R&D

The SEMI FlexTech R&D program recently completed project FT19-19-190 with SAFI-Tech to create a solder material with a substantially lower melting point than conventional solder paste, reducing the thermal stresses created by high-temperature processing used for smaller packaging technologies.

Luc Van den hove, president and CEO at imec, spoke on semiconductor sustainability, healthcare trends and deep tech, and their implications for the semiconductor industry, sharing his views ahead of his keynote presentation at SEMI ISS Europe on May 30, 2022, in Brussels, Belgium.

PNI Sensor, a member of the SEMI-MSIG Positioning, Navigation and Timing (PNT) Technical Advisory Council, is developing advanced tracking systems that promise to increase industrial worker safety.The availability of low-cost GPS jamming and spoofing technologies renders GPS-only solutions for location and navigation an increasingly dangerous and ineffective choice for the dismounted soldier in a battlefield environment. This threat to armed forces has spurred development of new self-contained location and navigation technologies for defense applications — an innovation that offers significant advantages for commercial applications.Though not as complex and mission-critical as in defense, self-contained location technology is also essential in commercially available industrial applications. That’s particularly true for workers in industrial sectors such as utilities, mining, and construction, and in environments with lone or remote workers, such as first responders. While jamming and spoofing are not a threat in the industrial sector, determining the precise location of workers in GPS-denied environments is fundamental to ensuring their safety. This makes it a priority to adapt any self-contained, non-infrastructure-based location technology — which was first developed for the modern dismounted soldier — to industrial applications.Bodies in MotionInertial solutions are very difficult to implement properly, even without the challenges uniquely created by human motion dynamics. On a construction site, for example, workers tend to cover a wide range of disciplines: supervisors, electricians, iron workers and equipment operators, among others. While performing their jobs, construction workers change locations, both indoors and outdoors, and perform dynamic motion such as crawling, ducking and climbing. These are all motions that are very difficult to model using traditional adaptive filtering techniques, which are typically applied in vehicular inertial navigation platforms, such as aircraft, ships and tanks. Even if existing inertial navigation systems could be made size, weight, power and cost (SWaP-C)-compatible to be body-worn, their performance accuracy would still need to satisfy the application’s requirements. To properly determine a worker’s precise location to ensure safety on job sites and in remote locations, we must tackle the combined challenges of SWaP-c and human dynamic motion. That’s the most effective approach for creating a complementary positioning technology that augments GPS or other infrastructure-based location systems.To address these challenges, we need to build a high-performance inertial measurement solution using commercially available MEMS inertial sensors. The issues of bias drift error and low sensitivity have traditionally made such sensors practically useless for any meaningful inertial tracking. Fortunately, this is no longer the case. We now have sensors that already conform to the necessary SWaP-C requirements for the application, and have the additional advantage of high dynamic range of measurements without saturation errors, which helps to reduce high-force and rapid movement-induced errors, promoting greater accuracy.Thus, a path forward is emerging. The current generation of high-performance MEMS gyros can now inertially track workers’ locations to step-level resolution very well for up to 30 minutes — without significant location errors due to bias or scale errors. That’s an order of magnitude better than previous generations. With the new MEMS gyros, errors typically remain less than 2% of distance travelled over that time period. Strategically applying algorithm improvements with higher levels of magnetic corrections has the potential to bring that accuracy down even lower, to less than 0.5% of distance traveled for durations of one hour or more. What’s more, the improved gyro and accelerometer bias, gain, and signal-to-noise (SNR) performance allows for better magnetic anomaly rejection. This enables finer and more sustained gyro bias corrections in the fused solution, which creates a system greater than the sum of its parts. We believe that these newer systems will promote greater worker safety at a truly affordable price.PNI Sensor, a member of the SEMI-MSIG PNT Technical Advisory Council (TAC), is developing a tracking system that combines the best elements of the newest-generation MEMS devices with an electronic compass that uses advanced magnetic anomaly detection and rejection algorithms. Based on PNI’s latest attitude and heading reference system (AHRS), the novel PNT system employs a unique Kalman algorithm that intelligently fuses its reference magnetic sensors with gyros