robotics

SEMI has submitted comments to the U.S. Department of Commerce’s Bureau of Industry and Security (BIS) in response to its Section 232 National Security Investigation of Imports of Robotics and Industrial Machinery.The submission highlights the vital role robotics and precision machinery play in semiconductor fabrication, packaging, and inspection and emphasizes the need for a balanced, risk-based approach to any future trade actions that strengthen U.S. national security while preserving access to robotics and industrial machinery essential to expanding the domestic semiconductor industry. SEMI RecommendationsSEMI outlined five key recommendations to the Administration.Encourage Investment and Maintain Existing Competitiveness. SEMI recommends excluding essential robotics and industrial machinery where domestic sourcing is not yet viable. If trade actions are taken following the investigation, SEMI recommends providing tariff reductions or waivers for companies investing in U.S. manufacturing capacity. SEMI emphasized protecting small and medium suppliers that keep the ecosystem running.Avoid Stacking Tariffs. Coordinate Section 232 actions across potentially overlapping actions and ongoing investigations, such as on imports of steel and aluminum, semiconductors, critical minerals, and polysilicon. This will help prevent duplicative or compounding tariffs that could raise costs and slow U.S. capacity building.Implement Adjustment Periods and Sunset Provisions. SEMI recommends any trade actions should phase in gradually to allow for domestic adaptation and include regular review mechanisms to recalibrate as the market evolves.Pair Trade Actions With R D, Workforce, and U.S.-Allied Collaboration. Strengthen domestic capacity through targeted federal research and development (R D) programs, workforce training, and deeper partnerships with trusted U.S. allies to build resilient technology ecosystems.Develop a National Robotics Strategy. Given robotics’ foundational role across semiconductor and advanced manufacturing sectors, SEMI recommends that the Administration develop a National Robotics Strategy. The strategy should align federal programs including those at NIST, NSF, and Department of Energy to accelerate robotics innovation, update technical standards, and drive U.S. leadership in automation and manufacturing competitiveness.The Global ContextWorldwide installations of industrial robots surpassed 540,000 units in 2023, with the market projected to exceed $73 billion in 2025.Robotics and industrial machinery are integral to semiconductor production ensuring cleanroom integrity, precision, and throughput. Broad or overlapping tariffs could raise costs and undermine U.S. competitiveness at a time when historic investments in domestic semiconductor manufacturing are taking hold.Next StepsSEMI looks forward to working with the Department of Commerce and other federal partners to ensure that Section 232 policies enhance both U.S. national security and the industry’s global competitiveness.Read SEMI’s full submission on Regulations.gov by searching Section 232 Investigation of Imports of Robotics and Industrial Machinery (XRIN 0694-XC138).Visit SEMI Global Advocacy to learn more about public policy efforts and developments as well as how your company or organization can get involved.Marc Coldiron is Director, Global Public Policy Advocacy at SEMI.

The FLEX Conference, held again this year in conjunction with SEMICON West 2023, provided numerous examples of continued developments in flexible, printed, and flexible hybrid electronics technologies applied to sensing, robotics, communications, and other applications.

MSTC 2023 will open with Nora Houlihan, senior research analyst for MEMS & Sensors with Omdia, providing a 2023 market update and a look at what’s ahead.

The hand has never been so sensitive. A sleek sensorized glove that monitors pressure to human hands – and objects they touch – for automotive, consumer packaging, robotics and medical applications just took a step closer to real-world use.

Luc Van den hove, president and CEO at imec, spoke on semiconductor sustainability, healthcare trends and deep tech, and their implications for the semiconductor industry, sharing his views ahead of his keynote presentation at SEMI ISS Europe on May 30, 2022, in Brussels, Belgium.

SEMI High Tech U (HTU) alumnus Oindree Chatterjee discusses why she created The STEM Corner podcast, available on Spotify, where she interviews professionals in the semiconductor industry.

In this article, several experts weigh in on considerations for developing the smart manufacturing workforce that will help to alleviate the U.S. semiconductor manufacturing talent shortage, even as multiple, data-intensive $1 billion to $10 billion fabrication facilities come online.

