FHE

Is your company working on the next big thing in flexible, hybrid and printed electronics – a breakthrough or innovation that will make the world safer, healthier or more productive for years to come? If so, we want to hear from you.You’re invited to deliver a technical presentation at virtual FLEX 2021, February 22-26, 2021. The call for abstracts is now open! Celebrating its 20th year, the online event will gather executives, product managers, business development professionals, and engineering directors as well as leading industry analysts and media for the latest developments, trends and innovations in flexible hybrid electronics (FHE). More than 400 companies, universities, R D labs, and government agencies from around the world have participated in FLEX conferences.Technical presentations should focus on the conference theme, 20 Years of Driving Innovation to Make the World Safer, covering flexible hybrid or printed electronics products, equipment, processes, materials, and the applications they enable. FLEX 2021 also takes aim at the future of the planet, so presentations on global sustainability in areas such as impacts, strategies, tactics, successes and progress area also a great fit. To submit your abstract, please complete the online form: Upload your abstract (100-300 words) describing the topic of your presentation and how it applies to the flexible, hybrid, and printed electronics products. Preference is given to original research and advancements in process and materials as they relate to end users. We also invite students from research universities to submit posters describing their work and results for the popular FLEX Poster Competition. As in the past, a panel of industry and academic experts will evaluate the posters and recognize the top three students and their work. Here are key deadlines and dates for industry experts and students to keep in mind: September 30, 2020 – Submit your abstract. October 31, 2020 – We’ll notify you whether your presentation has been accepted by this date. November 15, 2020 – Sign a Speaker Agreement and provide a bio and headshot. February 1, 2021 – Send us an electronic copy of your presentation. We’re looking for presentations in these topic areas: Flexible Hybrid Electronics Systems Materials Processing Sustainability and Power MEMS and Sensors Applications Presentations should include the following: Why the technology presented matters and to whom Practical recommendations for addressing commercialization issues or applications. This includes providing innovative technological or market solutions driven by a use case, the integration challenges you faced, and the system-level architecture decisions you made. Descriptions of how you overcame each challenge Ideas for what as an industry we should be working on and what are you working on to demonstrate sustainability For a full rundown on topics and other information, please visit the FLEX 2021 Call for Papers web page.Michelle Fabiano is a program and event manager for SEMI Americas.

Since 2015, FlexTech has funded three projects with ITN Energy Systems, based in Littleton, Colorado. The projects all draw on a unique concept of using thin, flexible ceramic sheets as both a substrate for functional devices and as an integral part of the hermetic packaging to support paper-thin FHE products. Each program was increasingly sophisticated, enabling a larger variety of functions to be integrated into a common package. Independent functions such as energy storage, energy harvesting, or printed microelectronic circuits are deposited on their own ceramic substrate and the layers vertically stacked and interconnected into a monolithic structure that combines several functions in the smallest possible package volume.The ITN projects provide excellent examples of the power of collaborative research and development to help de-risk investments in next-generation electronics. All the projects were conducted with technical contributions from small and large businesses as well as university partners. The programs were funded by the U.S. Army Research Laboratories (ARL), directed by industry leaders and managed by SEMI FlexTech with the focus on utilizing the advantages of flexible hybrid and printed electronics (FHE) to create lighter-weight, lower-power, more conformable electronics than available commercially today. Markets ready to take advantage of FHE developments include healthcare, aerospace, mobility, consumer electronics, industrial electronics.ITN was founded in 1995 to focus on researching and developing technologies related to aerospace, energy and the environment for defense and commercial marketplaces. Its business model employs collaborative R D projects to explore, develop and validate promising next-generation clean energy technologies with an emphasis on tackling the manufacturing challenges that enable low-cost, high-volume production of thin-film devices on flexible substrates. Those technologies that meet the technical and business requirements of the market are commercialized via focused, spin-out companies with five such spin-outs formed so far. The work on ultra-thin batteries needed by the SEMI FlexTech community readily slid into their portfolio of projects.Project 1 – New Solid-State Lithium BatteryThe first project kicked off in 2016, with ENrG, and successfully supported the development and validation of novel Solid-State Lithium Battery (SSLB) products with total packaged thickness ranging from 50-250 microns. The SSLB proved to have substantial advantages in form factor and performance when compared with both commercial-off-the-shelf batteries and emerging technologies. For