and accelerometers. In conjunction with this work, PNI Sensor has developed advanced pedometry functionality for use in its tracking system for very high dead-reckoning tracking performance used in defense industry applications. PNI is initially designing that system to track dismounted soldiers and special forces operating in GPS-denied or contested environments.For more information about PNI Sensor’s advanced location and navigation technology, please visit PNI Sensor. To learn more about the SEMI-MSIG PNT TAC, please contact Carmelo Sansone, director, MEMS Sensors Industry Group.George Hsu is a founder and CTO of PNI Sensor. He has focused his career on the sensor industry, having invented several magnetic sensor breakthroughs, including the magneto-inductive technology, the core of today’s electronic compassing in the automotive, consumer, scientific and military markets. Hsu is a graduate of Stanford University School of Engineering, holds several patents, and is a much-published author of technical articles on sensor theory, design and applications. He is an active member of the MEMS Sensors Industry Group PNT TAC.About the SEMI-MSIG Positioning, Navigation and Timing ProjectMEMS Sensors Industry Group (MSIG) created a member-based PNT TAC to identify and pursue PNT system innovations for GPS-denied environments. To that end, MSIG solicited proposals from its membership for the SEMI-MSIG PNT Project, a U.S. Army Research Laboratory-funded R D project. PNT committee members that have secured funding are pursuing R D platforms that improve accuracy and performance. Platforms may include software, hardware, and advanced packaging requirements of optical and MEMS-based positioning and timing systems.

Semiconductor companies that begin revising their long-term strategies now may emerge stronger in the next normal.In the months after the coronavirus began to spread, semiconductor companies moved decisively to protect employees, secure supply chains, and address other pressing concerns. Although the situation is still serious and many governments are still imposing physical-distancing requirements, semiconductor leaders are now looking ahead to the time when the pandemic abates and the next normal begins. To prepare for that moment, they are thinking about strategies for reimagining and reforming their business models—two activities that McKinsey described in a framework for responding to the coronavirus.Every aspect of the business model could be subject to change, including the composition of product portfolios, capital expenditures (capex), R D strategy, demand forecasts, supply-chain footprints, production decisions, and options for mergers and acquisitions (M A). But with so much uncertainty ahead, semiconductor companies may have difficulty making strategic decisions. To move forward, they should first establish a solid baseline for their company (see sidebar, “Determining the starting point,” for more information on this topic). With this foundation, semiconductor companies can chart a path to the next normal by focusing on the following questions: What recovery scenarios are most likely, considering evolving demand, economic developments, and other global changes? What is the impact of the COVID-19 crisis on long-term trends and demand? How can we emerge even stronger from the crisis? In past downturns, companies that thought about strategic questions early in the crisis were most likely to recover quickly and become market leaders. Although the COVID-19 pandemic is unprecedented in modern times, the need for long-term planning still holds true.Developing recovery scenariosCOVID-19 has significantly altered the fundamentals of the sector, including customer behavior, business revenues, and numerous aspects of corporate operations. Many companies have unclear future prospects, and some may not survive the crisis. Multiple recovery scenarios are possible, depending on potential government interventions and other variables that are now difficult to predict.Earlier, we published an article about the short- to medium-term outlook for semiconductor demand. Our analysis was partly based on assumptions in two of the nine scenarios that McKinsey developed for the COVID-19 recovery, both of which assume that the spread of the coronavirus is eventually controlled and catastrophic economic damage is avoided. In the first scenario, termed A3, global gross domestic product (GDP) recovers in the fourth quarter of 2020; in the second, termed A1, recovery is delayed until late 2022. Since the original analysis, we have updated the estimates to include 2021 demand.Both recovery scenarios suggest most semiconductor segments will experience negative year-on-year revenue growth in 2020.Both recovery scenarios suggest that most semiconductor segments will experience negative year-on-year revenue growth in 2020. Looking ahead to 2021, however, we expect that the situation will improve as most end markets recover, mostly because the starting point for 2020 will be much lower than it was in previous years. In the more optimistic A3 scenario, only a few segments meet the growth expectations that were forecast before COVID-19 emerged by 2021 (Exhibit 1). In the more pessimistic A1 scenario, the number of