Jabil

If you look at your clothes or shoes, there is a growing chance you will see the words Made in Vietnam printed on the tag. Since the United States lifted its trade embargo against Vietnam in 1994, the country has become the second largest exporter of apparel and shoes to the U.S. What may be less evident is the source of that new electronic gadget you received for Christmas, with its numerous parts, chips, and intricate supply chain. While light manufacturing has dominated Vietnam’s economic growth since the Đổi Mới economic reforms implemented in the 1980s, over the last decade the country has been repositioning itself to become a dominant player in the global microelectronics industry, a trend that has gained momentum in the wake of the U.S.-China trade war. In 2019, Vietnam ranked as the fourth largest exporter of electrical goods and components to the U.S. With exports doubling over the last four years and now exceeding $19 billion, surpassing Taiwan, Japan, and Korea (based on goods exported under chapter 85 of the Harmonized Tariff Schedule). Vietnam’s global electronics industry now accounts for about 40% of its exports, and the country seems to be just getting started. Early Entrants Though Vietnam owes its growing success in attracting foreign direct investment (FDI) in the semiconductor and microelectronics industries to the advent of China plus one – the business strategy to diversify business investments geographically – it was the few early entrants that gambled on this emerging market a decade ago that put Vietnam on the global stage. Of these early players, no other firm comes close to having the impact that Samsung has. It’s initial $670 million mobile phone manufacturing plant in the northern province of Bac Ninh in 2008 grew to a country-wide investment of $17.3 billion within a decade. Samsung is now Vietnam’s largest FDI contributor and accounts for more than 25 percent of its exports. Because of Samsung, Vietnam has become the second largest exporter of smartphones in the world. Around the same time, Intel opened its $1 billion semiconductor assembly and testing facility in Ho Chi Minh City, putting Vietnam firmly on the global technology map. More investors, like LG, Panasonic and Foxconn soon followed. Within a few years of these initial investments the industry was taking notice, illustrated by SEMI’s role in co-organizing the Vietnam Semiconductor Strategy Summits in 2013 and 2014. With SEMI SEA’s increased efforts to promote Vietnam as an important ecosystem in the electronics supply chain, more will be done to positively influence the growth and prosperity of its member companies in Vietnam. These early investors found Vietnam attractive for several reasons. Key among these are the country’s low wage rates combined with its favorable demographic structure – what the UN refers to as the golden population structure, which provides “Vietnam with a unique socio-economic development opportunity.” Companies are also attracted to the growing number of Free Trade Agreements (FTAs) that Vietnam belongs to, including the ASEAN Free Trade Area, CPTPP, the EU-Vietnam FTA, and, most recently, RCEP. Though the U.S. has yet to ink a trade agreement, the Singapore AmCham’s annual regional survey has consistently identified Vietnam as the most attractive country in ASEAN for a potential bilateral FTA partner with the U.S. Leveraging the Trade War If the plus one strategy was the catalyst that started this wave of electronics manufacturing in Vietnam, then the U.S.-China trade war was the enzyme that supercharged it. A common quip in Southeast Asia is that the U.S.-China trade war is over and Vietnam is the winner, and this is apparent in both trade and investment trends. According to the Asia Development Bank (ADB), the riff between the U.S. and China has caused a redirection in trade, as U.S. imports from the PRC fell by 12% in the first six months of 2019 while U.S. imports from Vietnam increased by 33%, with electronics and machinery accounting for the bulk of this jump. The ADB further reported that in a prolonged and intensified trade conflict, the worse-case scenario would result in Vietnam, Malaysia, and Thailand being the biggest winners, “in that order.” On the investment side, a March 2020 Gartner, Inc. survey of global supply chain leaders revealed that 33% had “moved sourcing and manufacturing activities out of China or plan to do so in the next two to three years.” While this survey did not mention specific winners, the ADB reported that “newly registered FDI in Vietnam from the PRC and Hong Kong rose by 200% year on year in the first seven months of 2019,” indicating the move of Chinese suppliers to Vietnam. Additionally, a review of recent press reports indicate firms like Apple, Nintendo and Dell are encouraging suppliers to move parts of their supply chains to Vietnam. These suppliers are complying, with Compal Electronics, GoerTek, HZO, Inventec, Luxshare Precision Industry, Pegatron, USI and Wistron all reportedly announcing plans for new investments in Vietnam. Manufacturing Hubs Within Vietnam, microelectronic facilities have concentrated in a few geographic hubs. In the south, the Saigon High Tech Park in Ho Chi Minh City attracted early entrants Intel and Samsung, with firms like Nidec and Jabil soon following. The largest investment capital, however, developed in the northern provinces that ring Hanoi. Bắc Ninh, an hour’s drive from Hanoi, was the site of Samsung’s first investment and has since