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New MEMS-based products are constantly emerging, fueled by the Internet of Things (IoT), autonomous driving, smart manufacturing and healthcare applications. The MEMS pressure sensor market is no exception to this trend1. Its growth has been driven mainly by automotive applications such as tire pressure management system (TPMS) regulations in China, fuel and ignition systems, thermal systems, oil-pressure monitoring, and indoor and outdoor navigation systems. Easy to customize and integrate, miniature, sensitive, accurate and low-power MEMS devices are especially well-suited to the accuracy, power consumption, sensitivity and miniaturization that pressure sensors require.Yet MEMS design also presents some specialized challenges, such as a strong coupling between fabrication technology and design. Complex physical structures that exhibit non-linear behavior, custom packaging requirements, and a final product that requires integration with surrounding CMOS circuitry are just a few examples. What’s more, there is a lack of standardized processes and process validation in MEMS design ecosystems. Pressure Sensor (Courtesy: X-FAB) As with other products based on MEMS technology, designers must increasingly customize pressure sensors for higher performance – sensitivity and linearity, in this case – while decreasing their package size. Designers can accomplish the task by studying sensor performance and manufacturability using computer models prior to fabrication. This can ensure that the sensor meets its required specifications while simultaneously reducing manufacturing cycles and cost.The Power of CollaborationThis is where strong collaboration among EDA providers, MEMS technologists and designers delivers tangible benefits. EDA providers and MEMS foundries can collectively help MEMS designers to incorporate foundry process constraints into their designs.In the semiconductor industry, first-pass successful silicon relies on standardized manufacturing processes, thorough technology characterization, accurate model generation, established simulation and verification, and extensive reuse of proven design blocks. In the MEMS world, where processes and products are developed concurrently, and processes change with every product, is it possible to adopt standardized processes, design methodologies, and tools that enable efficient reuse of existing technology and design knowledge? The challenge lies in maintaining the flexibility to optimize products for a diverse array of requirements. The ideal design platform should ease sharing of technology and design data between the foundry and its customers, enabling two-way collaborative development and allowing foundry technologists to easily perform a feasibility assessment of a customer’s project. This approach offers important benefits, allowing designers to explore and evaluate the suitability of a foundry’s process technology in their unique application. It also supports accurate prediction of device performance prior to fabrication and reduces costly build-and-test cycles. Combining standardized manufacturing processes, MEMS process design kits (PDKs), and a proven design flow are the starting point for development of manufacturing-ready designs.A Real-Life Example using Pressure SensorsAn EDA company, Coventor (a Lam Research company), along with MEMS foundry partner X-FAB, collaborated to develop a PDK that would ensure that manufacturing constraints are automatically considered early in their design process. The design flow is based upon an X-FAB fabrication platform that supports multiple process options for the manufacturing of absolute and relative MEMS pressure sensors. The PDK is a “golden container” for all the process and material characteristics of the silicon membrane and substrate, glass, passivation layers, and piezoresistive components. It enforces material properties and guarantees their correct implementation during the simulation. It also includes a component library containing ready-to-use, 3D parameterized devices (such as membranes and resistors), all pre-designed with foundry-supported materials to support their respective design rules. The components are readily partitioned for optimized meshing and simulation, saving design and simulation time. Figure 1: The elements and design flow of the PDK designed by Coventor and X-FAB. (Courtesy: Coventor)Designers can use components from the library to create a custom design — which might include different membrane shapes and sizes, and resistors of varying shape, size and position — to simulate the impact of different technology variants (such as resistor doping profiles, membrane and substrate thickness, glass material properties, and passivation schemes). This allows them to anticipate the effect of these design changes on sensor sensitivity for varying pressure and temperature regimes.Extensive validation of the pressure sensor design platform is currently underway. So far, the simulations have exhibited very good correlation to actual device measurements across a range of pressure and temperature conditions, including predictions of non-linear behavior for various pressure sensor designs. At the same time, the simulation accounts for mechanical membrane properties and piezoresistivity. With this type of design platform, a foundry can provide guidelines to help customers select both the fab technology and design features that lead to an optimal design solution. Figure 2: Simulation results depicting mechanical displacement in a pressure sensor design (Courtesy: X-FAB) Let’s Face the Next Challenges…A complete design platform for MEMS must eventually include not only MEMS device design, but system integration functions, such as the application-specific integrated circuit (ASIC) design and packaging/assembly of the product. In addition to the design verification that the PDK provides, additional partnerships among foundries, integrated