segments that recover is even lower (Exhibit 2). Within the individual segments, a few trends stand out: PCs. This segment will see the sharpest drop in demand and the performance gap will become more serious over time. Most people will buy all the home-office electronics that they need for remote work in 2020, lowering demand for next year. Meanwhile, enterprises may continue to delay investments in PCs to control expenditures, even if the recovery is proceeding. Automotive. In the more optimistic recovery scenario, A3, the automotive segment sees year-on-year growth of 28 to 36 percent in 2021. This estimate is based on the assumption that governments will offer incentives to car buyers. In A1, the scenario with the delayed recovery, government incentives are not as strong and growth remains in the 1 to 5 percent range. Wired communication. Growth in this segment could exceed pre-COVID-19 forecasts in both 2020 and 2021. This is one of the few areas where a delayed recovery would actually contribute to higher growth than the more optimistic scenario, since continued remote work and homeschooling will stimulate demand for wired communication. Evaluating the impact of the COVID-19 crisis on long-term demandBeyond 2021, semiconductor companies may have more difficulty predicting demand because even greater uncertainty abounds about healthcare and business developments. As companies create long-term plans and evaluate potential scenarios, trends in two areas deserve particular attention.Market pullOver the past few months, people around the world have experimented with new ways of working, studying, and communicating through videoconferencing and other technologies. Such trends could have a lasting impact on semiconductor demand and open new possibilities for existing products and services. For example, demand could increase for semiconductors that enable servers, connectivity, and cloud usage as online collaboration grows. Semiconductors may also be in high demand for the following products and services: contactless solutions, including touch screens and elevator buttons ambient assisted-living devices, including sensors, that help elderly and chronically ill patients remain in their homes, rather than moving to facilities automated-delivery solutions for the last mile, such as robots and drones digital work processes and the Internet of Things, especially in lagging sectors, such as healthcare, government, and defense Of course, COVID-19 could also decrease semiconductor demand in several important areas. Some automotive makers have already begun to postpone investment in autonomous driving because their lower revenues meant that less funding is available for R D. In other areas, demand trends are difficult to predict. Looking again at mobility, it is clear that public transportation is now less popular because people fear viral transmission. If subway and bus ridership remains low, or if more people begin to purchase private cars, semiconductor demand could shift in response.Monitoring industry shifts and geopolitical responsesOn the supply side, the pandemic has exposed risks that were previously unrecognized, leading to potential shortages of critical parts and components. In response, many semiconductor companies are already reconfiguring their supply chains to improve resiliency, and the changes may continue into the next normal. As they plan ahead, semiconductor companies might want to create scenarios that show the potential impact of localizing production, increasing stock and inventory levels, or making other changes.Within plants, the COVID-19 crisis could accelerate automation and the adoption of Industry 4.0 technologies. Remote manufacturing, diagnostics, and maintenance could all become permanent features. If that occurs, semiconductor companies might become smart workspaces, with technologies that facilitate remote work for most employees. They might also encourage a hybrid model in which a certain number of employees are remote and the rest remain on site. The efficiencies gained through such changes, as well as their start-up costs, could influence future semiconductor revenues.Long-term scenario planning must also consider the geopolitical response to the COVID-19 crisis. To stimulate the local economy, several governments have already announced subsidies and incentives, but these often vary by region. China for example has announced extended state subsidies and tax breaks for consumers purchasing new electric vehicles, while the United States has reduced fuel-efficiency standards for automakers. Semiconductor companies should closely track such regional variations, since they may affect demand patterns, and note whether local government responses appear to be evolving.Emerging stronger from the crisisSemiconductor companies have developed effective crisis-management strategies during other difficult periods, including the dot-com bubble in 2000 and the Great Recession of 2008. But the COVID-19 crisis presents entirely new challenges that make it different from any previous downturn. It hit unexpectedly and has exacted an immense humanitarian toll in addition to causing economic hardship. Although no playbook exists for such a crisis, some lessons from past downturns may apply if