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MEMS and image sensors are shining stars in the chip industry as technology companies worldwide accelerate innovation in the fight against COVID-19. The tiny devices are behind advances in areas of electronics ranging from thermal imaging and faster point-of-care testing to microfluidics-based polymerase chain reaction (PCR) tools and techniques to detect SARS-CoV-2.SEMI recently spoke with Yole Développement analysts Dimitrios Damianos and Chenmeijing Liang about MEMS and imaging sensors market trends and how microelectronics-enhanced technologies are supporting the worldwide push to contain the spread of COVID-19.For additional insights on the technologies, join the SEMI MEMS Imaging Sensors Summit, held for the first time at SEMICON Europa, 12-13 November 2020 in Munich, Germany. Registration is open.SEMI: Despite the global pandemic, the MEMS and sensors market is still growing and is one of the healthiest industries, not only in Europe, but globally. What is driving this growth?Damianos: MEMS have been continuously evolving from the first sensors that were measuring pressure and acceleration to rotation sensing and visible light management followed by light sensing beyond visible and the expansion to ultrasound and multi-spectral. Now we are heading towards an era where we want to sense every aspect of our environment, with more processing and eventually analytics bringing more quality to the data.COVID-19 has impacted various global markets in very different ways. While automotive, mobility and civil aviation have suffered, the impact on telecommunications and medical has been positive. The effects on the consumer, mobile and industrial markets have been moderate. Moreover, COVID-19 is changing the perception of the current global supply chain in manufacturing, potentially leading to more localized value chains and further regionalization in order to minimize similar risks posed by the pandemic and the first lockdown.SEMI: Who are the main MEMS players based on your research? Damianos: For MEMS players, the picture in 2019 was not the same as 10 years ago, when Texas Instruments (TI) and Hewlett-Packard (HP) were leading the scene, with Bosch and ST Microelectronics following, all at comparable revenue levels. Now, Broadcom and Bosch lead with almost $1.4 billion in revenue each, and the rest of the MEMS key stakeholders compete in the $400 million to $600 million league. Microphone players profited from the voice interface adoption trend, while players active in MEMS for mobility and smartphones suffered slightly due to weak end-system demand.SEMI: What scenarios can we expect for each market with regard to the impact of COVID-19 on MEMS for 2020? Damianos: For 2020, at Yole Développement we expect the consumer market to contract slightly by 2.6%, with the automotive market to dip by 27.5%, and defense and aerospace by 20.5%. For the defense market, no major effect is expected, as all major programs still run for the year. The market may experience some slight delays in deliveries due to supply chain and logistics problems. However, sensors integrated in commercial/civil aerospace applications will suffer due to the general paralysis of the air travel industry. On the positive side, telecommunications could increase by 4.7%, medical applications by 10.6%, and industrial by 11.5%.Due to the global pandemic, some types of MEMS have spiked in demand this year. For example, demand for thermopiles and microbolometers used in temperature guns and thermal cameras has increased because of the need for contactless monitoring of people’s temperatures. Moreover, microfluidics for DNA sequencing and real-time polymerase chain reaction (PCR) diagnostic tests for detecting COVID-19 are gaining market relevance, with the latter serving as a premier method of detecting a bacteria or virus on the molecular level with high degrees of accuracy. Furthermore, pressure and flowmeters in ventilators will grow because of huge demand by hospital intensive care units (ICUs).SEMI: What growth trends do you predict for the long haul?Damianos: In the longer term, we expect global MEMS volumes to almost double, from 24.4 billion units in 2019 to 50.8 billion units in 2025, with a 13% CAGR during the same period. The global MEMS market could reach $17.7 billion in revenue by 2025.We see a trend to more wearable devices integrating a lot of sensors but also a move to a more consumer-oriented healthcare. Moreover, everything related to voice interfaces and voice/virtual-personal assistants (VPAs) will continue to see strong growth, increasing demand for MEMS mics with better quality and high-fidelity voice capture. MEMS devices are shifting to higher accuracy, ultra-low power, embedded intelligence and possibly some bio-compatibility for medical applications.MEMS players will try to escape the commoditization cycle and deliver more value by increasing the value of the data, either grouping many sensors to create sensor hubs or by adding processing, algorithms and software. Industry players are employing strategies such as adding extra processing close to the sensor (e.g. Knowles) or ameliorating the use cases of their applications of their clients (e.g. Bosch or ST). AI on the edge seems very alluring for extra value acquisition, with many startups already working on it. Some examples include always-on-sensing (Aspinity in collaboration with Infineon, Syntiant), echolocation (IMERAI) and predictive maintenance using inertial