innovation

As healthcare undergoes a digital transformation, semiconductor technologies are emerging as a critical foundational enabler, making care more personalized, proactive, and accessible. At SEMI, we’re proud to highlight the leadership of STMicroelectronics (ST), a member and active participant in our Smart MedTech initiative’s governing council, for their commitment to advancing this critical frontier.With decades of experience in sensing, power management, and connectivity, ST is helping to shape a future where electronic systems seamlessly integrate with healthcare and wellness solutions, empowering both patients and providers.The Rise of Wearables and the Role of SemiconductorsST has long delivered innovation in automotive, industrial, and consumer electronics. Now, the company is applying its expertise to wearable health technologies, a rapidly growing segment that’s reshaping how we monitor, diagnose, and manage health.Today’s wearables go far beyond their predecessors. They capture vital signs and biomarkers such as heart rate variability, ECG signals, blood pressure trends, and more with medical-grade accuracy, providing real-time insights that can inform treatment and improve outcomes. This evolution represents not just a technological leap, but a shift in how we deliver and think about healthcare.A Shared Mission to Scale MedTech InnovationST’s active engagement with SEMI’s Smart MedTech initiative reflects our shared commitment to building an agile, responsive ecosystem that can bring life-changing technologies to the market faster. Through Smart MedTech, SEMI unites leaders across the electronics and healthcare value chains to identify systemic barriers, spark cross-sector dialogue, and co-create strategies for scalable success.ST brings invaluable perspective and technical depth to this mission. Their approach focusing on full solutions rather than standalone components, demonstrates how semiconductor companies can play a central role in enabling integrated healthcare systems.Meeting the Moment: Prevention, Personalization, and ReachHealthcare systems globally face mounting challenges: aging populations, chronic disease burdens, rising costs, and a projected shortfall of 18 million healthcare workers (WHO, 2019). Against this backdrop, wearables and remote health monitoring tools are poised to deliver tremendous value.As ST points out, the economic case is clear: treating chronic disease can be 100 times more expensive than prevention, wearables offer a proactive path forward. By enabling continuous, at-home health tracking, these devices empower individuals to take control of their wellness and allow providers to intervene earlier and more effectively.Accelerating the Future TogetherAt the SEMI 2025 Technology Workshop, ST joined a panel discussion exploring how semiconductors are reshaping healthcare. The session highlighted the need for earlier diagnosis, personalized care, and scalable solutions amid rising chronic disease and healthcare labor shortages.Panelists emphasized moving beyond component sales to integrated, system-level solutions. ST’s role on the Smart MedTech governing council emphasizes their commitment to cross-sector collaboration and advancing MedTech adoption.The MedTech revolution requires more than great products, it demands aligned ecosystems, shared knowledge, and coordinated strategies. As a member of SEMI and a key voice in our Smart MedTech initiative, ST exemplifies how semiconductor innovation can drive real change in healthcare.We’re proud to work alongside ST and other industry leaders who are committed to creating smarter, more sustainable healthcare through electronics. Because in today’s healthcare landscape, an ounce of prevention enabled by semiconductors isn’t just worth a pound of cure, it’s a blueprint for global health resilience.See the full ST article STMicroelectronics and Medtech: Enabling Personalized Healthcare and Wellness through the Integration of Electronics featured on Smart MedTech webpage.Gity Samadi is Senior Director of R D at SEMI.Rafael Tudela Senior Technical Marketing Manager at SEMI.Michelle Smith-Moritz is Senior Program Manager, Smart MedTech at SEMI.

Say ‘Ahhhh’ – imagine your doctor monitoring a health condition from afar or emergency responders receiving real-time alerts that could save a life. A new smart sensor is taking the ouch out of wound monitoring. By using laser-induced graphene (LIG), a two-dimensional (2D) material, researchers are developing a sensor that could revolutionize the tracking of wound healing and recovery. Doctors could get a much clearer picture of the healing process, identifying issues like inflammation, physical strain or a spike in body temperature early on. "This unique sensor material we've developed has potentially important applications in health care monitoring,” said Huanyu “Larry” Cheng, James L. Henderson, Jr. Memorial Associate Professor of Engineering Science and Mechanics (ESM) at Penn State. LIG sensors are self-powered which means they could be especially useful for continuous monitoring in clinical settings or helping detect fires in remote locations. Source: Materials Research Institute, Penn StateUnder the Sea – Mechanical engineers at Carnegie Mellon’s Soft Machines Lab have created a soft robot inspired by the quick and agile brittle starfish, the first mobile and untethered underwater crawling robot. Named after Sponge Bob Square Pants’ sidekick, PATRICK is an AI powered robot which operates without motors so as not to disturb delicate sea life. To make the robot move, the researchers hit it with electric current, causing the wires to heat up past its transition temperature and allowing the limbs to contract and move in different directions. “We want to put the power and the electronics on-board with the robots,” said Ph.D. candidate and PATRICK creator, Zach Patterson. The soft robotic systems which are ideal for tracking the health and quality of water, are biodegradable to eliminate waste and protect the natural environment.Source: Carnegie Mellon University, School of Engineering The sky is NOT the limit with engineering – While Blue Origin made the news recently for sending an all women crew to the edge of space, the first Mexican born woman to travel into space is Katya Echazarreta, an electrical engineer originally from Guadalajara, Mexico. Echazarreta was selected for the trip from a pool of 7,000 applicants from more than 100 countries based on her outstanding achievements in the space industry, including five NASA missions. She traveled to space in 2022 aboard Blue Origin’s NS-21 flight as one of Space for Humanity’s citizen astronauts. Echazarreta comes from a family of engineers and works to make space exploration accessible to young kids, teens, women, and other scientists and engineers through Fundación Espacial, a foundation started in Mexico. Source: Astronomy.comMargaret Kindling is Senior Program Manager at the SEMI Foundation. She promotes inclusive workplaces via initiatives including Women in Semiconductors, Semiconductor PRIDE and workforce and career development programming at SEMICON West and SEMIEXPO Heartland.