semiconductor players want to emerge stronger in the next normal.Modestly reducing capital expendituresIntel’s cofounder, Gordon Moore, once observed, “You can’t save your way out of a recession.” Large capex reductions are unavoidable if companies need greater liquidity to survive a crisis. But for companies in a better financial position, experience suggests that enormous cuts may not be the best strategy. During the Great Recession, many of today’s leading companies reduced capex less than their competitors and thus were better positioned to prepare for growth once the economy began to recover. With the current crisis, companies that proceed with plans to create next-generation products, purchase equipment, or make similar investments will be prepared if demand surges as the economy recovers. Those that hold back may have difficulty catching up, since some improvements can take years.Focusing R D budgets on next-generation productsFor maintaining a strong R D strategy during a crisis, three actions can be critical: Limiting cuts to R D budgets. As with capex, research shows that top companies tend to make moderate R D cuts during a downturn, allowing them to sustain a rich and evolving product portfolio. Unless liquidity issues require more significant cuts, companies should strive to fund innovation, rather than setting the bare minimum budget needed to keep R D running. Those companies that retain their focus on R D innovation now could gain long-term advantage over competitors, given the often lengthy timelines for developing new products. In some cases, the lagging competitors may never close the innovation gap. Focusing on next-generation products. Although semiconductor customers might be limiting their spending now, demand for new and innovative products could surge once the economy begins to recover. Rather than simply improving products using current state-of-the art technology, companies should also invest in next-generation products using new technologies. They may not generate revenue from these products over the next 12 to 24 months, but they will be well positioned once customer demand surges. Keeping a close eye on trends. Forward-thinking semiconductor companies will try to determine what products will generate the highest demand post-COVID-19 and prioritize their R D investments accordingly. Their analysis should encompass all areas, from new manufacturing techniques that allow for smaller process sizes to more innovative sensors. To make the right decisions, semiconductor companies must closely monitor new trends and customer behavior. If unexpected market shifts occur, they may need to take a new course. Taking a strategic approach to mergers and acquisitionsSemiconductor companies may also emerge stronger from the COVID-19 crisis if they take a strategic, systematic approach to investment and divestment. A retrospective, cross-industry analysis of 1,000 businesses shows that today’s top 100 companies were 10 percent more likely to undertake programmatic M A—the regular pursuit of modestly sized deals—both during and after the Great Recession (Exhibit 3). For divestment, the top 100 companies also unloaded 1.5 times more assets than their peers during the downturn. Another striking finding: the top companies also were more likely to pursue smaller deals. Overall, their average deal value was about 9 percent lower than that of competitors.A programmatic approach to M A is well-suited to the current era, since governments may implement stricter controls on large deals to limit foreign investment. It is possible that some protections may even extend to smaller deals to protect local businesses from hostile takeovers by international companies, so semiconductor players must examine regional regulations closely before proceeding with any M A activity.The world will be a different place after the COVID-19 crisis, and we do not yet know the extent of the changes within business, healthcare, and society as a whole. With so much uncertainty ahead, semiconductor companies will benefit by creating multiple future scenarios, each showing different macroeconomic and virus-related outcomes, as they set their strategy for coming years. They should embrace the uncertainty as part of their operating model, since agility and the ability to adapt quickly will be far more important than sticking to a plan. As in previous downturns, those semiconductor companies that act quickly could emerge stronger. Modest capex cuts, a focus on R D innovation, and a programmatic approach to M A could help them capture growth and create leading-edge technologies that will be in high demand once the economy begins to recover.About the authorsHarald Bauer is a senior partner in McKinsey’s Frankfurt office, Ondrej Burkacky is a partner in the Munich office, Peter Kenevan is a senior partner in the Tokyo office, Abhijit Mahindroo is a partner in the Southern California office, and Mark Patel is a senior partner in the San Francisco office.The authors wish to thank Daniel Anger, Stefan Burghardt, Sungwoo Chung, Viktoria Medvedenko, Sebastian Peick, Klaus Pototzky, Larissa Rott, Luisa Russwurm-Bössinger, and Klaus Seywald for their contributions to this article.Republished with permission from McKinsey Company.