sensors (Cartesiam). This will be the next pit stop for MEMS technology for sure. SEMI: The CMOS Image Sensor (CIS) is a cornerstone technology in the development of devices powered by machine sensing and artificial intelligence (AI) for applications such as advanced driver assistance system (ADAS). CIS powers many of the ongoing revolutions in new technical products and use cases. What is the status of the image sensors industry? Liang: Last year was exceptional with a combination of high demand and high prices due to capacity limitations. Q4 2019 went way above the forecast, and, in the end, the CIS industry reached $19.3 billion for the full year. This year, we think it will return to normal, and, despite the pandemic impact, we expect significant growth in the range of 7% to 12%. Last year’s 25% year-over-year (YOY) growth was the highest we’ve seen over the past decade. Mobile still dominates the marketplace for CIS with 69% market share. Two markets, computing (8%) and consumer (5%), are adjacent to the mobile market but progressively losing ground due to the smartphone disruption.Security, at 6% market share, will probably be the second largest CIS market in the future. Although this is an area of excellence for the emerging Chinese players, unfortunately, they could be hit by the current trade war. The automotive market did very well from 2018 to 2019 because of the numerous applications recently developed for ADAS, viewing, and in-cabin applications. Lastly, the industrial camera applications benefited from large investments in automation, especially in the semiconductor and automotive industries, but here again many uncertainties remain as these markets will reshuffle in the post COVID-19 world. SEMI: Which CIS markets are most susceptible to seasonality and the impact of COVID-19?Liang: According to our quarterly CIS monitor, automotive and security were both negatively impacted by the pandemic beyond what we expected in terms of seasonality. For computing, the situation improved just prior the lockdown. Q1 got a positive impact with high sales results for laptops and tablets, but no significant impact was seen for security equipment. For automotive, the demand for cameras was very high in Q1, which is seasonally normal, despite the decrease of car shipments that followed later. The automotive CIS market in 2020 should remain relatively flat compared to 2019 due to the higher attachment rates of cameras despite the lower number of cars produced. Consumer and industrial segments dropped in Q1, which is typical early in the year.The next five years might be a bit slow, and although we forecast growth for the next year, in the future the market share will be lower in mobile. In fact, mobile CIS growth will fall below the CIS growth average, but we will see an increase of market share for the security, automotive and industrial segments. The CIS market could reach $28 billion in 2025.At first, COVID-19 had a limited impact on the production side, as factories in China are usually closed for the New Year holiday, when the pandemic started. While supply is currently recovering, we still consider the limited impact on demand. Smartphone production for 2020 will be down 6%, but camera shipments for mobile should increase about 10% this year. Another positive trend for the mobile market is optical fingerprint implementation. Currently, high-end Android phones use this kind of technology. For 2023, we estimate optical fingerprint technology revenue to be over $1 billion.The roadmap for the automotive market is driven by camera proliferation. We’ll see 10 cameras per car and more for some high-end vehicles. Increasing demand for safety and convenience will mean more cameras per car in the future. With a strong attachment rate, the market average in automotive is around 2.0 cameras per car nowadays, and we expect the market average to reach 3.5 cameras per car in 2025. In security, Charge Coupled Device (CCD)-based cameras are nearly out of the market, as CMOS-based IP cameras are most important now.SEMI: What are current key technology trends?Liang: 3D semiconductor technology is the hot topic. CIS wafer staking technology is indeed at the center of the CIS technology race. Future applications could be AI analytics or recently developed applications on new types of CIS. So far, we have seen the introduction of variants of the CIS pixel. Global shutter (GS) and indirect Time of Flight (iToF) were recently introduced, and now direct time-of-flight (dTOF) pixels are being used in high volume. 3D semiconductor technology is a bonanza for the industry, as it allows to pack more value in a single chip. While the surface of silicon is still increasing, additional silicon is added through stacking.With COVID-19 still a problem, the endpoint for smartphones in 2020 remains uncertain. The short-term impact for CIS will be slower growth with respect to the 25% YoY of last year. The downturn in car production will be mitigated by an increased attachment rate for automotive cameras. The security market will also help maintain CIS growth.For more insights, see the following reports: Status of the MEMS Industry 2020 3D Imaging and Sensing 2020 CIS Market Monitor Q2 2020 Dimitrios Damianos is a technology and market analysts at Yole Développement covering MEMS, Sensors, Photonics and Imaging. Chenmeijing Liang is a technology and market analysts at Yole Développement covering Imaging. Serena Brischetto is senior manager of Marketing and Communications at SEMI Europe.