AEM Holdings Ltd, a Singapore-based multinational corporation, is listed in Forbes Asia’s 200 Best Under A Billion 2019 and 2020 spotlighting small and midsized companies in the Asia-Pacific region with sales under $1 billion. AEM clinched the Singapore Business Review Technology Excellence Award 2020 for Analytics-Semiconductor and the Singapore Business Awards Enterprise Award 2019/2020. These achievements are testament to AEM’s vision and innovation and the company’s contributions to the increasingly complex testing of chips in a rapidly evolving technological world. I spoke with AEM CEO Chandran Nair, a new Regional Advisory Board (RAB) member of SEMI Southeast Asia, about the company’s intelligent test and handling solutions, its role in digital transformation, the company’s key role in the smart manufacturing movement and the growth prospects for Singapore’s electronics sector. SEMI: AEM’s application-specific, intelligent system test and handling solutions for semiconductor and electronics companies serve the advanced computing, 5G and AI markets. How do you differentiate your solutions from those offered by competitors? Nair: A key differentiation for AEM is that we work closely with our customers to develop application-specific integrated test and handling solutions that meet their needs in a scalable manner from lab to production. We offer our customers customized, full-stack test and handling solutions that give them the agility to accelerate their delivery cycles and enhance product quality. Over the years, AEM has developed and acquired world-class technologies in instrumentation, test, automation, robotics, optical inspection, high-end thermal control, and software. These technology pillars, along with our deep know-how to customize test and handling solutions using the technology pillars as a platform, enable AEM to meet the fast-changing needs of our customers faced with the challenges of testing heterogeneous and complex devices. In addition to investing in technology, AEM has also invested in delivering application-specific solutions to meet customer demand. Our recently announced acquisition of CEI with its manufacturing capabilities in Vietnam and its specialization in low-volume, high-mix manufacturing increases our geographical reach and our ability to quickly turn application-specific test and handling solutions to be deployed. We have a unique and differentiated approach that enables our customers to test high-performance computing devices, automotive devices, and mobility devices with maximum test coverage, cost-effectively, in a manufacturing environment. Our experience in serving the high-performance computing market that traditionally drives advancements in thermal control also puts us at the forefront of delivering comprehensive thermal management, vision, and deep automation and test solutions for the computing, automotive, and mobility markets. AEM also has a strong instrumentation portfolio, including high-density digital instruments and mixed-signal and protocol-aware instrumentation that is well-suited for ATE solutions for SoC, high-power devices, and CMOS image sensors. Over the last few years, we have also established leadership positions in developing and deploying application-specific test solutions for MEMS devices and offering wafer and frame probing stations suitable for R D, wafer sort, and final test. We form strong partnerships with our customers, provide them with end-to-end support in product development, and take them through the entire life cycle process from concept to mass production. Chandran Nair and Goh Meng Klang, vice president of operations, at the AEM manufacturing site in Singapore. (Photo credit: AEM) SEMI: Digital transformation is powering strong growth of advanced computing, 5G and AI. Will AEM be expanding its AEM manufacturing plants in China, Malaysia and Singapore to meet rising demand for these technologies in the coming years? Nair: In regards to manufacturing, AEM currently has manufacturing facilities in Singapore, Malaysia, the U.S., Finland, and China. With our recently announced acquisition of CEI, we will add manufacturing capability in Vietnam and Indonesia. AEM will continue to expand manufacturing appropriately to give our customers cost-effective solutions while maintaining our proven track record of delivering on time and scaling rapidly in times of crises like the pandemic or geopolitical disruptions. As for advanced technologies, the three key factors that will bring the full potential of 5G to fruition are 1) cost-effective, high-powered processing devices at the edge, 2) easy access to high-bandwidth communications, and 3) cost-effective sensor technology. Semiconductors are the primary drivers of these three key success factors. As devices become more complex and our reliance on semiconductor-powered devices in all aspects of our lives deepens exponentially to include mission-critical applications, AEM’s role is to ensure that our customers' electronic and semiconductor devices are shipped thoroughly tested, safe to use, and highly reliable. It is imperative that, as a testing company, we find innovative ways to help our customers test their products with maximum coverage and minimum cost. To do this, we are focusing our R D efforts and investments to continue building on