smartphones

MEMS technology has changed human interaction with electronic devices. Introduced in the 1990s, the first mass-market MEMS devices were used for inkjet printheads and automotive airbag crash sensors. Today, MEMS are ubiquitous, with billions of the tiny devices adding intelligence and interactivity to smartphones, smart speakers, wearables, automobiles, biomedical devices, remote monitoring and event detection systems, and countless other applications. Integrating MEMS with Flexible Hybrid Electronics (FHE) is an important step in the evolution of this miniaturized intelligent sensing technology, paving the way for its use in new classes of flexible, conformal devices.The integration of the two technologies promises to breed new applications in small form factors but also presents challenges inherent to FHE design and fabrication processes. SEMI’s Nishita Rao caught up with Nathan Pretorius, prototyping and automation engineer, NextFlex, to discuss MEMS-FHE device integration challenges and opportunities ahead of his February 26 presentation, Integrating MEMS Devices in FHE, at FLEX|MEMS Sensors Technical Congress (MSTC) 2020, February 24-27, 2020, at the DoubleTree by Hilton in San Jose, California.Join us at FLEX|MSTC to meet Nathan and other industry influencers advancing innovation in FHE and MEMS sensors. Register now to connect with him at FLEX|MSTC or visit him on LinkedIn.SEMI: Why is integrating MEMS devices into FHE systems important? What new use cases might it enable?Pretorius: The main value proposition of integrating MEMS devices into FHE is that it allows MEMS devices to exist in a different form factor than was possible previously, giving us high-quality MEMS sensors on the flexible and conformable platform of FHE.Ease of application, flexibility, lower cost and rapid iteration on a design are just some of the benefits of FHE devices. And because there are few robust FHE sensors that overlap with MEMS’ capabilities, when you combine the two, you get a lot of compelling uses. That’s why NextFlex is working with agencies and companies to evaluate MEMS’ integration, including using bare MEMS die with microfluidics and promoting new ways of attaching and packaging MEMS die for use with FHE. SEMI: Why is FHE an ideal platform for integrating various types of sensors?Pretorius: MEMS integrated with FHE devices are ideal for rapid design and deployment of data-gathering sensor nodes — which we can iterate for specific applications. A few examples include on-body health monitoring devices for bio-fluids analysis, medical pressure sensors for monitoring blood pressure, and peel-and-stick sensors nodes for infrastructure monitoring. In terms of design and production, FHE devices support rapid prototyping, allowing for instantaneous design-iteration cycles. This speeds design-to-production over traditional rigid PCBs and copper flex because the feedback cycle time between design, manufacturing and testing is shorter, accelerating time to market. What’s exciting about FHE technology is that a variety of sensors or components, including MEMS, can be designed into the base system to easily customize it for a specific application. In addition, our experience shows that when compared to a traditional rigid PCB, an FHE board reduces manufacturing steps and device weight by two-thirds and, perhaps most importantly, converts the device to a thin, conformal shape that makes possible products in new form factors. SEMI: What are the primary challenges to integrating MEMS with FHE? What is NextFlex doing to help device manufacturers address these challenges? Pretorius: There are a few challenges, some of which are device-specific. Most recently, I’ve been focusing on inertial and timing devices, including accelerometers, gyroscopes and resonators. There are a few technical challenges involved in the process of getting the devices from the wafer to an FHE substrate. The wafer processing is very important, especially the dicing and thinning steps. After thinning and dicing, the die is placed onto the FHE substrate. The stresses caused by bonding to the substrate have to be understood and characterized. After placing the die, you then have a calibration step, which is normally performed after the device is packaged. With a MEMS die placed onto directly onto an FHE substrate, calibration then must be done.Finally, the device encapsulation is important, since on an FHE substrate the hard-to-soft material transition is very important to mitigate stresses to rigid component interfaces. We have also been looking at how to work with devices that have damping vents. Flexible encapsulants are inherently more permeable to gases and water vapor than hard encapsulants, so studying the encapsulation of MEMS devices on FHE is another area of interest. NextFlex has been working in a supporting role to evaluate best design practices and best attach and integration methods. In addition to our ongoing collaborative programs, NextFlex is developing the FHE manufacturing ecosystem to include system and component manufacturers and designers, product developers, and materials and equipment providers.SEMI: How do we facilitate closer