 outbreak, work-from-home offices, online shopping, virtual classes and remote doctor’s visits became the norm. The electronics at the heart of this connectivity – born of both necessity and convenience – and the chips that power them took on outsized importance around the world. Geopolitical skirmishes intensified and supply chains across the semiconductor industry were reimagined and redrawn. Governments jockeyed for advantage in the race to build new semiconductor manufacturing facilities and upped their chip investments. An acute chip shortage that started in the automotive industry and quickly spread to other sectors magnified just how pervasive and vital semiconductors had become in making the world go round. “There’s no question that the semiconductor industry is vitally important to global and national economies as governments around the world now recognize its strategic importance,” Raubacher said. That puts the industry in an even stronger position to help lay the regulatory groundwork for its own future. “There’s a unique opportunity for semiconductor industry executives to shape the public policies that could impact the direction of the industry for the next 30 years,” she said. More than 750 people attended the June 2nd webinar, Surging Chip Demand, Digital Transformation, and the Pandemic – What’s Next?, sponsored by SEMI members Brooks Automation, Hitachi, JECT, KLA and TEL. Sven Smit of McKinsey Company also delivered his talk Leading in COVID-19 Exit at the event.
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When COVID-19 hit the semiconductor industry, SEMI members were confronted with new hurdles to keeping their employees safe and their operations running uninterrupted. We quickly assisted our global membership around the globe by providing a forum for collecting member insights on best practices for operating and safety procedures, supply chain issues and sentiments on business impact and recovery. That forum took the form of surveys we launched in March 2020. We shared the results with the larger SEMI member community to help them cope with the evolving impacts of the pandemic on their businesses. Following is a summary of our 4th survey, issued last month. Regional and Sector Representation Nearly 40% of our respondents represented companies headquartered in North America. Of the respondents, 10% each were from companies headquartered in Taiwan and China; 5% from Korea, 13% from Japan and 20% from European and Middle Eastern members. The largest share of respondents – 40% – develop equipment for semiconductor fabrication, assembly, and test; 21% supply materials to the microelectronics industry; 14% are device makers; 6% supply software and design services; and 3% are OSATs, EMS suppliers or ODMs. Measures Member Are Taking to Continue Operations The May survey found that almost no companies ceased production for any significant length of time. In order to continue operations, companies instituted social distancing and masking requirements, temperature checks, schedule changes, and some contact tracing, all to varying degrees, as shown in Figure 1. In addition, several companies implemented some combination of mandatory testing, bump sensors, air purification and site capacity limits and sequestered foreign workers in separate housing for required quarantines after travelling. Figure 1 All of these measures are routinely discussed during the regular SEMI EHSS COVID-19 Working Group calls. That group consists of facilities, HR managers and others tasked with ensuring safety monitoring and compliance at member companies. Company Vaccination Policies With the pace of vaccine rollouts varying widely around the world, only 5% of respondents are requiring all workers to be vaccinated before returning to the office, and 12% have not yet considered a vaccine policy. The majority of companies are encouraging but not requiring employee vaccinations, and 26% leave the decision to the individual employees. Figure 2 North American companies constituted the majority of the required and encouraged vaccination categories. In Europe, companies fall into the employee decision or encouraged categories but none require vaccinations. Japanese companies primarily leave the vaccination decision to employees, while Chinese companies are split among the required, encouraged and employee decision categories. Clearly, these guidelines are not required by law in each region, but instead fall to employers and local policymakers. Member Readiness for Digital Transformation A solid majority of members reported they have invested in the adoption of digital transformation technologies and practices, though only about 14% expect to continue their digital investments in the coming year. Many respondents have deployed virtual meeting software and have implemented or plan to put in place virtual reality tools for remote diagnostics and predictive modeling for semiconductor manufacturing. Figure 3 Location by Functional Group in Returning Employees to Sites Not surprisingly, manufacturing and distribution staff that could work from home during the pandemic are back on site, and respondents signaled that R D and engineering groups will soon end their remote work, following by finance and procurement. Sales and marketing show the highest percentage of staff working remotely, with sales having the highest number remaining remote for some time to come. Figure 4 Resilience to Further Economic Uncertainty Of the 274 companies responding, 229, or 84%, feel more resilient in the face of further economic uncertainty after their response to COVID-19, though continuing supply chain issues and raw materials shortages ranked among their top concerns, as did rising customer demands, their ability to increase capacity utilization rates, and the increasing demands on employees and facilities overall. Figure 5 Many thanks to all survey respondents over the past year! We’ll keep you up to date on results of future surveys. For more details on the SEMI EHSS COVID-19 Working Group calls, visit the SEMI COVID Response Site. To watch the recording of our most recent CEO Webinar – Surging Chip Demand, Digital Transformation, and the Pandemic – What’s Next? – click here. More than 750 people attended the June 2nd webinar sponsored by SEMI members Brooks Automation, Hitachi, JCET, KLA and TEL. Heidi Hoffman is senior director of Technology Communities marketing at SEMI.