our key technology pillars to ensure that we stay ahead of the curve when it comes to test and handling solutions. We prepare our customers to test increasingly complex devices manufactured on the latest process node. SEMI: During your career you’ve driven projects in test and automation and more recently robotics solutions for ports, logistics warehouses and transport. With robotics and automation a key part of Industry 4.0, what role do AEM solutions play in powering the smart manufacturing movement? Nair: The smart manufacturing movement is powered by semiconductors, software and increasingly by artificial intelligence (AI). Test is at the heart of the process of ensuring that semiconductor and electronics devices reach the consumer well-tested for reliability. With our vision of enabling A Zero Failure World, AEM addresses the necessity for safe, highly reliable devices. The semiconductor companies themselves are adopting smart manufacturing methods. AEM’s tools are Industry 4.0-ready, and we continue to invest in machine learning and data analytics, which are integral to the future of test. Our tools are automated and feature embedded sensors to provide our customers with data about tool usage, the state of a machine’s health, and more. Our tools are connected to our customers’ manufacturing automation platforms. Additionally, we continue to invest in our ability to better slice and dice test data to understand trends and patterns to help our customers analyze data and make decisions faster. SEMI: You also have experience heading autonomous vehicle projects. With the COVID-19 pandemic hastening digital transformation, do you see an acceleration in the development of fully autonomous vehicles and smart manufacturing? Research and development efforts for autonomous vehicles (AV) continue at a fast pace worldwide. With shutdowns and restricted movement rules globally, the pandemic has hastened digital transformation in many ways. The delivery of goods and services is transforming, and AV will surely play a part, especially in secure environments for autonomous transport. The pandemic has accelerated the development of autonomous vehicles and smart manufacturing technology in automation-friendly environments like factories and ports. SEMI: At the recent Global Technology Summit hosted by SEMI, you spoke about testing innovations to meet the demands of highly complex devices. Please elaborate on innovative testing solutions versus traditional testing? Nair: AEM offers a disruptive and differentiated solution, one that is driving a paradigm shift to asynchronous, modular, highly parallel, smart testing solutions. ​ The traditional approach of ATEs to test increasingly complex devices on advanced nodes has reached a point of diminishing returns as it gets exponentially more expensive to increase test coverage to acceptable levels. Additionally, as devices get more complex and companies are rapidly adopting heterogeneous packaging technologies, the realization that System Level Test (SLT) is necessary is forcing a rethink of the entire test process. AEM’s provides asynchronous, modular, highly parallel test cell solutions that enable each test cell to run SLT, final test, or burn-in all in one system and its ability to handle hundreds of test cells independently with each test cell testing multiple devices. Our solutions suddenly make comprehensive testing of every complex device cost-effective. Freeing us from legacy ATE allows AEM to provide these innovative solutions to our customers. AEM engineering and manufacturing teams in Singapore at work on semiconductor test and handling systems for global deployment at world-class semiconductor facilities. (Photo credit: AEM) SEMI: Singapore seems to be in the sweet spot of digital transformation. Singapore’s industrial production grew 8.6% year-over-year in January 2021, an expansion driven mainly by a surge in sectors including electronics, and more growth is seen in the year ahead. Digital technologies such as 5G technology and cloud computing together with continued demand for work-from-home equipment is behind this growth. What are the growth prospects for the region’s electronics sector? Nair: Singapore is well-poised to benefit from the current digital transformation accelerated by the adoption of these technologies during the pandemic. Being a safe, well-governed country with strong IP protection, excellent infrastructure, and the rule of law, Singapore is in a great position to play a central role in cloud-based services, 5G, and the semiconductor industry. Singapore’s semiconductor sector output is at a record high, and the prospects for renewed growth in the region are very good. SEMI: As a new Regional Advisory Board member of SEMI Southeast Asia, how is your industry experience relevant to the scope of this role? What opportunities lie ahead for the region? Nair: I am honored to represent AEM in the SEMI’s Southeast Asia RAB. The SEMI RAB can influence policymakers with ideas and information on the current and future needs of the industry. I also believe that SEMI Southeast Asia can cultivate a strong innovative semiconductor ecosystem that helps regional and global growth. I look forward to working with other very experienced and accomplished board members. Bee Bee Ng is president of SEMI Southeast Asia.