Despite a tough year for critical subsystem suppliers, their overall expenditure on R&D has remained at near record levels– evidence that critical subsystems are indeed critical to the semiconductor manufacturing equipment industry and that high R&D spending on these products is essential.

The combination of state-of-the-art semiconductor devices and upcoming manufacturing technologies for cost-effective processing of flexible film substrates has paved the way for a large variety of new applications in the emerging Flexible Hybrid Electronics (FHE).SEMI spoke with Professor Christoph Kutter, executive director, Fraunhofer EMFT, about current FHE technologies and market opportunities ahead of the Get Started with Flexible Hybrid Electronics workshop organized by Fraunhofer EMFT and supported by SEMI, 15 October, 2019, in Munich, Germany. To register for the event, click here.SEMI: Recent developments in thin semiconductors, new materials and cost-effective processing techniques have opened the door to a plurality of new applications and future products. What are the most innovative integration approaches?Kutter: Most interesting is the hybrid integration approach – the combination of most modern printing technologies and lithographically defined semi-additive copper wiring systems with state-of-the-art semiconductor components. Combining these best-of-breed technologies enables low-cost and high-volume printing but also ultra-low power electronics, which is important for every wireless device without or with limited power supply.SEMI: Integrating sensors, integrated circuits (IC), displays, antennas and communication devices on film substrates enables extremely thin and bendable form factors for applications where existing board-level technologies fall short. What are the key enabler technologies?Kutter: Key enabling technologies are fabrication of high-performance wiring patterns, integration of ultra-thin bare dies/components and ongoing advancements in roll-to-roll processing of film substrates. Besides the manufacturing technologies, materials such as electronic inks, substrates, isolation and passivation layers play a key role.SEMI: Are you currently working and experimenting on something particularly exciting?Kutter: We are in the process of developing an adaptive roll-to-roll direct imaging system that analyzes the position of the components manufactured before adaptive lithography steps are carried out in real time. We think that this concept will open up completely new processing possibilities for us. The technical infrastructure making this development possible is funded within the framework of the Research Fab Microelectronics Germany (FMD), the largest cross-site R D cooperation for microelectronics and nanoelectronics in Europe.SEMI: Can you share some details about the Fraunhofer EMFT roadmap?Kutter: Fraunhofer will push the hybrid integration – for example, combining printing technologies with high-performance CMOS – since we are convinced that hybrid integration is the only way to offer low-power systems for IoT with the highest performance and at the lowest cost. For this purpose, we are currently setting up a roll-to-roll die bond and component assembly machine.SEMI: What are your expectations for the future of flexible electronics and why would you recommend attending the workshop in Munich?Kutter: Flexible hybrid integration is becoming more important and offers the best of both worlds: mass volume printing technologies integrated with high performance ultra-low power electronics. You will see many examples of hybrid integration approaches during the workshop. This is a very important opportunity to highlight the latest developments in the semiconductor industry. Researchers, market analysts, material and product developers, and equipment suppliers will gather to provide insights into the latest flexible hybrid electronics innovations. We are particularly proud to organize this platform with SEMI and FlexTech Alliance.Agenda - Get Started with Flexible Hybrid ElectronicsLocation: Fraunhofer EMFT, Hansastrasse 27d, 80686 Munich, GermanyConference Chair: Prof. Dr. Christoph KutterENTRANCE Fees: 150 € VAT excl.Contact: [email protected] Prof. Dr. Christoph Kutter is the director of the Fraunhofer EMFT, focusing on sensing technologies based on silicon electronics and flexible hybrid integration technologies.Kutter completed his physics studies at TU Munich. In 1995, he earned his doctorate in physics at the University of Konstanz. Serena Brischetto is a marketing and communications manager at SEMI Europe.