In a world where technological advancements move at lightning speed, the semiconductor industry is facing unprecedented challenges. The demand for smaller, faster, and more energy-efficient devices is growing, and traditional manufacturing processes are being pushed to their limits. Enter Spin-on Dielectrics (SOD), a breakthrough material technology that offers a cost-effective, scalable solution for micro-gap filling and high-performance dielectric films. As the industry evolves, SOD is expected to play a pivotal role in enabling the next generation of chips that power everything from AI to everyday electronics.To learn more, SEMI Europe and Merck KGaA, Darmstadt, Germany, held a joint webinar that focused on semiconductor device process evolution by SOD. The session featured insights from three technology experts in the company, including Dr. Surésh Rajaraman, Executive Vice President and Head of Thin Film Business Unit, along with Atsuko Yamamoto, R D Manager for Spin-On Dielectric, and Go Nakano, Global Marketing Manager for Dielectric Materials.SEMI: What is SOD, and how does it fit within the broader semiconductor manufacturing process?Rajaraman: SOD, Spin on Dielectrics, is a unique class of materials used to deposit thin layers of dielectric films, which act as insulators or other functional films, on semiconductor devices. The fabrication of a semiconductor chip involves thousands of intricate steps that incorporate conductors, semiconductors, and insulators. SOD is a versatile technology that supports device performance and miniaturization by enabling better gap fill and film uniformity, all while offering attractive cost of ownership.SEMI: Why is there so much focus on SOD materials, and how are they evolving to meet future industry demands?Rajaraman: As semiconductor devices become more complex—such as 3D NAND scaling to more than 300 layers and DRAM incorporating pillar capacitors—there’s a growing need for materials that can address challenges like interconnect delays, power consumption, and heat generation while maintaining optimal performance. Traditional dielectric materials are reaching their limits, making Spin-on Dielectrics (SOD) a critical solution. SOD offers advantages like bottom-up and seam-free gap filling, enabling ultra-thin insulating and other functional layers that enhance electrical and thermal efficiency and support next-generation device scaling.The industry is pushing the boundaries of scaling, with increasing aspect ratios and complex structures in Logic, 3D NAND and DRAM. Modern devices now require deposition in features which are not only incredibly narrow but also increasingly deep due to going into the third dimension. This creates new challenges, such as stress buildup and cracking in conventional SOD materials. To overcome this, we are developing enhanced formulations with improved mechanical stability and polymer backbone engineering. These innovations enhance gap-filling properties and resistance to process-induced stress, ensuring SOD remains a key enabler for advanced semiconductor manufacturing.SEMI: What are the current industry trends driving the adoption of SOD?Nakano: SOD is becoming a key technology because of its excellent gap-filling performance. Unlike gas-phase deposition methods like Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD), SOD is a liquid-phase process. This makes it more efficient for high-aspect-ratio structures. It also helps reduce costs while maintaining high-performance dielectric properties.With increasing demand for high-density memory and logic devices, SOD is crucial for applications like DRAM and NAND flash, which require precise dielectric layer formation. In DRAM, we’re witnessing a shift from planar to vertical transistors, and even to monolithic 3D DRAM. These changes require new materials for gate insulators and electrodes, alongside improvements in aspect ratio gap filling.For NAND memory, manufacturers are increasing the number of memory layers, leading to taller memory stacks and deeper trenches. As lateral scaling progresses, narrower and more complex structures demand high-aspect-ratio trench fills to maintain performance and reliability.Logic devices are also evolving, with transistor structures moving from FinFETs to nanosheets and forksheets. This transition enhances performance, but it also introduces challenges in wiring density and electrical properties. The narrower pitch of wiring requires advanced dielectric solutions, like SOD, to enable reliable, high-performance semiconductor architectures.SEMI: With all these recent innovations, what role does Merck KGaA, Darmstadt, Germany play in supporting these advancements, and what does the company offer its customers? Rajaraman: As the semiconductor industry pushes the boundaries of scaling, doing so requires materials that can support increasingly complex structures. We are the only materials company in the industry to possess the full spectrum of process technologies for gap-filling capabilities, including SOD, ALD, CVD, and Flowable CVD. Our strategic acquisition of Versum Materials has expanded our capabilities with organosilicon precursors. Combined with our SOD expertise, it allows us to reengineer material backbones with more material choices and tailored properties to optimize performance in high-aspect-ratio applications.To support this, we’ve expanded our global R D footprint. We now operate in various application labs, enabling close collaboration with customers for material customization and fine-tuning properties to address specific manufacturing challenges. Last year, we inaugurated a new R D center in Korea as part of our commitment to being near our customers and accelerating time-to-market for next-generation semiconductor solutions. As semiconductor roadmaps become more complex, customization and collaboration also become more critical. The key to innovation lies in working closely with our customers, understanding their challenges, refining materials, and optimizing processes together. By fostering this ongoing partnership, we can accelerate technological advancements and ensure that new solutions align seamlessly with evolving industry demands.SEMI: Can you share some technical insights on SOD?Yamamoto: SOD is a key material used in semiconductor manufacturing to create insulating layers with high precision. One of the essential components in SOD is PHPS (Perhydropolysilazane), a polymer composed of silicon, nitrogen, and hydrogen. This material is applied as a liquid solution and transforms into a high-quality silicon oxide film through a series of thermal processes.PHPS is essential because it enables precise gap filling in extremely small structures, helping to improve device reliability. The process involves spin-coating the polymer onto a wafer, followed by pre-baking to remove solvents. Then, it undergoes high temperature curing in an oxygen and steam atmosphere, forming a dense silicon oxide film. This method ensures uniform coverage and cost efficiency compared to traditional dry film deposition techniques.Our Spinfil® product line has evolved over the past two decades, starting with the Spinfil® 400 series and advancing through the Spinfil® 600 to the widely used Spinfil® 800 series. These improvements have enhanced gap-filling capabilities and film uniformity, making them ideal for high-aspect-ratio trench structures. The critical baking process involves spin coating and pre-baking before wafers undergo batch processing in a high-temperature furnace. Controlled temperature and moisture conditions transform Spinfil® into silicon oxide films, optimizing properties such as refractive index, shrinkage, and etching resistance and ensuring reliability in semiconductor applications.SEMI: What are the latest trends in new polymer development for SOD?Yamamoto: Our research focuses on three key areas: enhancing film quality, developing SOD for high-aspect-ratio trench filling, and advancing low-k SOD for semiconductor processes.To improve film quality, we introduced the Neofil®series, an evolution of the Spinfil® 800 series. This innovation reduces film shrinkage, lowers stress, and enhances wet etching rates, making it ideal for next-generation semiconductor nodes.Our latest Neofil® series for high-aspect-ratio trench filling is targeted for traditional dry processes like CVD and ALD, which can often lead to void formation and require multiple deposition-etch steps. Our latest SOD materials address this by improving polymer elasticity, ensuring uniform filling of deep trenches up to 16 microns without cracks, making them suitable for emerging 3D nanostaircase designs.In low-k SOD development, we’re focusing on siloxane-based polymers, which provide excellent trench-filling capabilities while maintaining strong mechanical and electrical properties. Compared to flowable CVD and ALD, SOD offers a more cost-effective and efficient alternative. With continued advancements, we anticipate SOD will become a key material for future semi-damascene processes, enhancing embedding performance and overall device reliability.SEMI ContactSitong He, Communications Manager Email: [email protected]