Japan’s semiconductor industry has weathered the COVID-19 pandemic to post robust growth. Far from a temporary setback, COVID-19 will lead to enduring change in how we work and live. And just as automation has been a bulwark against the devastating business impacts of the virus outbreak, increasing digitization will lead to new efficiencies in our industry.These were some of the key takeaways from three SEMI Japan Members Day webinars in June and July that offered the latest updates on COVID-19 impacts to the semiconductor industry and restart strategies for SEMI members. More than 2,000 SEMI members across Japan’s islands attended the webinars featuring the following five speakers: Hideki Kanewaka, Marketing Director, Consulting Lead, Japan, Accenture Japan Ltd. Takayuki Komori, Manager, Marketing Engineering Dept, SUMCO Corporation Taketoshi Hamaguchi, Director, Manufacturing Industry, Microsoft Corporation Akira Minamikawa, Senior Consulting Director, OMDIA (Informa Intelligence LCC) Yuichi Koshiba, Managing Director Partner, Boston Consulting Group COVID-19 Impact on Japan Semiconductor Industry is ModestThe consensus view of the five speakers from various quarters of the industry – consultant, IT service provider, materials supplier, market analyst – was that the Japan semiconductor industry withstood the heavy blows COVID-19 dealt to other industries thanks to strong demand for chips. Shelter-in-place policies and lockdowns spawned by COVID-19 has accelerated the digital transformation rippling around the world as electronics sales have soared to support everything from remote work and education to healthcare and home entertainment including gaming.The rapid growth of cloud usage for video streaming, gaming and remote work is taxing communications network capacity and placing more bandwidth demands on servers, said Akira Minamikawa of OMDIA. According to a recent report by Nokia, communications network traffic has skyrocketed 300 percent for online meetings and 400 percent for gaming, bringing the networks closer to their capacity limits. Minamikawa sees server shipments increasing at 8 percent CAGR through 2024. For the broader chip market, he expects demand for notebooks, solid state and hard disk drives, and gaming to remain strong in 2020. He also predicts rapid 5G penetration for smartphones will boost semiconductor chip industry growth.Still, not all semiconductor segments are expanding, said Yuichi Koshiba of Boston Consulting Group. Chip shipments for end products in markets such as automotive, industrial equipment and aircrafts are on the decline. Slowing demand for chips that power automotive applications in particular could pare sales for some chip companies and distributors since the segment accounts for a high proportion of their overall revenue.State of the Semiconductor IndustryFrom SUMCO’s vantagepoint as a major silicon wafer supplier, the company’s Takayuki Komori sees a number of changes unfolding in the semiconductor industry: Smartphones are driving growing demand for process technology (smaller nodes) and 300mm wafers. Komori estimates the typical high-end smartphone sports 1,700 square millimeters of silicon. 300mm wafers account for 80 percent of that total while more than 50 percent of the devices use leading edge multi-patterning technologies. Smartphones will need more RF chips to support 5G’s high-speed communications and added frequency ranges. Substrates for RF switches and tuners have been shifting from gallium arsenide (GaAs) and other compound semiconductors to silicon. 5G smartphone penetration will accelerate as the cost of integrating CPUs and modem functions into a single chip sees a swift decline. While the sensitivity and resolution of CMOS image sensors have evolved to incorporate innovative backside illumination and stacking technologies, future advances will focus more on products for machine vision applications capable of sensing invisible light bands. Rising adoption of electric vehicles and robotics applications will drive growing demand for power semiconductors that control their motors such as IGBTs and MOSFETs as the production capacity for the devices expands and shifts to 300mm wafer lines. For memory fabs, Minamikawa said utilization remains high as a result of a spending slowdown by major chip manufacturers and will stay elevated even once additional capacity ramps to support robust demand. Foundry fab utilization also remains high despite the pandemic-driven cancellation of smartphone chip orders in March. Minamikawa also sees the utilization rate of micro rising with the surge in demand for notebooks, PCs and servers in the second half of 2020.Transition to New NormalAs people around the world start to settle into new ways of living and working, there’s a growing acceptance that the transformation will be long-lasting. And no area of people’s lives is changing more than their work. Boosted by government subsidies, many small and midsize companies in Japan have started to implement work-from-home policies, an area where major electronics and IT businesses had already instituted reforms, said Hideki Kanewaka of Accenture. A few examples: Nippon Telegraph and Telephone Corporation (NTT) announced that half of its employees will continue to work from home in the future. A five-year plan Toshiba launched in 2019 to allow all employees to work from home will likely accelerate. Hitachi plans to allow all employees to work from home starting in April 2021. dwango, a major internet-based entertainment company in Japan, announced it will allow in principle any employees to work remotely. In the critical area of remote sales, Kanewaka pointed to the importance of going beyond online business meetings, paperless transactions and virtual events to devise new ways to attract customers and close deals. Creating