electronics

In a recent panel discussion, CARIAD SE, a Volkswagen Group company, Entegris, and SEMI shared their perspectives on how the automaker and other members of the automotive electronics ecosystem can collaborate to address new challenges facing the automotive industry.

Electronics innovation is inching tantalizingly closer to the day when treating neurological disorders such as epilepsy and migraine could be as easy and convenient as dropping into a medical clinic for a minor medical procedure – brain surgery. What today is highly invasive surgery promises to be reduced to a doctor’s office visit as chip engineers work to tether the delicate, complex neurochemical workings of the human brain to the hard wiring of electronics. The goal is to use electrical stimulation to trigger the release of therapeutic doses of natural brain chemicals using small implantable devices in order to restore normal brain functioning, reduce human suffering and help slash the financial burden to economies around the world. The advances come as neurological disorders remain the leading cause of disability worldwide, afflicting up to 1 billion people, a number projected to rise sharply in the years to come, according to the World Health Organization. In 2015, conditions including dementia, epilepsy, multiple sclerosis, Parkinson’s disease and stroke accounted for more than 94 million disability-adjusted life years (DALYS), the number lost globally to ill-health, disability or early death – a total expected to swell to over 103 million by 2030. In the U.S. alone, brain diseases cost nearly $800 billion each year, according to a paper published in the Annals of Neurology in 2017. Bioelectronics Innovation Outpaces Drug Development The trendlines are heightening the urgency to develop new, effective medical treatments, yet traditional drug development alone may not be able to keep pace: The journey to create drugs ready for pick-up at your local pharmacy takes, on average, 10 years from the time they are hatched in the lab. “Unfortunately, pharma is unlikely to help address this problem because drug discovery is becoming slower and more expensive,” George Malliaras, Prince Philip Professor of Technology at the University of Cambridge, noted in his presentation, Electronics on the Brain, at last month’s virtual FLEX 2021 conference. In marked contrast, microelectronics are “becoming cheaper and faster every year.” Dating back to the 1950s with the development of implantable pacemakers to re-establish normal heart rhythms, bioelectronics medicine could help demystify how the brain processes information and lead to more effective treatments for neurological disorders. The field has come a long way since devising cochlear implants to treat hearing impairments in the 1970s, designing spinal cord stimulators to relieve chronic pain in the 1980s and targeting the brain with electrical impulses to help relieve Parkinson’s disease symptoms and neuropsychiatric disorders in the 2000s. ​Deep Brain Stimulation Implants Help Treat Neurological Disorders Deep brain stimulation involves implanting electrodes in the brain through small holes in the skull to send electrical impulses to specific target areas. Used in the U.S. since 1997 to treat Parkinson’s disease, deep brain stimulation can improve motor skills in patients suffering from other conditions too such as dystonia, tremors and epilepsy, enabling them to “function normally, with the flip of a switch,” Malliaras said. Researchers are even testing the technology to treat autoimmune and other disorders not originating in the brain. But the large, rigid electrodes used in the surgery are hostile to the soft, subtle confines of the brain. What’s more, implanting the devices is invasive, with multiple follow-up surgeries typically needed to replace batteries, reposition electrodes or replace deteriorating electrical leads. To overcome these drawbacks, engineers are now designing electronics that can process complex neurological signals to treat brain disorders while conforming to its soft tissue. Malliaras said that means developing electronics capable of interacting with the diverse chemicals the brain uses to bridge the tiny gaps between neurons, called synapses, in order to transmit the neurochemical impulses that give rise to thinking and behavior. Mixed Conductors Form Key Connection Between Electronics and Brain Mixed conductors, materials that can transmit brain signals both ionically and electrically, promise to form this key connection by enabling the development of high-resolution cortical electrodes that monitor neurons without penetrating the brain. They’re also a springboard to the development of flexible pin-sized electronic devices that make neurosurgery much less invasive. That brings new hope for more effective treatments of neurological disorders like epilepsy. Traditionally, the first line of defense against seizures has been antiepileptic drugs, an ineffective treatment since 30% of patients are resistant to the medications, Malliaras said. Another drawback are side effects that include short-term memory loss, fatigue, blurred vision, speech impairments dizziness, nausea and weight loss. Resective surgery – disconnecting the diseased portion of the brain that causes seizures – is often the next option, but is not possible in cases when the procedure would risk damaging circuitry that controls cognition and behavior. Flexible Substrates Fuel Development of Tiny, Expandable Bioelectronics Devices With recent advances, studies on lab rats show that the miniature electrodes designed using flexible substrates made possible by photolithography can conform to the brain’s curvatures and creases to measure the slight electrical signals emitted by individual neurons without penetrating brain tissue and deliver drugs to prevent