collaboration between the FHE manufacturing ecosystem and MEMS suppliers such as MEMS device manufacturers, product developers, and materials and equipment providers?Pretorius: It’s important to include manufacturers early in the design process so we can identify challenges up front. That’s why NextFlex spearheads technology road-mapping efforts that include representatives from across the manufacturing ecosystem. We use the roadmaps to prioritize challenges that we can address effectively through collaboration, focusing the industry on solving problems through Project Calls that reveal integration challenges and results from real devices and that tell us how the materials and equipment actually perform with a real device.NextFlex keeps the information flowing, holding quarterly project update webinars to share results. As current devices are optimized for the process in which they will be used, we learn a lot from the project performers who make FHE system demonstrators — and we share that information with the member community. SEMI: Can you point to an example of a successful MEMS-FHE device integration?Pretorius: MEMS-FHE integration is still in the early stages, but we are working on several projects including a DARPA Seedling project for which we have integrated MEMS sensors into FHE systems for testing and evaluation. We plan to continue this work by integrating MEMS and FHE devices using methods that support mass production.SEMI: What would you like FLEX|MSTC attendees to take away from your presentation?Pretorius: We would like to see the FHE community work more closely with MEMS device manufacturers. For example, NextFlex often works with manufacturers to gain access to bare die, which is still a significant hurdle in making devices.The best way to speed things along is to get involved. We encourage FLEX|MSTC attendees to join NextFlex. As a prototyping and automation engineer at NextFlex, Nathan Pretorius explores new print methods for prototyping and automation using novel materials and processes. Pretorius currently focuses on how best to apply software scripting and machine learning to streamline FHE processes. Prior to joining NextFlex, he researched the strengths of roll to roll and screen printing on printed electronics designs, including capacitive touch interfaces, FHE passive component design, and antennas. Nathan holds a Bachelor of Science degree in Graphic Communications from Clemson University. FLEX|MSTC is organized MEMS Sensors Industry Group (MSIG) and FlexTech, SEMI technology communities focused on the growth of MEMS sensors and the flexible electronics supply chain, respectively.Nishita Rao is marketing manager for technology communities at SEMI.

John Smee, VP Engineering, Qualcomm Technologies Inc., will share insights on 5G – which is evolving to enable more reliable connectivity with higher performance in and beyond the era of Internet of Things (IoT) – in his keynote at MEMS Sensors Executive Congress, October 22-24, 2019, in Coronado, Calif.SEMI’s Maria Vetrano caught up with John to give MSEC attendees a preview of his talk.SEMI: Why should MEMS and sensors suppliers stand up and take note of the evolution in 5G, particularly 5G NR?Smee: 5G is the unifying fabric that will connect virtually everything around us. 5G New Radio (NR) is the global standard for a unified, more capable 5G wireless air interface. It will deliver significantly faster and more responsive mobile broadband experiences to users. It will also extend mobile technology to connect and redefine a multitude of new industries, including the IoT.As tens of millions of MEMS and sensors are the core components providing intelligence and interactivity to IoT devices, suppliers need to understand the capabilities and efficiencies that 5G will bring to connect the wide range of MEMS and sensors.We should also recognize that we are at the beginning of the 5G era, and 5G technologies will continue to evolve and expand in the coming years to connect new types of devices in increasingly efficient ways.SEMI: What’s special about the upcoming release of 5G NR, 3GPP Rel-16?Smee: While the first 5G NR release, 3GPP Rel-15, focused primarily on enhanced mobile broadband (eMBB), it also established a solid technology foundation for continued evolution in Rel-16 and beyond.With Rel-16, we are seeing 5G NR’s expansion beyond eMBB to address new tiers of IoT services such as industrial IoT (e.g., automation) with ultra-reliable, low-latency communication (URLLC) and cellular vehicle-to-everything (C-V2X) for more advanced use cases, such as autonomous driving. MEMS and sensors are critically important to both types of use cases as they collect the raw information of the physical world, and 5G is the connectivity of these sensors to the network. This makes the technologies inextricably linked.MEMS and sensors are equally integral to the development of more efficient low-complexity massive IoT devices (MIoT) with in-band 5G NR deployments of enhanced machine-type communication (eMTC)/narrowband Internet of Things (NB-IoT) and the use of the new 5G Core Network. In practical terms, devices that enable smart city use cases – such as