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Tracking and quickly diagnosing COVID-19 infections, working from home and telemedicine recently came into sharp focus as technology executives and other subject matter experts from microelectronics heavyweights recently gathered for the first-ever virtual SEMI CTO Forum to explore how the microelectronics industry and their own companies can leverage future technology trends to drive growth. Themed Intelligent Medtech and Wearable Technologies, the forum drew CTOs from ARM, Babblelabs, Brewer Science, Dell, Dow/Dupont, E-Ink, Hewlett Packard Enterprise, Intel, Lam Research, KLA, Microchip, ON Semiconductor, Qualcomm, Tokyo Electron, Ulvac, Veeco and Xilinx. The event is designed as a strategic driver of pre-competitive innovation. Following are key takeaways from the forum. Microfluidics Promises to Speed COVID-19 Diagnosis More than 240 companies worldwide are developing microfluidics solutions to improve diagnosis and treatment of COVID-19 and other conditions, said forum speaker Dr. Kurt Petersen, a member of Band of Angels, Silicon Valley's oldest angel investment group, with an illustrious background1 in technology. And their innovations are bearing fruit. Cepheid, a company founded by Dr. Petersen, has developed a disposable microfluidic cartridge, Xpert Xpress SARS-CoV-2, used by doctors to swab the inside of a patient’s mouth. Highlighting the vital role of MEMS in medical electronics, the tiny powerful devices are behind a test that can detect COVID-19 infection in under 40 minutes. Dr. Petersen also cited a few examples of implantables and injectables under development, including: In vivo chemical sensing: Profusa developed a continuous glucose monitoring sensor via an optical patch. Glaucoma pressure monitors: Injectsense built a silicon chip the size of a grain of rice that is embedded in the eye to measure eye pressure. Retinal implants: Second Sight implanted a 60-electrode array chip that projects images onto the retina to improve vision. Microelectronics Takes Aim at Battling COVID-19 The event’s CTO roundtable, a platform for discussing societal and technology issues, revealed microelectronics technology will likely give rise to solutions for combatting pandemics and new business opportunities both in the short and long run. Areas of the greatest interest included: Tracking and Security: Infection tracking accuracy is key to limiting the spread of viruses yet comes with inherent privacy and security challenges. The consensus view of the executives was that developing trusted hardware capabilities is critical for adoption of accurate infection-tracking technologies. Remote Operation: Executives expect working from home or the use of telehealth to continue building momentum long after pandemic. To give staying power to the remote communications at the heart of these trends, microelectronics ecosystems will need to boost compute performance, both at the edge and in the cloud, while increasing bandwidth to enable applications such as augmented reality/virtual reality (AR/VR), artificial intelligence (AI), machine learning and advanced data analytics. Edge intelligence: The challenge of remote communications spans both people and the Internet of Things (IoT). Questions persist about how hundreds of billions of sensors will connect to the cloud and how much power they will consume. The need to push computing to where data is generated – at the edge – is rising and the necessary underlying technologies will only come by combining various forms of distributed computing and analytics. The microelectronics industry’s ability to seize these opportunities will only be possible with huge strides in innovation, raising concerns among the CTOs about the financial viability of cutting-edge devices because of increasing device complexity and R D costs. Technology partnerships and collaborations – an area where SEMI is contributing and will continue to expand its efforts as it works with the CTO community – will be critical to containing R D costs. SEMI will help the executives identify and mobilize the resources key to future innovation. Improving Home, Work Productivity and Experiences Key to AR Adoption Smart wearables also offer great promise. In just over a decade, AR and VR have grown from science fiction to practical uses such as AR applications for smart contact lenses, said Dr. Mike Wiemer, Co-Founder and CTO of Mojo Vision2. Dr. Wiemer said that while many AR applications remain under development, the technology will only see widespread adoption once it starts to improve productivity and efficiency at home and work and the quality of other experiences. The smart augmented reality contact lens developed by Mojo Vision is a step in that direction. The product’s built-in display gives users timely information about everything they see while remaining invisible by packing 70,000 pixels into a space smaller than a half a millimeter across, making it the smallest and densest dynamic display ever made. The contact lens is powered by an ARM-based processor, with later versions adding an image sensor, eye-tracking sensors and a communications chip. SEMI thanks EMD Performance Materials and Telit for sponsoring the CTO Forum. For more information on the CTO Forum and SEMI’s Smart Data-AI initiative, please sign up on our webpage. 1 Dr. Kurt Petersen is a member of the National Academy of Engineering, an IEEE Medal of Honor winner, and a Life Fellow of the IEEE for his contributions to the commercialization of MEMS technology. 2 Dr. Wiemer also co-founded Solar Junction, where he led technical teams to two world records in solar cell efficiency (43.5% and 44%). He also has patents and papers in Semiconductor Devices Applications, Silicon Photonics, Materials Integration, Lasers, Solar Cells, Solar Systems, and Analog Circuits. Tom Salmon is Vice President of Collaborative Technology Platforms at SEMI. Pushkar P. Apte, Ph.D., is Strategic Technology Advisor for the Smart Data AI Initiative at SEMI.