seizures in animals. Measuring just micrometers in width, these horseshoe-shaped microfluidic devices can pump GABA, a natural neurotransmitter that acts as a brake against neuronal excitability throughout the nervous system, through their minute perforations into the ion exchange membrane of the brain to prevent epileptic seizures. “The data from the research is very exciting, but the path to the clinic is long,” Malliaras said. Still, the findings are a step forward in better understanding the brain and treating its pathologies. Today, microfluidic devices are under development to localize drug delivery in order to bypass the blood-brain barrier and destroy remaining brain cancer cells after a tumor is removed. The devices promise not only to improve cancer treatment since a broad array of cancer drugs can’t cross the protective barrier, but to enable doctors to administer cancer-fighting drugs in smaller doses to help reduce side effects. Implantable electronics today are used to bring relief to sufferers of chronic pain. However, the sizeable paddle-type electrodes involve invasive surgery under general anesthesia and a hospital stay of a few days. An alternative is to implant smaller flexible devices through an outpatient spinal tap with local anesthesia, an approach with its own disadvantages. The devices are less efficient than paddles in delivering electrical stimulation and tend to shift position as the body moves, so are seen as an unreliable solution. That leaves patients to choose between an effective treatment requiring invasive surgery and a less intrusive but less effective alternative. One promising solution combines bioelectronics with soft robotics to enable expandable implants containing microfluidic channels that can be activated mechanically. The device’s malleable paddle electrode can be rolled up inside a needle, inserted with a final tap and then pneumatically unrolled for treatment. While the device so far has been tested only on human cadavers, it could spur the design of a broader category of expandable microfluidics devices that minimize the invasiveness of neurosurgery and get patients back on their feet sooner. The tiny flexible electronics could be available to veterinarians to treat dogs in as soon as next year, Malliaras said, and “hopefully someday in the not-to-distant future they’ll be used to treat human patients.” Michael Hall is a marketing communications manager at SEMI.

For the first time in its 20-year history, the FLEX Conference dedicated an entire session to the important and timely twin topics of environmental sustainability and power consumption of electronic devices. The event planning committee recognized the urgent need to increase the awareness of how technology and electronics devices can help reduce greenhouse gas emissions (GGE) overall and meet aggressive targets to curb the impacts of climate change. Dr. Christine Ho, CEO of Imprint Energy, delivered the keynote for the session, focusing on the need for powering billions of sensors that will be deployed annually, and their role in reducing fossil fuel emissions through becoming aware of issues, monitoring our resources over time, and intervening early and often to combat waste in multiple sectors and industry. Quoting extensively from the organization Exponential Roadmap Initiative (ERI), Ho noted that “the digital sector has the potential to directly reduce fossil fuel emissions 15% by 2030 and indirectly support a further reduction of 35% by influencing consumer and business decisions and systems transformation.” The initiative’s playbook for reaching net zero carbon emissions by 2050 and limiting global warming to 1.5° Celsius outlines how the digital sector can help remove 13 of the 27 gigatons (GT) of CO2 needed to reach this goal. Ho stated that the rapidly emerging Internet of Things (IoT), devices, software systems, and data insights are the backbone of this digital transformation. The IoT's vast network of sensors can transform multiple sectors, such as the logistics industry, which on an annual basis moves and ships more than 10 billion tons of products worldwide by ships, airplanes, long haul trucks, and train - contributing 17% of GGE and more than 4 gigatons of CO2 annually. Always-connected IoT sensors used by the logistics industry can reduce waste and damage in the supply chain, which is especially problematic for temperature-sensitive and damage prone pharmaceutical and food products, mitigating the need for producing high volumes of buffer inventory to replace damaged goods Noting that the attendees of 20 Years of FLEX Conferences were a big part of the current advancements of low-cost printed, active, shipping tags, Ho said that Imprint Energy’s flexible and thin, Zinc based batteries are ideal for IoT devices, since they boast a significantly smaller carbon footprint than Lithium-Ion (Li-ion) batteries. Imprint Energy is working with systems designers and integrators to design the battery as an integral part of the device package and use low-power strategies to extend device lifetimes. Imprint recommends co-locating battery printing alongside the device integration to further minimize shipping and logistics. When manufactured separately, Imprint’s small footprint, low-operating temperature process line (less than 80°C) provides significant carbon footprint advantages over other technologies. Ho challenged the attendees, saying “we all need to participate in protecting our earth. We need to eliminate waste and contribute to reducing half of our current greenhouse gas emissions by 2030, and we can do that by deploying a global digital skin with more than 100 billion IoT devices in 2030 and up to 1 trillion by 2050. We can minimize the device carbon footprint and maximize its longevity by considering the power capability, as well as design