green manufacturing

For the semiconductor industry to flourish, all chip ecosystems must embrace closer ties, greater openness, and more flexibility to co-innovate solutions in today’s rapidly unfolding global digital transformation.

SEMICON Europa, SEMICON West, SEMICON Japan, & SEMICON Taiwan welcome back exhibitors and visitors to show floors starting in mid-November as four of SEMI’s seven flagship events gather visionaries and industry leaders to explore the latest semiconductor trends and innovations by the end of 2021.

The SEMI Smart Manufacturing Americas Chapter, a key driver of the Global Smart Manufacturing Initiative, accelerates awareness of digital and data-driven strategies and implementations to help speed adoption of smart manufacturing. In 2021, the Chapter will focus on expanding its work across the industry to include academic and research initiatives. The semiconductor industry saw an unprecedented focus on improving digital monitoring of manufacturing activity in 2020, partially due to COVID-19. The Americas Chapter shared case studies on new tools and techniques for social distancing in fabs, aides for remote maintenance, and tips for remote workers. The Chapter also introduced its three pillars of Sensing, Connecting and Predicting and offered related programs. The Global Smart Manufacturing Conference (GSMC) highlighted the significance of universities and research institutions in the development of smart manufacturing with their focus on joint research for broad dissemination. To help drive smart manufacturing advances, at GSMC several offered non-proprietary tutorials on topic including the following: Integrating sensors for acquisition – CEA-Leti Applying new AI and ML tools and strategies to manufacturing – Binghamton University Digital tools for planning, qualifying and management and scheduling in fabs – MINES Saint-Étienne. Adding AI tools to robot work in a smart factory – KAIST Institutes By continuously highlighting the activities of these and other institutions through presentations, interviews, articles and blog posts, we will draw more attention to what is on the horizon for smart manufacturing in 2021. The SEMI Smart Manufacturing Americas Chapter also plans to elevate activities important to the Outsourced Semiconductor Assembly and Test (OSAT), Surface-Mount Technology (SMT) and Printed Circuit Board Assembly (PCBA) segments of the industry including programs on inspection, traceability and the SEMI SMT-ELS Standard for SMT automation. Thurston Taylor, marketing expert at Tokyo Electron and Vice Chair of the Americas Chapter, notes that “With increasingly more demanding requirements for bump, assembly and test, smart manufacturing and applied data science are necessary to achieve back-end goals now and in the future.” Also, many companies are implementing smart manufacturing applications and assessing various strategies to increase their smart manufacturing capabilities. Members of the Americas Chapter plan to review and develop self-assessment documents and maturity models that apply to front-end wafer fabs all the way through packaging and assembly facilities. “Moving forward it is imperative for all of us to up the intensity on specific ROI vectors such as quality, cost, productivity, sustainability and safety leveraging our smart manufacturing SEMI framework of Sensing, Connecting and Predicting,” said noted Bobby Mitra, worldwide director of Smart Manufacturing at Texas Instruments and Americas Chapter Chair. “By offering special flagship events, invited talks, ROI case-studies and ROI criteria in maturity models, we’ll bring high value to the smart manufacturing industry.” Chapter members also will begin mapping the skills needed to implement and support increasingly digital manufacturing capabilities, including any new skill sets, to help companies develop their hiring, training and management strategies. The mapping effort aims to support companies in building a strong pipeline of employees who can efficiently manage and operate smart manufacturing facilities. For its part, the Americas Chapter’s Go Green Subcommittee will focus on applying smart manufacturing technology to reducing the electronic industry’s carbon footprint by accurately tracking energy waste improving overall fab efficiency. Stay tuned for details on activities planned for our chapters in Europe, China, Japan, Korea, Southeast Asia and Taiwan. To learn more about each chapter and how to get involved, please visit the SEMI Smart Manufacturing Hub and sign up for our newsletter. Ayo Kajopaiye is senior project coordinator, Collaborative Technology Platforms, at SEMI.

The semiconductor industry must do far more to educate the electronics supply chain on the subtle differences among various fluoropolymers, 30 SEMI member companies learned in an October 13 webinar organized by SEMI to help maintain a unified voice on the critical importance of per- and polyfluoroalkyl substances (PFAS) in semiconductor manufacturing. At the same time, producers and customers of the substances used in chipmaking should work more closely together to steer clear of adopting policies that could limit the availability of safe fluoropolymers and the semiconductor industry’s ability to use them in the future.The insights were offered by representatives from the Performance Fluoropolymer Partnership – a group within the Washington, D.C.-based American Chemistry Council – on per- and poly-fluorinated substances including fluoropolymers. The Council is an industry trade association representing American chemical companies. Following are other key takeaways from the webinar. Fluorinated polymers and non-polymers are commonly found in components used in semiconductor manufacturing such as fittings, valves, tubes, O-rings, wafer carriers, filtration media, high purity air filters, greases and lubricants. The substances are ideal for use in corrosive chemicals, high temperatures and other harsh environments and are found in a variety of electro-technical components such as potentiometers, wiring, printed circuit boards and Lithium-ion batteries. Fluoropolymers are a diverse family of plastics also widespread in modern life, with applications ranging from food packaging and non-stick coatings on kitchen pans to rechargeable batteries for electric vehicles. The term PFAS (per- and poly-fluoroalkyl substances) covers more than 4,700 chemicals with diverse physical, chemical, environmental and biological properties and impacts. There are also significant differences among their chemical compositions. A careful appraisal of their risks and impacts should take into account any potentially hazardous properties, toxicity levels, their prevalence in the industry, and whether substitutes are readily available. Growing pressure from regulators worldwide threatens future access to fluorinated chemicals, increasing the importance of raising awareness on how to distinguish groups of chemicals and encouraging a measured approach towards eliminating only chemicals carrying the greatest risk. Fluoropolymer producers and opponents of the chemicals must look past their divergent interests to work together to voice common concerns to regulators. Various SEMI working groups respond to public consultations when opportunities to present the semiconductor industry’s position arise. Individual group members communicate both among each other regarding new regulatory developments and also with external constituents through SEMI about the importance of chemicals to chip manufacturing. As with other sectors, the semiconductor industry continuously seeks to “green” its manufacturing processes. SEMI believes the commitment of the supply chain to these efforts is crucial to protecting the industry’s interests and driving innovation.Olivier Corvez is senior manager of Environment, Health, Safety and Sustainability at SEMI.