attracted Foxconn and Canon. More recently, firms have been drawn to the port city of Hải Phòng, the country’s third largest city, which is already home to Samsung and LG. The city’s close proximity to other manufacturing clusters, its new deep-water port, and its expressway that provides a 12-hour trucking route to China’s electronics epicenter in Shenzhen are helping make the city Vietnam’s new high-tech production center. In 2019, LG Electronics moved its entire smartphone production line from South Korea to Hải Phòng, and in 2020 Pegatron reportedly chose the city for its $1 billion investment plan. Local phone manufacturer VinSmart is also producing the country’s first 5G smartphones in Hải Phòng. In November, USI, a subsidiary of Taiwan-based ASE Holding, broke ground on its first production base in Southeast Asia, a $200 million phase-one investment in the production and assembly of chips for wearable electronic devices. USI’s investment, which is moving into the internationally managed DEEP C Industrial Zones in Hải Phòng, is “intended to move us closer to our overseas customers and accommodate their ever-increasing demand,” according to Mr. Kuei Chun Chi, the firm’s Manufacturing Service Director. “North Vietnam, with its strategic geographical position and an extended infrastructure in place, offers USI an optimal way to facilitate fast and flexible response to customers' orders.” Though the Covid-19 pandemic has dampened the pace of new investments in Vietnam’s microelectronics industry, it has also amplified the country’s attractiveness to investors. Vietnam was successful in containing the outbreak through aggressive quarantine and contact tracing measures, and as a result its economy has the brightest outlook in the region. The ADB forecasts the country will be one of the fastest-growing economies in SEA in 2021, with GDP estimated at 6.8%. The Ministry of Industry and Trade is also reporting that several of the world's largest technology corporations plan to shift their production chains to Vietnam post-Covid-19, an indication that technology firms will accelerate relocation plans in 2021. Vietnam’s successful response to the pandemic, combined with its strategic location, low wage rates and foreign trade agreements, will ensure that the region continues to benefit from the shift in supply chains in Asia, making it the new destination for electronics manufacturing. About the Author Stuart Schaag is Principal at E-Ward Trade Consulting LLC, which assists firms that are expanding their presence in the global marketplace by creating strategies combining market analysis, business development, commercial diplomacy, and relationship building. He previously spent 25 years in various domestic and overseas positions in the U.S. Department of Commerce’s International Trade Administration. Stuart served as the Commercial Counselor at the U.S. Embassy in Hanoi from 2014-2018 and resided in Vietnam until 2020.

SEMI’s annual FLEX Conference Exhibition returns to Monterey, California, February 18-21, 2019, bringing together nearly 100 speakers on the major developments at the leading edge of printed/flexible/hybrid sensors and electronics technology.The maturing technology for smarter sensors, in a wider range of flexible formats, is enabling new opportunities across a wide range of applications, from healthcare to agriculture. And that means sensor suppliers need to connect with a broader range of users to build the next generation of innovative outside-the-box solutions. SEMI gathers the flexible/hybrid integration supply chain, leading researchers and potential customers at this annual event to help advance the sector.Collaborative efforts for sensors emerging markets: global health, faster crop development, military monitoringThere’s huge potential for smarter, more accessible sensor systems to detect infectious diseases and aid decision-making for community health workers around the globe, but new technologies and manufacturing methods alone will not be enough to meet the needs of these resource-constrained environments, argues Arunan Skandarajah, program officer at the Bill and Melinda Gates Foundation. He’ll introduce the foundation’s funding and partnering priorities for sensing and imaging for diagnostics and decision support and discuss potential paths forward for development.Recent advances in plant genomics and high-throughput phenotyping have big potential to enable faster development of crop varieties that better withstand adverse conditions – but that will depend on getting fast feedback from sensor data from the field. There’s immediate need for robust, high-efficiency, low-cost sensor technologies to collect on-the-ground microclimate and resource-use data from tractor-based sensors to field scanners, says Nadia Shakoor, Danforth Plant Science Center. She’ll discuss the sensors researchers need to develop high-yielding, energy- efficient crops that are resilient to variable climates.Military interest in biosensor patches to monitor human physiology and performance, and other sensor solutions for flexible imaging and point-of-care diagnostics, are also drivers of collaborative research between industry and universities. The Nano-Bio Materials Consortium (NBMC), a SEMI strategic association partnership with the Air Force Research Lab, will offer a workshop to discuss its potential needs, and how to get involved in its development program to create an integrated suite of nano-bio materials and production technology. Progress in