for re-use and re-cycling of the critical materials.” Following Dr. Ho’s presentation, FLEX kicked off a spirited panel discussion with experts from PowerRox, ITN Energy Systems, Birla Carbon, and Auburn University and chaired by Bob Praino and Eric Forsythe, from Chasm Advanced Materials and the Army Research Labs, respectively. The speakers summarized their on-demand presentations and looked at what is being done today to recycle Lithium-Ion batteries, how IoT devices are currently being powered, and drew comparisons between the early days of the Internet and development of the IoT. The speakers generally agreed that the power requirements of wireless cellular and Blue-tooth devices were still too high and run times too short. FLEX 2021 was a virtual event in the 2021 SEMI Technology Series. It was organized by SEMI FlexTech, SEMI NBMC, and NextFlex. Major sponsors included E Ink and Novacentrix. The event covered technical developments in flexible, printed and hybrid electronics, featuring more than 100 presentations and networking opportunities. Technical proceedings are available until March 26 at http://flex.semi.org. Heidi Hoffman is senior director in Corporate Marketing at SEMI.

Europe is facing an acute shortage of skilled microelectronics workers that undermines the growth potential of not only the electronics industry but the European economy as a whole. Nearly 1.1 million job advertisements for electro-engineering workers were placed in the EU between mid-2018 and the end of 2019 (CEDEFOP, 2020). The shortfall looms large as a skilled and diverse workforce that can continuously innovate is the oxygen of microelectronics. In light of the critical importance of microelectronics to Europe’s ability to fulfill its growth potential, SEMI Europe participated in the high-level roundtable hosted by Commissioner Nicolas Schmit and Commissioner Thierry Breton on October 5. The discussion’s key takeaway: The skills challenge facing the microelectronics industry is too complex for one organization to tackle, and reskilling and upskilling its workforce should be a common priority for Europe. Only with a diverse, substantial and skilled microelectronics workforce can Europe achieve its R D, design and manufacturing ambitions while ensuring its sovereignty in the digital age. The roundtable highlighted the EU Pact for Skills as a key means to narrow the industry’s skills gap.An ever-growing part of our lives, microelectronics, with their ability to run billions of computations per second and store vast quantities of data, are the brains of modern technology. The digital sovereignty of nations around the world today relies on advanced microprocessors to collect, transfer, analyze and store immense amounts of data used in key end-user sectors such as mobility, telecommunications, energy, security and healthcare. Information and communication technologies (ICT) enabled by microelectronics are helping much of the world’s population to work and study from home and remain safe during the COVID-19 pandemic.According to the Smarter2030 Report, further deployment of ICT, including electronic components in critical sectors such as transportation, manufacturing, agriculture, construction and energy, could eliminate the equivalent of 12.1 billion tons of CO2 per year globally. These are some of the reasons why nations worldwide are making large-scale investments to advance a homegrown microelectronics R D, design and manufacturing base. It is no surprise, then, that semiconductors are now at the center of the so-called global techno-trade wars.Clearly, Europe urgently needs to mobilize and pool resources to develop effective lifelong learning programs for all workers and continue investing in microelectronics innovation. We need to instill the passion for creating technology among current and future workforce, in particular women and people with challenged backgrounds, and build a highly diverse talent pool. Working together, we can better demonstrate how computing technologies, including quantum, high-performance and edge AI, provide solutions to grand societal challenges and attract talented people to the fascinating world of electronic components and systems.Against this backdrop, the microelectronics industry finds the Pact for Skills very timely and crucial to advancing the talent pool underpinning Europe’s deep digital ecosystem. The Pact will play an instrumental role in improving the scope and the quality of training partnerships at regional, national and European levels, sharing best practices and helping the microelectronics industry and workforce adapt to the effects of COVID-19.The microelectronics industry is committed to building on the momentum created by the METIS Erasmus+ collaborative project and to mobilizing our ecosystem and education partners for a successful Pact for Skills in Microelectronics starting this year.The High-Level Roundtable: Skills for Microelectronics was hosted by Commissioner Thierry Breton and Commissioner Nicolas Schmit. Participants included Paul Boudre, CEO, SOITEC; Lars Reger, CEO Germany and CTO, NXP; Frits van Hout, Executive Vice-President and Chief Strategy Officer, ASML; Françoise Chombar, CEO, Melexis; Emmanuel Sabonnadiere, CEO, CEA-Leti; Luc Van den hove, President and CEO, imec; Sabine Nietzsche, Board member, Silicon Saxony and Vice President, GlobalFoundries; Laith Altimime, President, SEMI Europe (coordinator of METIS); Yolande Berbers, President, European Society for Engineering Education (SEFI); James Calleja, President, European Forum for Technical Vocational Education and Training (EFVET); Ludovic Voet, Confederal Secretary, European Trade Union Confederation (ETUC).Emir Demircan is director of Advocacy and Public Policy at SEMI Europe. To learn more about SEMI Europe advocacy, contact Emir at [email protected].