ASN had a chance to talk to François Brunier of Soitec, who’s leading this important project.Advanced Substrate News (ASN): Can you tell us briefly about OCEAN12?Francois Brunier (FB): OCEAN12 stands for Opportunity to Carry European Autonomous driviNg further with FD-SOI technology up to the 12nm node.Francois Brunier, Partnership Program Manager, Soitec.OCEAN12 deals with “Ultra-low power computing solutions for automotive and aeronautics using all the range of FDSOI technologies”. This project with a budget of 103M€ brings together 27 partners from 7 different countries. The project received the ECSEL JU* label under the 2017 call. ECSEL is an EU-driven public-private partnership enabling the co-financing of innovation in electronic components and systems both by Member States and the European Union.ASN: Why is this project needed?FB: As of today a car has around 500 million transistors. These electronic components represent already an important vector of valorization and differentiation for the automotive industry and for the consumer. The increased autonomy of the vehicles will require a very strong build-up of computational capacities. 50 to 100 times more transistors could be required for a level 5 (fully autonomous car). Following this trend an autonomous car will require power consumption equivalent to 50 to 100 computers running continuously (without taking into account the car propulsion).The OCEAN12 partners.The power consumption of these components becomes a key element in the choice of technologies. We believe that our technologies on SOI present the best assets to meet this challenge.The FD-SOI substrates, technologies and designs developed in OCEAN12 offer a palate of different solutions to this challenge: increased performance for data processing (including Artificial Intelligence); much higher energetic efficiency; and smaller form factors to fit in embedded systems like autonomous cars with higher integration and reliability, and enabling safe connectivity.The OCEAN12 project will demonstrate that SOI technologies are able to meet these challenges through relevant demonstrators in the targeted fields.ASN: What are the project goals?FB: OCEAN12 will bring concrete solutions to the main challenges of smart connectivity and low power consumption in the automotive industry.As such, OCEAN12 will build awareness around the key enabling technologies in substrate development, transistor behavior, and the design and fabrication of integrated circuits up to the system and end-user application levels. We will show that the technology is advantageous for automotive and aerospace applications, which are strategic sectors for Europe. Having the whole supply chain in Europe means having trusted and secured components made in Europe.The OCEAN12 project goals stand on three pillars:First: Confirming the technology foundation. Ocean12 puts the FD-SOI substrate and device developers in direct contact with the full value chain of suppliers and end users. This gives the entire ecosystem visibility into current and future needs, and ensures that substrate and device solutions are both technically feasible and correctly aligned with actual system requirements.Second: Creating concrete, innovative demonstrators in automotive (Audi, Bosch) and aeronautics (Airbus, Thales). These demonstrators are a first step in defining the context and environment to prove the advantages of these technologies in real application cases, showing they are useful and as such prefigure a final system and a potential future product roadmap. Demonstrators should be as close as possible to the final application.Third: Broadening the design ecosystem, with the big companies, the small- and medium-sized companies (SMEs) and the research organizations (universities, RTOs). We have a critical mass of 16 design ecosystem partners focusing their efforts on FD-SOI. The project leverages that dynamic FD-SOI design ecosystem for IC product migration to FD-SOI and the creation of new IP. Inventing the future components in Europe is also key.ASN: Can you tell us more about the demonstrators? When will we see them?FB: There are four demonstrators. All these demonstrators will be delivered by the end of the project in 2021:Always-on wake-up systems (Audi, Bosch, Leti). With such a system we can imagine an application to monitor our car when it is parked in a parking lot for a long time. The sensors would remain aware of everything that goes on around the car. Based on sensor observations, the car can make decisions on further actions to take. This can be used in many future car applications like intrusion detection or vehicle access systems. But you will not have to worry