example, the SSLB provided more than double the operating time in a substantially smaller package in powering an audio device supplied by SEMI FlexTech partner companies.By avoiding the use of liquid electrolytes, the ITN SSLB also eliminates flammability issues while still allowing the benefits of lithium-based battery chemistry. The SSLB boasted many attributes attractive to the FlexTech community, including: Ultra-thin form factor, i.e. 250 microns thick, mAh class packaged batteries High volumetric energy density, i.e. baseline products with ~500 Wh/l and a roadmap to 1,000Wh/l The ability to support high current pulsing, i.e. current pulses at 4-10C rates, in support of demanding FHE duty cycles High temperature compatibility with solder reflow and other FHE integration schemes Rechargeability with high capacity retention at 1,000 cycles This new SSLB has formed the foundation of subsequent projects and commercialization efforts.Project 2 – Adding Energy Harvesting Based Recharging Capability The second SEMI FlexTech-funded project proposed a novel self-recharging battery with the addition of Lucintech’s cadmium telluride (CdTe) photovoltaics (PV), which was also deposited on thin yttria stabilized zirconia (YSZ) substrates. Because the CdTe supports a superstrate configuration, the SSLB can function as the back sheet for the PV package, thereby dramatically decreasing overall package thickness. The resulting flexible integrated power pack provided up to 0.25 Wh of energy storage and ~0.2 W of PV generating capacity in a total package less than 250 microns.As part of that effort, the ITN Team identified an effective power-management circuit that was ultimately compatible with die thinning and form factors very attractive to FHE. Consequently, the PV and SSLB were interconnected into a common power bus that enabled FHE to be operated with either the PV, SSLB or some combination of the two.ITN is seeing great interest in this product and both developing a version with substantially higher capacities than the project entertained for a UAV platform while ramping to low volume with support from NextFlex, a member of the Manufacturing USA network, and formed in 2015 through a cooperative agreement between the U.S. Department of Defense (DoD) and FlexTech Alliance.Monolithic integration of function layers atop of SSLB for high performance microelectronics device Project 3 – Integration with Processing and Sensor SystemsThe third FlexTech-funded project builds further on that foundation. In this project, the ITN Team is maturing the technologies to create a battery with an integrated processing and sensor system, nicknamed BiPASS. In addition to SSLB layers, the BiPASS package integrates printed circuits on YSZ employing high-performance, silicon- based bare die micro-electronics and/or thin film sensors into the common packaging. Mock-up of the charge control circuit on SSLB The initial demonstration integrates a commercial lithium battery charge control circuit within the SSLB packaging to create a monolithically integrated power module. There have also been promising developments of the University of Rhode Island’s metal oxide (MOx)-based thin film gas sensors that have dramatically increased sensitivity when deposited on thin YSZ. The resultant sensor achieves ppb detection of trace explosives gases that can be powered by SSLB. Along the way, ITN’s partners Molex and SunRay Scientific matured several aspects of FHE circuit printing and integration on both PET and YSZ, including new materials and processes for conductive traces, and bare die attachment with fine features. The project is in its final stages and the ITN Team now has a promising roadmap to integrate power, microelectronics, and thin film sensors/sensor systems into a single paper-thin package.Commercial Scale-Up StrategySince the initial demonstrations were completed, ITN has been actively maturing a commercial scale-up strategy based on significant market-pull and interest from several companies. A new venture to commercialize this next generation SSLB is in process. As part of those discussions, ITN is in active discussions with potential strategic partners to support the transition to high-volume production to access additional markets, many of which are cost-sensitive and need a higher degree of production maturity.In the meantime, ITN’s limited volume SSLB production line is already supporting medical device customers. In addition, a baseline SSLB (~2.5 mAh capacity) has been developed and tested in several new applications, including wearables, sensors and smart labels.“Based on the acceptance of these project in the market, I believe all three projects have provided significant value to the SEMI FlexTech community,” noted Brian Berland, Chief Technology Officer at ITN. “In addition, the connections and visibility we have gained within the industry by partnering with SEMI FlexTech have been invaluable. We are excited to continue this journey with new and additional projects. In the meantime, we are hopeful that our ongoing discussions with investment partners will support our commercializing of these components.”For more information visit www.flextech.org. SEMI FlexTech is currently (from 6/10/2020 – 7/17/2020) accepting white papers for new technology development projects. Read more at www.flextech.org.About the AuthorDr. Gity Samadi is the SEMI FlexTech Program Manager. Gity is responsible for the flexible hybrid electronics R D consortium activities including project awards and management, Technical Advisory Council management, and webinar/industry event planning for the building and fostering of this dynamic innovative community.