As the semiconductor industry continues to grapple with the widespread effects of the COVID pandemic, at the SEMI Foundation we continue to build programs and initiatives that inspire the next generation of STEM workers and drive new and diverse talent to all of our member companies.Our work to build out the semiconductor workforce centers on creating more diversity, equity, and inclusion within the industry. We want everyone to win. We want students and workers to benefit from these excellent jobs. We want our industry to diversify to increase our productivity, innovation, and our bottom lines. And we want to fulfill the extraordinary potential of electronics to help people around the world in the way they work and live. COVID-19 is hitting certain populations – women, veterans, and Black, Indigenous and other people of color – particularly hard, so our work has never been more timely or important for local communities and the global economy.To that end, we’re going big by generating funding and designing initiatives that will benefit the industry over the long term. The SEMI Foundation’s SEMI VetWorks Program, currently in development, will help U.S. veterans better understand our industry, the careers available to them, and how their skills will transfer to working in microelectronics. The program also provides training portals and mentorship support to smooth their transition to the industry.We’re also working to fund our Women In Industry Network, a major new initiative designed with national partners to significantly increase the representation of women, who today account for just 10-25% of the semiconductor workforce across all roles and functions. What’s more, the SEMI Foundation’s global industry image and awareness campaign is inspiring more young people to enter high-school and university STEM programs and ultimately pursue careers in microelectronics while encouraging current workers to re-skill or up-skill and join the tech workforce.Meanwhile, your High Tech U team continues to connect semiconductor companies with students all over the globe. While we’re eager to get back on the road to meet and inspire students in person, we are excited to provide updates about two of our programs:HTU in the ClassroomWith the transition to online and hybrid learning classrooms, we seized the opportunity to combine STEM activities from SEMI High Tech U with discussion sessions and other projects to help students explore and deepen their understanding of the semiconductor manufacturing process. The 16-week pilot program, called HTU in the Classroom, will launch late next year to introduce high-school students to four key areas of chip production: patterning and layering, the chemistry involved in photolithography, logic gate systems, and computational thinking. These interviews with SEMI member companies will give students a chance to share their new knowledge gained from the class and to ask questions about what life is really like as an engineer, HR professional, or manager in industry.From Sand to SiliconWith silicon the lifeblood of our industry, it is impossible to understand what makes the semiconductor/microelectronics industry tick without knowing more about the companies, processes and technologies that all make it possible. That’s why we are developing a self-guided online journey through the chip manufacturing process for students and educators. This will go beyond reading like a Wikipedia site. Instead, the learning and exploration will feature interactive elements including company videos and links to resources such as fact sheets as well as university and company websites. At each stage, students will get details about the companies and individuals who do the work and the paths the professionals followed to these roles. The big-picture look will show how all the production stages come together to build working devices that power everything from smartphones to data centers.The SEMI Foundation is grateful for your support and partnership as we all work through these unprecedented times and roll out new programs to help build the talent pipeline. To learn more about or support our workforce development programs, please contact Shari Liss, SEMI Foundation’s Executive Director, at [email protected].