online communities and providing rich digital content are also important measures to consider, he said.Manufacturing's Digital TransformationTravel restrictions by most countries to curb the COVID-19 outbreak have also raised barriers to chip companies sending engineers overseas sites to service state-of-art equipment and provide other technical support. Microsoft’s remote assist system deployed by ASML is one tool semiconductor makers can use to overcome this challenge, said Taketoshi Hamaguchi of Microsoft.The system connects a remote equipment service expert with an onsite worker through the internet, allowing the technical expert to provide support through a goggle display with a camera worn by the worker. Guided by the expert, the worker can perform complex services. A Natural User Interface (NUI) helps give the factory worker a clear understanding of the often highly technical instructions.Using artificial intelligence (AI) to increase automation will also help reduce the reliance of semiconductor factories on onsite workers. For example, AI deep learning can be deployed to calibrate equipment autonomously and reduce downtime after scheduled maintenances, Hamaguchi said.Corporate Restart Strategies Beyond factory considerations tied to COVID-19, semiconductor companies will need to adapt their business strategies to new ways of operating. For example, global supply chains will shift to domestic sources and increase redundancy to ensure a steady supply, a change leading to higher overall costs, Koshiba said. Trade routes among regions will also be redrawn as the trade rift between the United States and China and other geopolitical tensions intensify. The total value of those routes is expected to recover by 2023.Koshiba advised companies to evaluate the supply chain trade-offs between stability and cost and factor in potential risks to improve their short-term resilience and drive mid- to long-term supply chain restructuring.After past recessions, 14 percent of companies restored sales growth, Koshiba said. He recommended investing aggressively in growth and seizing M A opportunities during the downturn. Chip companies must also adapt to supply chain changes faster than competitors.Become a SEMI MemberWebinars like the recent SEMI Japan Members Day series have become increasingly important in the mix of programs and services SEMI offers members to help them connect, collaborate and innovate in the microelectronics community. To become a SEMI member, please visit the SEMI website or contact your nearest SEMI office.Jim Hamajima is president of SEMI Japan.

Tracking and quickly diagnosing COVID-19 infections, working from home and telemedicine recently came into sharp focus as technology executives and other subject matter experts from microelectronics heavyweights recently gathered for the first-ever virtual SEMI CTO Forum to explore how the microelectronics industry and their own companies can leverage future technology trends to drive growth. Themed Intelligent Medtech and Wearable Technologies, the forum drew CTOs from ARM, Babblelabs, Brewer Science, Dell, Dow/Dupont, E-Ink, Hewlett Packard Enterprise, Intel, Lam Research, KLA, Microchip, ON Semiconductor, Qualcomm, Tokyo Electron, Ulvac, Veeco and Xilinx. The event is designed as a strategic driver of pre-competitive innovation. Following are key takeaways from the forum. Microfluidics Promises to Speed COVID-19 Diagnosis More than 240 companies worldwide are developing microfluidics solutions to improve diagnosis and treatment of COVID-19 and other conditions, said forum speaker Dr. Kurt Petersen, a member of Band of Angels, Silicon Valley's oldest angel investment group, with an illustrious background1 in technology. And their innovations are bearing fruit. Cepheid, a company founded by Dr. Petersen, has developed a disposable microfluidic cartridge, Xpert Xpress SARS-CoV-2, used by doctors to swab the inside of a patient’s mouth. Highlighting the vital role of MEMS in medical electronics, the tiny powerful devices are behind a test that can detect COVID-19 infection in under 40 minutes. Dr. Petersen also cited a few examples of implantables and injectables under development, including: In vivo chemical sensing: Profusa developed a continuous glucose monitoring sensor via an optical patch. Glaucoma pressure monitors: Injectsense built a silicon chip the size of a grain of rice that is embedded in the eye to measure eye pressure. Retinal implants: Second Sight implanted a 60-electrode array chip that projects images onto the retina to improve vision. Microelectronics Takes Aim at Battling COVID-19 The event’s CTO roundtable, a platform for discussing societal and technology issues, revealed microelectronics technology will likely give rise to solutions for combatting pandemics and new business opportunities both in the short and long run. Areas of the greatest interest included: Tracking and Security: Infection tracking accuracy is key to limiting the spread of viruses yet comes with inherent privacy and security challenges. The consensus view of the executives was that developing trusted hardware capabilities is critical for adoption of accurate infection-tracking technologies. Remote Operation: Executives expect working from home or the use of telehealth to continue building momentum long after pandemic. To give staying power to the remote communications at the heart of these trends, microelectronics ecosystems will need to boost compute performance, both at the edge and in the cloud, while increasing bandwidth to enable applications such as augmented reality/virtual reality (AR/VR), artificial intelligence (AI), machine learning and advanced data analytics. Edge intelligence: The challenge of remote communications spans both people and the Internet of Things (IoT). Questions persist