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Bosch Sensortec

With increasing demand for personalized smart devices, the MEMS and sensor market is undergoing rapid transformation. MEMS sensors are the backbone of smart wearable devices, seamlessly integrating multiple functions to monitor and simplify our day-to-day activities. As applications in healthcare, environmental tracking, and AR/VR expand, the need for ultra-compact, energy-efficient, and intelligent sensors is more critical than ever.In an exclusive conversation with SEMI, Stefan Finkbeiner, CEO of Bosch Sensortec, shared his perspective on the dynamic landscape of MEMS sensor technology. From Bosch’s evolution to a solutions provider with a focus on sustainability and market-driven innovations, Finkbeiner offered a deep dive into how Bosch Sensortec is positioning itself at the forefront of the industry. “We have to think in terms of the end application and determine what the right hardware and software configuration should be in order to provide solutions with the greatest benefit and flexibility.”Further insights into the future of MEMS and sensor technology will be shared by Finkbeiner during his keynote at the SEMI MEMS Imaging Sensors Summit on November 14, 2024, in Munich, Germany. Registration is still open.SEMI: Welcome, Stefan, and thank you for sharing your insights on advanced sensor technologies. Let’s start with a personal question: What motivates and inspires you about working in sensor technology?Finkbeiner: Sensor technology is very diverse and has significant impacts on consumers. We take pride in prioritizing consumers’ needs and benefits. True to the Bosch motto, “Invented for life,” we are committed to making life better, easier and healthier. This is demonstrated in our sensing solutions, which provide valuable data for fitness tracking in smartwatches, enhance the audio experience in hearables, and enable real-time monitoring of air quality to help individuals make informed decisions for a healthier environment. I am fascinated by technology advancements that are enabling the scaling of sensors—and the processing power and intelligence packed into these increasingly compact devices. For instance, our latest acceleration sensors for hearables are the smallest in the world and are nearly invisible at just 1.2 x 0.8 x 0.55 mm³.We leverage innovative wafer level chip scale packaging (WLCSP) to achieve this reduced form factor. These compact, feature-rich, high-performance accelerometers are easier to integrate in the latest generation consumer products where size and functionality are critical requirements.SEMI: How has Bosch Sensortec’s approach evolved over the years and what is the company’s primary focus today? Finkbeiner: We began our success story a few years ago as a hardware supplier, with one of our first applications being the 'Portrait-Landscape' function in smartphones. Over time, we’ve evolved into one of the leading providers of MEMS sensors.Today, we no longer see ourselves purely as a sensor manufacturer, but as a technology solutions provider. Our focus has shifted to think in terms of the end application and determine what the right hardware and software configuration should be to provide solutions with the greatest benefit and flexibility.Achieving this requires significant software and artificial intelligence (AI) development. In essence, we are optimizing software through self-learning models. Hardware remains essential for optimizing power consumption, with most sensors integrating a controller alongside the ASIC to enable seamless software integration.This unique software and hardware configuration unlocks exciting possibilities and broadens our market reach. We see significant growth in head-mounted devices, and we are actively working on related acoustics solutions.SEMI: Looking ahead, what trends do you anticipate will have the most significant impact on the MEMS sensors market?Finkbeiner: We see several trends that will significantly impact the MEMS sensor market. First, there is growing demand for personal health monitoring in consumer and mobile electronics. Wearable devices, in particular, are becoming essential tools for individuals to track their health and fitness status. This trend requires MEMS sensors to become even more accurate, with solutions that include sophisticated software algorithms to ensure reliability, accuracy, and reproducibility. As a result, AI and machine learning (ML) technologies will play a crucial role in enhancing sensor performance.A second important trend is the continued miniaturization of MEMS sensors. To meet customer demands, sensors must integrate more functionality, including edge-processing capabilities. For example, what once may have been a simple accelerometer with a step-counting algorithm is now evolving into a 6-axis Inertial Measurement Unit (IMU) with an integrated microcontroller and advanced AI/ML software. A great example of this is in True Wireless Stereo (TWS) earphones, where the IMU not only tracks steps but also enables complex tasks like dead reckoning and supports 3D audio—all within the tight constraints of a small TWS earbud housing. Low power consumption, as always, is a critical factor for these mobile devices to meet CE (Conformité Européenne) standards.Finally, we believe that smart glasses, augmented reality (AR) and virtual reality (VR) devices are poised to become the “next big thing.” These devices require advanced image projection optics that offer excellent optical quality, low weight, and ease of use to ensure consumer adoption. We believe our MEMS-based LBS (Laser Beam Scanning) solution is ideal for these applications. Additionally, the successful adoption of smart glasses hinges on high-performance MEMS sensors that are compact, accurate, and power-efficient—critical requirements for all-day wearability and functionality.These trends underscore the need for MEMS technology to evolve, integrating greater functionality, precision, and efficiency to meet the demands of next-generation consumer devices.SEMI: What are some of the biggest challenges facing the MEMS sensors industry today, and how can companies overcome them?Finkbeiner: One key challenge is that the smartphone market—arguably the most attractive market for a variety of MEMS and MOEMS sensors—has become more or less saturated. To stay competitive, MEMS companies must innovate existing products while also developing new, differentiated sensors and actuators for next-generation mobile products.SEMI: How is Bosch Sensortec supporting sustainability initiatives?Finkbeiner: We are helping to mitigate climate change with our low carbon footprint solutions.Up to 20% of annual global carbon emissions are caused by forest fires. This is equivalent to carbon dioxide emitted by all the vehicles driven worldwide. Our sensors can detect forest fires before they develop into wildfires by measuring various gases such as carbon monoxide and hydrogen. In parallel, we are working with our production partners to reduce our carbon footprint over the coming years, while also replacing or minimizing the use of environmentally hazardous chemicals, such as PFAS.SEMI: What are you most excited about for the MEMS Imaging Sensors Summit, and how do you think it will impact the European semiconductor industry?Finkbeiner: The European semiconductor industry has deep expertise in MEMS and sensor technologies, positioning it to make a significant impact in markets such as consumer health, optical sensing, and AR displays. By continuing to focus on sustainable solutions, we can drive even greater impact for the broader industry and secure Europe’s leadership in these growth sectors.I look forward to collaborating with industry peers at the Summit to define next steps needed to advance Europe’s leadership. The MEMS Summit is an invaluable opportunity to collaborate and drive progress, and I warmly invite my colleagues to join us in shaping the future of the European semiconductor industry.Dr. Stefan Finkbeiner Dr. Stefan Finkbeiner has been CEO and General Manager at Bosch Sensortec GmbH since 2012. He was born in 1966 in Freudenstadt, Germany. Stefan Finkbeiner held various senior positions at Bosch including Director of Sensor Marketing, Director of Corporate Research in microsystems technology, and Vice President of Sensor Engineering. He looks back on almost 30 years in semiconductor industry working in different positions related to sensor research, development, manufacturing, and marketing. Due to his wide experience in semiconductor and sensor industry, Stefan Finkbeiner is a recognized guest in panel discussions and as keynote speaker. SEMI ContactSitong He / Communications Manager, SEMI EuropeEmail: [email protected]: +49 151 5546 2638