scaling printed/hybrid flexible electronics manufacturing technologyThe maturing manufacturing supply chain continues to make progress towards scaling volume manufacturing of higher performance products, with recent innovations in materials and assembly technologies.Cal Poly researchers will report results from the recent FlexTech benchmark study of the flexible hybrid electronic industry. The study looks at the current state of maturity of the technology, its manufacturing processes, and its main applications while projecting the roadmap for future development. The study covers passives, sensors, batteries, antennas, speakers, PV and energy harvesting, and flexible hybrid integration.Catch up on new process development capabilities and recent work at the NextFlex Flexible Hybrid Electronics Manufacturing Institute’s San Jose Technology Hub for prototyping and pilot manufacturing. The institute has been adding engineers and projects as it looks towards the next generation of technology for sector growth. Innovations in scalable assembly of thin die on flexible substratesSeveral companies will update on recent progress developing solutions for the industrial-scale, high-yield assembly of fragile thinned die on to flexing substrates. American Semiconductor reports new automated assembly capacity for flip chip die attach and interconnect for devices with up to 100 I/Os and 100um pitch pads. The company also notes that it now has flexible Bluetooth ICs from two major suppliers available in semiconductor-on-polymer chip-scale packages, finally enabling improved wireless capacity for flexible hybrid systems.CEA-Leti will present its latest developments in flip chip bonding of thin bare die on flex. It uses gold stud bumps on the die, with 150°C thermocompression bonding to PEN Film. The researchers have also developed a wafer-level die process that thins and encapsulates die before removing them from the carrier wafer. systeMECH will also present its results for direct die placement of 300nm die on flexible polyester. Innovations in materials for easier processing, higher performanceDevelopments in substrates and processing may now enable use of photonics for laser patterning and flash curing on flexible substrates. Brewer Science will report developments on new polymers that can be quickly and cleanly etched with the mid-UV wavelengths commonly used for laser drilling and etching on printed circuit boards, bringing this improved performance to printed electronics as well. The polymers can be processed at less than 200°C with desirable qualities for substrates, adhesives, protective layers and the like for many electronics applications.Novacentrix will update on improvements in photonic curing equipment for fast heating to enable the use of high-temperature solders without damaging low-temperature substrates. Atotech will report results from its multiyear initiative to develop lower temperature solder pastes for better performance than SAC-based materials on a variety of substrates. Printed graphene and carbon nanotubes find applications in sensors and RF devicesBonbouton will introduce its commercial smart insole using a printed graphene sensor to monitor skin temperature to detect early signs of foot ulcers in diabetic patients. The company inkjet-prints graphene oxide followed by thermal reduction to fabricate graphene supercapacitor electrodes for temperature and pressure sensing.C2Sense will update on its development of carbon nanotube gas sensors to monitor food condition to prevent waste. The sensitized carbon nanotubes selectively detect ethylene from fruit or ammonia from chicken to accurately track the condition of the foods as they pass through the supply chain. Georgia Tech will report results of printing not only sensors from carbon nanotube ink but even RF and mm-wave diodes and transistors for high-frequency, long-range, low-cost RFIDs. Innovations in display materialsMaterials for flexible displays continue to see innovations – from solutions for foldable displays to plenty of new options for improved transparent conductive films and force-sensitive films. Solotech will introduce a cross-inked polymer that it says offers both high hardness and excellent foldability as a reliable covering for foldable/bendable displays. Atotech will describe its development of selective electroless copper deposition for metal mesh and TFT electrode patterns for touch screens to eliminate the need for costly mask and etching steps after deposition. Chasm Advanced Materials suggests hybrids of the conductive metals and carbon nanotubes offer a promising alternative for flexible transparent conductive films.C3Nano reports on nanowire ink, fused after printing, for flexible transparent conductors. Peratech will report on its printable pressure touch technology that it describes as high-resolution and low-cost for better localized, force-sensitive touch. Jabil will share the results of its evaluations of five of the available printed force-sensitive sensors. E Ink will introduce new capabilities for its electrophoretic display technology – it’s now possible to write on it with a magnetic stylus, and there’s a variable transmission version for electronic windows. Next generation technologies from universities and startupsResearchers from major research institutions and startups will talk about developments in flexible/printed/hybrid electronics including innovations in biological/electronics interfaces, via skin or neurons, and demonstrations of