about how hundreds of billions of sensors will connect to the cloud and how much power they will consume. The need to push computing to where data is generated – at the edge – is rising and the necessary underlying technologies will only come by combining various forms of distributed computing and analytics. The microelectronics industry’s ability to seize these opportunities will only be possible with huge strides in innovation, raising concerns among the CTOs about the financial viability of cutting-edge devices because of increasing device complexity and R D costs. Technology partnerships and collaborations – an area where SEMI is contributing and will continue to expand its efforts as it works with the CTO community – will be critical to containing R D costs. SEMI will help the executives identify and mobilize the resources key to future innovation. Improving Home, Work Productivity and Experiences Key to AR Adoption Smart wearables also offer great promise. In just over a decade, AR and VR have grown from science fiction to practical uses such as AR applications for smart contact lenses, said Dr. Mike Wiemer, Co-Founder and CTO of Mojo Vision2. Dr. Wiemer said that while many AR applications remain under development, the technology will only see widespread adoption once it starts to improve productivity and efficiency at home and work and the quality of other experiences. The smart augmented reality contact lens developed by Mojo Vision is a step in that direction. The product’s built-in display gives users timely information about everything they see while remaining invisible by packing 70,000 pixels into a space smaller than a half a millimeter across, making it the smallest and densest dynamic display ever made. The contact lens is powered by an ARM-based processor, with later versions adding an image sensor, eye-tracking sensors and a communications chip. SEMI thanks EMD Performance Materials and Telit for sponsoring the CTO Forum. For more information on the CTO Forum and SEMI’s Smart Data-AI initiative, please sign up on our webpage. 1 Dr. Kurt Petersen is a member of the National Academy of Engineering, an IEEE Medal of Honor winner, and a Life Fellow of the IEEE for his contributions to the commercialization of MEMS technology. 2 Dr. Wiemer also co-founded Solar Junction, where he led technical teams to two world records in solar cell efficiency (43.5% and 44%). He also has patents and papers in Semiconductor Devices Applications, Silicon Photonics, Materials Integration, Lasers, Solar Cells, Solar Systems, and Analog Circuits. Tom Salmon is Vice President of Collaborative Technology Platforms at SEMI. Pushkar P. Apte, Ph.D., is Strategic Technology Advisor for the Smart Data AI Initiative at SEMI.

At SEMICON West 2020, the Honorable Al Gore, former U.S. Vice President and recipient of the Nobel Peace Prize for environmental activism, commented on the world being in the midst of a “sustainability revolution.” Just what did he mean by that, and why bring that message to us? The answer is that he believes the digital transformation wields the magnitude of the agricultural and industrial revolutions, but with the exponential speed that the semiconductor industry created and enabled. Ok, that would put him in the right place… SEMICON West.Among a rich lineup of speakers to mark the 50th anniversary of the event – and 50 years of the semiconductor industry facilitating the innovation of the Information Age -- Gore joined other icons in their fields who graced the virtual stage for our featured keynotes. Each analyzed how microchip advances are critical to solving some of the world’s greatest challenges.As host of the conference, I had the privilege of introducing Gore; Gary Dickerson, President and CEO of Applied Materials; and, Dr. John Kelly III, Executive Vice President and Director of IBM Research, along with other renowned speakers. Their insights seemed especially timely for how our global supply chain can help to build a more sustainable future. Following are a few of the highlights from their discussions. Al Gore – The Planet Faces Existential CrisisIn his keynote conversation with Greenbiz editorial director Heather Clancy kicking off SEMICON West 2020, Gore emphasized that digital technology advances – and in particular microchip innovation – provide the greatest opportunities to overcome the world’s most epic challenges. Chip breakthroughs will be the cutting edge of what he called the rapidly growing sustainability revolution to improve energy efficiency, reduce our reliance on fossil fuels, and optimize the performance of renewable energy generated by solar, wind, and electric battery sources.“We face an inflection point as we rely more on data and communications technology, particularly in areas like cloud computing and artificial intelligence,” Gore said. “Industry is aware of this and working on it, but this meeting (SEMICON West 2020) with your present leadership marks a real turning point. It’s something to be proud of, something to be celebrated. It’s what gives me hope.”Citing Moore’s Law and enormous strides made in chip efficiency and effectiveness, Gore said that within two years smart chips will make everything from solar panels and batteries to renewable energy plants and electric vehicles to be both cost- and performance-competitive with traditional energy sources. Afterwards, renewable energy will be more attractive. Gore urged the energy-intensive semiconductor industry to shift to more renewable power sources for manufacturing. To meet this challenge, Gore encouraged the industry to embrace strategies for “step changes”: First, collaborate and share best practices more transparently across the entire microelectronics value chain. Examples already abound where “cutting-edge apps, AI, and deep learning reduced