As the body’s largest organ, skin is responsible for the transduction of a vast amount of information. This conformable, stretchable, self-healable and biodegradable material simultaneously collects signals from external stimuli, which translates into information such as pressure, pain and temperature. The development of electronic materials, inspired by the complexity of this organ, offers a tremendous unrealized materials’ challenge. Fortunately, the advent of organic-based electronic materials may offer a solution to this longstanding problem.Zhenan Bao, K.K. Lee Professor of Chemical Engineering, Stanford University, is one of the world’s leading researchers working on the design of organic electronic materials that mimic skin functions. SEMI’s Maria Vetrano interviewed professor Bao to preview her February 25 keynote, Skin-Inspired Electronics, at FLEX|MEMS Sensors Technical Congress (MSTC) 2020, February 24-27, 2020, at the DoubleTree by Hilton in San Jose, California.Join us at FLEX|MSTC to meet Professor Bao and other industry influencers furthering innovation in flexible hybrid electronics (FHE) and MEMS sensors. Register now to connect with her at FLEX|MSTC or visit her on LinkedIn.SEMI: Your pioneering work on the use of electronic materials to construct second skin is a major step forward in human-machine interfaces. Could you please describe second skin?Bao: Second skin is a new electronic-device platform encompassing electronic devices that have skin-like properties such as stretchability, self‐healing ability, biocompatibility and biodegradability. In essence, the second skin is an electronic system of fully integrated multifunctional components operating on the surface of or inside the body to enable smart healthcare for disease prevention and treatment and to enhance the functional capabilities of natural skin. The second skin could also serve as a module to connect our human body to the Internet, thereby allowing human integration with the Internet of Things (IoT) for next‐generation wireless communications. In this way, we can view the second skin as an artificial body part that can be used to improve our everyday lives.SEMI: How might second skin operate in the human body?Bao: It has many potential uses. It could be a prosthesis for people who have lost their sense of touch. It could be used to repair damaged skin as well as to provide enhanced functionality that’s not possible with biological human skin. It could, for example, connect us with our external environment, with other people, even with our cars.I can also envision second skin as an implantable device for both neurostimulation and for early detection of disease. Schematic illustration of structure of second skin composed of functional devices: sensor, integrated circuit, display and power supply. Source: Stanford University SEMI: How did you get started in this research? Bao: Sixteen years ago when I started at Stanford, I learned of a colleague in mechanical engineering who was working on robotic cockroaches. That’s when I understood the need for sensor functions in robotics.I considered the large number of people with prosthetics who do not have a sense of touch. With this audience in mind, I started by designing a simple flexible electronic device that could take the shape of skin, even conforming to a robot hand, thereby approximating the natural sense of human touch.Once we developed the first sensor, and realized that its touch sensitivity could eclipse that of human touch, I asked myself: what can we learn from second skin – in addition to its sensing functionality?Skin is not just flexible; it is biodegradable and stretchable. So we started to dream. We began by developing electronic materials, either conductors or semiconductors. We added new functionality, such as self-healing properties, biodegradability and stretchability. That opened the way to new materials’ development.SEMI: What discoveries have you made in new materials?Bao: Over the past decade, we’ve developed skin-like materials with electronic properties that are on par with the best conducting and semiconducting polymers. Some of our skin-like semiconducting polymers can perform even better than amorphous silicon. That means with suitable processing methods, we can make stretchable ICs, initially with tens of transistors that can perform analog or digital functions, and in a later stage, stretchable displays driven by active matrix arrays.SEMI: What would it take to put these materials into production?Bao: We need to develop methods to pattern the skin-like electronic materials into fine features. We have been leveraging similar processes used for flexible circuit boards. Some research groups are developing roll-to-roll fabrication and printing methods.SEMI: Which technologies/applications are you commercializing?Bao: C3Nano is a Bao Research Group spin-off startup that is commercializing nanomaterials that are promising for bendable and foldable electronics.Another spin-off that is licensing our technology, PyrAmes, is developing a continuously non-invasive blood-pressure monitor. It’s not a cuff so the patient doesn’t have to remember to put it on.In the shorter term, we’re looking at putting artificial skin on prosthetic limbs and robotic hands. Further down the road, we could put skin on wounded regions of the body, forging connections to nerves that would support realistic sensation.To realize these applications, we’ll need to conduct further R D on materials and applications. The manufacturing of these devices still needs much more development.Fortunately, we’re part of a fertile development ecosystem at Stanford. I started the Stanford Wearable Electronics Initiative (eWEAR) to forge collaborations across Stanford campus as well as with industry.SEMI: What would you like FLEX|MSTC attendees to take away from your presentation?Bao: I’d like them to realize that the future of electronics is changing. I imagine a future in which the functions of a smartphone will disappear into what we wear, what we attach to our skin and what we implant inside our body. I believe that skin-like electronics will help to facilitate this future, allowing us to connect with each other and our surroundings in ways that feel natural, yet that also enhance our quality of life. Zhenan Bao is K.K. Lee Professor of Chemical Engineering with courtesy appointments in Chemistry and Material Science and Engineering at Stanford University. She founded the Stanford Wearable Electronics Initiate (eWEAR) and serves as the faculty director. Prior to joining Stanford in 2004, she was a Distinguished Member of Technical Staff at Bell Labs, Lucent Technologies from 1995 to 2004.Bao has over 500 refereed publications and over 65 U.S. patents with a Google Scholar H-Index 155. In her recent work, she has developed skin-inspired organic electronic materials, which have resulted in unprecedented performance or functions in medical devices, energy storage and environmental applications. She has pioneered several important design concepts for organic electronic materials. Her work has enabled flexible electronic circuits and displays.For more information on professor Bao’s research, visit Bao Research Group. FLEX|MSTC is organized MEMS Sensors Industry Group (MSIG) and FlexTech, SEMI technology communities focused on the growth of MEMS sensors and the flexible electronics supply chain, respectively. Maria Vetrano is a public relations consultant at SEMI.