piezoelectric and better stretchable circuits. Emerging technologies for biosensors and human/machine skin interfaces Georgia Tech researchers will detail their electrical interface with human skin for wireless control of a remote-control car and a wheelchair by electrical signals from the body. They’ve developed a flexible elastomer skin patch patterned with thin film metal/polymer nanostructures made by CMOS processes, and metal pads compatible with conventional reflow soldering. Other Georgia Tech researchers will report their work on better cochlear implants made of encapsulated polymer printed with conductive microcoils for pulsed micro-magnetic stimulation that can focus more tightly on specific areas of auditory neurons. Seoul National University will introduce its flexible organic artificial nerves that can activate an insect’s leg muscle. Researchers there have devised a pressure sensor connected to a ring oscillator that converts the pressure signal into voltage pulses, which are then integrated by a transistor into a signal that replicates a post-synaptic current to communicate with the biological nerves.Epicore Biosystems will report on its advances in manufacturing and packaging technology that enable its skin-interface electronics and microfluidics systems in thin stretchable format to continuously monitor electrical, acoustic and biochemical signals. The technology is now entering commercial development with industrial partners. GE Global Research will update on its field testing of sweat-sensing devices to monitor hydration. Emerging technologies for piezoelectric actuators and improved stretchable sensors and circuits PARC will report on audio speakers made of PVD piezoelectric film on polyimide with inkjet-printed flexible hybrid operating circuits, and Novasentis will talk about its piezoelectric electroactive polymer for different kinds of vibrations for wristband notifications. UTC will share its learnings from deploying large numbers of stretchable flexible hybrid sensors conformably over large areas on aerospace and infrastructure assets to sense temperature, vibration, strain and damage for critical safety.The Air Force Research Lab reports promising results for stretchable circuits made with liquid metals, which maintain their high conductivity even when stretched. Silent Sensors will discuss its printed flexible manufacturing technology for low-cost, stretchable energy storage and piezoelectric energy harvesting for monitoring the condition of automobile tires.By Heidi Hoffman, senior director of technology community marketing, SEMI

What’s next for smarter, more connected electronics manufacturing - Part 3 The fast-maturing infrastructure now enabling analysis of exponentially larger data volumes brings the microelectronics industry to an inflection point, where the winning companies will be the first to master the use of this data to solve the industry’s emerging challenges. SEMI expands its coverage of these vital issues with a Smart Manufacturing Pavilion and three days of talks SEMICON West, July 10-12 in San Francisco. While deep learning is starting to be applied to image recognition for wafer inspection, it is also being considered for sequential pattern recognition in order to evaluate equipment parameter traces. The next emerging applications will start to use those learned patterns to predict outcomes, and then use those predictions to automate process control. One early application of deep learning is IC process development. “People don’t think of research and development as the first place to automate, but it’s where applying our digitization and simulation has first had impact,” says David Fried, Coventor vice president of Computational Products. He noted that insertion is easier in the lab than in the fab. Technology at 10nm and beyond is now so complex that companies at the leading edge must use process modeling to understand the effect of process variation on their designs. Learning cycles can now be accelerated during development by simulating 10,000 digital wafers instead of running 25 actual wafers during screening, Fried says. Applying structured analysis and machine learning to the data simplifies optimization across the 500 or more interrelated process steps. Coventor has recently introduced a statistical analysis package that aids the design and analysis of process variation experiments by using large volumes of data from its models. Fried says these models are next being used to accelerate the yield ramp in manufacturing. Digital simulation also could speed development of high-mix, lower value products While digital twins are best known for their use in complex, high value products like jet engines, the simulation technology could also enable the electronic manufacturing services (EMS) sector to reduce the time, cost and risk of developing its high mix of products. “The EMS sector’s use of digital twins will be vital for it to smooth the move of CAD/CAM digital design data for so many different products into manufacturing, and to accelerate validation testing of designs and products by doing more of it in the virtual world,” says Dan Gamota, vice president of Engineering and Technical Services at Jabil. Gamota also highlights the push for traceability from the automotive and healthcare markets, where the digital models could be used to quickly assure that the design was built exactly as specified. “In the past year, traceability has evolved from just ‘nice to have’ to ‘how to achieve,’” he