data server energy use significantly without hardware changes,” he said. Second, reduce electricity required to manufacture smarter and smaller semiconductors. Gore encouraged “all of the equipment manufacturers to work together to reduce the amount of carbon dioxide emissions in manufacturing these advanced semiconductors.” Third, follow the lead of a growing number of companies that “continue decarbonizing the power supply on which data centers operate,” he said. Fourth, work with government through the Science Based Target Initiative, which sets decarbonization limits that keep global temperatures no more than two degrees Celsius above preindustrial levels. Finally, rely on “diversity of thought” and “collective thinking” when innovating for the digital future. Research and experience prove that different points of view lead to better decisions. The technology industry has made progress in workforce diversity, but more can be done, Gore said. This last point plays to our collaborative strengths as SEMI members and an industry. “It is just unbearable to imagine a future generation living with the kinds of consequences scientists tell us would ensue if we don’t heed their warnings and solve this crisis,” Gore said, drawing parallels to the COVID-19 pandemic. “We have to accept the situation and make sure we do everything we can. I am inspired by this industry’s leadership, innovation, and spirit to rise to the challenge and make a difference.”Gary Dickerson – Making Possible A Better FutureTo ensure another 50 years of accelerating growth and innovation, today’s semiconductor leaders must share a deep commitment to a more sustainable and just supply chain industrywide.“The first thing we need to do is decouple our growth from environmental impacts,” Dickerson said in his keynote. “Our responsibility as leaders is to leave the world a better place.”Dickerson said that while he firmly believes the explosion of processing and storage data has “the potential to change the world,” the downside is that it also has the potential to rapidly expand our industry’s carbon footprint. Without dramatic change, electrical usage will continue to rise as machines generate and consume more data, compute performance progresses, and workloads from the edge to the cloud grow.“It will be impossible to create neural networks (using AI) with the rate of today’s power consumption,” Dickerson said, noting that more improvements must be made in the performance and efficiency of semiconductor devices, architectures, structures, materials, and advanced packaging.Dickerson urged the electronics ecosystem to “permanently think and act differently” by breaking down communication barriers among systems integrators, equipment suppliers, design and manufacturing service providers, and other industry players. Sharing learnings and best practices will be vital to this change, he said. Dickerson unveiled SuCCESS2030 (Supply Chain Certification for Environmental and Social Sustainability) – Applied Materials’ 10-year roadmap for creating a more sustainable supply chain – during his talk. Under the SuCCESS2030 initiative, Applied Materials will hold its suppliers to the company’s own high standards for committing to renewable energy and workforce diversity by setting targets such as: Reducing supply chain carbon emissions 15 percent in four years by relying more on intermodal shipping than air freight Transitioning the supply chain to recycled content packaging, with a target of 80 percent by the end of 2023 Eliminating phosphate-based, pre-treatment of metal surfaces by 2024 Working with trade associations like SEMI to develop diversity and inclusion strategies to increase underrepresented minorities in the workplace Dickerson said that deeper and more open partnerships between Applied Materials and its customers and suppliers have led to a number of promising outcomes. Examples include hardware and software upgrades, product and service optimizations, and improvements in chip architectures that increased throughput density for higher system performance while decreasing power and chemical consumption, costs, and space requirements. What’s more, Applied Materials recently introduced its Selective Tungsten Process Technology, which uses new materials, atomic-level designs, and ultra-clean rooms to improve the performance of interconnected transistors while lowering power consumption.Dickerson said the COVID-19 pandemic has awakened the world to the power of digital technologies that make it possible to communicate, collaborate, and share data across the globe while sheltering in place. “When I think of the world’s grand challenges, it’s clear the semiconductor industry has a critical role to play,” Dickerson said. “I strongly believe we’re in a position to shape the future and leave the world a better place.”John E. Kelly III – 50 Years That Changed The World … And We’re Just Getting Started During the past half century, semiconductors have given rise to essentially every major technology advance, Kelly said in his keynote. Microchip innovation has played a central role in rocketing humans to the moon, simulating nuclear weapons on a supercomputer, connecting people to nearly everything via mobile devices, and keeping people alive with pacemakers and other electronic medical devices.The strides in innovation have been staggering. In 1970, a semiconductor chip featured a few thousand components. Today, that number stands at 50 billion. Breakthroughs in everything from materials and chemicals to polishing, processes and interconnectivity have driven gains in power-efficiency and performance while reducing chip size.Moore’s Law is far from dead. Paraphrasing Winston Churchill, Kelly said, semiconductor innovation today is not at “the beginning of the end, but at the end of the beginning, and