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MEMS sensors have come a long way over the past few decades. The late 1990’s brought us the mass production of both MEMS accelerometers for automotive air bag crash sensors and MEMS gyros for rollover detection and anti-locking braking systems (ABS). In the early 2000’s, MEMS sensors made the jump from automotive to mobile and consumer electronics, first with a MEMS microphone in the wildly successful Motorola RAZR phone and then with a MEMS accelerometer in the first Nintendo Wii remote.Following this initial period of MEMS’ commercialization, the timetable for the mass proliferation of both MEMS and non-MEMS sensors accelerated dramatically. Just take Apple iPhone. Released in 2007, the first iPhone had one MEMS accelerometer and one proximity sensor. Released 10 years later, iPhone X included four MEMS microphones, a barometer, three-axis gyro, MEMS accelerometer and proximity sensor, an ambient light sensor and an infrared (IR) sensor, a magnetometer, and multiple image sensors. For perspective’s sake, well over two billion iPhones have been sold since 2007, making iPhone a major growth-driver in MEMS. According to Yole Développement[i] (Yole), MEMS will generate $10.9 billion in revenue in 2020 alone (non-MEMS sensor revenue will be even higher), spanning automotive, consumer and mobile, Internet of Things (IoT), medical and healthcare, aerospace, industrial and other markets.With so much growth behind us, what’s ahead? Jens Fabrowsky, executive vice president of Automotive Electronics at Robert Bosch GmbH, will share his insights on the future of MEMS during his MSEC 2020 keynote, The Next 10 Years of MEMS: An Outlook on Opportunities and Challenges. I recently spoke with Fabrowsky to preview his October 15 presentation at SEMI’s first virtual MEMS Sensors Executive Congress, October 6-8 and 13-15, 2020. Register now for MSEC 2020 and explore this topic with Fabrowsky by participating in the Q A segment of his presentation.SEMI: What are some of the primary challenges facing the MEMS industry?Fabrowsky: Development costs for new generations of MEMS sensors are increasing, leading to several major shifts. To compensate for rising development costs and reduce risk, MEMS sensors suppliers are pursuing wider, diverse markets instead of just targeting high-volume applications. At the same time, end-device manufacturers are demanding greater product differentiation, but they don’t want to pay a premium for it or wait for new hardware iterations. To stay competitive, sensor suppliers are providing software solutions that support new features and functionality. That approach is more cost-effective and speeds design-to-production cycles. SEMI: What factors are increasing development costs for new MEMS sensors, and what can companies do to mitigate their R D risk? Fabrowsky: As with most electronic components, MEMS’ costs are driven by development and capital expenditures. The increasing complexity of the content, especially in interface ASICs and software, makes MEMS development a multidisciplinary feat, requiring several competencies across multiple design centers to meet ever-demanding timelines.Manufacturing also plays a role. We often see dedicated manufacturing lines built for new MEMS products, which stresses both investments and capacity planning. Working together as an industry, we can reduce risk and costs by applying the same manufacturing process to more than one generation of product, which will speed time to market, increase volumes and improve ROI. SEMI: To what degree will the COVID-19 pandemic continue to affect sensors suppliers?Fabrowsky: MEMS manufacturing flows have been affected by disruptions in the supply chain. While the benefits of multiple sourcing and more direct ownership of the flow itself (on-shoring, vertical integration) have helped us, no one in the industry can claim they are out of danger, especially if a new wave of contagion occurs. Our industry relies heavily on just-in-time manufacturing and logistics, and we are all watching for influences that could alter flow. The pandemic has reminded us all that an important competitive advantage is a predictable, secure supply — which also comes at a cost that the end customer must value. SEMI: Why and how are traditional hardware companies like Robert Bosch differentiating their platforms for end-device manufacturers? Fabrowsky: On-shoring was already a trend before the pandemic. We’ve always believed in and are still investing in our own manufacturing facilities. That includes the 12-inch ASIC fab in Dresden, Germany, where we expect to manufacture future generations of power and control electronics to satisfy the growing appetite for silicon that vehicle electrification demands.We think that one of our biggest differentiators is that our portfolio includes more than just components: Close collaboration with our internal partner divisions gives us comprehensive system know-how across the automotive supply chain. On the consumer-electronics side, we have extensive partnerships with makers of application processors, wireless systems, and sensor processing software. With this expertise behind us, we can provide flexible system-integration options to our end customers — who also benefit from a mature supply chain that supports high volumes and field-tested quality.SEMI: What does customer demand for software solutions mean for sensor suppliers and how will suppliers evolve to meet this need? Fabrowsky: In some silicon product business units, the R D effort to develop software is higher than the effort to design the hardware! Software is not only what’s needed on the application layer. It also runs the interface to the processors – the drivers. In addition, increasingly complex testing software ensures high yield and minimizes defects. On the application layer, we are increasingly using and promoting open-source platforms to encourage better collaboration throughout the ecosystem. In contrast, companies that charge fees to access their own proprietary software environments are missing the opportunity to remain competitive in the long run. SEMI: Why are end-device manufacturers looking for plug-and-play solutions instead of standalone devices? Fabrowsky: Consumers of electronic devices always want products with more features and lower prices. Their requirements produce a trickle-down effect that reaches all the way to component suppliers such as ourselves. This requires us to manage a healthy innovation pipeline, and to choose products and technologies that promise growth and high volumes. This isn’t always simple, however, and many times the component itself is not enough. Think of our Light Drive projector for Bosch Smartglasses. The only way we can hope to win designs in this market is by realizing a fully integrated module, with our own scanning mirrors and driver chips, as well as our integration of laser modules and the display system. This lets us offer an individually tested and calibrated end product ready for assembly.SEMI: What would you like MSEC 2020 attendees to take away from your presentation?Fabrowsky: We’ll be looking at what’s driving the next decade of MEMS applications. For example, the embedded computing inside the sensors, together with enhancements in integration, materials and packaging, will increase the pervasiveness of MEMS sensors and actuators as touchpoints between electronics and the physical world. This will create a new form of intimacy between us and the machines, which we call Artificial Empathy.To learn more about Bosch Smartglasses Light Drive and other MEMS advancements, register now for MSEC 2020.Robert Bosch GmbH is a longtime member of MEMS Sensors Industry Group® (MSIG), a SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets, enabling members to grow and prosper. Visit us today.Jens Fabrowsky began his more than 20-year career at Bosch Group as department head responsible for hydraulic units in the Blaichach plant, Germany Chassis Systems division, in 1999. He soon moved onto technical plant manager and later to plant manager within the company’s Germany Gasoline systems division. He has held the role of executive vice president, Automotive Electronics at Robert Bosch GmbH, since April 2012. Fabrowsky studied mechanical engineering and industrial engineering at the University of Stuttgart (Germany) and the Technical University of Munich (Germany). [i] Status of the MEMS Industry report, Yole Développement, 2020.Nishita Rao is product marketing manager at SEMI.