Solving challenges in semiconductor manufacturing requires an ongoing collaborative effort by customers, device makers, equipment and materials suppliers, and academia. ASMC 2021 will continue efforts to help the industry overcome these hurdles. To that end, we are now soliciting abstracts from industry experts across all areas of semiconductor manufacturing for presentations at the event, May 3-6, 2021 at the Saratoga Hilton/Saratoga Springs City Center in Saratoga Springs, New York.The conference provides an unparalleled platform for semiconductor professionals to network and learn the latest information in the practical application of advanced manufacturing strategies and methodologies. ASMC 2021 will be co-chaired by Ishtiaq Ahsan, Ph.D. of IBM Research and Alexa Greer of KLA.We’re looking for presentations in topic areas including the following: Advanced Metrology Advanced Equipment Processes and Materials Contamination Free Manufacturing Big Data Management and Mining Defect Inspection and Reduction Equipment Optimization Factory Automation Industrial Engineering Smart Manufacturing Yield Methodologies Click here to submit an abstract for a technical presentation. Provide an extended abstract of no more than two pages (max. of 1000 words, MS Word or PDF) with supporting data, charts, figures embedded in the last page. See author kit for details. Summarize the topic and theme in as much detail as allowed by the word count limitation. Include title, author(s), company affiliation(s), contact information, topic and five key words describing the work. The final technical manuscript must show a complete set of data to support initial abstract. Here are key deadlines and dates for industry experts to keep in mind: Abstracts Due: October 30, 2020 Author Notification: December 15, 2020 Manuscripts Due: February 9, 2021 Final Manuscripts Due: April 6, 2021 Presentations Due: April 20, 2021 Conference Dates: May 3-6, 2021 ASMC 2021 could be held as a virtual event depending on progress in containing COVID-19. Whether the event is on-site or virtual, all abstracts accepted for presentation will be published by IEEE. Speakers should be prepared to present live or online.Speakers also may be invited to publish their papers in a special section of ASMC 2021, which will be featured in IEEE Transactions on Semiconductor Manufacturing. All technical presentations will be considered for the ASMC Best Paper Award sponsored by Entegris. Students presenting an oral paper or poster will be considered for the ASMC Best Student Paper Award sponsored by GLOBALFOUNDRIES.For a complete overview of topics and other information, please visit the ASMC 2021 Call for Papers web page.Margaret Kindling is senior manager of Programs for SEMI Americas.

Even though microchips continue to get smarter, vital security gaps continue to be exposed through such hack attacks as Meltdown, Spectre, and in recent weeks, Plundervolt. Researchers continue to discover open doors in chip architectures for malicious players to steal increasingly sensitive data, hide the identity of counterfeits, or tamper with electronics systems most anywhere along the global microelectronics supply chain. Today, it’s impossible to have full visibility of the distributed chip making process – from design and fabrication to packaging, testing and delivery. That’s why our industry’s future hinges to a large degree on establishing a hardware root of trust throughout the silicon’s operational lifecycle. Trust but verify! It’s easy to say, but how do we do it?To gain insights, SEMI interviewed Dr. Mark Tehranipoor, currently the Intel Charles E. Young Preeminence Endowed Chair Professor in Cybersecurity at the University of Florida’s Electrical and Computer Engineering Department. A foremost authority on microelectronics security and trust, counterfeit electronics detection, and supply chain risk management, Dr. Tehranipoor will be a keynote speaker at the SEMICON Taiwan Security on Chip Summit, Friday, September 25, where a full program of industry leaders will address key security challenges and solutions involving IoT, systems on a chip (SoCs), integrated circuits, physical unclonable function (PUF) technology, future design, certifications, managed services, and more.For additional insights and to hear Dr. Tehranipoor’s full presentation, register for SEMICON Taiwan 2020, which SEMI is holding as a hybrid event with both a virtual format and an in-show program September 23-25.SEMI: What are the major uncertainties in providing the hardware root of trust within the cyber domain?Tehranipoor: One of the most critical issues we’re dealing with now is loss of control over the process of designing and fabricating integrated circuits and systems. This has happened along with globalization and the movement of supply chain operations overseas to lower costs of nearly all goods, including electronics products and semiconductors. As skill sets, talent, design and fabrication have all shifted offshore, concerns have also risen about security controls across the many different segments of the microelectronics supply chain.For example, when you think about the security of military, space, transportation, power grids, financial or other networks, it becomes a major concern if you cannot trust the underlying electronics system that runs them. New SoCs are also holding more sensitive data around encryption keys, biometrics, personal information or banking data. And as reports escalate about cybersecurity gaps at the electronics part level, it’s increasingly important to establish a hardware root of trust. Today, it’s not enough for a buyer to just call up the design house and verify the electronic ID of an asset. The ID might match, but the device could have been tampered with or replaced with a counterfeit somewhere along its end-to-end journey. Unlike software or networks where problems can be automatically identified, upgraded and fixed, verifying electronic hardware is a costly and time-consuming process, especially when they’re as complex as microchips. It can take months to deconstruct, reverse engineer, inspect, and authenticate a chip. By then, discovery