the best is yet to come – driven by extreme collaboration and extreme innovation to solve the world’s biggest challenges.”Kelly said he believes technology is the only answer to the onslaught of grand challenges confronting societies and people today, including air and water pollution, climate change, diminishing natural resources, storm-related disasters, food supply shortages, and the COVID-19 pandemic.Kelly lamented that the world’s response to COVID-19 illustrates that “not much has changed” since the Spanish Flu crisis a century ago. The same technology – masks – remains the primary defense. “I think if we had used digital technologies and computer modeling earlier on, we could have detected the spread of this flu” to minimize its impact, Kelly said.Today’s computer modeling and analytics capabilities aren’t quite ready yet to tackle such complex problems as pandemics, global warming, or water contamination. However, Kelly said, several game-changing technologies – all powered by semiconductors – are emerging as promising answers to our most daunting challenges.“It’s all about the data, and artificial intelligence is the way forward – it’s analytics on steroids, and many new devices will be required to drive AI at the scale of these problems,” Kelly said. “The second technology revolves around not just cloud computing but edge computing and cloud at the edge. Data will be generated in enormous amounts at the edge, which is where we will need to store and compute the data. The next is Quantum Computing. Frankly, we do not have enough computing power yet to look at some of the biggest challenges we have.”All these advances will present new challenges for the semiconductor industry, such as developing new materials, new chip architectures and new mapping structures for AI-embedded devices to reach their full potential.With many of these disruptive innovations too large for any company to solve singlehandedly, Kelly advised industry players to form more “radical partnerships.”“Extreme collaboration and extreme innovation will drive solutions to all these world challenges,” Kelly said. “The best is yet to come.”Radical partnerships… Sustainable revolutions… Extreme innovation… It’s been 50 years of SEMICON West, but it sounds like we’re just getting the real magic started. Like John Kelly said and the other keynoters emphasized, the best is yet to come.Dave Anderson is president of SEMI Americas.

Emerging applications powered by 5G and artificial intelligence (AI) are expected to be a boon to the semiconductor industry, but only once chipmakers overcome a key challenge: Architecting chips that meet the exacting performance, power consumption, size and cost requirements of devices for mid- to high-end applications. One technology – heterogeneous integration – promises to meet these demands and help drive future leaps in semiconductor innovation in the post-Moore era. To help the industry better grasp the technology challenges and business opportunities associated with deploying highly integrated chip and packaging technologies, SEMI and AI on Chip Taiwan Alliance recently gathered industry leaders from organizations including ASE, Unimicron, Dialog Semiconductor, Cadence and AITA to discuss technology trends and the vital importance of building a cross-industry exchange platform to advance next-generation manufacturing processes critical to heterogeneous integration. Following are key takeaways from the forum, Heterogeneous Integration Enables 5G and AI. Overcoming Heterogeneous Integration Technology Challenges Key to Advances in Taiwan High-End Semiconductor Manufacturing The introduction of the Heterogeneous Integration Roadmap (HIR) by the International Technology Roadmap for Semiconductors team in 2016 was an important first step, Dr. C.P. Hung, Vice President of ASE Group, noted in his opening remarks. The HIR is designed to stimulate pre-competitive collaboration to advance heterogeneous integration technology development and accelerate electronics innovation. The roadmap provides a long-term vision for the electronics industry, identifying future technology requirements and potential solutions. Today, the HIR working group focuses on high-performance computing (HPC), 5G and other leading-edge technologies.Dr. Hung predicted that heterogenous integration will reshape traditional collaborations between the semiconductor ecosystem and supply chain in order to clear I/O bottlenecks that hamstring high-performance applications. The retooled industry connections will also need to enable high I/O pin counts, ultra-thin devices, and high-frequency signal shields. In an important step forward, the chip industry today is developing a platform that enhances wafer-level advanced packaging services and deepens cooperation with Oversea Assembly and Testing (OSAT) and substrate supply chain partners. Overcoming the current limits of IC substrates – the connection between IC chips the PCB – is one key for heterogeneous integration technology to flourish, said Dr. Yu-Hua Chen, Vice President, Carrier SBU, RD Division of Unimicron. He noted that the industry must tackle limits to PCB thickness, substrate density, fine pitch and automation to meet the needs of high-end packaging customers. Another barrier the industry must be surmounted is to make the currently inscrutable confidentiality requirements for patents of foreign materials – key to improving chip yields – easier to access and understand for substrate engineers. Chen said partnerships across the entire industry will be necessary to break through this and other technology breakthroughs. Supply Chain and Cross-Border Ecosystem to Strengthen Partnerships for Further DevelopmentTaiwan has long invested heavily in advancing semiconductor manufacturing and application engineering technologies to become a