about battery drain: even though all the sensors are always on, they go right back into a very low-power sleep mode thanks to FD-SOI technology.mm-Wave integrated radar SOCs (Bosch and Audi), which will benefit from all the innovations of FD-SOI thanks to its low consumption properties, but also the optimization of the sensors. The performance gain is made over the entire system with adaptations between analog and logic.High-performance video processor for aeronautics. (Airbus, Thales, Kalray). Kalray, a French SME working on Massively Parallel Processor Arrays (MPPA) aims to demonstrate an ultra-low power, low-cost, high-performance neural processor on FD-SOI technology. This demonstrator would be key for Airbus and drones with high-performance, low-power cameras. Airbus and Audi have partnered on air and ground mobility services.Microcontroller plug-and-play board. This demonstrator lead by ST will allow for the development of new solutions in the domain of GNSS/GPS.ASN: Can you tell us more about the partners?FB: The OCEAN12 consortium of 27 partners involves 8 large groups, 9 SMEs and 10 universities/RTOs. These partners come from 7 different European countries.The eight large groups include: Soitec, the world’s leading provider of FD-SOI substrates; EVG, a leading global equipment supplier; GlobalFoundries and STMicroelectronics, the two major European FD-SOI foundries; and Bosch, as a Tier 1 automotive supplier. At the top of the value chain, high-end European automotive manufacturer Audi, the avionics industrial giant Airbus, and Thales for security issues, will develop product demonstrations.Ten highest-level research institutes support the industrial consortium. They include CEA-Leti (FR), Fraunhofer(GE), IMS (FR), INP Grenoble (FR), TU Dresden (GE), U. Paderborn (GE), Bundeswehr U. Munich (GE), Eberhard Karls U. Tübingen (GE), Instituto de Telecomunicações (PT), and Warsaw UT (PL). They increase the competitiveness through technological innovation and transfer of technical know-how while gaining new expertise working with global leaders.In addition, OCEAN 12 has a very strong SME consortium covering the supply chain in the fields of new equipment, IP, system integration and fabless companies. They include: IBS, UnitySC (HSEB), MunEDA, Kalray, AED Engineering, ISD, EVOTEL, M3 Systems and Design Reuse.All these partners have longstanding experience of cooperation in various national and international frameworks and are specialists in their fields of activity. Their contributions are essential for the success of the project.ASN: What is the timetable?The OCEAN12 kick-off event at Soitec’s headquarters near Grenoble.FB: The project started on April 1st 2018. The kick off with all the partners was held at Soitec on 29 September 2018. It was a great success. The project runs through December 2021, by which point everything has to be demonstrated.ASN: Can you clarify the funding structure?FB: The budget is about €103.6M. If the project succeeds, we get European Commission funding. In that case, just over 20% of the eligible cost – about €23M – is subsidized at the European level. The seven countries with companies or organizations participating in the project will then roughly match the European subsidies, contributing about €27M. These ECSEL-type public-private projects are a tried and true model in Europe, maximizing synergy across ecosystems. To conclude, in the name of the consortium I’d like to thank the ECSEL JU, the European Commission and our National Funding Agencies from France (DGE), Germany, Portugal, Greece, Spain, Austria and Poland. Such a project would not exist without them.______*ECSEL JU: Electronic Components and Systems for European Leadership Joint Undertaking

Leti and Soitec have announced a new collaboration and five-year partnership agreement to drive the R D of advanced engineered substrates, including SOI and beyond. This agreement brings the traditional Leti-Soitec partnership to a whole new dimension and includes the launch of a world-class prototyping hub associating equipment partners to pioneer with new materials, The Substrate Innovation Center will feature access to shared Leti-Soitec expertise around a focused pilot line. Key benefits for partners include access to early exploratory sampling and prototyping, collaborative analysis, and early learning at the substrate level, eventually leading to streamlined product viability and roadmap planning at the system level. [caption id="attachment_12066" align="aligncenter" width="644"] CEOs Emmanuel Sabonnadière (Leti) and Paul Boudre (Soitec) announcing the new Substrate Innovation Center during Semicon West '18. (Image courtesy: Leti)[/caption] Leading