of any security breaches is too late.When addressing the security of electronics systems, there are three important features to keep in mind. First, there’s confidentiality. The device shouldn’t leak information to an unauthorized user. Second, there’s integrity. Unauthorized users should not be able to manipulate an SoC’s sensitive data. The third feature is availability, which can be a result of Denial of Service (DoS) attacks. If the device is under attack and can’t access your online service or network, you must still have security measures for your electronics system to be available in a safe mode while you simultaneously identify the problem, recover from it, and return to normal functions.SEMI: What framework should be followed to establish greater trust and confidence across the entire microelectronics supply chain?Tehranipoor: In the United States, we recognize it may not be possible to bring all manufacturing, design, and delivery teams back to this country and have them certified by the U.S. Department of Defense. You could do some of it, but it would be very costly and complex to bring back all the design, fab, testing, and packaging operations involved with electronics systems and still have complete control.The most practical approach is to make sure we design electronic systems with security and trust in mind from the start. We need to provide security features up front throughout the extended supply chain – into the design flow, fab flow, and out into the field to make it easier and faster for anyone at any point to verify the authenticity of an electronic system as well as identify and mitigate a problem. Finally, we have to remember that we are all in this together – designers, developers, packaging facilities and fabs. We can’t just blame semiconductor manufacturers or any other single entity. As a result, we must be cooperative and collaborative by focusing on this issue as a consortium. Everyone in this ecosystem must come to the table, share best practices, establish standards, and initiate best practices for device to system authentication.SEMI: How can SEMI and the SEMI Electronic System Design (ESD) Alliance help the industry meet these challenges?Tehranipoor: It’s certainly of utmost importance for members of organizations like SEMI and its ESD Alliance committees to jointly develop and adhere to standards or guidelines that establish hardware root of trust across all participants in the global supply chain. At the same time, such alliances should make it a high priority to protect each company’s intellectual property (IP). Collectively, we need resolutions that allow us to develop unique IPs and more easily trace, identify, and verify the authenticity of electronics systems as they flow throughout the end-to-end electronic supply chain. Great efforts are under way and progress is being made. But it’s not enough. Clearly, more needs to be done to establish root of trust standards at the chip level.I can’t emphasize enough the importance of consortia like the SEMI ESD Alliance to create an environment where industry, government, and academia can come together, share best practices and even case studies on how they handled security vulnerabilities and breaches. We understand that not everyone wants to share their security problems, vulnerabilities, or attack surfaces, but learning from each other’s experiences can have a tremendous impact on industrywide progress. If you don’t know what you need to address, you won’t be able to address it when it happens.I also encourage organizations like SEMI to create standards or guidelines that reduce the complexity of microchip designs for security purposes. Realtors often say there are three things to consider in finding a home that will appreciate in value: Location, location, location. To build more secure electronics systems, my mantra is: Automation, automation, automation. Complexity is the enemy of security. By using automation to simplify security mechanisms and detect inconsistencies, it will be easier to find and fix security problems, not to mention lower costs at the same time. SEMI: What will an attendee take away from your talk at SEMICON Taiwan?Tehranipoor: I have a large team of researchers who day and night spot vulnerabilities by attacking and assessing data from different electronic systems set up in our labs. Attendees will see real-world examples and lab animations that show how electronics systems can be hacked most anywhere across the supply chain. They will also learn about step-by-step security solutions we have developed at the microchip level. We need to do a better job of protecting the security of our semiconductor assets and the electronic solutions or services they power. My call to action will be that we need to invest more in research and foster an environment of more open trust and cooperation. We can do this by bringing together different countries, companies, and organizations in the microelectronics ecosystem to overcome this major challenge.Dr. Mark Tehranipoor is currently the Intel Charles E. Young Preeminence Endowed Chair Professor in Cybersecurity at the ECE Department, University of Florida. He is currently serving as Director for Florida Institute for Cybersecurity Research (FICS), National Microelectronics Security Training Center (MEST), CYAN Center of Excellence, and ECI Transition Center. He also serves as Program Director of Cybersecurity for UF Herbert Wertheim College of Engineering. His current research interests include IoT security, hardware security and trust, and reliable circuit design.Samer Bahou is senior manager of corporate communications at SEMI.

Although the semiconductor chip and capital equipment markets performed well in the first half of 2020, many of the electronic equipment end markets struggled globally. World electronic equipment sales declined almost 10% in 2Q’20 vs. 2Q’19.

So far the semiconductor industry is outperforming most other manufacturing sectors. Semiconductor capital equipment shipments were up 23% globally in 2Q’20 vs. 2Q’19 and semiconductor chip 3/12 growth is still in positive territory. However there are signs of slowing.