MEMS technology has changed human interaction with electronic devices. Introduced in the 1990s, the first mass-market MEMS devices were used for inkjet printheads and automotive airbag crash sensors. Today, MEMS are ubiquitous, with billions of the tiny devices adding intelligence and interactivity to smartphones, smart speakers, wearables, automobiles, biomedical devices, remote monitoring and event detection systems, and countless other applications. Integrating MEMS with Flexible Hybrid Electronics (FHE) is an important step in the evolution of this miniaturized intelligent sensing technology, paving the way for its use in new classes of flexible, conformal devices.The integration of the two technologies promises to breed new applications in small form factors but also presents challenges inherent to FHE design and fabrication processes. SEMI’s Nishita Rao caught up with Nathan Pretorius, prototyping and automation engineer, NextFlex, to discuss MEMS-FHE device integration challenges and opportunities ahead of his February 26 presentation, Integrating MEMS Devices in FHE, at FLEX|MEMS Sensors Technical Congress (MSTC) 2020, February 24-27, 2020, at the DoubleTree by Hilton in San Jose, California.Join us at FLEX|MSTC to meet Nathan and other industry influencers advancing innovation in FHE and MEMS sensors. Register now to connect with him at FLEX|MSTC or visit him on LinkedIn.SEMI: Why is integrating MEMS devices into FHE systems important? What new use cases might it enable?Pretorius: The main value proposition of integrating MEMS devices into FHE is that it allows MEMS devices to exist in a different form factor than was possible previously, giving us high-quality MEMS sensors on the flexible and conformable platform of FHE.Ease of application, flexibility, lower cost and rapid iteration on a design are just some of the benefits of FHE devices. And because there are few robust FHE sensors that overlap with MEMS’ capabilities, when you combine the two, you get a lot of compelling uses. That’s why NextFlex is working with agencies and companies to evaluate MEMS’ integration, including using bare MEMS die with microfluidics and promoting new ways of attaching and packaging MEMS die for use with FHE. SEMI: Why is FHE an ideal platform for integrating various types of sensors?Pretorius: MEMS integrated with FHE devices are ideal for rapid design and deployment of data-gathering sensor nodes — which we can iterate for specific applications. A few examples include on-body health monitoring devices for bio-fluids analysis, medical pressure sensors for monitoring blood pressure, and peel-and-stick sensors nodes for infrastructure monitoring. In terms of design and production, FHE devices support rapid prototyping, allowing for instantaneous design-iteration cycles. This speeds design-to-production over traditional rigid PCBs and copper flex because the feedback cycle time between design, manufacturing and testing is shorter, accelerating time to market. What’s exciting about FHE technology is that a variety of sensors or components, including MEMS, can be designed into the base system to easily customize it for a specific application. In addition, our experience shows that when compared to a traditional rigid PCB, an FHE board reduces manufacturing steps and device weight by two-thirds and, perhaps most importantly, converts the device to a thin, conformal shape that makes possible products in new form factors. SEMI: What are the primary challenges to integrating MEMS with FHE? What is NextFlex doing to help device manufacturers address these challenges? Pretorius: There are a few challenges, some of which are device-specific. Most recently, I’ve been focusing on inertial and timing devices, including accelerometers, gyroscopes and resonators. There are a few technical challenges involved in the process of getting the devices from the wafer to an FHE substrate. The wafer processing is very important, especially the dicing and thinning steps. After thinning and dicing, the die is placed onto the FHE substrate. The stresses caused by bonding to the substrate have to be understood and characterized. After placing the die, you then have a calibration step, which is normally performed after the device is packaged. With a MEMS die placed onto directly onto an FHE substrate, calibration then must be done.Finally, the device encapsulation is important, since on an FHE substrate the hard-to-soft material transition is very important to mitigate stresses to rigid component interfaces. We have also been looking at how to work with devices that have damping vents. Flexible encapsulants are inherently more permeable to gases and water vapor than hard encapsulants, so studying the encapsulation of MEMS devices on FHE is another area of interest. NextFlex has been working in a supporting role to evaluate best design practices and best attach and integration methods. In addition to our ongoing collaborative programs, NextFlex is developing the FHE manufacturing ecosystem to include system and component manufacturers and designers, product developers, and materials and equipment providers.SEMI: How do we facilitate closer collaboration between the FHE manufacturing ecosystem and MEMS suppliers such as MEMS device manufacturers, product developers, and materials and equipment providers?Pretorius: It’s important to include manufacturers early in the design process so we can identify challenges up front. That’s why NextFlex spearheads technology road-mapping efforts that include representatives from across the manufacturing ecosystem. We use the roadmaps to prioritize challenges that we can address effectively through collaboration, focusing the industry on solving problems through Project Calls that reveal integration challenges and results from real devices and that tell us how the materials and equipment actually perform with a real device.NextFlex keeps the information flowing, holding quarterly project update webinars to share results. As current devices are optimized for the process in which they will be used, we learn a lot from the project performers who make FHE system demonstrators — and we share that information with the member community. SEMI: Can you point to an example of a successful MEMS-FHE device integration?Pretorius: MEMS-FHE integration is still in the early stages, but we are working on several projects including a DARPA Seedling project for which we have integrated MEMS sensors into FHE systems for testing and evaluation. We plan to continue this work by integrating MEMS and FHE devices using methods that support mass production.SEMI: What would you like FLEX|MSTC attendees to take away from your presentation?Pretorius: We would like to see the FHE community work more closely with MEMS device manufacturers. For example, NextFlex often works with manufacturers to gain access to bare die, which is still a significant hurdle in making devices.The best way to speed things along is to get involved. We encourage FLEX|MSTC attendees to join NextFlex. As a prototyping and automation engineer at NextFlex, Nathan Pretorius explores new print methods for prototyping and automation using novel materials and processes. Pretorius currently focuses on how best to apply software scripting and machine learning to streamline FHE processes. Prior to joining NextFlex, he researched the strengths of roll to roll and screen printing on printed electronics designs, including capacitive touch interfaces, FHE passive component design, and antennas. Nathan holds a Bachelor of Science degree in Graphic Communications from Clemson University. FLEX|MSTC is organized MEMS Sensors Industry Group (MSIG) and FlexTech, SEMI technology communities focused on the growth of MEMS sensors and the flexible electronics supply chain, respectively.Nishita Rao is marketing manager for technology communities at SEMI.