smart utility monitoring, connected parking meters, and smart street lighting solutions that support 3GPP Rel-16 – are MIoT devices that will delight city administrators and dwellers with their improved coverage and efficiency. SEMI: In addition to low-complexity MIoT devices, what other markets will benefit most from the evolution in 5G NR?Smee: We continue to enhance 5G NR to support the high-performance IoT, including URLLC.URLLC is one of the many new 5G capabilities that wasn’t possible with the previous generation of cellular technologies, such as LTE. Because it delivers services at very high reliability (i.e., 99.9999%) and ultra-low latency (i.e., sub-1ms), URLLC literally opens up new use cases that that only wired communication could serve in the past. Industrial IoT applications that require a mix of high reliability and low latency, such as robotic arm command and control, are foremost among these new URLLC use cases.Another example of IoT taking advantage of URLLC is smart grid, where faults in the electricity distribution network require immediate protection and control to ensure safety and avoid equipment damage.SEMI: How is Qualcomm building on the eMTC/NB-IoT for low-power wide-area IoT (LPWA) – and how will this influence IoT connectivity?Smee: We continue to evolve eMTC/NB-IoT beyond its initial 3GPP release in Rel-13, making these foundational LPWA IoT technologies more capable and efficient as they become the basis for 5G massive IoT.The most significant updates to eMTC/NB-IoT include multi-cast and positioning support in Rel-14 and improved spectral/power efficiencies in Rel-15. Multi-cast can help service providers to deliver firmware updates over the air with greater efficiency, which speeds deployment of new features. Positioning can create new values, which can inform end users where their assets/packages are located, potentially safeguarding assets in transit. Improving spectral/power efficiencies offers more power-efficient transmissions, which takes less toll on battery-operated devices.With Rel-16, we have further optimized eMTC/NB-IoT, which is supported by the new 5G Core Network and is also deployable in 5G spectrum in-band with other 5G NR services.The evolutionary path ahead for eMTC/NB-IoT enables support for an even wider range of 5G massive IoT devices. New enhancements in the pipeline, such as grant-free uplink and multi-hop mesh, will boost efficiency and coverage area that much more.SEMI: Where do mobile broadband devices such as ultra-high-definition (UHD) security cameras fall within Qualcomm’s realization of 5G-NR?Smee: Mobile broadband is at the core of 5G NR. We see it both powering the new generation of 5G smartphones and expanding beyond traditional devices (including always-connected PCs and tablets) to address the needs of high-performance IoT devices such as UHD security cameras.It’s actually an important part of our vision for 5G to have an industrial network that requires all types of 5G connectivity for devices spanning eMBB (e.g., cameras, laptops), URLLC (e.g., machines) and MIoT (e.g., sensors).SEMI: What can the MEMS and sensors industry do to prepare for the 5G wave?Smee: Because 5G can evolve to deliver even better performance and efficiency for connecting sensors in the 5G world, we will see even more widespread adoption of MEMS and sensors into larger numbers of connected applications. MEMS and sensors suppliers, therefore, need to get ready for the 5G wave by preparing to support 5G connectivity in their devices, which will ultimately help to realize the 5G vision of connecting virtually everything in the world around us.John Smee, Ph.D., is vice president of engineering at Qualcomm Technologies Inc., where he is the 5G R D lead responsible for overseeing all 5G research projects, including end-end systems design and advanced RF/HW/SW prototype implementations in Qualcomm’s wireless research and development group. He joined Qualcomm in 2000, holds over 100 U.S. Patents, and has been involved in the design, innovation, and productization of wireless communications systems such as 5G NR, 4G LTE, 3G CDMA, and IEEE 802.11. He also leads Qualcomm’s companywide academic collaboration program across technologies including wireless, semiconductor, multimedia, security and machine learning. John was chosen to participate in the National Academy of Engineering Frontiers of Engineering program and received his Ph.D. in electrical engineering from Princeton University and also holds an M.A. from Princeton and an M.Sc. and B.Sc. from Queen’s University.Smee will present Evolving 5G NR to Connect the Internet of Things on Wednesday, October 23, 2019, at MEMS Sensors Executive Congress, Coronado Island Marriott Resort Spa in Coronado, Calif.Register today to learn how 5G NR will transform the user experience with MEMS- and sensors-enabled devices in IoT, automation and beyond.Interested in engaging with the MEMS and sensors supply chain? MEMS Sensors Industry Group is a SEMI technology community that enables the MEMS and sensors industry to innovate, address common challenges and accelerate business results.Maria Vetrano is a public relations consultant for SEMI.