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For the second straight year, SEMICON China, among the world’s largest and most influential semiconductor industry events, was the first local tradeshow of its scale held in-person, reflecting China’s rising prominence in the semiconductor industry. After securing approval from the Chinese government to hold large events, SEMI staged SEMICON China 2020 and 2021 with advanced protections against COVID-19 in place. There were no reported infections at either event. Highlights from SEMICON China 2021: Large Scale: Attendance of over 92,000, including more than 66,000 visitors and 25,000 exhibitors. Expo hall totaled 84,500 square meters with about 1,100 exhibiting companies and over 4,000 booths. World-Class Thought Leaders: Strong industry support from key foundries, OSATs, equipment and materials suppliers. Keynote speeches featured world-class industry leaders and head of China’s IC industry fund and global investment consulting agency, who explored the latest global business, technology and market trends and hot domestic investment topics. Concurrent Forums: Forums included SIIP China: SEMI Innovation Investment; Smart Manufacturing; Advanced Manufacturing; Advanced Packaging; Memory; Power Compound Semiconductor; China Display Conference; the all-new Advanced Materials Forum; and China Semiconductor Technology International Conference (CSTIC). Rich Digital Content: SEMICON China’s digital platform provided a rich array of content to attendees around the world including the Grand Opening Keynote and CSTIC, which were broadcast live online. Workforce Development: SEMI China worked closely with industry and government partners to promote SEMI Workforce Development programs to help attract and retain talent for China’s semiconductor industry. SEMICON China again featured the SEMI Workforce Pavilion and SEMI Workforce CXO Talent Forum. Outstanding COVID-19 Protective Measures: SEMICON China deployed advanced testing and monitoring equipment and implemented strict COVID-19 preventative measures to ensure a safe environment for all attendees to network and conduct business. Looking Ahead With the resounding success of SEMICON China 2021, optimism is growing that more physical events will be held with travel restrictions set to ease later this year. The more than 2,500 SEMI members around the world are eager to again network and collaborate face-to-face with customers, suppliers and partners to solve challenges in the microelectronics industry and drive semiconductor innovation that continues to transform how we work and live. That very innovation made many businesses more resilient as the virus spread and enabled people worldwide to work, learn, and shop from home. As SEMI starts to stage other events in-person, we will put in place advanced protective measures against COVID-19 to ensure the safety and well-being of all attendees. As the vaccination roll-out continues worldwide and new COVID-19 strains emerge, SEMI’s flagship SEMICON events are evolving in several ways, most notably with a larger digital presence. In this new era, we offer an international platform for SEMI members and partners across the microelectronics supply chain to collaborate, discuss industry trends, solve common challenges, network, and accelerate business growth through physical, virtual, and hybrid formats. Hybrid events – on-site exhibitions and conferences featuring a digital presence – allow the face-to-face connections so important to the semiconductor industry but also improve the attendee experience by offering an online option with the following benefits: More international accessibility to content live or on-demand Robust interactivity with live-streamed events, allowing more people to participate Greater cost effectiveness to enable companies and people under tight budgets to take advantage of world-class content, including keynote presentations, panel discussions, and technical sessions. In a recent survey of advanced manufacturing businesses, Informa Markets, a multinational publishing, business intelligence, and exhibitions group, found that 93% of respondents are likely to return to in-person events between August and December 2021, signaling a widespread eagerness for the return of live events and face-to-face connections. SEMICONs Scheduled for 2021 In a normal year, each of the seven regions where SEMI operates stages a SEMICON, with the exhibitions spread throughout the year. With the world continuing to combat COVID-19, more SEMICONs have been moved to the second half of 2021 – most of them with a hybrid format so exhibitors and attendees can take advantage of the increasing popularity of online events. After last year’s disruptions to the SEMICON schedule – and with more experience in the new normal – SEMI is excited to welcome the businesses and peers who couldn’t attend the 2020 events back to the in-person and hybrid shows. Innovation never sleeps. And SEMI will continue to evolve its events to help you form the partnerships and make the connections vital to the growth of your company and the industry. For more information about regional SEMICONs, please visit the SEMI events page. About the Author David Ghodsizadeh is the Director of Global Product Marketing at SEMI, where he develops customer-centric strategies to market SEMI Membership, Market Data, Expositions, Smart Initiatives, and Technology Communities to members, partners, and industry peers. Connect with David on LinkedIn.
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