adds. “Companies are expecting it, but aren’t willing to accept the cost and risk of doing it alone. We need the community to discuss realistic implementations, identify the most critical elements and bring together the ecosystem partners to build baseline reference architectures for key digital building blocks. The community also needs to assure the reliable flow of data among the electronic manufacturing segments from semiconductor to OSAT to EMS.” Predictive maintenance and virtual metrology applications could mature in next few years While predictive maintenance initially seemed a likely early application of machine learning in factories, it remains a challenge for the electronics sector. “The difficulty is that it’s not clear where to get the most bang for the buck,” says Tom Ho, president of BISTel America, noting that it may make the most sense to track the failure performance of a single expensive part, like an electrostatic chuck, since predicting the failure performance of a whole complex system like an etcher is much harder. “Collecting enough data from all failure types, including especially the rare events, is difficult unless you have a long history of a lot of tools,” adds Doug Suerich, PEER Group product evangelist. “The gain from collecting performance information from many tools across the industry could be big, but many companies still need to overcome concerns around exposing their IP.” Another big opportunity for prediction is virtual metrology – predicting the wafer outcome from the process or sensor data with enough accuracy to replace the physical metrology. “Virtual metrology is improving, and since metrology can be slow and expensive, any reduction could mean a huge potential savings,” says Suerich. “But it is still seen as too scary for many companies. Two to three years from now, companies will expand the practice from lower risk areas into processes that require more confidence in the results.” Moving beyond prediction to automated control needs digital models Once the results are predicted, the model can be used to control or automatically optimize a process and enable the system to learn by itself, usually by reinforcement learning on a digital model. The model can then independently make adjustments to optimize the manufacturing process. “Automated process development is getting close now. Instead of smart guys turning the knobs, deep learning is automating the smart tuning,” says Suerich, suggesting the industry could see widespread adoption in as little as two to three years. This type of machine learning needs a good digital model, and masses of data for learning. One approach uses human experts to build a physics-based model of the clearly understood parts of the process, then turns to deep machine learning to optimize the lesser-understood variables. The alternative, the data-first approach, runs a computer algorithm to suggest the solution purely from data, without human input, and then relies on the human to evaluate the usefulness of the results. Modeling digital twins of wafers could enable automated process control, chamber matching, and fleet matching, says Fried. If every wafer had its own virtual twin with all the upstream metrology and structural information needed to make equipment control decisions, it could feed forward that information to enable the seamless transition from one step in the process to another based on understanding their complex interrelationships. This could potentially improve uniformity across wafers and equipment, and reduce the need for metrology, he argues. Moving metrology sensors into the chamber will also require model-based algorithms to enable dynamic process control in close to real time, says Fried. These algorithms will be needed to acquire, parse, and process the data at high speed, and then to choose how to adjust the controls. “There will be a model behind collecting and interpreting the metrology data,” he notes. “That’s a really rich vein for improvements in process control.” “The end goal is to collect equipment data in real time, analyze it with AI, and send back controls to optimize manufacturing processes,” Jabil’s Gamota says. “This requires a robust architecture for communication between equipment and consistent formats for data collection and analysis. But the cost and complexity of this heavy lifting is too great for any one company to do alone. We need a consensus-based architecture for ingesting, analyzing and acting on the data.” SEMI tests data transfer protocols, benchmarks best practices SEMI is launching a smart data project to identify the various data transfer protocols needed for inter-company communications. The project will feature a proof-of-concept model in a development fab to produce verifiable results so SEMI can better understand how different approaches meet member needs. SEMI’s smart manufacturing technology communities and the Fab Owners Alliance are also benchmarking current smart manufacturing practices in the microelectronics industry to help SEMI members better understand the path forward and potential return on investment. Speakers over all three days at SEMICON West addressing these issues include Active Layer Parametrics, Applied Materials, Applied Research Photonics, ASML, Bosch Rexroth, Cimetrix, Coventor, ECI Technologies, Edwards Vacuum, Final Phase Systems, GE Digital, Infineon, Jabil, Lam Research, Osaro, Otosense, PEER Group, Qualcomm, Rockwell Automation, Rudolph Technologies, Schneider Electric, Seagate, Siemens, Stanford University, TEL, TIBCO Software. See semiconwest.org. What’s next for smarter, more connected electronics manufacturing - Part 1 What’s next for smarter, more connected electronics manufacturing - Part 2 Paula Doe, SEMI