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Why do we need environmental air pollution sensors?Today we need environmental air pollution sensors more than ever to ensure that we have clean and safe outdoor and indoor air. Although federal rules have improved air pollution over the past several decades, more than 110 million Americans still live in counties where air quality is below national standards. An estimated 100,000 Americans die prematurely each year of illnesses caused or exacerbated by polluted air.“Cars and trucks are much cleaner than they were, power plants are cleaner, industrial operations are cleaner,” said Paul Billings, Senior Vice President Advocacy for the American Lung Association. But cleaner air is not clean air.”While scientists have long known that air pollution may exacerbate asthma and other respiratory illnesses, new data suggests polluted air leads to higher COVID-19 higher death rates and brain inflammation that can contribute to dementia and autism.To understand the importance of air quality and how we can apply existing sensors and develop new ones, we look both outdoors and indoors (see Figure 1). Outdoor air quality relates to gaseous and particulate pollutants, defined by the Air Quality Index (AQI). The AQI became a standard based on regional thresholds for a set of key outdoor pollutants: four gaseous pollutants (sulfur dioxide, nitrogen dioxide, carbon monoxide, ozone) and particulates (PMs) of different sizes such as 10 μm (PM10) and 2.5 μm (PM2.5). At present, the AQI is measured using traditional analytical instruments. Despite their high acquisition and maintenance costs, these instruments are the only solution to accurately measure these pollutants in the presence of variable environmental background.Figure 1. Examples of outdoor and indoor air quality markers Indoor air quality (IAQ) is also of growing concern. Formaldehyde, benzene, carbon monoxide, and carbon dioxide are some of the key pollutants with restricted concentration levels in residential, office and industrial buildings. Sources of these and other gaseous pollutants include building materials and equipment, workplace cleansers, and building occupants. Regulatory agencies and building occupants use different methodologies to estimate IAQ using gaseous and particulate pollutant analyzers. These estimates also consider air humidity and temperature that affect indoor air quality. Where are we today with environmental sensors?The top three requirements for modern gas sensors include: the sensor reliability to provide accurate readings in diverse environmental conditions over desired period of use low power, to extend battery life or to eliminate its need, and low cost, to facilitate their ubiquitous deployments. Advances in electronics, microfabrication, and packaging have delivered recent important developments in reducing the power consumption and miniature packaged solutions. Recent R D efforts are also increasing the number of successful gas sensor field deployments for outdoor and indoor air quality monitoring. Figure 2 illustrates three examples of recent developments in gas sensors that meet requirements of diverse customers.Electrochemical sensors from SPEC Sensors were collocated with EPA instruments for monitoring of NO2 and O3 in Chicago’s Array of Things Project. Figure 2A shows that these new cost-effective sensors track well the EPA instruments. Advancements in circuit quality, sampling, enclosure design, and initial calibration/compensation were all essential in achieving these results. While this example clearly demonstrates the usability of these sensors in this particular application, the expectations that low-cost, off-the-shelf sensors will match the performance of EPA reference systems that cost 50x-100x more must be adjusted. A micropackaged sensor suite from Bosch Sensortec includes sensors for total volatile organic compounds (TVOCs), temperature, humidity, and pressure. TVOC measurements are needed according to the guidelines by the German Federal Environmental Agency. To report TVOC, the sensor algorithm tracks the TVOC-related resistance of the metal oxide sensor, corrects sensor resistance for ambient temperature and humidity, and outputs the TVOCs Index of Air Quality between 0 (clean air) and 500 (heavily polluted air) as shown in Figure 2B. A recent GE-developed dielectric excitation scheme of metal oxide sensing materials provided a highly desired and long-awaited calibration stability of sensors for monitoring of fugitive methane gas emissions in all-weather conditions. These sensors were used in several field validation campaigns in Oklahoma, North Dakota, Arkansas, and British Columbia and had stable performance after more than 400 days, as compared to an initial calibration (see Figure 2C). Such stable sensor performance has become possible by switching from the conventional resistive mode of operation of metal oxide sensing elements to the dielectric excitation scheme. Figure 2. Examples of applications of contemporary gas sensors based on different detection principles.(A) Outdoor performance of NO2 and O3 electrochemical sensors versus EPA-validated instruments.(B) Calibration results of a BME680 metal oxide gas chemiresistor upon exposures to TVOCs (blue stair-profile) and its ± 15% confidence interval band as the Index of Air Quality.(C) Calibration stability of a sensor with an innovative dielectric excitation scheme implemented for monitoring of fugitive methane gas emissions after multiple uses in diverse field validation campaigns. Key challenges and solutions toward realizing new applicationsIn this era of data-on-demand, environmental sensors could enable countless new applications. Imagine you have a gas sensor conveniently integrated into a smartphone or a watch. You are commuting to work, and your sensor alerts you that the subway station through which you are traveling has very poor air quality. How might this alert affect your behavior? Would you put on a mask, change your commuting route to a twice-longer one, or petition the city? What if you are attending a parade downtown with your asthmatic child, and your device informs you that the air is clean? Would you skip the parade if you knew that your sensor was only 10% accurate? How would you avoid a risk of ending with your asthmatic child in a hospital?Design principles of modern sensors originate in the 20th century for detection of high gas levels from leaks, but they did not anticipate the applications proposed now. By design, existing sensors have only a single output – e.g. resistance, voltage, current, light intensity – that mathematically cannot correct for the sensor instabilities caused by the complex chemical background and variable temperature and humidity conditions. Thus, often these simple sensors perform best when pollution levels are high and when the compound of interest swamps others. As a practical example, there are dozens of gaseous