The state of manufacturing is changing rapidly. Regardless of sector or location, manufacturing decision-makers across the world are signaling a desire for better supply chain resiliency, manufacturing flexibility, increased speed of innovation and stronger environmental sustainability. Singapore’s manufacturing sector, a significant contributor to its gross domestic product, is always evolving and today is shifting away from its traditional focus on producing highly customized products using flexible manufacturing processes, but at significantly lower efficiencies. Today, with Industry 4.0, we can design manufacturing systems that optimize both efficiency and flexibility. And this is possible because of the convergence of technologies such as artificial intelligence (AI), data analytics, robotics and the Industrial Internet of Things (IIoT). This blend of technologies helps reduce the cost of technological solution ownership – a derivative of Right’s Law – as a function of cumulative production. In HP Singapore, driving innovation in our product and processes is part of our DNA, and over time our products have grown in complexity and breadth. We have embraced Fourth Industrial Revolution (4IR) technologies in our advanced manufacturing lines. We started our Industry 4.0 journey in 2016 with Vision and Mission 2020 to modernize our production facilities to smart factories that strengthen our competitive edge. Our focus was on upskilling our employees with future skill sets, build new technological capabilities and partner with higher education institutes. To drive these transformations, we have formulated five pillars: Additive Manufacturing Data Analytics Cyber-Physical Integration Digitalization Workforce Transformation These five pillars have enabled us to move from labor-intensive and reactive processes to processes that are highly digitized, automated, and AI-driven, enabling us not only to increase quality and productivity but also to reskill our people in anticipation of jobs they will need in the future. Technicians have been upskilled and promoted to techno-operators which has, in turn, freed up technical specialists to explore other roles. Engineers have retrained as data scientists, or have moved to new product development, for instance. In 2017, HP’s Ink Supplies Operations (ISO) set up Smart Manufacturing Applications and Research Centre (SMARC) to adopt 4IR technologies and implement these innovations in production lines. Today, SMARC is the home ground for HP engineers to experience, trial and prototype solutions, bringing innovative and sometimes unexpected solutions to manufacturing. It is also a showcase for industry partners, government agencies and schools. Here is how each pillar of the SMARC contributed to transformation to augment the manufacturing workforce: Cyber-Physical Integration – Move Role of robotics/automation – By standardizing automation standards for robotics, we have deployed collaborative robots (Cobots) and autonomous intelligent vehicles (AIVs) to perform manual and routine tasks to drive productivity, while reducing errors from operator fatigue and protecting our operators’ physical well-being. Digitalization – Sense Role of IIoT – Devices are a treasure trove of data that can provide clarity on how the entire manufacturing line is performing in real time. Building a platform that connects devices and collects data while allowing factory floor managers to dynamically visualize on an Integrated Command Centre (ICC) and manage factory performance is central to HP’s digital transformation journey. And IIoT is not restricted to just devices that are already wired for data sharing. HP has also connected off-the-shelf analogue devices using a standardized data transportation protocol, allowing HP to collect essential data across all types of devices and eliminating manual data entry. Additive Manufacturing – Build By embracing additive manufacturing (use of HP MultiJet Fusion 3D printers), HP introduced more flexibility in operations through on-site rapid prototyping, light production, and replacement of parts needed on our manufacturing floors, shortening production timelines. We 3D printed pallets, which are cheaper and faster to produce, and replaced original pallets for transportation on conveyor belts, improving the efficiency and productivity of our operators. Director Jamie Neo with HP’s MultiJet Additive Manufacturing Printer. (Photo Credit: HP) The HP Multi Jet Fusion 3D printing technology has helped HP to replace traditional manufacturing methods and streamline processes in our supply