SEMI spoke with Dr. Mikko Söderlund, sales director for Beneq’s semiconductor business, about trends in Atomic Layer Deposition (ALD) applications. Söderlund shared his views ahead of his presentation at SEMI MEMS Imaging Sensors Summit, 25-27 September, 2019, at the WTC in Grenoble, France. Join us at the event to meet Beneq and other key industry influencers. Registration is open.SEMI: The Backside Illuminated (BSI) CMOS Image Sensors (CIS) market continues to experience steady growth. Which applications are currently driving market growth?Söderlund: BSI CMOS Image Sensor market continues to be driven by mobile, security, automotive and Internet of Things (IoT) applications – so there seems to be plenty of opportunities for BSI CIS market to grow further.SEMI: What is critical for advanced thin-film deposition methods to extract best electrical performance?Söderlund: It is critical to control the material properties of the deposited layer (such as charge density, resistivity or barrier property) and of course, film uniformity and conformality. Furthermore, controlling material interfaces is also important, especially for sensitive III-V materials. {% video_player "embed_player" overrideable=False, type='scriptV4', hide_playlist=True, viral_sharing=False, embed_button=False, width='350', height='197', player_id='12721134435', style='margin: 0px auto; display: block; float: right; margin-left: auto; margin-right: auto; width: 350px;' %} Coatings and material features based on existing standard techniques can be very expensive, or not feasible at all. What does Atomic Layer Deposition (ALD), as a thin film coating method, offer in particular?Söderlund: ALD offers dense, highly conformal and pinhole-free best-in-class functional layers for dielectrics, passivation, encapsulation and much more. As a gentle and precise layer-by-layer method, ALD is extremely well-suited for deposition of such performance critical layers over large surface areas such as a cassette of wafers.SEMI: Please describe the Atomic Layer Deposition (ALD) coating process. Söderlund: ALD is based on a self-limiting surface reaction controlled thin film deposition. During coating, two or more chemical vapors or gaseous precursors react sequentially on the substrate surface, producing a solid thin film (see schematic below). Most ALD coating systems use a flow-through traveling wave setup, where an inert carrier gas flows through the system and precursors are injected as very short pulses into this carrier flow. The carrier gas flow takes the precursor pulses as sequential waves through the reaction chamber, followed by a pumping line, filtering systems and, eventually, a vacuum pump.SEMI: What are the two leading edge ALD applications?Söderlund: Today’s leading-edge ALD applications are in logic (high-k/metal gate, multiple patterning) and memory (DRAM capacitor, 3D NAND). Within the More-than-Moore (MtM) markets, CIS and MEMS (actuators and sensors, RF) have been early adopters of ALD, and we also see ALD being introduced in GaN Power and RF, as well as photonics.SEMI: Give us one prediction about the opportunities offered by advanced imaging applications.Söderlund: The large diversity of imaging applications will continue to drive growth and innovation. For example, machine vision is expected to transform the imaging landscape. We see this as a big opportunity for advanced thin-film deposition methods such as ALD, provided that the tools are versatile enough to address the diverse manufacturing requirements.SEMI: What are your expectations for SEMI MEMS Imaging Sensors Summit and why do you invite your peers to attend? Söderlund: The summit brings together all key RF stakeholders in the MEMS and imaging sensors industry, and we are looking forward to a great event. It’s a special event for us as we are officially launching a new ALD cluster tool product specifically engineered for the MtM applications – so this brings great excitement that we want to share with the attendees.Dr. Mikko Söderlund is Sales Director for Beneq’s semiconductor business. He has more than 20 years of experience in product development, product management, technical sales and business development across the photonics, OLED, and semiconductor industries. Mikko received his Ph.D. in Micro- and Nanotechnology from the Helsinki University of Technology. Serena Brischetto is a marketing and communications manager at SEMI Europe.