pollutants in ambient air with their toxicity that differ 1,000-10,000 fold. Often, the insufficient reliability and accuracy of existing sensors in the field conditions is a significant bottleneck toward the broad adoption of gas sensors. According to the United States Environmental Protection Agency (EPA), the correlation between readings of low-cost sensors versus reference monitors varies widely from 1% to 80%. The EPA also states that no low-cost sensors meet Regulatory Monitoring requirements, and the World Meteorological Organization emphasizes that “low-cost sensors are not currently a direct substitute for reference instruments, especially for mandatory purposes.” However, we now have the increasing number of examples of reliable operation in complex environments (Figure 2) in addition to important advances in reduced power and size of contemporary sensors. Still, the key challenges to realize new applications are often the lack of required accuracy and reliability of available sensors for new contemplated applications.Is it possible to offer low-cost sensors for at least some applications and some gases with the degree of accuracy approaching more expensive specialized instruments? We, the SEMI-MSIG Device Working Group, are saying: Yes. To deliver on this bold statement, our SEMI community brings new technological solutions to the 100-year old general design of gas sensors.Our next blog What is in the Air will provide details on our activities of SEMI-MSIG Device Working Group to establish standards and new measurement schemes to reduce effects from uncontrolled ambient conditions and to improve stability, limit of detection, and dynamic range of environmental sensors. Also learn how new MSIG members can impact this important working group. The MEMS Sensors Industry Group (MSIG) is a SEMI technology community that enables the MEMS and sensor industry to address common challenges, innovate and accelerate business results.Radislav A. Potyrailo is Principal Scientist, Micro Optoelectronics Gas-Chem-Bio Sensors Systems, at GE Research; Ed Stetter is General Manager at SPEC Sensors, LLC; Ryotaro Sakauchi, is Senior Manager of Business Development at Bosch Sensortec; Merry Smith is a Product Manager and Senior Scientist at C2Sense, Inc.; and Sreeni D. Rao is Senior Director of the MEMS Business Group at TDK Corporation.
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Part 2 of 2-part series on MSEC 2019 highlights. Read Part 1. Neural Networks on ChipTo be sure, low power is king when bringing machine learning to the sensor edge. Battery-powered, always-on sensing devices require it since frequent recharging is the death knell of any electronic product. That’s why semiconductor companies are offering new ways to conserve power.“MEMS sensor suppliers have made significant strides in the power, size and performance of their devices,” said Aspinity CEO Tom Doyle. “Yet these gains deliver only incremental power improvements to the system.”Doyle advocates a new architectural model that uses an analog neuromorphic processor to analyze all sensor data at the start of the signal chain instead of sending it downstream so power-hungry chips such as DSPs can digitize it before analysis.“The technology industry wants to take advantage of the many benefits of always-on sensing applications,” said Doyle. “Before we can reach mass proliferation, however, we need to resolve the power issues that are deal-breakers for some applications. We believe the answer to this challenge is architectural. All the data gathered by always-on sensing systems is analog in nature, yet as soon as it’s captured, it’s digitized immediately for analysis. Determining which data is important up front eliminates the digitization and processing of irrelevant data so that voice-first devices such as smart speakers and wearables/hearables can run for long periods of time without requiring battery recharge.”Syntiant CTO Jeremy Holleman agreed that on-device intelligence is the future.“Did you just fall? Is your heartrate a bit off? Deep learning provides a toolset that yields vastly superior decisions,” said Holleman. “The problem is that deep learning is computationally intensive. The answer is a neural network that performs on-device edge inferencing.”Holleman added that Syntiant’s neural decision processor was recently certified as Amazon Voice Service (AVS)-compliant for wake-word detection, making it easier to design voice control in battery-powered devices such as earbuds and wearables.MSEC Technology Showcase WinnerWith the groundswell of interest in intelligence at the edge, it was no surprise that Cartesiam won top honors among all competitors in the MSEC Technology Showcase for its NanoEdge AI, software that brings AI to the edge of the signal chain, making it easier for designers to create intelligent objects that can learn and understand.“Unlike other AI algorithmic technologies for sensing devices, NanoEdge enables both learning and inference at the edge, providing accurate and adaptive intelligence,” said Cartesiam Managing Director and Co-founder Marc Dupaquier, who accepted the award. “It’s also the only tool of its kind that does not require data scientists on board for implementation, which saves a tremendous amount of money. Our clients can build a machine learning library and embed it into their own code within weeks to realize the same caliber of unsupervised neural network that was once the exclusive domain of AI cloud vendors.”MSIG 2019 Hall of FameAt this year’s conference, MSIG Director Carmelo Sansone recognized two longtime contributors to the commercialization of MEMS and sensors: Peter G. Hartwell, Ph.D., chief technology officer at InvenSense, a TDK group company; and Thomas Kenny, professor and senior associate dean of engineering at Stanford University.Hartwell leads technology strategy and the InvenSense advanced technology research group. He has more than 25 years’ experience commercializing silicon MEMS products, including advanced sensors and actuators, and developing MEMS testing techniques.Kenny’s academic accomplishments include authoring or co-authoring more than 250 scientific papers and holding 50 issued patents. He has also advised more than 50 graduated Ph.D. students from Stanford.MSEC 2020Mark your calendar for next year’s MSEC, October 12-14, at Coronado Island Marriott Resort Spa in Coronado, Calif. Get updates from MSIG on MSEC and other upcoming events including MSTC 2020.Stay in Touch with MSIGMEMS Sensors Industry Group (MSIG), a SEMI Strategic Association Partner, is the industry association representing the global MEMS and sensors supply chain. To learn how MSIG enables professionals in the MEMS and sensors industry to innovate, address common challenges and accelerate business results, visit us today.Connect with MSIG on Twitter and LinkedIn. Subscribe to SEMI Blog: Technology and Trends.Maria Vetrano is a public relations consultant at SEMI.