chip makers and foundries worldwide use Soitec products to manufacture chips for consumer applications targeting performance, connectivity, and efficiency with extremely low energy consumption. Applications include smart phones, data centers, automotive, imagers, and medical and industrial equipment, but this list is always growing, along with the need for flexibility to explore new applications starting at the substrate level. At the Substrate Innovation Center, located on Leti’s campus, Leti and Soitec engineers will explore and develop innovative substrate features, expanding to new fields and applications with a special focus on 4G/5G connectivity, artificial intelligence, sensors and display, automotive, photonics, and edge computing. “Material innovation and substrate engineering make entire new horizons possible. The Substrate Innovation Center will unleash the power of substrate R D collaboration beyond the typical product road maps, beyond the typical constraints,” said Paul Boudre, Soitec CEO. “The Substrate Innovation Center is a one-of-a-kind opportunity open to all industry partners within the semiconductor value chain.” Whereas a typical manufacturing facility has limited flexibility to try new solutions and cannot afford to take risks with prototyping, the mission of the Substrate Innovation Center is to become the world’s preferred hub for evaluating and designing engineered substrate solutions to address the future needs of the industry, inclusive of all the key players, from compound suppliers to product designers. Using state of the art, quality-controlled clean room facilities, and the latest industry-grade equipment and materials, Leti and Soitec engineers will conduct testing and evaluation at all levels of advanced substrate R D. “Leti and Soitec’s collaboration on SOI and differentiated materials, which extends back to Soitec’s launch in 1992, has produced innovative technologies that are vital to a wide range of consumer and industrial products and components,” said Emmanuel Sabonnadière, Leti CEO. “This new common hub at Leti’s campus marks the next step in this ongoing partnership. By jointly working with foundries, fabless, and system companies, we provide our partners with a strong edge for their future products."

Although many months past due, Congress on March 23 finalized the federal spending for the remainder of fiscal year (FY) 2018, only hours before a what would have been the third government shutdown of the year. Congressional spending has been allocated in fits and starts since the end of FY 2017 last September, with patchwork deals keeping things running amid pervasive uncertainty. While this clearly isn’t an ideal way to fund the federal government, the end result will make many in the business of research and development pleased with the addition of more resources for science and innovation.There was grave concern over the future of federal spending with the release of the president’s FY 2018 budget, which would have cut the National Science Foundation (NSF) budget by 11 percent and National Institutes of Standards Technology (NIST) spending by 30 percent. Relief came with early drafts from Congress that whittled those cuts down to between 2-9 percent. But the real boost was a February bipartisan Congressional agreement that lifted self-imposed spending caps and introduced a generous dose of non-defense discretionary spending, increasing NSF spending 3.9 percent over the previous year and the NIST budget an astounding 25.9 percent over FY 2017 levels.SEMI applauds this much-needed support for basic research and development (R D) at these agencies after their budgets were cut or flat-funded for multiple cycles. It is well understood that federal R D funding is critical to U.S. competitiveness and future economic prosperity. With the stakes that high, full funding of R D programs at the NSF and NIST should be a bipartisan national priority backed by a strong and united community of stakeholders and advocates in the business, professional, research, and education communities.With the work for FY 2018 completed, Congress will now turn to FY 2019 spending – already behind schedule due to the belated completion of the previous year’s budget. With 2018 an election year, Congress will likely begin work on the FY 2019 budget in short order, but probably won’t complete its work prior to the November elections. SEMI will continue to work with lawmakers to support the R D budgets at the agencies and their important basic science research. If you’d like to know how you can be more involved with SEMI’s public policy work, please contact Jamie Girard, Sr. Director, Public Policy at [email protected].