The 3D optical sensing market is once again surging – and it’s all thanks to Apple. What will we see in the next wave of end products enhanced by this technology, how will other market segments approach – and eventually use – 3D optical sensing, and which suppliers stand to gain the most from this very vital technology?Although 3D sensing, facial recognition and optical authentication systems have become only recently hot topics in the consumer electronics market, these mechanisms first made their appearance nearly a decade ago in November 2010. Following that debut, Microsoft soon launched the Kinect system in its Xbox 360 gaming console, marking a milestone as significant as Nintendo’s launch of its Nintendo Wii remote controller in 2010, which catapulted MEMS motion sensors into the high-volume consumer market.The Kinect system used a triangulation-based camera that Israeli developer PrimeSense Ltd. created and then licensed to Microsoft; Apple liked the technology so much that it acquired PrimeSense in 2013. The first version of Kinect applied the Structured Light (SL) method, a depth-sensing principle featuring an infrared (IR) laser projecting dots onto the scene, with a monochrome CMOS sensor measuring the differences in the acquired pattern. The second version of Kinect used the Time-of-Flight (ToF) principle.Kinect for Xbox360 was not only a successful consumer product; it also sparked a new market, thanks to the relatively low cost of the 3D sensing solution. By using the same hardware for Xbox 360 as in its first version of Kinect, Microsoft allowed developers to design their pet projects in the Kinect environment. Adding hand gestures controls to a PC, creating a user-controlled virtual dynamic light (see Kimchi and Chips’ demo), and developing an inexpensive hologram generator (see “Princess Leia” video from the MIT Media Lab) are just a few examples of ecosystem developers and DIYers applying their creativity to Kinect.Apple Goes 3D with Face ID3D optical sensing has expanded from gaming consoles to the smartphone. In 2017 Apple presented its Face ID camera system for the iPhone X, which they launched to celebrate the 10-year anniversary of the iPhone. Face ID is the result of a longer term strategy for Apple, the byproduct of several company acquisitions to expand know-how in 3D sensing and augmented reality (AR)/virtual reality (VR). Between 2015 and 2018, Apple acquired the camera-module maker LinX (2015), the AR startup Vrvana and the imaging sensor firm InVisage Tech (both in 2017), and AR glasses’ designer Akonia Holographics (2018).For a company that has always innovated on its own terms, Apple’s idiosyncratic approach called for deployment of the Structured Light method combined with a ToF device. The result is an amalgamation that utilizes the best features of the two mechanisms, even if the combination is one that is expensive. Apple’s addition of a near-infrared illuminator to its ToF device enhances the system’s effectiveness under most light conditions while also improving the reliability of Face ID; the overall outcome is a more satisfying user experience. The ToF component, which STMicrolectronics supplies, makes use of so-called single-photon avalanche diode (SPAD) receivers that can work with any target material and color, although a higher target illumination is required to obtain good accuracy.The other core components of the Face ID system are the Vertical Cavity Surface Emitting Laser (VCSEL, from Lumentum) and a dot projector (from ams/Heptagon), assembled together in an optical package. Apple’s expensive but reliable approach explains the company’s inclusion of the Face ID system in its latest smartphone and tablet offerings – across the iPhone Xs, Xs Pro and Xr as well as in the latest iPad Pro models. Apple’s Face ID uses facial recognition for authentication on a range of iPhone and iPad Pro models. Image courtesy of Apple. Chinese Phone Makers Get into the GameMeanwhile, other mobile handset manufacturers are rumored to be working on Face ID-like systems or have already presented similar solutions, albeit through a variety of approaches. Some have chosen to use standard ToF devices while others have adopted an SL tactic. In many of these designs, which happen to target Android systems, OEMs generally include a fingerprint sensor as a fallback biometric option to their own