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SEMI has long promoted the industry collaboration that has contributed to the rise of the smart digital world we live in today. A world where data is being generated continuously by systems, gadgets, and sensors around us – often referred to as the Internet of Things (IoT). In our personal lives, most of us have smartphones, smart watches, smart TVs and smart cars, and we live in smart homes and smart cities generating huge amounts of data.In the work world, data and analytics are now influencing almost every industry including healthcare, government, financial services, construction and transportation. This data has the potential to transform our lives and make our world even smarter – if we can communicate and process this data, and use it to come up with actionable recommendations or actions. Artificial Intelligence (AI) and Machine Learning (ML) techniques have generated much excitement precisely because they offer us ways to realize the full value of data by harnessing it and transforming it into active intelligence.Data-intensive technologies are required to store, communicate and analyze data. And it all starts with innovation in microelectronics chips and systems spanning processors, memory, sensors, radios and other devices, presenting a huge opportunity to producers of these technologies. However, with Moore's Law beginning to slow, technology paths and innovation options are diverging. Companies must swiftly assess these options in order to develop competitive offerings. But the technological complexity and divergence makes it increasingly expensive or even unaffordable for many companies to track and pursue these options.The good news is that cost-effective early assessment is possible through pre-competitive collaboration that can produce new and often unexpected cross-disciplinary insights by overcoming traditional silos in industry and academia. Unfortunately, important collaborative industry platforms, such as the International Technology Roadmap for Semiconductors (ITRS), have folded, opening a collaboration gap in the global microelectronics ecosystem.As part of its mission to help companies connect, collaborate, and innovate, SEMI has built a collaborative, cross-supply-chain platform – the Strategic Innovation Platform (SIP). The goal is to provide early and comprehensive assessment of future technologies that are five to eight years away from commercialization. The assessment identifies not just technical barriers but also manufacturing and supply-chain constraints to implementing new technologies. SIP brings together the entire microelectronics ecosystem including strategic technology thought leaders, subject matter experts, technology and application developers, academia, researchers, start-ups and government. With more than 2,100-member companies spread across the global electronics manufacturing supply chain, SEMI is uniquely positioned to enable this critical collaboration. Award-Winning First ProjectThe inaugural SIP project assessed key drivers of future technologies. A key finding was that fast, efficient interconnects between devices and components are critical to the system performance important to customers and users, implying that system-level optimization is required. For data-intensive applications, interconnects have emerged as a key bottleneck for both performance and power in various circuits and systems in part because the slowing of Moore’s Law has decelerated advances in individual device performance, and in part because systems are becoming more complex, requiring heterogeneous integration.To address this challenge, SIP brought together industry experts from ASE Inc., Dow Chemical, Lam Research, Qualcomm and Xilinx to assess the future impact of interconnects for data-intensive applications. SEMI also involved Stanford University professors to collaborate on modeling and simulation. Through this unique cross-disciplinary collaboration, SIP developed a realistic model to evaluate the system-level performance of single-chip systems, as well as multi-chip systems – including traditional 2D packages, high-performance 2.5D systems that use interposers, and futuristic 3D systems. SIP also explored supply chain challenges in business continuity, manufacturability, Environment, Health and Safety (EHS) and the regulatory environment. SEMI worked with a broad range of industry partners to ensure that the model parameters accurately reflected realities on the design and factory floors to ensure usable results. Experimentation has become ever more expensive, with one industry player reporting that “it costs us $100 million to do a good experimental evaluation.” Accurate models can go a long way toward reducing the cost of technology assessment. The SIP collaboration produced key quantifiable insights including comparisons that highlight the benefits and limitations of various materials being explored for future interconnects, and of architectures under consideration for future data-intensive applications. For example, the current workhorse for artificial intelligence (AI) platforms – 2.5D technology – delivers a 4X improvement over 2D packaging but falls short of providing the orders-of-magnitude improvement that future AI/ML applications may require. These findings enable the industry to begin to identify ways to optimize 2.5D architectures, transition to 3D heterogeneous integration for performance-critical applications in the medium term, and to eventually evaluate new paradigms such as neuromorphic and quantum. The project findings were presented late last year in the form of two research papers at Electronics System-Integration Technology Conferences (ESTC) and International Microelectronics Assembly and Packaging Society (IMAPS) recently. One received the “Best Paper of the Session” award at IMAPS – a recognition that affirms the power of a collaborative platform such as SIP to produce valuable insights to address the growing technology complexity within the microelectronics industry. The microelectronics industry is on the cusp of a historic inflection point, where it could fuel the rise of emerging applications in AI/ML and IoT, and can grow into a trillion dollar industry over the next several years. More importantly, the industry is poised to help solve some of society’s most complex problems in areas including healthy living, climate change and transportation. No company can do this alone, and pre-competitive platforms such as SIP are key both to accelerating innovation through cross-disciplinary collaboration, and to reducing costs for individual companies. Please contact Tom Salmon at [email protected] or Pushkar Apte at [email protected] for more details and to get involved in future projects.Tom Salmon is vice president of Collaborative Technology Platforms. Pushkar Apte is a strategic technology advisor at SEMI.