What’s next for smarter, more connected electronics manufacturing - Part 2The fast-maturing infrastructure now enabling applications for big data and artificial intelligence means disruptive change not just at individual companies but also in data connections among companies across the microelectronics manufacturing value chain. SEMI checked in with some leading players on the changes they see coming in the next several years for this article series. The trade group is expanding its programming on smart manufacturing to address these industry-wide developments at SEMICON West, July 10-12 in San Francisco.“The ramp of EUV, and the smaller geometries and smaller process margins, will drive an exponential increase in the amount of metrology data to manage,” says Neal Callan, ASML vice president, Silicon Valley. Callan notes that moving to multibeam e-beam inspection will increase data volume from megabytes per second to gigabytes per second and from thousands of data points to millions of data points. “The process is so tight and the margin so small that stochastic variation, or noise, becomes more dominant – at least it’s noise until we can learn to understand and control it. And understanding and controlling this variation will be key to delivering 5nm patterning,” he says.Single-beam e-beam inspection is already driving large increases in data as engineers extend the slow technology to broad, high-speed defect metrology applications by more intelligently instructing the system where to look for problems. Callan says ASML is now using the scanner data on wafer focus, alignment and leveling. The company is also using the computational lithography model from the design to identify the smallest process windows in the pattern that are most likely to see problems. The model then quantifies the number and significance of those instances.“The collection of all this diverse data means that tools will need to be plug-and-play so all tool data is instantly available to all systems and software,” says Doug Suerich, PEER Group product evangelist. “We need tools that can be discovered automatically by the network so it can start slurping up data immediately. The adoption of the Interface A (EDA) standard is accelerating and fabs are starting to ask for it. The proliferation of sensors also needs to self-discover. If you are going to add thousands of new sensors into a facility, you can’t afford a time-consuming integration process.”“We are now seeing that engineers are greedy for more data – if they can get the data, it’s becoming a need-to-have,” adds Tom Ho, BISTel America president. “Getting more data from more sensors, from the sensors on the tool that are not being fully utilized, and from untapped data sources like vibration is another big coming opportunity.” Process complexity drives demand for feed-forward between silos with computational models ASML co-optimizes its scanner process with etch and reticle process steps. Source: ASML In addition to the drive for trace-back of data, the increasing complexity of interrelated processes is also driving demand for feed-forward of data. “Feed-forward is becoming more important,” notes Ho. He points to the example of 3D NAND features, now getting so deep that identifying the layer being measured is a challenge unless the signal at the step before can be recognized. “We need partnerships with our peers to understand how to take advantage of the sensors they use, integrate them with our data, and then feed-forward corrections to the other systems,” concurs Callan. “To drive the best CD uniformity and overlay, we need to co-optimize litho and etch,” agrees Henk Niesing, ASML director of product management. He notes that the company is working with etcher makers to measure the overlay and CD, decompose the finger prints, and then use models to steer automated control that best adjusts both the scanner and the etcher. ASML is also working with Zeiss on co-optimization between the scanner and the reticle to make even higher-order corrections by locally modifying the reticle.These higher-order corrections, applied on each exposed field, drive the need for even more data, and at higher speed but without higher cost, notes Jan Mulkens, ASML senior fellow. These corrections increase demand for computational metrology, which combines various metrology sources with physics and deep learning models trained on real data to predict and control process results in real time. “We’re working on computational metrology to ideally use all the knobs we have in the fab,” he says. So far this effort has largely involved linking data between two companies. More consistent data formats would enable data exchange to be extended to more companies. “The software versions also need to be managed for upgrades so they still match after one party updates the system on its tool,” notes Niesing. Speakers on these issues of smart manufacturing and data handling at SEMICON West include Active Layer Parametrics, Applied Materials, Applied Research Photonics, ASML, Cimetrix, Coventor, ECI Technologies, Edwards Vacuum, Final Phase Systems, GE Digital, Infineon, Jabil, Lam Research, Osaro, Otosense, PEER Group, Rockwell Automation, Rudolph Technologies, Schneider Electric, Seagate, Seimens, Stanford University, TEL, TIBCO Software. See semiconwest.org.What’s next for smarter, more connected electronics manufacturing - Part 1What’s next for smarter, more connected electronics manufacturing - Part 3Paul Doe, SEMI