VTT Technical Research Centre of Finland Ltd (VTT) has its sights set high. As a leading global research and development firm , VTT is out to produce bio-interfacing and biodegradable flexible hybrid electronics (FHE) devices that help tackle some of the world’s greatest challenges including environmental degradation and food scarcity.SEMI’s Maria Vetrano interviewed Antti Vasara, president and CEO of VTT Technical Research Centre of Finland, to preview his February 25 keynote, Beyond Flexible Hybrid Electronics: Biodegradable Electronics and Interfacing Bio+Electronics, at FLEX|MEMS Sensors Technical Congress (MSTC) 2020, February 24-27 at the DoubleTree by Hilton in San Jose, California. Join us at FLEX|MSTC to meet Antti and other industry influencers driving innovation in flexible hybrid electronics (FHE) and MEMS sensors. Register now to connect with him at FLEX|MSTC or visit him on LinkedIn.SEMI: What is body-interfacing electronics and what is your vision for bio-interfacing and biodegradable electronics?Vasara: Body-interfacing electronics have existed for decades. Developed in the 1970s, the wireless heart rate monitor is a good example. While continuous heart monitoring with a compact, inexpensive wearable device is widely accessible technology, other bodily parameters, such as cholesterol levels or biomarkers, are diagnosed every time we see a doctor. Establishing a baseline using multiple measurements — before symptoms develop is actually much more effective.That’s where bio-interfacing comes in. Bio-interfacing devices will continuously measure and analyze complex biogenic substances such as sweat, breath, blood and urine. A smart patch for continuous sweat monitoring, for example, would overcome several challenges: supporting electronics functionality in liquid environments, managing the transport of harvested samples to and from the sensor, managing potential contamination, and disposing of samples after measurement.While FHE in principle delivers the right building blocks and is an ideal form factor for a wearable sweat analytics patch, flexible circuits are not ready for out-of-the box interaction with biological matrices. Hence, our mission at VTT is to anticipate and develop the upscaling process know-how required for FHE devices that either interface with biological systems — or that must themselves biodegrade.We’re also focusing on biodegradable electronics because environmentally conscious end-users and manufacturing companies want biodegradable versions of energy-autonomous, label- or sticker-like Internet of Things (IoT) sensors. Typically used for packaging, logistics, environmental monitoring and medical diagnostics applications, these sensors — which have a lifetime of a few days, weeks or months — have become very popular. Unless they are biodegradable, however, they just add to landfill.SEMI: What approaches is VTT using to develop bio-interfacing and biodegradable electronics?Vasara: In our Business Finland-funded ECOtronics project, we are working with our partners to create recyclable and compostable electronics and optics that use renewable resources. For example, devices developed using substrate materials like paper, cardboard or VTT’s in-house-developed nanocellulose films and biopolymer films for environmental monitoring or skin patches can be easily recycled or even biodegrade naturally. Where possible, we use roll-to-roll printing to generate the device circuitry, and on a component level, we have optimized our assembly process towards bare-die component bonding to reduce the overall footprint of non-biodegradable waste per device.SEMI: What use cases do you find most promising and why?Vasara: A prominent example of a single-use test that generates a large amount of waste is the digital pregnancy test. When breaking it down into components, you will find a rigid circuit board with microprocessor, a couple of coin cell batteries, a liquid crystal display, a LED light source and photodiode, and a large chunk of plastic packaging around it. The materials and battery capacity of such a device would be sufficient to run hundreds of pregnancy tests – actually technical overkill.By using printed circuits on biodegradable substrates, bare-die assembled components (ASIC, LED light sources, photo diodes, thin film batteries as power sources) and device packaging composed of biodegradable plastics, we can completely redefine the environmental footprint of single-use tests. We are currently developing a toolbox for our customers to turn their existing conventional test into an ecotronic form factor.Another exciting use case is a sweat sensor that we developed collaboratively with Ali Javey, Ph.D., professor of Electrical Engineering and Computer Sciences, UC Berkeley, and the co-director of Berkeley Sensor and Actuator Center (BSAC). Together with his team, we created a wearable electrochemical sensor for