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Part of 1 of 2-part series on MSEC 2019 highlights. Read Part 2. MEMS and sensors are proliferating across consumer, automotive, biomedical/healthcare, robotics, industrial and agriculture applications to harvest sensory data in a hyper-connected world and meet demand from consumers and organizations alike as they clamor for more intelligence in electronics.Take the ubiquitous iPhone. Shipped in 2007, Apple’s first iPhone sported five sensors. By contrast, the most feature-packed smartphones will embed up to 20 sensors by 2021, according to Yole Développement’s Jérôme Azémar. He estimates that the devices will feature four MEMS microphones, four CMOS image sensors (CIS), a RGB color sensor, a laser rangefinder, an infrared sensor, a gas sensor, a heart rate monitor and a fingerprint sensor, not to mention the MEMS inertial sensors that device users have come to know and trust.The MEMS market is expected to reach $18.5 billion in 2024 [1], up a whopping 60 percent from $11.6 billion in 2018, according to Azémar, who presented at MEMS Sensors Industry Group’s 15th annual MEMS Sensors Executive Congress (MSEC) in late October in Coronado, Calif. Add other types of sensors to the mix – CIS, environmental sensors, LiDARs, radars, ultrasonics, and fingerprint sensors – and the market will mushroom to $93 billion by 2024, said Azémar.Since MEMS Sensors Industry Group (MSIG) joined SEMI as a Strategic Association Partner three years ago, SEMI has expanded its MEMS and sensors programs to Europe and Asia while continuing to grow its U.S. conferences. “SEMI is continually investing in MEMS and sensors innovation across the supply chain,” said Dave Anderson, president of SEMI Americas and host of MSEC. “For example, MSIG is contributing to the development of the Heterogeneous Integration Roadmap, an initiative designed to drive heterogeneous integration technology development and accelerate electronics innovation. The roadmap spans device design, test and fabrication, ecosystem development, R D, equipment and materials. “At MSEC, executives and other speakers explored how AI and blockchain are remaking the food supply chain, air transportation and other sectors as MEMS and sensors improve the quality of our lives,” said Anderson.Sensing at the EdgeThe concept of artificial intelligence (AI), that a machine can harness intelligence that rivals or outperforms humans – and act without human intervention – has been a feature of the human imagination since at least the 1968 film 2001: A Space Odyssey. MEMS and sensors facilitate intelligence in a wide range of electronics such as smartphones, healthcare wearables, robots, industrial predictive maintenance systems, and cars. AI is sure to augment that functionality.MEMS and sensors are now in their third wave of evolution, a focus on edge AI, Bosch Sensortec CEO and General Manager Stefan Finkbeiner told MSEC attendees. For its part, Bosch is working to add AI to MEMS devices. The first wave integrated software with MEMS sensors, and the second, sensor fusion, enabled designers to allocate performance and power strategically to tune MEMS for resource-constrained devices. The third wave is “an active-learning phase in which MEMS facilitates real-time learning at the edge to promote greater personalization, environmental feedback, privacy of user data and improved battery life,” said Finkbeiner.Small sensor nodes with edge AI exemplify third-wave applications. Integrating low-power environmental sensors (e.g., gas, temperature, pressure, humidity and air-flow sensors), the nodes could be deployed in fire-prone forests to assess fire risk and support early detection. Access to this real-time environmental information could prove invaluable to residents and public-safety personnel alike.Google takes another tack, applying machine learning to resource-constrained devices, said Nick Kreeger, a senior software engineer at the Internet giant. The company’s Google Brain creates machine learning models that can run on inexpensive, low-power microcontrollers using Google’s TensorFlow Lite, an open-source machine learning tool that’s been deployed on a multitude of mobile devices. Inferencing is done at the device’s edge, rather than transmitted to the cloud.Meeting the power constraints of battery-powered sensing devices is another matter that starts with minimizing energy and data waste. “Deep learning is compute-bound and runs well on existing microcontrollers,” Kreeger said. “Because it’s all arithmetic, it’s low-power compared to storage access.”Already Google has worked with Plant Village, a research unit at Penn State University, and the International Institute of Tropical Agriculture (IITA) to help farmers improve food production by using machine learning and cheap sensors to spot and manage planet diseases in developing countries. And that production chain is in dire need of a boost, according to Rajendra Rao, general manager of IBM Food Trust, an enterprise-class blockchain solution.“We are on the cusp of complete failure of the food system,” Rao said. “One out of 10 people gets sick each year from foodborne illness, 420,000 die from this annually, 80 percent of companies in the food supply chain have not digitized, one-third of all fresh food in the US is thrown away, and one in five seafood samples worldwide is mislabeled.”IBM Food Trust’s work with Sucafina, which manages a global green coffee supply chain, shows how sensors can trace food from the farm to the processing plant to the consumer. With the IBM Food Trust platform, Sucafina can track the origin of the beans used in a cup of coffee – a competitive differentiator to coffee drinkers eager to support fair-trade coffee roasters.ripe.io, one of Forbes’ 25 most innovative AgTech startups, is also tackling the challenges and complexities of the food supply chain.“Our secure blockchain platform creates a digital twin of food items, transparently aggregating foods’ journey in real-time, to provide a harmonized trustworthy platform for multiple stakeholders,” said Rachel Gabato, the company’s COO. The ripe.io blockchain-based platform collects data from various sensors – temperature, pressure, light, humidity and inertial MEMS sensors. Growers, distributors and end customers including sweetgreen – a U.S. restaurant chain that depends on fresh produce – use the information to trace the origin and quality of food.MSEC 2020Mark your calendar for next year’s MSEC, October 12-14, at Coronado Island Marriott Resort Spa in Coronado, Calif. Get updates from MSIG on MSEC and other upcoming events including MSTC 2020.Stay in Touch with MSIGMEMS Sensors Industry Group (MSIG), a SEMI Strategic Association Partner, is the industry association representing the global MEMS and sensors supply chain. To learn how MSIG enables professionals in the MEMS and sensors industry to innovate, address common challenges and accelerate business results, visit us today.Connect with MSIG on Twitter and LinkedIn. Subscribe to SEMI Blog: Technology and Trends.[1] Source: Status of the MEMS Industry report, Yole Développement, 2019Maria Vetrano is a public relations consultant at SEMI.