Superconducting Naturally – Miassite is a naturally occurring mineral which scientists at Ames National Laboratory have identified as the first unconventional superconductor found in nature. Unlike conventional superconductors that follow the Bardeen-Cooper-Schrieffer (BCS) theory, minerals such as miassite exhibit unique properties outside of this framework. Made of rhodium and sulfur, miassite was initially recognized as a regular superconductor in 2010. Recent tests confirm it joins a small, exclusive group of unconventional superconductors previously limited to lab-made materials.Lab tests on miassite involved measuring magnetic reactions, inducing defects, and analyzing energy gaps, all confirming its unconventional behavior. While naturally occurring, samples are unlikely to be superconductive due to their disordered state, miassite’s lab-verified properties open doors to new research and highlight its unique duality as both a conventional and unconventional superconductor.Source: A Superconductor Found in Nature Has Rocked the Scientific WorldPheromones + vision = mate selection – When choosing a mate, Heliconius butterflies, despite their tiny brains can outperform current AI in multi-sensory decision-making by processing visual and chemical cues simultaneously. This discovery inspired Penn State researchers to develop a low-energy, multi-sensory AI platform using 2D materials. The device combines molybdenum sulfide (MoS2) to mimic visual capabilities and graphene to detect chemical signals like pheromones.The device could integrate visual and chemical cues, offering adaptability like a butterfly’s mating behavior. This innovation addresses limitations in current AI, which relies heavily on energy-intensive, single-sensory processes. Researchers aim to expand the device to process three senses, like crayfish using visual, tactile, and chemical cues. The work, supported by the U.S. Army Research Office and the U.S. National Science Foundation, could revolutionize applications in robotics, smart sensors, and critical environments, by enabling AI systems to detect issues using multiple sensory inputs efficiently. Imaging of Heliconius Butterfly A Butterfly Effect – Proving once again that there is a lot to be learned from nature, researchers from the Fraunhofer Institute for Solar Energy Systems ISE have developed innovative, colored solar facade elements inspired by morpho butterfly mimicry. These panels are aesthetically pleasing, integrate seamlessly into building exteriors, and retain high efficiency, achieving 95% of the power output of uncoated panels. Using vacuum-applied 3D photonic structures like those on butterfly wings, the panels produce vibrant, angularly stable colors with minimal energy loss. This MorphoColor® technology addresses architects’ and building owners’ concerns about design, offering an efficient, visually appealing solution for building-integrated photovoltaics while surpassing other technologies currently available.Close up of a morpho butterfly wingSustainable Flight – The world’s fastest supercomputer, Frontier, located at Oak Ridge National Laboratory, enables unprecedented advancements in sustainable aviation technology. Capable of over a quintillion calculations per second, Frontier allows GE Aerospace to conduct full-scale simulations of its revolutionary Open Fan engine design, accelerating insights into aerodynamics and turbulence. This groundbreaking tool aids the CFM RISE program, which aims to cut fuel consumption and CO2 emissions by at least 20%. Frontier’s detailed simulations predict engine performance under real-world conditions, saving years of testing. The partnership between GE Aerospace and Oak Ridge is expanding, promising future collaborations in climate modeling and advanced simulation techniques.An Open Fan engine design developed as part of a new project led by GE AerospaceSource: https://www.geaerospace.com/news/articles/new-frontier-how-ge-aerospace-using-worlds-fastest-supercomputer-help-design-open-fanMargaret Kindling is Senior Program Manager at the SEMI Foundation. She promotes inclusive workplaces via initiatives like Women in Semiconductors, Semiconductor PRIDE and workforce development programming at SEMICON West and SEMIEXPO Heartland.

The sensor revolution is shaping the future of connectivity, with innovation in MEMS and imaging technologies paving the way for a smarter and more integrated world.As the world becomes increasingly interconnected, MEMS and imaging sensor technologies are driving transformative changes across industries, shaping the future of connectivity, intelligence, and sustainability. Powered by advances in miniaturization, AI integration, and sustainable design, MEMS and imaging technologies are enabling groundbreaking applications—from autonomous vehicles to wearable health devices—while addressing urgent global challenges like climate change and energy efficiency. At the MEMS Imaging Sensors Summit 2024, Laith Altimime, President of SEMI Europe, emphasized the pivotal role of MEMS and imaging technologies. Setting the stage for discussions on technological breakthroughs and market trends, Altimime remarked, “Sensors are at the heart of the next wave of innovation, enabling unprecedented levels of intelligence that are transforming industries and fostering a smarter, more sustainable, and seamlessly connected future.”Laith Altimime, President, SEMI EuropeStefan Finkbeiner, CEO of Bosch Sensortec, underscored in his opening keynote how advanced sensor technologies are enabling life-changing use cases. “Sensors are all around us, though we don’t always notice them,” emphasizing sensors’ ubiquitous role in smartphones, wearables, and hearables. Finkbeiner highlighted miniaturization as a key challenge, noting that even as sensors continue to shrink, they are increasingly integrated with edge AI to enable efficient, local decision-making.Stefan Finkbeiner, CEO, Bosch SensortecSimone Ferri, APMS Group Vice-President and MEMS Sub-Group General Manager at STMicroelectronics, highlighted the pivotal role of sensors as a bridge between the physical and digital world, noting “the most sophisticated machine is the human – so it is best to emulate human capabilities to enable the next generation of devices to accurately measure the parameters of your body.” Ferri stressed the importance of sustainability, advocating for smart, transformative, and precise sensors that provide meaningful data with optimal efficiency. By aligning technological innovation with environmental responsibility, Simone Ferri demonstrated how sensorization can enhance lives while enabling a net-zero transition across industries.Simone Ferri, APMS Group Vice-President and MEMS Sub-Group General Manager, STMicroelectronicsMEMS Growth Fueled by Piezo Materials and ElectrificationJean-Christophe Eloy, CEO and President of Yole Group, grounded the discussion in market data, forecasting a 5% CAGR for the MEMS market, which is set to exceed $20 billion by 2029. He highlighted key trends such as the increasing sophistication of automotive sensors—more cameras, higher resolution—and the impact of electrification. On the technology front, Eloy noted a “strong shift towards piezoelectric (piezo) MEMS,” driven by advancement in new materials like Lead Zirconate Titanate (PZT), Aluminum Nitride (AIN), and Scandium-doped Aluminum Nitride (ScAIN).Jean-Christophe Eloy, CEO and President, Yole GroupAlissa Fitzgerald, CEO of A.M. Fitzgerald Associates explored the expanding roles of MEMS technology in new domains, such as fiber optics for data centers. “Photonics is in the news,” she remarked, highlighting its potential to deliver 40% power savings compared to copper technologies. “MEMS manufacturing is set to evolve by 2030 and beyond,” said Fitzgerald, emphasizing the continued innovation in traditional wafer-based processes through the adoption of advanced thin-film materials like piezoelectrics and GaN. Furthermore, Fitzgerald discussed emerging manufacturing techniques such as 3D-printed MEMS and biodegradable materials to enable low-cost, sustainable sensors.Alissa Fitzgerald, CEO of A.M. Fitzgerald AssociatesAdding to the conversation on manufacturing, Jessica Gomez, CEO of Rogue Valley Microdevices, shared