At SEMICON West 2020, the Honorable Al Gore, former U.S. Vice President and recipient of the Nobel Peace Prize for environmental activism, commented on the world being in the midst of a “sustainability revolution.” Just what did he mean by that, and why bring that message to us? The answer is that he believes the digital transformation wields the magnitude of the agricultural and industrial revolutions, but with the exponential speed that the semiconductor industry created and enabled. Ok, that would put him in the right place… SEMICON West.Among a rich lineup of speakers to mark the 50th anniversary of the event – and 50 years of the semiconductor industry facilitating the innovation of the Information Age -- Gore joined other icons in their fields who graced the virtual stage for our featured keynotes. Each analyzed how microchip advances are critical to solving some of the world’s greatest challenges.As host of the conference, I had the privilege of introducing Gore; Gary Dickerson, President and CEO of Applied Materials; and, Dr. John Kelly III, Executive Vice President and Director of IBM Research, along with other renowned speakers. Their insights seemed especially timely for how our global supply chain can help to build a more sustainable future. Following are a few of the highlights from their discussions. Al Gore – The Planet Faces Existential CrisisIn his keynote conversation with Greenbiz editorial director Heather Clancy kicking off SEMICON West 2020, Gore emphasized that digital technology advances – and in particular microchip innovation – provide the greatest opportunities to overcome the world’s most epic challenges. Chip breakthroughs will be the cutting edge of what he called the rapidly growing sustainability revolution to improve energy efficiency, reduce our reliance on fossil fuels, and optimize the performance of renewable energy generated by solar, wind, and electric battery sources.“We face an inflection point as we rely more on data and communications technology, particularly in areas like cloud computing and artificial intelligence,” Gore said. “Industry is aware of this and working on it, but this meeting (SEMICON West 2020) with your present leadership marks a real turning point. It’s something to be proud of, something to be celebrated. It’s what gives me hope.”Citing Moore’s Law and enormous strides made in chip efficiency and effectiveness, Gore said that within two years smart chips will make everything from solar panels and batteries to renewable energy plants and electric vehicles to be both cost- and performance-competitive with traditional energy sources. Afterwards, renewable energy will be more attractive. Gore urged the energy-intensive semiconductor industry to shift to more renewable power sources for manufacturing. To meet this challenge, Gore encouraged the industry to embrace strategies for “step changes”: First, collaborate and share best practices more transparently across the entire microelectronics value chain. Examples already abound where “cutting-edge apps, AI, and deep learning reduced data server energy use significantly without hardware changes,” he said. Second, reduce electricity required to manufacture smarter and smaller semiconductors. Gore encouraged “all of the equipment manufacturers to work together to reduce the amount of carbon dioxide emissions in manufacturing these advanced semiconductors.” Third, follow the lead of a growing number of companies that “continue decarbonizing the power supply on which data centers operate,” he said. Fourth, work with government through the Science Based Target Initiative, which sets decarbonization limits that keep global temperatures no more than two degrees Celsius above preindustrial levels. Finally, rely on “diversity of thought” and “collective thinking” when innovating for the digital future. Research and experience prove that different points of view lead to better decisions. The technology industry has made progress in workforce diversity, but more can be done, Gore said. This last point plays to our collaborative strengths as SEMI members and an industry. “It is just unbearable to imagine a future generation living with the kinds of consequences scientists tell us would ensue if we don’t heed their warnings and solve this crisis,” Gore said, drawing parallels to the COVID-19 pandemic. “We have to accept the situation and make sure we do everything we can. I am inspired by this industry’s leadership, innovation, and spirit to rise to the challenge and make a difference.”Gary Dickerson – Making Possible A Better FutureTo ensure another 50 years of accelerating growth and innovation, today’s semiconductor leaders must share a deep commitment to a more sustainable and just supply chain industrywide.“The first thing we need to do is decouple our growth from environmental impacts,” Dickerson said in his keynote. “Our responsibility as leaders is to leave the world a better place.”Dickerson said that while he firmly believes the explosion of processing and storage data has “the potential to change the world,” the downside is that it also has the potential to rapidly expand our industry’s carbon footprint. Without dramatic change, electrical usage will continue to rise as machines generate and consume more data, compute performance progresses, and workloads from the edge to the cloud grow.