chain. For example, HP is 3D printing the Drill Extraction Shoe, a tool that is essential to the removal of waste products from laser-drilling in HP’s printhead manufacturing line. Through 3D printing, HP has consolidated the production of the tool from nine parts to one 3D printed model, thereby optimizing the design of the tool and reducing its production time from three to five days to 24 hours. Data Analytics – Think By deploying advanced analytics and machine learning models, HP has enabled real-time detection, diagnostics, and prediction of product quality across our manufacturing lines. Predictive models are replacing traditional “destructive testing,” reducing waste and allowing HP to meet unique product specifications more accurately. Machine learning is diagnosing and recommending the right set up for tools and manufacturing lines, when necessary, to reduce downtime and increase precision. Workforce Transformation – Grow The pivot to becoming an advanced manufacturing leader not only requires HP to invest in 4IR technologies but also skill sets to operate 4IR technologies. We embarked on a Workforce Transformation program to help our employees stay competitive in a fast-changing world. Today 35% of HP technical workforce have had the opportunity to take on new roles even as needs evolve, thanks to internal and external training and reskilling. Beyond technology and training, the glue that binds these together and makes it successful is our culture at HP. We are ambition-led, which means that we do not see the world as it is, but what we can be. And we do so by collaboration. Plans for the Future After accomplishing our Mission 2020, in late 2020 we launched Mission 2025 to extend our end-to-end smart factory capabilities through advanced connectivity, intelligence and automation to optimize and drive sustainable manufacturing flexibility and efficiency. Pyramid of HP’s smart manufacturing focus Advanced technologies such as additive manufacturing, IIoT, automation and robotics, data analytics, machine learning and AI are central to the connectivity and the end-to-end intelligence of our smart factories, enhancing production efficiency and flexibility while improving the quality of our products. For example, the deployment of IIoT sensors in our wafer plant has helped to reduce downtime in replacing CO2 gas cylinders. What’s more, AI enables us to more accurately monitor the dispensing of structural adhesive to eliminate lost yield. We believe that by enhancing manufacturing efficiency and flexibility, we were able to shorten resolution time, reduce our carbon footprint, and improve the resiliency of our manufacturing and supply chain systems. HP smart factory model In April 2021, two lines in HP Singapore joined the World Economic Forum’s Global Lighthouse Network after being recognized for pivoting from a labor-intensive factory into a digitized, automated one with the help of AI. In doing so, we managed to improve manufacturing costs by 20% and productivity by 70%. Under Mission 2020, we saw the following successes: Improved manufacturing costs by 20% Improved productivity by 70% Brought most HP employees onboard to our smart manufacturing journey Equipped HP employees with skill sets in areas such as additive manufacturing, data analytics, AI, robotics and Internet of Things Established a Model Factory playbook With Mission 2025, we will: Continue to train employees in future skillsets by partnering with institutes of higher learning Scale our Model Factory playbook across more manufacturing lines to reduce costs and improve productivity Enhance our knowledge in additive manufacturing by building an ecosystem as a service platform to help manufacturing companies Enable a sustainable manufacturing system to reduce our carbon footprint and help enable a circular economy We believe in innovating with purpose by focusing on solving real-world problems and creating technology in the service of humanity. That is why we built the SMARC to create the solutions for our lines and showcase these solutions to encourage industry participation. We are driven by values and ambition, which means that it is not just what we do, but also how we execute it. We make sure our values inform everything we do – for instance, helping us make a greater impact to environmental sustainability, people, and our community. We believe this is a crucial step in coalescing industry support, which is necessary to move the needle on advanced manufacturing. Robert Ronald is Master Program Manager, Cost Structure, Model Smart Factory and Sustainability, at HP.