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Software for sensors has evolved from simply reading out and evaluating sensor data to making intelligent decisions based on that data, a transformation enabled by new software synthesis and artificial intelligence (AI) technologies. Together, they make consumer devices smarter, dramatically improving the user experience through greater interactivity and higher levels of automated personalization.SEMI’s Nishita Rao spoke with Stefan Finkbeiner, CEO and General Manager at Bosch Sensortec, who will explore the topic in his October 23 keynote, How Software Makes MEMS Sensors into Smart Systems, at MEMS Sensors Executive Congress (MSEC), October 22-24, 2019, at the Coronado Island Marriott Resort Spa in Coronado, Calif.Join us at MSEC to meet Bosch Sensortec and other industry influencers driving MEMS and sensors innovations. Registration is open.SEMI: What is the relationship between MEMS sensors suppliers and specialized software synthesis providers?Finkbeiner: Collaboration is a key driver for innovation in sensor software. There are already several fruitful collaborations between MEMS sensors suppliers and specialized software providers, which are mostly startups. Collaborations with providers of simulation and evaluation tools as well as with well-known universities in the field of AI are starting to show positive results.Domain expertise is also critical for developing smart sensor software, making it essential to future sensing solutions.SEMI: How does software synthesis relate to sensor fusion?Finkbeiner: Put simply, software synthesis refers to ways of automatically generating code based on domain knowledge and given constraints for specific product versions. Sensor fusion combines sensor data from different kinds of sources in order to improve the results.Software synthesis techniques enable a level of automation that creates new opportunities for more complex sensor fusion, which was formerly out of reach when using traditional approaches that involved, for example, big data and a large number of potential data sources.The traditional sensor fusion toolset can now be further extended by machine learning techniques that help to determine which sources are more reliable than others and how to combine data streams. This topic and others are still active areas of research. A wearable device with motion detection is a case in point. With unsupervised learning, the device could identify short versus long cyclically repeating motions and treat them differently from other types of motion. SEMI: How is the new software synthesis-AI approach different from previous approaches? To what degree will the new approach open up new applications?Finkbeiner: Traditionally, technology companies have used cloud computing for data storage and machine learning on aggregated user data. In that model, MEMS sensors generate large amounts of data that power-hungry hardware (such as digital signal processors) must process. In addition, machine learning generally requires lots of power-hungry cloud nodes with GPUs. This model, however, is not the best option for many users. Just think for a moment about all the scenarios in battery-powered devices where frequent battery charging frustrates users.Leveraging both software synthesis and AI techniques in MEMS sensors is therefore a very promising approach because it supports improved recognition and learning inside the sensor. This means that user-specific data isn’t transferred to the cloud. Instead, it remains private inside the sensor. This improves existing applications that learn all the time and opens up new opportunities for applications such as smart clothing, predicting a product’s lifespan, detecting whether a window or door is open or closed – all without server connectivity.SEMI: How will such software adapt to the individual user?Finkbeiner: Devices will offer much more personalized information to users. For example, optimizing a step counter to match the height, age or Body Mass Index (BMI) of a user – or to adapt to a user’s environment (is the person running on a beach, hiking up a mountain or strolling in a park?) – will provide more accurate information on calories burned. Not every step is created equal, and both pre-loaded personal data as well as real-world environmental data will prove that some steps consume a lot more energy than others.SEMI: What would you like MSEC attendees to take away from your presentation?Finkbeiner: I want to introduce the journey of software development by illustrating specific use case examples. I would also like to offer my outlook on the role of software and AI in MEMS sensors to help increase their adoption in current and new applications. Ultimately, I think it’s important to raise awareness in our industry on why we should embrace the use of software and AI.Connect with Stefan Finkbeiner at MSEC or via LinkedIn. Get more information on Bosch Sensortec products and solutions online.Stefan Finkbeiner, Ph.D., CEO and General Manager, Bosch Sensortec, was appointed CEO of Bosch Sensortec in 2012. He joined the Robert Bosch GmbH in 1995 and has been working in different positions related to the research, development, manufacturing, and marketing of sensors for more than 20 years. His senior positions at Bosch have included director of marketing for sensors, director of corporate research in microsystems technology, and vice president of engineering for sensors.Finkbeiner received his Diploma in Physics from the University of Karlsruhe in 1992 before studying at the Max-Planck-Institute in Stuttgart, where he earned his Ph.D. in Physics in 1995. In 2015, Finkbeiner received the prestigious lifetime achievement award from the MEMS Sensors Industry Group (MSIG), a SEMI technology community.Bosch Sensortec is a member of MEMS Sensors Industry Group, the industry association representing the global MEMS and sensors supply chain. To learn more about how MSIG enables professionals in the MEMS and sensors industry to innovate, address common challenges and accelerate business results, visit us today.Nishita Rao is marketing manager for technology communities at SEMI.
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For nearly two decades, Sean Ding, CTO and chief scientist of Alibaba Cloud IoT, has worked in software and algorithm architectures, sensing, semiconductors, systems and cloud computing – all areas that have contributed to the rise of the Internet of Things (IoT). It’s no surprise, then, that Alibaba is leading next-generation innovation for the IoT. Ding will bring his expertise to his role as moderator of Brave New World - MSIG Conference on AI+IoT 2019, a half-day forum March 20, 2019, at SEMICON China in Shanghai, China. Maria Vetrano of SEMI spoke with Ding about technologies key to the IoT era including MEMS, sensors, artificial intelligence (AI), edge gateways and cloud computing. SEMI: MEMS sensors are widely used in IoT devices. What is the relationship between AI and MEMS sensors?DING: While MEMS sensors and AI will increasingly co-reside in end-user devices, I do not recommend adding AI next to the sensor (in the same package). That’s because designers continue to use the ASIC for signal conditioning, so A/D converters are still required. Rather, we should look to edge gateways to carry the majority of the workload, including deep learning, because this reduces system complexity and power consumption.SEMI: Why are smarter sensors shifting data processing and analytics to the edge of IoT devices?DING: Data processing and analytics are very important for IoT devices, but we need to focus on understanding the data, parameter calibration and more. The MEMS sensor industry should leave big data analytics to edge computing and cloud computing because AI requires deep learning, demanding a huge amount of data.The challenge is to find the sweet spot for data processing right next to the sensor element.SEMI: What is China’s evolving role in innovation in MEMS sensors for IoT devices?DING: At present, the MEMS community in China needs to figure out how to