continuous sweat analysis during exercise. With the UC Berkeley group providing the chemistry to monitor N+, K+ ion and hydration levels in sweat over the duration of several hours, VTT delivered the underlying sensor platform, featuring the printed sensor electrodes and sweat harvesting microfluidic channels for fluid management and transport. It’s exciting to see what we can achieve by combining techniques from different disciplines, in this case electrochemistry, printing, packaging and microelectronics.SEMI: How can industry enable the development/manufacture of flexible FHE devices? Where does VTT fit into the ecosystem?Vasara: As many FHE devices target large-volume markets, scalability of manufacturing is key: How can I get from one device (= working prototype) to a handful of devices (= feasibility study), to thousands (= pilot manufacturing), to a million (= mass manufacturing) without compromising the quality of the system’s performance and reliability?Access to upscaling infrastructure is essential for the development of novel FHE devices and methods, but infrastructure is expensive. That’s where our establishment of a roll-to-roll pilot printing line to bridge the gap between laboratory R D and mass manufacturing has proved invaluable. We can provide a unique worldwide upscaling infrastructure for advanced FHE devices, with a strong focus on large-area roll-to-roll processes and hybrid assembly. This service removes our customers’ burden of high infrastructure investment in early development stages and it allows us to guide customers along their development path, from prototype to mass production.Watch our video: VTT pilot manufacturing for diagnostics and wearablesSEMI: Is there anything else that device manufacturers need to know in order to succeed?Vasara: In my eyes, the success of FHE devices eventually depends on several factors: It requires a high degree of automation, well-optimized processes, reliable supply chains, and perhaps most importantly, clear standards and rules for designers to guarantee flawless interoperability of all the different elements on a flexible and hybrid circuit. Let us not forget – we are trying to marry electronics with printing, biology, packaging, microfluidics, injection molding and other fields of expertise.We recently finalized the compilation of a set of design rules for publication in our state-of-the-art overview of printed and hybrid electronics manufacturing methods. You can download the overview, PrintoCent Handbook, for free.SEMI: What would you like FLEX|MSTC attendees to take away from your presentation?Vasara: The latest technologies and innovations in microelectronics, MEMS, printing, materials, and biosensors provide us a toolbox for true innovation in the FHE space. Now we need cross-disciplinary thinking and daring steps to combine different manufacturing methods and skill-sets. The ideal cross-disciplinary team might include: The printing engineer who knows how to design contact pads for a bare-die IC assembly The biologist who knows about the thermal and mechanical stress in a printing environment to design processes for bio-functionalization of surfaces The electronics engineer who knows how to optimize a circuit powered with an enzymatic biofuel cell The number of sensors deployed on (or inside) our body, in our drinking water, in our cars, on our fields, in our pets, and everyday products will surely grow. Let us make sure they leave the smallest environmental footprint possible.Antti Vasara, Ph.D. has been the president and CEO of VTT Ltd since 2015. VTT is a visionary research, development and innovation partner with over 2000 people and a turnover exceeding 250M EURO. Vasara is president of EARTO (European Association of Research and Technology Organisations) and is chairman of the board of Palta (Finnish Service Sector Employers). In addition, he is a non-executive director of Elisa Oyj (largest communications operator in Finland) and a board member at EK (Finnish Confederation of Industries).He has served on several high-profile groups on industrial and innovation policy of the European Commission, in addition to several groups in Finland on artificial intelligence and research policy. Previously, Vasara spent close to 25 years in private industry, working at Nokia, Tieto, SmartTrust and McKinsey Company. Earlier in his career, he was a researcher in optical communications with 20+ peer-reviewed articles and one international patent. Vasara holds a Doctor of Science (Technology) degree from Aalto University in Finland.For more information about VTT’s work in bio-interfacing and biodegradable FHE devices, visit VTT Research. FLEX|MSTC is organized MEMS Sensors Industry Group (MSIG) and FlexTech, SEMI technology communities focused on the growth of MEMS sensors and the flexible electronics supply chain, respectively.Maria Vetrano is a public relations consultant at SEMI.