Electric mobility, renewable energy and other technology innovations like IoT, 5G, smart manufacturing and robotics all require reliability, efficiency, and compact power systems, fueling the adoption of Silicon Carbide (SiC) and Gallium Nitride (GaN) to support lower voltages in significantly smaller devices. But chip designers must overcome the technological and economical challenges of integrating the two semiconductor materials into power systems.SEMI spoke with Elisabeth Brandl, Business Development Manager at EV Group about trends and new developments within the power electronics industry and the devices' application in smart mobility. Brandl shared her views ahead of her presentation at the SEMI SMART Mobility Forum, 18 February, as part of the SEMI Technology Unites Global Summit, 15-19 February 2021, online event. Join us to meet experts from EV Group and other key industry influencers. Registration is open. SEMI: What is driving new developments in power electronics?Brandl: Globally there are significant changes in infrastructure requirements for communication, automotive and power conversion. We need to look no further than the rising adoption of 5G, electric and hybrid vehicles, and renewable energy as examples of drivers of these changes. The device level, particularly in the field of power electronics, figures prominently in these shifts.The power electronics industry faces a growing number of scenarios where conventional silicon power devices are no longer suitable and are easily outperformed by new architectures mainly based on wide bandgap semiconductor materials like Silicon Carbide (SiC) and Gallium Nitride (GaN).SEMI: What industry challenges is power electronics innovation aiming to solve? Brandl: Power conversion efficiency is very important and needs further improvement as the related losses significantly contribute to the overall power consumption. For green power and a better environmental footprint, renewable energy is crucial, but so is overall power-consumption efficiency, yet the role of power devices is often underestimated. High-frequency and high-power applications, such as data center applications and inverters for renewable energy, where silicon power electronics are reaching their limits, are also important areas in power electronics.SEMI: How will the transition from silicon to compound semiconductor materials help?Brandl: The superior material properties of several compound semiconductors can tackle the need for lower losses in power conversion or better high-frequency behavior. Today, we mainly talk about GaN and SiC power devices as they are materials well-suited to address these needs. However, other materials like diamond and gallium oxide are in development for these applications. Material properties of SiC that enable thinner materials with lower power losses and better thermal behavior address power conversion efficiency as well as form factor challenges. GaN, especially in a high electron mobility transistor (HEMT), can be used for high-frequency applications.SEMI: What enables a better and more cost-effective manufacturability of SiC and GaN power devices?Brandl: For the end customer, a typical figure of merit regarding the cost effectiveness is $ per Ampere or Watt. While this seems simple, the reality is of course more complex. It is important to understand the main cost contributors within the manufacturing area. For SiC, this is clearly the substrate cost. In my presentation, I will show a way to reduce this cost via wafer bonding. For GaN, epitaxy – a method for growing or depositing mono crystalline films on a substrate – is the critical parameter. And of course, yield has a very big impact on cost effectiveness too, which means that good process control including metrology is very important.SEMI: Many semiconductor companies are already transitioning to silicon carbide and gallium nitride. Can you give us an example of a success story?Brandl: All the big power device manufacturers have either acquired or developed their SiC and/or GaN power device technology, so they also see a bright future for these wide bandgap semiconductors in the power device market. The most prominent success story is STMicroelectronics with its SiC MOSFET power devices, which have been implemented by Tesla in its Model 3 vehicles since 2018.SEMI: What is coming next?Brandl: New materials for power devices are being explored, such as diamond and gallium oxide. For SiC, the trend is moving toward 8-inch substrates, which is the focus of the funded EU project REACTION under the coordination of STMicroelectronics. Cost reduction and substrate availability also play a big role. All major power device manufacturers have contracts to secure the supply chain for SiC substrates because material availability is the main uncertainty at this time. Finally, collaborations along the supply chain are crucial and generally beneficial for all parties, as development requirements are better communicated and prioritized.Elisabeth Brandl is Business Development Manager at EV Group. She received her master in technical physics from the Johannes Kepler University Linz, Austria in Semiconductor and Solid State Physics. Since 2014, she has been responsible for Product Marketing Management for temporary bonding and compound semiconductors at EVG. The SMART Mobility Forum is the digital platform of SEMI Europe’s Global Automotive Advisory Council (GAAC) for industry stakeholders along the automotive and electronics value chains, from Design, Semiconductor Equipment and Materials Suppliers to Automotive OEMs.Smart Mobility is one of four SEMI initiatives focused on building communities, content, and activities around critical and emerging electronics markets. Read more about our Regional Chapters.Serena Brischetto is senior manager of Marketing and Communications at SEMI Europe.