her perspective on how 300mm-capable MEMS foundries could “change the game,” improving production efficiency and lowering costs. Gomez also outlined the unique challenges of MEMS manufacturing, including the need for custom processes and the high-mix, low-volume nature of production.Advancing Smart Mobility Through Interoperable NetworksSmart mobility gained significant traction as Patrice Ancel, In-Vehicle Technologies Leader at BMW, tackled the intricacies of in-vehicle networking. Ancel shed light on the complexities of today’s vehicles, which contain 20,000 components and over 100 electronic control units (ECUs) from multiple suppliers. His message was clear: “Interoperability is key for us; without interoperability, none of this will happen.” Ancel’s call for collaboration resonated throughout the summit, highlighting the critical role of teamwork in driving innovation and progress within the automotive industry.Patrice Ancel, In-Vehicle Technologies Leader, BMWA Vision for the Future: Sustainability, Collaboration, and InnovationThe MEMS Imaging Sensors Summit demonstrated how collaboration, sustainability, and innovation are driving the sensor industry forward. From addressing market trends to tackling manufacturing challenges, the discussions revealed a shared commitment to creating a smarter, more connected world.On behalf of SEMI, the SEMI Europe team would like to thank the industry leaders whose expertise and enthusiasm made this summit a resounding success. SEMI ContactAna Bernardo, Manager of Technology ProgramsEmail: [email protected] Mobile: +49 175 4129 764Sitong He, Communications Manager Email: [email protected]: +49 151 5546 2638

How Cool is That - Northrop Grumman’s “World’s Fastest Microchip” won the 2024 “Coolest Thing Made in California” contest, organized by the California Manufacturers Technology Association (CMTA). Public votes were cast for 138 California-made products in four rounds, culminating in this microchip—boasting speeds up to 1 terahertz—being crowned the winner. Manufactured in Redondo Beach, CA, the chip is 1,000 times faster than smartphone processors and represents California’s cutting-edge manufacturing sector. The contest and award ceremony were celebrated during CMTA’s MakingCA Conference, honoring manufacturing’s $310 billion contribution to the state’s economy. Doing the Green Wave - NIST scientists have successfully created a compact, full-spectrum laser covering the green-yellow-orange wavelengths, long considered challenging to produce. Traditional semiconductor lasers struggled with green wavelengths due to material limitations, so NIST turned to nonlinear optics, producing different wavelengths by adjusting silicon nitride device geometry and laser input. This breakthrough enables more precise, pure wavelengths ideal for quantum computing, medical devices, and underwater communications. Their method combines pump laser tuning and device adjustments, achieving 150+ wavelengths, demonstrating a significant advancement in accessible, high-quality lasers.Source: NIST’s Compact Green Semiconductor Laser - IEEE SpectrumEnergy Hero - At the 2024 ITF World conference, AMD CEO Lisa Su spotlighted a new goal: a 100x boost in computing efficiency by 2027. As shrinking transistor sizes yield diminishing returns, materials innovation has become essential for boosting performance and efficiency. Applied Materials has responded with advanced materials engineering solutions, harnessing exotic elements and 3D chip designs to improve efficiency. For instance, Applied’s Integrated Materials Solution™ combines six process technologies to reduce chip wiring resistance by 25%, a critical advance as semiconductor nodes shrink to the atomic scale. These methods promise breakthroughs in power efficiency across AI, personal electronics, and more. Building Automation of the Future - Imagine a future where every device in newly built structures— from HVAC systems and appliances to light switches and sensors—is equipped with a microprocessor and linked through a reliable communication network. This could transform how buildings operate, yielding substantial benefits across various sectors. Chip manufacturers would see new growth opportunities, while builders could offer smarter, more efficient homes. Consumers would gain convenience and comfort, as buildings could dynamically adjust to personal preferences and real-time needs. For instance, rooms would automatically adapt their temperature as people move through them, making manual thermostat adjustments obsolete. This automated approach wouldn’t just create a more comfortable environment but would also optimize energy use, potentially lowering costs and benefiting the environment.Source: Building Automation of the Future - EE TimesDo you have a fun fact to share? We invite SEMI members to share fun facts about the industry or their company. We’ll consider your tidbits for inclusion in future blog articles and or posting on social media. Complete our survey form or email [email protected]. Learn more about the SEMI Foundation and its initiatives to promote industry awareness and help provide a path for those interested in rewarding careers in microelectronics. Follow the SEMI Foundation on LinkedIn, Instagram, X and Facebook. Margaret Kindling is Senior Program Manager for Diversity, Equity, and Inclusion at the SEMI Foundation. She promotes inclusion and belonging via Women in Semiconductors, Semiconductor PRIDE and SEMICON West Workforce Development Pavilion programming.

In today’s rapidly evolving semiconductor industry, ensuring both precision and efficiency in manufacturing has become an increasing challenge, particularly as advanced technologies like MEMS and AI chips push the boundaries of design and production. Inspection methods that were once sufficient are now falling short, making room for cutting-edge solutions powered by artificial intelligence (AI). The introduction of AI-driven 3D X-ray inspection technologies is transforming the landscape, offering manufacturers a sophisticated tool to ensure quality control, while driving sustainable production strategies.SEMI spoke with, Joscha Malin, Product Manager, and Daniel Stickler, R D Expert for X-ray Imaging at Comet AG, Industrial X-Ray System Division, to explore how AI-powered 3D X-ray inspection technologies are shaping manufacturing. They delve into how these technologies address critical challenges during inspections and defect analysis, using tools such as Dragonfly 3D World software for user-friendly, AI-driven insights that facilitate effective decision-making.Further insights into the application of AI-powered 3D X-ray inspection technologies and their role in advancing MEMS manufacturing will be presented by Stickler at the SEMI MEMS Imaging Sensors Summit on November 14, 2024, in Munich, Germany. Registration is now open.SEMI: Thank you both for agreeing to share your insights. To start, can you explain the importance of inspection strategies in the context of MEMS manufacturing?Malin: As MEMS devices become increasingly miniaturized and complex, effective inspection strategies are crucial. These strategies not only accelerate the wrap-up of production processes, but also significantly enhance product yield. With tighter tolerances and various materials involved, ensuring the integrity and functionality of each component is more critical than ever. A robust inspection strategy allows us to catch potential defects early, which can save time and costs associated with rework or scrap.Stickler: The evolution of MEMS technology, particularly in AI chips, demands a higher level of inspection sophistication. Traditional methods may fall short in providing the necessary detail and speed, which is why we’re focusing on advanced solutions like our AI-powered 3D X-ray inspection.SEMI: Could you elaborate on how the 3D X-ray technology differs from conventional inspection methods? Stickler: The 3D X-ray technology we utilize acts as a bridge between traditional optical methods and standard 2D X-ray inspection. It offers high-resolution, three-dimensional images without damaging the samples. 