nascent 3D facial recognition systems. The fingerprint sensor operates in either standalone mode or integrates into the display.Chinese handset maker Oppo, for instance, uses the SL method on its Find X model with algorithms coming from Megvii. Oppo claims its equivalent of Apple Face ID is faster. I have heard that Vivo has been working on a ToF camera since mid-2018, which it claims provides greater accuracy and security in end-applications such as secure payments and unlocking the phone.Chinese technology giant Huawei’s first 3D facial sensor appeared in its Mate 20 Pro flagship mobile phone. Aside from providing facial biometrics, the front-facing 3D sensor doubles as a 3D scanner, enabling users to digitize live objects that they can then manipulate in 3D AR applications. While still a novelty, the application highlights the use of 3D light sensors beyond that of biometrics. Xiaomi’s Mi Explorer Edition smartphone features a complex SL 3D module to enable 3D facial scanning although it looks like a clone of the Apple solution.Overall, the importance of facial recognition is no longer a matter of dispute, given that Apple’s rivals are now developing counterpart offerings of their own. Leaked code from the next revision of the Android operating system (revision Q), now under development by Google, has confirmed as much. Big and Getting BiggerIHS Markit forecasts that global revenue for ToF sensors in the 3D optical sensing market will surpass $500 million in 2019, up from $370 million last year. We also predict that the ToF market will grow in the coming years, spurred by combo solutions integrated with other light sensors in the same package. This will lead to a cheaper bill of materials (BOM) compared to the BOM for the SL method.At the same time, IHS Markit forecasts that the total market potential for light sensors will be worth much more, reaching $1.5 billion by year 2022. That’s because after a solid start with gaming consoles, 3D sensing has matured and consolidated in the massive smartphone arena.A segment of 3D Sensing’s future growth will come from other use cases and applications that are emerging outside consumer electronics and mobile. These include people-counting and -tracking in consumer and industrial applications, landing-aid and obstacle-avoidance functions in drones, and car-trunk (boot) opening with foot gestures, as well as gesture recognition and passenger detection in automotive. IHS Markit predicts steady growth for ToF and other light sensors. All told, the ToF approach appears to have a greater chance than the SL method in gaining a larger market share, leading to a cheaper and smaller BOM along with reduced integration costs in system assembly and calibration.Sometime this year, Apple and other handset OEMs may include a ToF-based 3D camera on the back of the iPhone to support more immersive gaming experiences and new AR/VR applications. This will further boost the 3D sensing market.To be sure, other mature technologies are available as valid alternatives to optical 3D sensing, including ultrasonic, mmWave and radar. These alternative technologies may gain part of the total market now commanded by 3D sensing, in use cases such as obstacle-avoidance or in-cabin presence detection.To learn about 3D Optical Sensing and Light Sensors from IHS Markit, go to: https://technology.ihs.com/606483/light-sensors-for-consumer-mobile-report-2018Manuel Tagliavini, a principal research analyst at IHS Markit, covers MEMS and sensors technology.Manuel Tagliavini joined IHS Markit in 2017. His key areas of focus are MEMS and sensors for mobile and consumer technologies. He is responsible for the tracking of sensors in handsets, tablets, laptops, and sports and fitness products.Prior to IHS Markit, he spent over 10 years with STMicroelectronics, working in various roles including product engineering, program management, and marketing and business development in the company's MEMS division.Tagliavini earned an Executive Master of Business Administration at SDA Bocconi School of Management and a Master of Science in Electronic Engineering from the University of Parma, both in Italy.Stay tuned with the technological advances and market trends in the MEMS Sensors ecosystem. Join MEMS Sensors Industry Group (MSIG), the SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets, allowing members to grow and prosper.