Photo on left: My Skin Track pH by L'Oréal Group’s La Roche-Posay – the first wearable sensor and companion app to easily measure personal skin pH levels – leverages two decades of microfluidic and soft materials research in Professor John Rogers’ laboratory at the Center for Bio-Integrated Electronics and the Simpson Querrey Institute. As director of the Center for Bio-Integrated Electronics at Northwestern University, Professor John A. Rogers explores soft materials for conformal electronics, nanophotonic structures, microfluidic devices and MEMS, all with an emphasis on bio-inspired and bio-integrated technologies. During his keynote at FLEX and MEMS Sensors Technical Congress 2019, February 18-21 in Monterey, Calif., Rogers will present examples of the diverse, novel classes of biocompatible electronic and microfluidic systems with skin-like physical properties that stem from his work in materials science, mechanical engineering, electrical engineering and advanced manufacturing. SEMI’s Maria Vetrano caught up with Rogers to discuss his research, which has already been commercialized by companies such as L'Oréal Group.SEMI: What is the concept behind skin-interfaced electronic and microfluidic devices?ROGERS: Biological systems are mechanically soft, with complex, time-dependent 3D curvilinear shapes. Modern electronic and microfluidic technologies are rigid, with simple, static 2D layouts. We believe that eliminating this profound mismatch in physical properties will create vast opportunities in microsystems technologies (electronics, optoelectronics, microfluidics and microelectromechanical devices) that can intimately integrate with the human body for diagnostic, therapeutic or surgical functions. Skin-like devices that assess blood-glucose levels in real-time or continuously monitor the vital signs of infants in neonatal intensive care are just two examples of non-invasive, wirelessly connected biocompatible devices with the potential to dramatically improve quality of life.SEMI: What are some examples of commercially available biocompatible/microfluidic wearables that have leveraged your research?ROGERS: We’ve been fortunate in that we have been able to translate some of our ideas into commercial products for broad deployment in both life-enhancing and potentially life-saving applications. In sports and fitness, our skin-interfaced microfluidic systems form the basis of soft devices that capture, store and perform in-situ chemical analysis of sweat. These devices have been launched as products in two different categories – cosmetics and athletics – with two global brands. As an example of the former, L’Oréal Group just unveiled at CES 2019 My Skin Track pH, a thin, flexible version of this technology, designed to determine skin pH from measurement of sweat pH. Once armed with this information, L’Oréal customers can choose skincare products matched to their personal body chemistry. See the video on this device. Notably, a globally recognized consumer brand will reveal a product for athletics around the time of the 2019 Super Bowl on Sunday, February 3. A look inside My Skin Track pH, which uses Rogers Research Group technology from the Center for Bio-Integrated Electronics at Northwestern University Our technologies also have applications in clinical medicine and rehabilitation, including soft, skin-interfaced wireless sensors used to assess patient progress in stroke rehabilitation. In contrast with conventional, wired sensors that tether the patient to external boxes of electronics (a design that makes such devices impractical for in-home use), or conventional wearables that are confined to the wrist, our systems apply to the skin like a BAND-AID, and are described as “imperceptible” by stroke patients who are using them during rehab. These platforms measure speech, swallowing capability, movement of limbs, sleep quality, walking and balancing. Healthcare professionals can use the information collected to continue to monitor patients when they leave medical facilities, to understand how patients function in the real world. See video.SEMI: What work are you doing beyond flexible devices?ROGERS: We are pursuing devices that are unique not due to their soft mechanics, but due to their extremely small sizes. A good example is My Skin Track UV, which we recently commercialized with L’Oréal’s La Roche-Posay. This millimeter-scale, wireless, battery-free platform for digital UV dosimetry measures UV exposure dose continuously in real time and provides user access to this information via a smartphone app. My Skin Track UV is now available at all Apple stores across the U.S. and through the Apple website. See video. L’Oréal’s La Roche-Posay My Skin Track UVOther biocompatible/microfluidic devices based on our technology provide functionality that can save lives. Hydrocephalus patients suffer from a condition that, if unchecked, leads to excessive buildup of fluid in the brain. If left untreated, the resulting pressures can prove fatal.Hydrocephalus is treated with shunts, which drain accumulated fluid away from the intracranial space to a distal part of the body, often the abdomen. Unfortunately, however, shunts have a nearly 100 percent fail rate over a 10-year period, and testing them typically requires an MRI, CT scan or even surgery. Our technology serves as the basis of a bandage-sized, skin-like sensor that applies to the surface of the skin on the neck. Within five minutes of placement on the skin, the sensor can test non-invasively to determine if fluid is flowing through the shunt. The net result uniquely supports the rapid evaluation of shunts from home or other non-medical settings. The devices free patients from the constraints of hospitals, giving them a greater sense of security and independence. See video. SEMI: What would you like FLEX and MSTC attendees to take away from your presentation?ROGERS: I would like attendees to know that biocompatible microfluidic and electronic wearables that are flexible and conformal to the human body are no longer risky futuristic technologies that exist only in academic labs: They are emerging right now as key products in commercial markets for flexible hybrid electronics (FHE) and MEMS/sensors. Our group alone is anticipating deployment at the scale of tens to hundreds of millions of units in the markets in which we are seeing traction over the next five years. We believe that the broader area will become a multi-billion-dollar market opportunity in five to 10 years.John Rogers, Ph.D. will present Soft Electronic and Microfluidic Systems for the Skin at FLEX/MSTC on Tuesday, February 19 at 10:30 am.Register today to connect with him at the event. To learn more about Rogers Research Group, click here.MSTC Flex 2019 is organized by the MEMS Sensors Industry Group (MSIG) and FlexTech.Maria Vetrano is a public relations consultant at SEMI.