innovate instead of copying existing technologies, a low-margin business that will not help to grow the industry. One reason why I am so pleased to see the MSIG Conference on AI+IoT in China is that it will encourage greater creativity in the MEMS community in China, and this will ultimately lead to Chinese companies and R D institutions leading innovation rather than copying it.SEMI: What is the right approach to combining smart MEMS sensors with AI in IoT devices? Why is this important for both domestic Chinese and international markets?DING: Combining data from sensors with cloud-edge computing is the right approach. As sensor companies increasingly provide end-to-end solutions, such as “sensor+ firmware + SaaS + app,” we will realize easier and faster integration of sensors in IoT applications.This is incredibly important because China today is the world’s biggest market for IoT hardware. China has 2,000-plus design houses, 200-plus OEMs and thousands of distributors. That said, we still see a highly fragmented market that will benefit from a faster integration methodology.Faster integration of MEMS sensors and AI/machine learning for IoT hardware will benefit designers in international markets as well.SEMI: What do you hope MISG Conference on AI+IoT attendees will take away from the forum? DING: MEMS sensors are highly fragmented, reflecting the highly fragmented applications in which they play. The MEMS sensors industry should figure out how to provide one-stop-shopping solutions for vertical markets. This will speed the scalability of applications and expedite the growth of sensor production. Sean Ding (柯镇) will moderate Brave New World - MSIG Conference on AI+IoT 2019 at SEMICON China on Wednesday, March 20, 2019, at Kerry Hotel Pudong in Shanghai, China.This conference has been organized by the MEMS Sensors Industry Group (MSIG). Register today to connect with Sean Ding and featured speakers at the event.Speakers at the MSIG Conference on AI+IoT 2019 at SEMICON China include: Welcome and Introduction / 欢迎辞Carmelo Sansone, Director, MEMS Sensors Industry Group (MSIG), a SEMI technology community AI Needs Accurate Data – MEMS Sensors Can Provide It / MEMS传感器为人工智能提供真实数据Andrea Onetti, Group VP of Analog MEMS Group, GM of MEMS Sensor Division, STMicroelectronics Enhanced IoT Edge by Smart Sensors / 智能传感器助力IoT边缘智Bennini Fouad, Regional President Asia Pacific, Bosch Sensortec Horizon AI Processor Solution, Enable Industries in AI Time / 地平线AI芯片解决方案,赋能千万业Carl Zhang 张永谦, General Manager/VP, Smart Chip Solutions Division, Horizon Robotics Inertial Sensors in AI Applications / 运动传感器AI应用案例Ben Lee 李彬 , CEO, mCube Ultra-Low-Power Solutions: an Ecosystem Approach / 超低功耗的生态链解决方案Carlos Mazure, IEEE Fellow, Chairman Executive Director, SOI Industry Consortium High-Integrity, Fault-Tolerant Open Inertial Measurement Platform for AI-based Vehicle Automation / 适用于人工智能车辆自动控制的高集成及容错的惯性测量开放平台Dan Dempsey, Senior Director of Automotive, ACEINNA Maria Vetrano is a public relations consultant at SEMI.
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Marcellino Gemelli, director of global business development at Bosch Sensortec, will present at the upcoming MEMS Sensors Executive Congress on October 29-30, 2018 in Napa, Calif. SEMI’s Maria Vetrano caught up with Gemelli to give MSEC attendees a preview of Gemelli’s feature presentation.Sensor fusion — the integration of different types of sensors through software algorithms to increase overall system performance and/or reduce power consumption— has come a long way since its inception. In those early days, sensor fusion generally involved MEMS inertial sensors only. The advent of new sensor varieties, including environmental sensors, is making new use cases a reality. Gemelli will explore the ways in which the next generation of sensor fusion is improving autonomous mobility devices. SEMI: Why are environmental sensors important to autonomous mobility devices?Gemelli: When most of us think of autonomous systems, we think that they are driven by motion sensors and proximity sensors (e.g., radar, Lidar). When vertical location comes into play, however, in applications such as drones or asset tracking, pressure sensors become an integral part of flight control, navigation and positioning in GPS-challenged areas.While not commonly considered an electronically enabled sense, the ability to “smell” the environment opens new opportunities. The quality of a user’s experience with personal cleaning robots and robo-taxis are good examples of where we might want to enable scent detection.SEMI: I’ve never thought much about using sensors to detect smell. How would a robo-taxi or a cleaning robot benefit from scent detection?Gemelli: Fully autonomous cars will inevitably give rise to robo-taxis. In fact, last month Volvo announced its fully electric robo-taxi, and in March 2018 Waymo announced that Jaguar Land Rover’s SUV would join Fiat Chrysler’s Chrysler Pacifica minivans in its planned fleet of robo-taxis, so we may see robo-taxis in the U.S. within the next five years.With robo-taxis fast-approaching, we need technologies that provide the same level of oversight that a taxi driver once fulfilled. Gas sensors would function like an electronic nose (e-nose) in a robo-taxi to inform the taxi’s owner of prohibited passenger behavior, such as eating, drinking or smoking in the vehicle, which could potentially damage the vehicle’s interior. Camera sensors could record the act as proof of the offense.Cleaning robots would be more sophisticated than they are today. In addition to leveraging image and range-finding sensors to more accurately map the rooms in your house, they could also detect scents from spilled red wine, pet urine or other foreign materials. When the cleaning robot, such as a vacuum, detects the foreign substance, it would navigate around the substance instead of going through it and spreading it all over the carpet.In addition to robo-taxis and cleaning robots, I will also discuss asset tracking and drones.SEMI: What role does sensor fusion play in autonomous mobility devices?Gemelli: Combining sensor fusion with artificial intelligence (AI) will generate new use cases and therefore new markets for sensor suppliers.There is another major benefit as well. With so many connected devices in our lives — including those with cameras, location awareness and always-listening capabilities — we are seeing growing concern about user privacy. Sensor fusion and AI can help to alleviate this concern: By supporting more local processing, they allow for greater control of data, safeguarding personal privacy.SEMI: Who is responsible for the AI part of the sensor-fusion equation?Gemelli: AI is a new frontier for MEMS and sensors suppliers. It benefits us and our customers to embrace AI algorithms through in-house development and/or partnerships.SEMI: What would you like MEMS Sensors Executive Congress attendees to take away from your presentation?Gemelli: I plan to issue a call to action to increase research in hybrid sensor-fusion software architectures, including AI, as suppliers’ collaboration will benefit the industry at large.Marcellino Gemelli is currently based in Palo Alto (CA) responsible for business development of Bosch Sensortec's MEMS product portfolio. He received the ‘Laurea’ degree in Electronic Engineering at the University of Pavia, Italy while in the Italian Army and an MBA from MIP, the Milano (Italy) Polytechnic business school. He previously held various engineering and product management positions at STMicroelectronics from 1995 to 2011 in the fields of MEMS, electronic design automation and data storage. He was contract professor for the Microelectronics course at the Milano (Italy) Polytechnic from 2000 to 2002.Marcellino Gemelli will present Environmental Sensors Systems Enabling Autonomous Mobility on Tuesday, October 30 at MEMS Sensors Executive Congress in Napa Valley, Calif.Register today to learn more about the connection between sensor fusion, AI and next-generation autonomous mobility devices.Maria Vetrano is a public relations consultant at SEMI.