What’s next for smarter, more connected electronics manufacturing - Part 1The fast-maturing infrastructure now enabling applications for big data and artificial intelligence means disruptive change not just at individual companies but also in data connections among companies across the microelectronics manufacturing value chain. SEMI expands its smart manufacturing program with a Smart Manufacturing Pavilion with displays and three full days of talks to address these industry-wide developments at SEMICON West, July 10-12 in San Francisco.Autonomous autos’ demand for zero-defect systems and 100 percent traceability back to the manufacturing data for each die is driving a push to traceability across the chip sector. “Far more chips are being used by the automotive sector, and its very different requirements are driving demand for traceability,” says Tom Ho, president of BISTel America. “Our chipmaker customers are looking for traceability solutions and the trend is the same in backend packaging and assembly – automotive applications are driving the sector to traceability.”Traceability is also driven by the growth of systems in a package as fabless chipmakers look to connect back to the packaging companies’ fault analysis labs and die interconnect history to diagnose and fix the cases where known-good die are failing in the system, adds Mike Plisinski, CEO of Rudolph Technologies. Plisinski adds that makers of consumer products like phones that can also see harsh conditions are demanding higher quality and traceability as well. The electronic manufacturing services (EMS) sector also must establish an architecture for traceability to collect critical manufacturing-related data and to interface with OSATs and semiconductor fabs. The reason is that EMS companies are adding traditional OSAT processes such as assembly of products with bare die and complex optics modules requiring clean rooms. “A unified sand-to-smart-phone smart manufacturing roadmap should be established,” says Dan Gamota, vice president of Engineering and Technology Services at Jabil. “We need to identify protocols for manufacturing data communications that can be adopted across the supply chain.”To enable smart manufacturing, vendors need to collaborate on getting their production equipment to interoperate and support factory analytics and data management systems. Source: SEMI One big challenge, of course, is how to format this diverse data so it can be linked and used by various supply chain stakeholders. “Smart data needs to be contextual and it needs data standards across the supply chain so it’s easy to link from the front end to the back end, follow common lot IDs front and back end, and have a way to map streaming data from sensors to a discrete lot ID,” notes Ho. New approaches to metrology, analysis and test that increasingly exploit machine learning on simulations will also be needed to help predict which die and connections that test well now may fail in the future as conditions change.Another issue is how to securely share the needed data across companies without jeopardizing IP. “On the equipment side we collect data across customers on how the tool is running to improve the equipment,” notes Neal Callan, ASML VP Silicon Valley. “Next we need to integrate performance and reliability data that today is not as well shared.”The other big hurdle is how to pay for data sharing. “The challenge is that the final manufacturers reap the benefit of traceability, but since they expect their suppliers to deliver good die, they don’t want to pay more for it,” notes Plisinski. He suggests that over the next two to three years, traceability and predictive fault prevention will become the norm as the automotive sector is compelled to invest in it to assure safety. Meanwhile, fabless companies will face so much complexity in integrating different die from different suppliers in SiP that they will no longer be able to afford to simply use the cheapest supplier, potentially driving a fundamental shift in relations and division of labor among fabless chipmakers, OSATs and fabs. Standards extend across supply chainSEMI member committees are collaborating to build the infrastructure to enable these developments. Standards committees are updating standards for higher bandwidth data exchange and extending semiconductor-like vertical and two-way horizontal equipment communication standards to flow shops to enable assembly players to optimize and trace back results across players. The SMT/PCBA community is integrating its smart manufacturing work into SEMI standards, and the SEMI A1 standard was a key reference document in the development of the Japan Robotics Association’s Equipment Link Protocol.Speakers addressing these issues at SEMICON West include Active Layer Parametrics, Applied Materials, Applied Research Photonics, ASML, Bosch Rexroth, Cimetrix, Coventor, ECI Technologies, Edwards Vacuum, Final Phase Systems, GE Digital, Infineon, Jabil, Lam Research, Osaro, Otosense, PEER Group, Qualcomm, Rockwell Automation, Rudolph Technologies, Schneider Electric, Seagate, Siemens, Stanford University, TEL, TIBCO Software. See semiconwest.org.What’s next for smarter, more connected electronics manufacturing - Part 2What’s next for smarter, more connected electronics manufacturing - Part 3Paula Doe, SEMI