Peel-and-stick simplicity isn’t just for adhesive bandages any more. IoT and flexible hybrid electronics (FHE) are bound to change hardware business models. And flexible displays will breathe life into any surface.These were among the insights foreshadowing the future of the FHE, electronic textiles, IoT, MEMS and sensors industries at the FLEX Japan and MEMS Sensors Forum Japan 2018. At the April event, organized by SEMI-FlexTech-MSIG, nearly 200 attendees shared their observations and lessons learned in the development of processes, products and applications. Presentations and discussions revealed these five takeaways.1. Expect the unexpected with FHE developmentFlexible Hybrid Electronics (FHE) continues to shrink the size and weight of products, enabling new markets and concepts. “FHE takes printed electronics and adds ICs for getting performance out of the PE structure,” said Wilfried Bair of NextFlex, adding that “peel- and-stick electronic products are one example of unexpected new markets enabled by FHE capabilities.” One potential application is large peel-and-stick safety sensors adhered to buildings to warn of structural dangers.Another surprising turn: With new insights into OLED technology originally developed for flexible displays, Cambridge Display Technology (CDT) has devised an innovative medical diagnostic tool for markets such as biomedical and agricultural monitoring. The tool features an atmosphere-processable OLED component with a simplified OLED structure encapsulated in aluminum foil.2. IoT and FHE devices should change hardware business modelsThis is the standard business model for many new FHE products: develop a product, manufacture it, find customers and sell. FHE and IOT device developers were encouraged by Jam Kahn of Gemalto to consider flipping the script: During FHE product development, explore building an after-market revenue stream by controlling and mining the data for trends it reveals. Because of its data harvesting potential, IoT is an excellent emerging technology for this strategy.The “Experience Economy” could create 200 connectable items per person, generating strong revenue streams from the collection and analysis of massive amounts of sensor-generated data. The key is for the data to be actionable. That means hardware suppliers must extend their focus to software development. “A recent study of California investors found that by 2025, 60 percent of global business profits will be from data,“ noted Harri Kopola of VTT, who advised hardware producers to examine business models that produce continuous value by leveraging software. “With FHE, we are creating the path to digitization for non-digital industries, and these industries need complete solutions,” he said.Hardware provider Xenoma, for example, sells an electronic shirt with sensors for measuring muscle movements, heart rate and other health-related data. Xenoma’s Ichiro Amimori said the company offers its open-source software development kit for free under one condition: The developer must share the collection data with Xenoma. The idea is that the more data collected, the greater Xenoma’s ability to improve human health over the long term and achieve its long-term vision of alleviating disease.3. Roll-to-roll and sheet-to-sheet manufacturing will meet in the middleOne of the big advantages of flexible and printed electronics was its promise to enable the manufacturing of electronics on a roll-to-roll (R2R) process in atmospheric (or close) conditions, like newspaper, rather than one sheet at a time, as with displays or wafers. But as development of inks and interconnects progressed, along with the placement of discrete and thinned-die components and basic flexible substrates on a moving web, most research and development (R D) and limited-production runs moved to sheet-fed systems to control material costs for experiments and low-volume production. R D on printing electronics processes split into two camps: the simple printed components camp on R2R, and the camp backing more flexible hybrid electronics development on a sheet-by-sheet basis. But progress didn’t stop.Harri Kopola of VTT highlighted new R2R inspection and test capabilities in the VTT pilot line in Finland. R2R processing advances incorporate ideas from biology, chemistry, optics, optoelectronics, advanced inspection and test capability, illustrating the multidisciplinary nature of FHE. While accurate, high-speed, pick and place of thinned, bare die remains the domain of sheet-to-sheet manufacturing, look for more improvements in accuracy and speed.Another new manufacturing concept that turns business models on their heads – “minimal fabs” – focuses on creating limited-run equipment and processes that use 3D printing and do not require cleanrooms. With a relatively low cost of entry, the approach enables electronics to be produced affordably anywhere.4. Powering the IoT is a grand challengeThe requirement for edge devices to function without intervention for long periods raises hard questions about how to power the devices. Using organic photovoltaics (OPV) in textiles to harvest energy from light could be one solution, according to Kasimaesttro Sugino of the Suminoe Textile Technical Center. ULVAC’s answer to the IoT power issue are requirements for edge device micro-batteries to be environmentally benign, safe, flexible and compatible with semiconductor processing less than .1 mm in height. The micro-batteries must also feature a long life and support continuous power output, high power density, low self-discharge (over 10 years) and mass production, said Shunsuke Sasaki of ULVAC. The batteries are being built on silicon, glass and stainless steel with dry, thin-film vacuum processing. 5. Flexible displays bring any surface to lifeWith their durability, flexibility, low-cost processing and programmability, flexible displays can transform any surface into a content-rich display with messages that make lives healthier, simpler and safer.One example is FlexEnable’s organic thin-film transistor (OTFT), a device made possible not only by recent advances such as the ability to build organic material transistors on plastic and the increasing clarity of new film materials but by continuous manufacturing process improvements. These advances are improving switching times and the color and video capabilities of thin-film transistors while retaining their flexibility, low power consumption and communication capabilities. Simon Jone of FlexEnable gave the examples of wrapping a display around the blind spots of automobiles or replacing side-view mirrors with interior monitors showing feeds from an external camera, approaches that would improve safety while reducing wind drag and increasing fuel efficiency.E Ink’s reflective technology and flexible products are coming to market with a wider color spectrum. The company’s Michael McCreary said its designers are specifying the panels for innovative projects such as the exterior walls of the San Diego International Airport parking garage. Used to communicate with airport visitors, the installation is weather-proof, programmable and self-powered.