“It will be impossible to create neural networks (using AI) with the rate of today’s power consumption,” Dickerson said, noting that more improvements must be made in the performance and efficiency of semiconductor devices, architectures, structures, materials, and advanced packaging.Dickerson urged the electronics ecosystem to “permanently think and act differently” by breaking down communication barriers among systems integrators, equipment suppliers, design and manufacturing service providers, and other industry players. Sharing learnings and best practices will be vital to this change, he said. Dickerson unveiled SuCCESS2030 (Supply Chain Certification for Environmental and Social Sustainability) – Applied Materials’ 10-year roadmap for creating a more sustainable supply chain – during his talk. Under the SuCCESS2030 initiative, Applied Materials will hold its suppliers to the company’s own high standards for committing to renewable energy and workforce diversity by setting targets such as: Reducing supply chain carbon emissions 15 percent in four years by relying more on intermodal shipping than air freight Transitioning the supply chain to recycled content packaging, with a target of 80 percent by the end of 2023 Eliminating phosphate-based, pre-treatment of metal surfaces by 2024 Working with trade associations like SEMI to develop diversity and inclusion strategies to increase underrepresented minorities in the workplace Dickerson said that deeper and more open partnerships between Applied Materials and its customers and suppliers have led to a number of promising outcomes. Examples include hardware and software upgrades, product and service optimizations, and improvements in chip architectures that increased throughput density for higher system performance while decreasing power and chemical consumption, costs, and space requirements. What’s more, Applied Materials recently introduced its Selective Tungsten Process Technology, which uses new materials, atomic-level designs, and ultra-clean rooms to improve the performance of interconnected transistors while lowering power consumption.Dickerson said the COVID-19 pandemic has awakened the world to the power of digital technologies that make it possible to communicate, collaborate, and share data across the globe while sheltering in place. “When I think of the world’s grand challenges, it’s clear the semiconductor industry has a critical role to play,” Dickerson said. “I strongly believe we’re in a position to shape the future and leave the world a better place.”John E. Kelly III – 50 Years That Changed The World … And We’re Just Getting Started During the past half century, semiconductors have given rise to essentially every major technology advance, Kelly said in his keynote. Microchip innovation has played a central role in rocketing humans to the moon, simulating nuclear weapons on a supercomputer, connecting people to nearly everything via mobile devices, and keeping people alive with pacemakers and other electronic medical devices.The strides in innovation have been staggering. In 1970, a semiconductor chip featured a few thousand components. Today, that number stands at 50 billion. Breakthroughs in everything from materials and chemicals to polishing, processes and interconnectivity have driven gains in power-efficiency and performance while reducing chip size.Moore’s Law is far from dead. Paraphrasing Winston Churchill, Kelly said, semiconductor innovation today is not at “the beginning of the end, but at the end of the beginning, and the best is yet to come – driven by extreme collaboration and extreme innovation to solve the world’s biggest challenges.”Kelly said he believes technology is the only answer to the onslaught of grand challenges confronting societies and people today, including air and water pollution, climate change, diminishing natural resources, storm-related disasters, food supply shortages, and the COVID-19 pandemic.Kelly lamented that the world’s response to COVID-19 illustrates that “not much has changed” since the Spanish Flu crisis a century ago. The same technology – masks – remains the primary defense. “I think if we had used digital technologies and computer modeling earlier on, we could have detected the spread of this flu” to minimize its impact, Kelly said.Today’s computer modeling and analytics capabilities aren’t quite ready yet to tackle such complex problems as pandemics, global warming, or water contamination. However, Kelly said, several game-changing technologies – all powered by semiconductors – are emerging as promising answers to our most daunting challenges.“It’s all about the data, and artificial intelligence is the way forward – it’s analytics on steroids, and many new devices will be required to drive AI at the scale of these problems,” Kelly said. “The second technology revolves around not just cloud computing but edge computing and cloud at the edge. Data will be generated in enormous amounts at the edge, which is where we will need to store and compute the data. The next is Quantum Computing. Frankly, we do not have enough computing power yet to look at some of the biggest challenges we have.”All these advances will present new challenges for the semiconductor industry, such as developing new materials, new chip architectures and new mapping structures for AI-embedded devices to reach their full potential.With many of these disruptive innovations too large for any company to solve singlehandedly, Kelly advised industry players to form more “radical partnerships.”“Extreme collaboration and extreme innovation will drive solutions to all these world challenges,” Kelly said. “The best is yet to come.”Radical partnerships… Sustainable revolutions… Extreme innovation… It’s been 50 years of SEMICON West, but it sounds like we’re just getting the real magic started. Like John Kelly said and the other keynoters emphasized, the best is yet to come.Dave Anderson is president of SEMI Americas.