3D X-ray technology emphasizes three main benefits: clarity, efficiency, and actionable insights. This means we can obtain detailed images that help us analyze components more effectively, allowing for real-time decision-making.Malin: Moreover, the clarity and detail provided by the 3D X-ray images are critical when it comes to defect analysis in MEMS devices. They allow us to assess mechanical, electrical, and assembly errors in ways that conventional methods simply cannot. This leads to a more reliable production process.SEMI: What specific MEMS defects can be effectively analyzed using this technology?Stickler: There are several types of defects we can analyze. For instance, we can detect mechanical defects such as stiction or fractures, as well as electrical failures like short circuits. The 3D X-ray inspection allows us to visualize these defects in detail. Additionally, we can monitor assembly errors, which are particularly important in complex MEMS devices where misalignments can lead to significant issues.Malin: I’d like to add that early detection of these defects is paramount. The faster we identify issues, the quicker we can implement corrective actions, thereby improving overall yield and reducing production costs.SEMI: You mentioned yield improvement earlier. Can you explain how your technology contributes to that?Malin: Our approach supports process optimization by providing information on product characteristics and, for example, allows us to identify trends early on that may lead to yield issues later. We also aim to accelerate new product introduction in the early phase by rapid feedback, saving time and cost. This is crucial because many defects may not be apparent until later stages of production. With our technology, we can monitor samples in real-time, allowing us to react promptly to emerging challenges.Stickler: By integrating this feedback loop, we can significantly shorten the time to market for new products. This is particularly beneficial in industries where speed and efficiency are essential.SEMI: Can you tell us about Dragonfly 3D World software and its role in this process?Malin: Dragonfly 3D World is a user-friendly software that leverages AI and, specifically, deep learning for image processing. It enables users to efficiently perform bump metrology and defect identification, for example, without needing extensive expertise in the field. The software makes complex processes manageable, even for operators who may not be specialists in image processing.Stickler: Beside MEMS and advanced packaging in GPU production, this software is indeed an “AI-for-AI” application. By utilizing deep learning, users can train models that adapt to various imaging tasks, making the entire inspection process more efficient. The insights generated from the 3D X-ray images are automated, enhancing usability and streamlining workflows.SEMI: In conclusion, what are the key takeaways you’d like to share?Malin: The key takeaways are that AI-driven 3D X-ray inspection is transformative for the MEMS manufacturing process, enhancing inspection strategies and defect detection significantly. By integrating advanced technologies, we can ensure higher product quality and efficiency.Stickler: Yes, and I would emphasize the importance of powerful monitoring and non-destructive test tools. Our innovative solutions not only improve yield, but also pave the way for sustainable practices in manufacturing, ultimately benefiting the industry. Dr. Daniel SticklerDirector X-ray Technology Components at Comet AG, Industrial X-Ray System Division. Based in Hamburg, Germany, he holds a PhD in Physics from the University of Hamburg and has extensive experience in X-ray imaging, semiconductor X-ray applications and product innovations. Joscha MalinDirector Product Marketing Software Products at Comet AG, Industrial X-Ray System Division. Based in Hamburg, Germany, he holds a degree in Electrical Engineering with specialization in Semiconductors and profound experience in the industry. For over a decade, he has focused on developing X-ray inspection and metrology solutions, especially for the Semiconductor industry. SEMI ContactSitong He / Communications Manager, SEMI EuropeEmail: [email protected]: +49 151 5546 2638

In the rapidly-evolving semiconductor industry, maintaining a competitive edge is crucial. To position Europe at the forefront of global semiconductor innovation, imec is leading the NanoIC pilot line initiative. Aligned with the European Chips Act, this initiative is a strategic move to bolster Europe's leadership in key markets like high performance computing, automotive, and healthcare.SEMI spoke with Srikanth Samavedam and Jo De Boeck from imec, Belgium, to learn more about the NanoIC pilot line and to better understand its goals, challenges, and prospects. From transitioning to gate-all-around (GAA) nanosheet devices, to developing advanced memory technologies and interconnects, this conversation highlights the cutting-edge advancements made possible through collaboration across the industry’s value chain.SEMI: How is the NanoIC pilot line working to revolutionize the semiconductor industry, and what are its main objectives?Samavedam: The NanoIC pilot line is a European initiative aimed at bridging the gap between R D and industrial innovation. The project is creating a beyond-2nm system-on-chip (SoC) pilot line, developing advanced logic, memory, and interconnect technologies. This effort supports the European Chips Act's vision for leadership and competitiveness in global semiconductor innovation, particularly in critical markets like high performance computing, communication, automotive, energy, and healthcare. However, advanced technologies come with more complexity, and addressing these complexity challenges requires more mature module baseline flows. By improving baseline flow repeatability and variability while reducing defectivity, we can accelerate the development of future technologies. The NanoIC pilot line is working to provide access to these advanced technologies and baselines to develop future compute systems. This will help ensure European competitiveness across the industry – from semiconductor materials, equipment and design to systems and applications.SEMI: Who are the core partners involved in this initiative?De Boeck: Key partners of the pilot line include CEA-Leti, Fraunhofer-Gesellschaft, VTT Technical Research Centre of Finland, Tyndall National Institute, and the Center for Surface Science and Nanotechnology of the University POLITEHNICA of Bucharest. This project is also supported by the Flemish government, other participating states, and the Chips Joint Undertaking of the EU Chips Act.These institutions and organizations bring a wealth of knowledge and resources, and imec compliments their efforts by providing access to its global partnerships with key industry leaders. The NanoIC pilot line is helping strengthen Europe’s global semiconductor industry leadership while aligning efforts with other regional Chips Acts. SEMI: Can you elaborate on the significance of transitioning from field-effect transistors (FinFETs) transistors to GAA nanosheet devices in CMOS technology?Samavedam: The transition from FinFETs to GAA nanosheet devices is a significant advancement in CMOS device technology. FinFETs have been the backbone of CMOS technology from the 22nm to the 3nm node. But starting at the 2nm node, nanosheet devices will need to be introduced. Nanosheet devices, including variants like Forksheet devices, are expected to drive scaling and performance through three generations – 2nm, A14, and A10. Complementary FET (CFET) architectures are also expected to be introduced around 2031 at the A7 node, which will represent another major inflection point in CMOS device design. This progression requires extensive research into new materials, process modules, equipment, and advanced patterning capabilities using high numerical aperture extreme ultraviolet (high NA EUV) lithography – all of which will be implemented on the NanoIC pilot line. FIGURE PROVIDED BY IMEC │ SCHEMATIC ILLUSTRATION OF A FUTURE COMPUTE SYSTEM. THE SYSTEM IS MADE OF LARGE MULTI-DIE ELECTRICAL-OPTICAL INTERPOSER PROVIDING ELECTRICAL AND OPTICAL INTERCONNECTS BETWEEN THE VARIOUS CHIPLETS (CPUS, GPUS, HBM). ALSO SHOWN ARE CONNECTIONS TO PACKAGE SUBSTRATE, AS WELL AS FIBER CONNECTORS AND AN INTEGRATED LASER SOURCE. CENTRAL PROCESSING UNIT (CPU); GRAPHICS PROCESSING UNIT (GPU); HIGH BANDWITH MEMORY (HBM); PROCESSING UNIT THAT CAN INCLUDE CPUS, GPUS, AND OTHER SPECIALIZED PROCESSORS (XPU); APPLICATION-SPECIFIC INTEGRATED CIRCUIT (ASIC); ELECTRONIC INTEGRATED CIRCUIT (EIC); FF-LEVEL: FEMTOFARAD-LEVEL; FIELD-PROGRAMMABLE GATE ARRAY (FGPA); GAAS QD: GALLIUM ARSENIDE QUANTUM DOT; INTEGRATED SILICON PHOTONICS PLATFORM 300MM (ISIPP300); REDISTRIBUTION LAYER (RDL); SILICON PHOTONICS (SIPHO); THROUGH PACKAGE VIA (TPV). SEMI: What are the key innovations necessary for advancing memory technology?Samavedam: As SRAM scaling slows, the exploration of novel, dense embedded memory concepts will become imperative. Technologies like spin orbit torque magnetic RAM (SOT-MRAM) and 2-transistor 0-capacitor (2T0C) embedded DRAM using deposited semiconductors like indium gallium zinc oxide (IGZO) are promising. These innovations address memory capacity and bandwidth challenges from new workloads in compute systems. Additionally, developing a 3D memory platform to explore future memory options will be essential for improving SRAM and DRAM. These advancements will help meet the demands of new applications like machine learning, augmented and virtual reality, and autonomous vehicles.SEMI: How do advanced interconnect technologies contribute to the future of semiconductor design?Samavedam: Advanced interconnect technologies, like chip-to-chip lateral (2.5D or interposer technologies) and vertical interconnects (3D technologies), play a crucial role in addressing memory capacity and bandwidth challenges. These technologies enable the partitioning of SoC functions into separate dies, allowing for more efficient and scalable designs. Advances like pitch scaling of micro-bumps and copper (Cu) hybrid bonding are facilitating this fine-grained partitioning of SoC functions. Additionally, optical interconnects and 3D interconnect-enabled co-packaging provide high-bandwidth and low-power connectivity at wafer scale. The rise of chiplet architectures and standardization will also increase the demand for low-cost, tight-pitch interconnect technologies like Cu/polymer redistribution layers.SEMI: How do your collaborators benefit from the NanoIC pilot line? De Boeck: One of the biggest collaborator benefits is the pilot line’s commitment to knowledge sharing through R D access and training. We invite foundries, IDMs, materials suppliers, equipment suppliers, and system companies/OEMs to jointly develop the materials, process modules, and integration flows to accelerate the development of beyond-2nm SoC technology pillars.Design pathfinding and system exploration process design kits (PDKs) will be available for start-ups, small- and medium enterprises, universities, and design and system companies to aid in prototyping and testing their designs. The NanoIC pilot line will also offer comprehensive training programs, including virtual PDK training, bootcamps for faculty, and internships and expert courses for students. To learn more, experts and key partners of the NanoIC pilot line will be presenting from 14 -16:40 at SEMICON Europa on November 12. imec’s program, ITF Chip into the Future, will highlight advancements in digital technology, capacity building through the European Chips Act, and the role of the NanoIC pilot line in accelerating beyond-2nm innovation. The conversation will also address industry requirements for pilot lines, emerging initiatives boosting Europe’s innovation and competitiveness, and perspectives on advanced materials and semiconductor equipment. Srikanth Samavedam, Senior Vice President of Semiconductor Technologies at imec, oversees programs in logic, memory, photonics, and 3D integration. Previously, he was a senior director at GlobalFoundries, leading 14nm FinFET technology into production and developing 7nm CMOS. Starting his career at Motorola, he worked on strained silicon and other advanced materials. He holds a Ph.D. in materials science and engineering from MIT and a master's degree from Purdue University. Jo De Boeck, Executive Vice President and Chief Strategy Officer at imec, oversees the company’s strategic direction and serves on its executive board. He joined imec in 1991 after earning his Ph.D. from KU Leuven and has since held various leadership roles, including head of imec’s Smart Systems and Energy Technology business unit and CTO. De Boeck is also a part-time professor at KU Leuven. Maria Daniela Perez / Communications Manager, SEMI EuropePhone: +49 160 2562977Email: [email protected]

With the rapid proliferation of electronics applications with more powerful embedded intelligence, demand for smarter, more efficient sensors is increasing to help devices connect to the world around them. As the semiconductor industry drives the future of connected technologies and sustainable solutions, it faces challenges in energy consumption, resource management, and ensuring data security.SEMI spoke with Simone Ferri, Vice President and General Manager at STMicroelectronics (ST), about current trends and challenges in the Micro-electromechanical Systems (MEMS) and imaging sensors market and how ST is driving innovation in this rapidly evolving industry. Ferri shared insights ahead of his keynote presentation at the SEMI MEMS Imaging Sensors Summit on November 14, 2024, in Munich. Registration is open.SEMI: Welcome, Simone, and thank you for sharing your perspective on the dynamics and trends for today’s MEMS and imaging sensors. To start, how would you describe the current market dynamics for these technologies, and what key factors are influencing these dynamics? Ferri: Right now, the MEMS and imaging sensors market is primarily driven by applications such as automotive electronics, consumer medical devices, AI-powered devices, and intelligent wake-up systems.According to Omdia, the MEMS market is projected to reach approximately $11 billion by 2027, with a CAGR of 2.8% from 2022 and 2027. Currently, automotive applications account for 50% of this market, with industrial at 15% and consumer at 35%. Notably, the automotive sector is the fastest growing, with a 5.4% CAGR, driven by the increasing use of inertial measurement units (IMUs) and microphones.In addition, Yole Group estimates that the imaging market, including optical sensing, will grow at a 4.7% CAGR between 2023 and 2029. Although mobile phone applications remain the primary driver of Complementary Metal-Oxide-Semiconductor (CMOS) image sensors (CIS) volumes, other sectors, including consumer electronics, automotive, and security imaging, are also contributing to the growth.Long-term forecasts for smartphone sales have been trending downwards, but mobile phones still remain a major driver of applications, innovation, and overall volume in the imaging market. Notably, the automotive imaging sector is one of the fastest growing markets and is expected to drive additional demand for CIS.Factors that influence the current market include global economic conditions, regulatory changes, geopolitical factors, technological innovations, and the emergence of new applications and use cases.SEMI: Can you elaborate on the growth strategies that STMicroelectronics is adopting to stay competitive in the MEMS and imaging sensors market? Ferri: ST has played a pivotal role in both the MEMS and imaging sensors markets for over two decades with its proprietary silicon technologies. We fully leverage our Integrated Device Manufacturer (IDM) business model, which allows us to support our customers through integrated capabilities for both design and manufacturing.To remain competitive, we are exploring new markets for MEMS sensors, particularly in digital healthcare with biosensors, where wearable devices are expected to exceed 500 million units per year by 2027.We’re focusing on the growing demand for automotive sensors such as accelerometers, Inertial Measurement Units (IMU), and pressure sensors, particularly with the rise of electric vehicles. We are enhancing the integration and synergy between automotive and personal devices. For example, we are combining high-g and low-g accelerometers within a single IMU, enabling accurate fall and crash detection, along with precise orientation and wake-up functionality.AI is another one of our priorities. In today's digitalized world, AI enables real-time, contextual understanding and the ability to make decisions that optimize and reduce the power consumption of the final device. Sensors are no longer merely for data collection. Thanks to AI, sensors can interact with their environment and significantly contribute to innovation and sustainability.We are also prioritizing low power consumption. Our MEMS technology operates in low-power mode with almost negligible energy use, activating only when necessary, without waking up the system to understand its environment or to be reconfigured.In addition, we’ve seen optical sensing continue to grow year over year. Optical sensing now offers features such as 3D capture, low-power and low-footprint computer vision, Near InfraRed (NIR) and even Short Wavelength InfraRed (SWIR).We are accelerating and leveraging our IDM model and broadband semiconductor supplier positioning to propose wider system offerings based on the array of sensors and microprocessors that ST develops. As the world shifts toward widespread use of sensors and data collection, the demand for secure sensing technologies is growing, extending beyond mobile and PC applications to spatial computing and AR/VR environments. For example, if we are talking about recognizing specific persons in an AR environment, we don't want the data related to these persons to be sent to the cloud before a decision is made about whether they are supposed to be there or not, as such information can be intercepted. We want all the data to be managed at sensor level and only a warning of rejection or acceptance to be transferred outside our secure sensor. SEMI: What are some of the latest technological innovations in MEMS and imaging sensors that are shaping the industry? Ferri: In MEMS, we're seeing significant advancements in three key areas:- In-sensor AI is integrating technologies in the sensors such as machine learning core (MLC), adaptive self-configuration (ASC), and intelligent sensor processing units (ISPU).