device manufacturers (IDMs), research centers, equipment suppliers, and EDA vendors will help to define requirements and solutions that address every level of design and production. These might include tasks such as describing standardized material properties and process specifications, creating accurate foundry-proven design models, and defining requirements for system-level simulation. In the future, PDK simulations might even include up to tape-out and physical verification. To learn more about this collaborative PDK development work, please click here for the whitepaper.Christine Dufour, MEMS PDK Program Manager, CoventorChristine Dufour is the MEMS PDK program manager at Coventor. She has more than 20 years of experience in the semiconductor industry, leading process design kit development for BiCMOS and CMOS processes at several major semiconductor companies. Ms. Dufour has also worked as a product manager in the RF design environment area. In addition to her extensive experience in MEMS PDK development, she is an expert in all aspects of MEMS design flow and design tool development. Ms. Dufour received an engineering degree at Technological University of Compiegne.For more information on Coventor, a Lam Research Company, visit: https://www.coventor.com/ Viraja Sharma, Development Engineer, MEMS Simulation Design, X-FABViraja Sharma is a development engineer for MEMS Simulation Design at X-FAB. Her work involves the design and simulation of MEMS inertial and pressure sensors. Prior to her tenure at X-FAB, Ms. Sharma performed similar duties for other semiconductor companies. She received her Master of Science degree in Micro and Nano Systems from TU Chemnitz, where she studied MEMS and micro technologies.For more information on X-FAB, visit: https://www.xfab.comCoventor and X-FAB are members of SEMI-MEMS Sensors Industry Group that connects the MEMS and sensors supply network, enabling members to address common industry challenges and explore new markets. 1 Market research firm Yole Développement predicts that MEMS pressure sensors alone will become a $2 billion market by 2023. See: https://yole-i-micronews-com.osu.eu-west 2.outscale.com/uploads/2019/01/YD18018_MEMS_Pressure_Sensor_Market_Yole_Developpement_2018_Sample.pdf
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Korea is on track to top all other regions in fab investment, spending $63 billion between 2017 and 2020, with powerhouses Samsung Electronics Co. and SK Hynix leading the way, according to latest World Fab Forecast Report by SEMI. Samsung Electronics increased fab investments $770 million to $12 billion this year, and SK Hynix upped its spending a significant $2.8 billion to $7.25 billion in 2018.Korea's investment companies anticipate continued growth for both companies in the second half of 2018.Under this halo of extraordinary investment, nearly 380 SEMI Korea members and industry analysts gathered for 2018 SEMI Korea Members Day on September 13 to share insights on semiconductor market trends and new technologies that could help members bolster their competitiveness. Following are key takeaways from the event. Korea semiconductor market to grow 16% in 2018That’s according to IDC Korea VP Kim Soo-kyung, who noted that data center, memory and Internet of Things (IoT) are becoming key growth drivers for the semiconductor industry. He encouraged semiconductor companies to closely track development of automotive technology and the industry semiconductor market, both key growth areas. SEMI Korea president H.D. Cho opens SEMI Korea Members Day 2018 Continuing fab investment will lead to oversupply, but display will shineMarket entry by Chinese companies will also spur the oversupply, said Jeong Won-Seok, an analyst at HI Investment Corp. He noted that the oversupply will force Korea into stiffer competition with other regions. However, with OLED used for a wide variety of devices and the display industry seeing rapid growth, the sector will remain ripe for growth among Korean companies.Interconnecting various applications is a big semiconductor industry trendThe need for these interconnections will stand out in the mobility and high-performance computing (HPC) markets, said Park Sung-Soon, principal research fellow at Amkor Technology Korea, who addressed trends in packaging technology. He also emphasized interconnection cost efficiency as key to maximizing competitiveness.Smart Manufacturing is driving mass customizationAs semiconductor industry growth continues, production methods are shifting from ‘mass production’ to ‘mass customization,’ increasing the importance of Smart Manufacturing in driving greater production efficiency, noted BISTel VP Jeon Kyeong-Sik. Building a Smart Manufacturing platform to support large-scale production of specialized database and artificial intelligence (AI) chips will boost production efficiency, reduce costs and improve risk management. Virtual simulation will be a key enabling technology. SEMI analyst Clark Tseng presenting at SEMI Korea Members Day 2018 Surge in data volume and technology advances to drive long-term semiconductor industry growthThese key industry drivers will continue to power fab investment growth, with spending focused on 3D NAND, DRAM, and foundry, said Clark Tseng, director of Industry Research and Statistics at SEMI. China alone will see eye-watering growth with the region’s investments in domestic companies surging 46% from 2018 to 2019 and fab investment by Chinese domestic companies outpacing spending by foreign companies in China, Tseng predicted. SEMI membership rises with industry growthCulminating the event, SEMI Korea president H.D. Cho said, "With the growth of the semiconductor market, the number of SEMI members is gradually increasing, and we will help member companies grow with various activities such as Korea Members Day.”Jaegwan Shim is a marketing specialist at SEMI Korea.
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