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Ahead of his presentation on the future of wearables at the European MEMS Sensors Summit 2018, 19-21 September in Grenoble, France, SEMI spoke with Dr. Peter Weigand, vice president, Business Strategy and Portfolio Management, Bosch Sensortec GmbH. Dr. Weigand gave a glimpse into insights he’ll share at the event.1. Wearables such as smartwatches, fitness trackers or hearables are becoming ubiquitous – but what are the must-haves for wearables for daily use by wearers?We see that users nowadays want to track their activities such as steps walked, calories burnt and floor levels “climbed” on a daily and holistic basis. “Quantifying yourself” is becoming an overall trend in our society with health, fitness and well-being continuously gaining in importance. This is only possible if information about activities is delivered comprehensively in an accurate manner. Therefore, at Bosch Sensortec we provide MEMS sensors that measure the user’s activity very precisely. For example, the smart sensor hubs BHI260 and BHA260 provide sophisticated in-sensor algorithms (e.g. activity recognition) with very low latency and guaranteed performance due to the real-time nature of the embedded software. From the system manufacturer’s perspective, “quantifying yourself” on a 24/7 basis means that the device has to be “always-on.”However, these always-on functions usually consume a lot of battery power, which poses challenges to the manufacturers and system designers, as the battery capacity is usually small due to the size of the wearable. This shows two other must-haves for the users nowadays. First, the compact size of the device. While smartphones have become larger, users of wearables benefit from the devices’ small size and their low weight, offering the possibility to wear them directly on the body. Therefore, we design the footprint and height of our MEMS sensors as small as possible to ensure the compact size and the ease of integration into new, stylish types of wearables. For example, the BMP388, measuring only 2 x 2 x 0.75 mm³, qualifies as the world’s smallest barometric pressure sensor. The second requirement in this regard is long battery life. Users do not want to charge their wearable device every other day, as this would also impede the always-on activity tracking aspect. At Bosch Sensortec, we hence provide MEMS sensors that run at ultra-low power to ensure always-on endurance and a long battery life. The BMA400 is an ultra-low power acceleration sensor that draws ten times less current than existing accelerometers.2. Are there any other user requirements for wearables?Yes, we see for example that just tracking the number of steps or the calories burnt is not enough anymore. Users require multi-functional devices that also provide information that can be used to monitor sleeping behaviour, navigate in cities, or prepare your smart home for your arrival. We are equipping our sensors with more features and developing new types of sensors that add new functionalities to wearable devices. For example, we have developed a smart watch Projection Module that can project information on the back of the user’s hand for an additional, enlarged display. While smart watches are rising in popularity, demand for basic wristbands is waning. Users are paying more attention to device design. Like clothing, the look and feel of the device should support the user’s individual style.At the same time, with more fashion brands are entering the wearables market we are providing sensors that are easy to integrate into new types of wearables such as hybrid watches. Our products feature a small form factor to ensure flexible, simple design-in. For example, the new BMA400 acceleration sensor easy to design into various applications. Finally, to conform to the user, the wearable must adapt to the user’s individual habits and motions such as learning different gestures, requiring the devices to be not only smart but increasingly intelligent with artificial intelligence (AI). We are providing sensors, such as the BHI260, with embedded, local intelligence with advanced algorithms that enable devices to learn. We are developing intelligent software solutions that use deep learning, enabling device to adapt to the user’s individual behaviour.3. What current techniques are design engineers using to reduce power consumption of wearables?Several techniques are being developed to reduce power consumption. The goal largely is to reduce the power draw of components that are always-on, such as the screen in a smartwatch. In activity trackers, the motion sensor is always on to sense, track, classify and store motion data. Reducing the power needed to operate these features will cut total system power consumption as well. A good example is our BMA400 accelerometer that has a current consumption of less than 1 µA in full operation.At the same time, it independently processes sensor data. For example, the device converts the three-axis motion sensor data stream into step counting events. This allows the main (host) microcontroller to remain in the stand-by mode required for activity tracking and to be activated by the accelerometer to deliver full power only, say, every 100 steps. The sensor, rather than the microcontroller, manages the overall duty cycling of the microcontroller to reduce system power and increase overall efficiency.4. What alternatives are engineers exploring to reduce power consumption? What is the role of intelligence directly within sensors for local processing capabilities in wearables?We have seen how the BMA400 can reduce power by integrating the motion classification functions. We can take this concept further by integrating a microcontroller that’s specifically tailored for low-power sensor data processing, such as the “fuser core” that Bosch Sensortec uses within its smart sensor hubs such as BHI260 or BHA260. The built-in sensor data fusion and machine learning hardware accelerators make it uniquely suited to reduce overall system power. The concept of edge computing has been around for many years, but only in this and the previous sensor generation with built-in local intelligence are we reducing the full power profile of the wearable device. Our sensor architecture design allows us to process the power locally in the MEMS sensor without waking up the main application processor.5. What technologies are you developing to lengthen battery life without compromising performance? We are continuously improving the MEMS and ASIC designs of our sensor portfolio to drive ever higher power efficiency. The BMA400 draws 10 times less current than existing accelerometers while delivering solid high performance (e.g. low-noise data). 6. Wearable device feature and performance requirements are continuously rising. Will batteries need to be larger to support these requirements? Since the beginning of the portable consumer electronics, improving batter life and reducing chip power consumption have been parallel efforts, a trend we expect to continue. However, we expect a greater focus on the overall system power reduction with sensors managing the power, turning on and off microcontrollers, radios (including GPS) and displays in wearable devices.7. What do you expect from European MEMS Sensors Summit 2018 and why do you recommend attending in Grenoble?The European MEMS Sensors Summit is a very important platform for us. It is an opportunity to meet partners, customers, industry leaders, to exchange ideas and to get new insights and thus to ultimately refine our solutions for our global customer base. Our ultimate goal is to improve people’s individual lifestyle and well-being.Serena Birschetto is a marketing communications manager in SEMI Europe.
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