- Open sensors are designed to interface seamlessly with other sensors, allowing third parties to benefit from on-sensor processing innovations, while building an ecosystem to create joint value with customers.- Accurate sensors are providing high-precision data, enabling better decision-making and smoother, more natural user interactions. These sensors also reduce factory calibration time and resources, leading to overall lower energy consumption. Because of their accuracy, onboard MLC, and ASC, the sensors can also reconfigure themselves without interaction with the processor, thus guaranteeing the proper accuracy at lower power consumption, at any time, under any condition.In the imaging sensor market, key trends include:- Higher Pixel performance is leading to improved signal-to-noise ratio (SNR), low light performance, better quantum efficiency (QE) and lower noise performance. Despite post processing, pixel performance remains the key factor as SNR performance must remain high while the pixel shrink roadmap advances.- Embedded Intelligence is providing local processing for local decision making, enhanced security, advanced image sensor processing (ISP) for improved image quality, and fusing sensor functions to deliver a better user-experience.- "Always on" capabilities are supporting mass sensorization and deployment of optical sensing solutions everywhere through specific low-power design techniques, process development, and overall system architecture optimization.SEMI: Looking toward the future, what trends do you anticipate will have the most significant impact on the MEMS and imaging sensors market? Ferri: Some macrotrends for sensors include:Electrification: Certain consumer and industrial applications are now being adopted in the automotive sector, especially with the rise of electric vehicles creating new opportunities for innovation and for new players to enter the market. As example, the predictive maintenance that has been developed for industrial electric motors is ported 1:1 to electric vehicles.AI: Regarding data transmission, distributed architecture will push AI towards edge computing, increasingly supported by advancements in 6G and foldable technologies. Additionally, as AI becomes more integrated, the maintenance and security for AI will require more attention.Smart home, buildings, and cities: As cities grow, the demand for smart homes and buildings rises, requiring more sensors to manage energy, security, and urban infrastructure efficiently. Over 55% of the global population and 70% of the EU population reside in cities. Urban areas generate more than 80% of the world’s GDP, and by 2030, it's anticipated that 68% of the global population will be urban dwellers, pointing to the growing need for smart cities.Aging population and digital health: The integration of biosensors with MEMS technology will be crucial for addressing the needs of an aging population.Overall, the use of image sensors for environmental sensing is steadily increasing. This is a major focus for ST, particularly in 3D sensing. New use cases, such as presence detection, are enhancing security and reducing power consumption due to efficient data processing. Additionally, the average number of cameras in smartphones, automobiles, and even in devices like robots and vacuum cleaners, continues to grow.SEMI: What has STMicroelectronics been working on, and what are your plans for the upcoming years? Ferri: To date, we have shipped over 23 billion MEMS sensors. Still, we remain committed to continuously improving our products and enhancing our MEMS technology in terms of affordability, miniaturization, performance, and novelty. We are striving to set the stage for a future defined by innovation and excellence with:Evolution of our current product portfolio by investing in lower power consumption, lower supply voltage, and additional and more sophisticated in-sensor AI for an effective distributed AI conceptNew sensors for presence detection, like infrared (IR) sensors, and health-focused sensors such as biosensors.MEMS sensors are also becoming increasingly accurate, open towards different ecosystems of technologies, and so intelligent that they can self-configure and reduce power consumption thanks to optimal data processing. These attributes allow us to provide meaningful and sustainable solutions across sectors such as automotive, industrial, infrastructure, and personal electronics, enabling us to improve energy efficiency, reduce waste, and support sustainable practices for a greener planet.For the past 10 years, ST has focused on depth sensing across multiple use cases. Today, ST is the number one in the world for time-of-flight solutions through our ST FlightSense product family. More recently, we launched our global shutter image sensors family, ST BrightSense, to address markets like personal electronics, automotive, industrial, communications equipment, and computers and peripherals.More specifically on the automotive side, we have the portfolio, customers, and customer program awards to lead the driver and occupancy monitoring market. We continue to secure design wins from our growing customer base while we expand our product portfolio and broaden our customer and application footprints.SEMI: What are some of the biggest challenges facing the MEMS and imaging sensors industry today, and how is ST addressing them? Ferri: The MEMS and imaging sensors industry faces several challenges, but with strategic planning and innovative solutions, companies can overcome these obstacles by focusing on the following:Integration: With our biosensors, we are doing more with less space. For example, in a standard accelerometer, we integrate an analog front end for electrocardiogram (ECG) analysis, enhancing functionality without increasing the device footprint.Performance enhancement: Ensuring high performance and reliability in various environmental conditions is crucial, especially in automotive and healthcare applications. To meet these demands, we deploy comprehensive testing protocols to ensure our sensors meet performance and reliability standards.Power efficiency: Reducing power consumption is vital, particularly for battery-operated devices like smartphones and IoT devices. We are developing low-power architectures to address this need.Data security: With the growing use of imaging sensors in surveillance and personal devices, data security and privacy have become paramount. Our solutions include encryption for data transmission and storage, as well as robust access control mechanisms to prevent unauthorized access to sensor data.Additionally, supply chain issues remain a significant challenge today. We believe our strategy and capacity as an IDM, combined with our strong innovation capabilities, give us a competitive edge in supply chain management.SEMI: What are you most looking forward to at the MEMS Imaging Sensors Summit, and what does it mean for the European semiconductor industry? Ferri: I look forward to the Summit as a valuable opportunity to connect with industry peers, share insights, and explore new collaborations. I encourage my peers to attend, as it’s a unique platform to collectively shape the future of our industry and sustain Europe’s leadership in semiconductor innovation. About Simone FerriSimone Ferri is Vice President of APMS Group and General Manager for MEMS sub-group at STMicroelectronics. Ferri began his career in STMicroelectronics in 1999 as an R D engineer before becoming a digital designer for the company’s audio division, leading into product management after 5 years. In 2014, ST entrusted Ferri with MEMS consumer sensors followed by global MEMS-sensor related Marketing and Application activities across all markets and segments, leading into his current role. Ferri graduated with a degree in microelectronics from Politecnico di Milano (Polytechnic of Milan), where he also completed his MBA. Sitong He is Marketing and Communications Manager at SEMI Europe.