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The fast-growing automotive semiconductor market means big change for the IC supply chain. Beyond the obvious demands for reliability and traceability, the sector is moving towards simpler and lower-cost solutions while facing the daunting challenge of automating driving in a complex world. The need for simpler and cheaper automotive intelligence will likely drive acquisitions to build complete platform solutions that are easier to integrate. This demand has already spawned a market for pre-configured test cars to save developers time and money, and is driving LiDAR (Light Detection And RADAR) towards lower-cost, solid state solutions. “The growth of the automotive electronics market provides a great opportunity for the IC supply chain to differentiate on specialty processes and quality for the high-volume automotive business with its long design cycles,” says Scott Jones, principal, strategy, at KPMG, who will speak in the automotive program at SEMICON West. “This differentiation is a chance to reduce chip suppliers’ dependence on scaling volume for the mobile phone world with its short-cycle volatility of winning and losing sockets.” He notes that increasing demand for automotive ICs is also reinvigorating the eight-inch supply chain and spurring opportunity for specialty products such as compound semiconductor devices for power efficiency. Supplying the automotive market also means addressing automotive reliability requirements, which can be 10 times more stringent than for consumer devices. At the same time, the industry must sustain fast-paced development cycles required for the volume and diversity of low-cost IoT devices, manage the segmented supply chain for both those markets, and still spread development costs. Another big challenge for the supply chain will be to automate testing and update vast amounts of embedded software in these automotive devices. “The more complete solution a company can put together, the more the automakers will gravitate to it. They want simplicity,” Jones suggests. Smaller players will need to differentiate with IP and acquire other IP provider to build a broader platform, or be acquired and folded into an all-in-one solution.AutonomouStuff helps accelerate and simplify development of autonomous driving solutionsAutonomouStuff is helping to speed development of these platforms. The company has grown from a sensor distributor into a supplier in the emerging niche of vehicles preconfigured with key interfaces for sensors and controls. These interfaces can then be customized by integrating different components for developers to test their applications. AutonomouStuff offers developers a lineup of vehicle models pre-configured with the interfaces needed to add desired chips, sensors and software to develop their autonomous vehicle systems. Source: AutonomouStuff.“Whether they’re major chipmakers or AI software startups, they don’t have a year to build their own vehicle platforms themselves for developing autonomous vehicle systems,” says Wolfgang Juchmann, VP sales and business development at AutonomouStuff. Juchmann, a SEMICON West speaker, will bring a demonstration vehicle to the show. “In four to six weeks we can prepare a custom test car with selected sensors, enabling users to start testing their computer platforms and software. It’s faster and more cost-effective for us to supply the car with the needed interfaces.” He notes that developers are using some 300 AutonomouStuff vehicles in the field. AutonomouStuff customers are starting to transition from testing on a single car or two to testing on mini-fleets with 50 to 100 vehicles. Beyond sensors and pre-configured vehicles, the next step will be to add more data intelligence services to help with capabilities like tagging the data for training, Juchmann says. AutonomouStuff already offers hardware to support Baidu’s Apollo open-source software stack and data set. The company was recently acquired by the Swedish holding company Hexagon to help support expansion.CMOS silicon LiDAR nears automotive qualificationInnovations in the hyper-competitive LiDAR market, where burgeoning demand is driving the race to develop various types of solid-state devices, may also help reduce the cost of autonomous vehicles. Among the roughly 40 LiDAR suppliers, at least one – Quanergy – is taking advantage of 45nm and 32nm foundry CMOS volume production. The company uses voltage through the semiconductor stack to change the refractive index, controlling the phases of optical beams and the resulting interference patterns of light exiting the chip to quickly steer the laser beam without the need for moving parts, much like the phased array radar its team developed earlier. Solid state LiDAR image with object recognition software. Source: QuanergySo far, most of the small LiDAR units have shipped to the security, industrial automation, drone, robots and 3D mapping markets. However, Quanergy CEO Louay Eldada, another SEMICON speaker, says the company is also winning automotive designs and expects automotive shipments to take off early next year, once automotive certification testing is completed. “We can get design wins because standard CMOS production at TSMC makes us a known entity,” says Eldada. To prevent component misalignment, the company produces its own specialized packaging to secure the laser, phase control ASIC, optical phased-array emitter, detector array, and receiver readout ASIC at its plant in Silicon Valley or the facility of its automotive partner Sensata. Through its software business, Quanergy offers an artificial intelligence (AI) perception program for object recognition and LiDAR tracking. The solution uses the people-tracker software the company acquired from Raytheon.SEMICON West this year expands to three full days of automotive electronics programming and features a Smart Transportation Pavilion. Other companies with experts who will speak as part of the program include XPT/NIO, Infineon, McKinsey, Voyage, GM Cruise, Bosch, Deepen AI, Airbus A3, Nvidia, Excelfore, Byton, Macronix, SK Hynix, SAP, Xilinx, Achronics, California Fuel Cell Partnership, Velodyne, Lam Research, KLA-Tencor, SCREEN, Rockwell, Versum Materials, TechSearch International, Entegris, ASE, Amazon, Continental and Wind River. www.semiconwest.orgPaul Doe, SEMI
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