Silicon carbide (SiC), with its wide band gap and high thermal conductivity, is increasingly favored for semiconductor power applications across several fast-growing industries. Its ability to operate at higher voltages and frequencies enables significant efficiency gains, particularly in e-mobility, where SiC offers key advantages in size, weight, and speed compared to traditional silicon-based power devices.However, as promising as SiC is, the industry still faces critical challenges in scaling to meet growing demand. Key barriers include cost, reliability, and manufacturing capacity, all of which must be addressed for SiC to fully mature.SEMI spoke with Entegris Senior Director - Advanced Technology Engagements, Office of the CTO Mark Puttock, Ph.D., to discuss the challenges of scaling SiC power chip manufacturing from a material supplier’s perspective. Puttock shared insights ahead of his presentation at the Entegris session, Cultivating a Thriving SiC Market: Tackling Key Challenges Across the Value Chain, taking place on November 14, 2024, at SEMICON Europa in Munich, Germany. Don’t miss the opportunity to engage with experts from Entegris and other industry leaders. Registration is now open. SEMI: Global megatrends like environmental crises and AI drive the necessity for SiC power semiconductors. What is the current status? Puttock: The increasing demand for efficient power electronics — fueled by global megatrends such as vehicle electrification, environmental de-carbonization, and the rise of power-hungry AI chips — drives the necessity of wide bandgap semiconductors. SiC offers advantages of weight, size, and speed over traditional silicon (Si) solutions, which are particularly vital in automotive applications 600V and above. However, SiC chip manufacturing has not reached the maturity of silicon-based processing. Greater maturity will help reduce costs, which will accelerate adoption in the market.SEMI: What are the main challenges in scaling SiC?Puttock: Challenges in scaling SiC power chip manufacturing to high volumes are not surprising. That’s because high volume producers have not been operating long enough to resolve early-stage issues. From a material perspective, SiC is more challenging to manage compared to Si. The challenges we identify include:Chemical Mechanical Planarization (CMP): SiC is nearly as hard as diamond and significantly harder than Si, making it challenging to achieve a high removal rate while maintaining both planarity and low defectivity. This step is crucial toward the end of the wafering process and before the epitaxial growth of device layers.Handling: SiC is more brittle than Si, making it more susceptible to damage or breakage.Implantation: SiC is more difficult to implant than Si, requiring higher temperatures and the use of aluminum instead of boron as a P-type implant species. Additionally, it is a significant challenge to achieve a reliable aluminum source with a long and stable lifetime.Thermal Processing for Wafer Growth and Epitaxy Processes: SiC processes run hotter than Si ( 2000° C for wafering, 1500° C for epitaxial growth), demanding resilient chamber parts to achieve good lifetimes.Sustainability: Because SiC is extremely hard, the CMP process requires significant amounts of slurry. Improving slurry recycling and wastewater management continues to be a challenge.On October 29, we will address these issues in our webinar, “Challenges in Scaling SiC Power Chip Manufacturing: A Material Supplier's Perspective” This session will provide valuable insights and considerations for advancing maturity in high-volume SiC power chip manufacturing. SEMI: Can you elaborate on the challenges associated with CMP for SiC wafers? Puttock: SiC wafers are challenging to process, requiring specialized materials and methods compared to traditional silicon. Defects in the SiC wafer crystal during non-optimized CMP processing can propagate into the device epitaxial layers. This leads to yield loss, increased electrical resistance, reduced performance, and wasted power.SiC wafers must be cut, ground, lapped, and polished to create the necessary surface properties before depositing active layers. As the demand for these devices grows, optimizing the CMP process is essential to ensure the desired surface quality and planarity required for device fabrication. For a deeper understanding of these challenges, we recommend downloading our latest white paper, “Solving CMP Challenges in High-Volume SiC Production,” which covers:Achieving maximum smoothness with high removal ratesReducing the total cost of ownership Optimizing CMP slurry and pads for the unique wafer chemistry and topology of SiC wafersSEMI: What do you mean by optimizing slurry for SiC CMP?Puttock: CMP slurry typically consists of abrasive nanoparticle powder dispersed in a chemically reactive solution. The objective is to achieve a smooth, defect-free surface (less than 1 A Ra) with a high removal rate (greater than 7 µm/m).Traditionally, achieving high removal rates and smooth surfaces required two separate slurries. This approach sometimes forced SiC wafer manufacturers to choose a defect-free surface over a faster, more efficient CMP process, depending on their fab capabilities. Today, optimization allows SiC wafer manufacturers to achieve both high polishing capacity and good final surface quality using a single slurry.Additionally, while the slurry is the most critical part of the CMP process, the pad must be compatible with the application. This ensures the desired planarity while also preventing scratches or contamination of the SiC wafer surface. Research shows that optimized thermoplastic polyurethane CMP pads outperform traditional thermoset polyurethane pads. The optimized pads minimize surface damage and enhance removal rates due to their bulk hardness.SEMI: What are the future challenges for SiC devices? Puttock: SiC devices are increasingly favored for their superior energy efficiency and reduced environmental impact. However, the SiC manufacturing process presents challenges due to its high-temperature operations, which consumes significant amounts of energy and shortens the lifespan of chamber components. To address this, improving efficiency in these processes will be crucial in the coming years.Recycling is another important challenge. For example, CMP slurries present an opportunity for water recycling and conservation. At Entegris, we are committed to this issue and are actively collaborating with key industry players to enhance material circularity and prioritize sustainability in our new product development.SEMI: How is Entegris contributing to advancements in SiC technology, and what initiatives or partnerships do you have planned for the near future? Puttock: Entegris is an active member of the SEMI Global Automotive Advisory Council (GAAC) and participates in a working group focused on SiC with key industry leaders such as Volkswagen, BMW, Porsche Consulting, onsemi, Infineon, STMicroelectronics, and others. Our engagement spans the entire semiconductor supply chain, collaborating with integrated device manufacturers and original equipment manufacturers in fabs worldwide. Additionally, we recently announced our latest long-term agreement with onsemi, which underscores our commitment to advancing SiC technology.SEMI: What are your expectations regarding your participation at SEMICON Europa? Puttock: SEMICON Europa is a unique platform to connect with the semiconductor and automotive ecosystems. Last year, we organized a highly successful SiC session in collaboration with SEMI at both SEMICON West and SEMICON Europa, focusing on “Connecting the Automotive Ecosystem Towards More Mature SiC Manufacturing.”This year, we will continue the discussion with industry leaders during our session, “Cultivating a Thriving SiC Market: Tackling Key Challenges Across the Value Chain.” Our goal is to provide insights and propose solutions that will enable SiC power chips to achieve their anticipated role in future technology ecosystems.We will present alongside Porsche Consulting, and the talks will be followed by a panel discussion that will explore the current state and future prospects of SiC technology in power electronics. We invite visitors to join us at the Executive Forum on Thursday, November 14, from 1:40 – 3:00 p.m. and to visit us at Silicon Saxony booth 219 in Hall C1.About Mark PuttockMark Puttock, Ph.D., is the senior director of advanced technology engagements in the office of the CTO at Entegris. He has worked in the semiconductor industry for over 30 years with a background in physics and plasma processing. As a team member of the Entegris CTO office since 2014, Mark has followed technology trends and collaborated with Entegris’ global product development teams to develop timely and differentiated new materials, chemistries, and components for all the world’s semiconductor manufacturers. Maria Daniela Perez is Communications Manager at SEMI Europe.