top global chipmaking hub and, in the process, has been behind significant leaps in optimizing chip functionality, said Leroy Liu, General Manager, Asia Headquarters, of Dialog Semiconductor (Germany). With its semiconductor manufacturing prowess, Taiwan can also play a central role in maturing advanced heterogeneous integration packaging technology while managing development costs by partnering with its international supply chain community to overcome technical challenges more effectively, Liu said. The region can also help forge partnerships, even among competitors, to build the ecosystem essential for heterogeneous integration technology to shine.EDA tools will be critical in understanding and resolving heterogeneous integration technical issues since IC substrate, packaging and chip design all pose interdisciplinary engineering challenges, said Julian Sun, Product Marketing Director at Cadence. To help the industry navigate these challenges, Cadence has launched intelligent system design products – solutions that address a wide range of design problems with semiconductor nanometers, micrometers on packaging and testing, and PCB level micro/millimeters to Pin/Pitch, I/O models, and thermals and electricity. By supporting various technical designs, Cadence helps customers shorten the design cycle to strengthen design quality and reduce costs.Sun also pointed to the vital importance of overcoming the significant challenge of designing silicon interposers for heterogeneous integration. Today’s EDA tools are capable of optimizing the design of complex structures including 5GAiP and HBM and are instrumental in aiding Taiwan’s semiconductor ecosystem players to quickly adapt to shifts in the evolving heterogeneous integration market.Heterogeneous Integration Enables 5G and AI speakers (L-R): Julian Sun, Product Marketing Director at Cadence, Dr. Yu-Hua Chen, Vice President, Carrier SBU, RD Division of Unimicron, Dr. C.P. Hung, Vice President of ASE Group, Leroy Liu, General Manager, Asia Headquarters, of Dialog Semiconductor (Germany), Dr. Shih-Chieh Chang, AITA Executive Secretary Designing AI chips is particularly difficult as semiconductor makers struggle with high costs and low yields, said Dr. Shih-Chieh Chang, AITA’s Executive Secretary. That’s why the chip industry now uses FPGAs for small-volume production of AI chips, which makes it easier to improve manufacturing yield through redundant design. For its part, AITA has formed a special interest group (SIG) to help form connections among the chip industry, academia and research institutes. The association’s goal is to build a platform for mass production of AI chips.To get involved in SEMI Taiwan Heterogeneous Integration related events, please contact Ula Huang, outreach senior specialist, at [email protected] Fang is a coordinator and Ashley Huang is a specialist in marketing and public relations at SEMI Taiwan.

The world’s most advanced manufacturing factories are leading the way in driving efficiency and sustainability.In advance of its 2020 meeting, the World Economic Forum welcomed Micron into its Global Lighthouse Network, a group of advanced manufacturers “that are showing leadership in applying the technologies of the Fourth Industrial Revolution to drive operational and environmental impact.”For years, Micron has been helping clients integrate artificial intelligence (AI), big data analytics and the industrial internet of things (IIoT) into their factories. And now Micron’s factory is one of the first facilities in Singapore, along with Infineon, to be recognized by the Global Lighthouse Network.In a recent interview with Channel News Asia, Manish Bhatia, executive VP of Global Operations, explained how Micron has been practicing what it preaches: “Our products enable new technology trends such as IoT, 5G, cloud computing and autonomous driving. Applying these technologies in our own manufacturing facilities demonstrates the enormous potential in driving business value. Industrial IoT and artificial intelligence are part of the biggest revolution since the advent of robotic manufacturing productivity 50 years ago.”For Micron, this journey started with the need to “keep pace with the technological advancement of our semiconductor processes,” Manish said. “We wanted to provide higher-capacity, higher-performance, lower-cost and lower-power chips.”This meant embarking on the same journey they guide clients through: “We started by focusing in 2014 on simple statistical analysis to improve our production processes,” Manish said. “Following that, we developed more complex deep learning and AI capabilities to draw insights from our data. Most recently, we introduced IoT sensors — like cameras and acoustic sensors — to gather even more data that allows us to further improve our production processes.”The Singapore factory plays a critical role in developing leading-edge NAND. Micron’s Singapore presence, composed of two wafer-fabrication facilities and one assembly and test facility, serves as the base for worldwide operations. With over 500,000 square feet of cleanroom space, the location is also a designated NAND Center of Excellence, driving the implementation of the company’s leading-edge 3D NAND production for use in mobile phones, solid-state drives, digital cameras and more. Micron employs approximately 8,000 people in Singapore.The World Economic Forum says the results of the Singapore transformation have been spectacular: Micron’s “semiconductor fabrication facility has integrated big data infrastructure and IIoT to implement artificial intelligence and data science solutions, raising product quality standards and doubling the speed at which new products are ramped.”Below are notable achievements that Micron was recognized for: Automation of production and maintenance produced a 4% tool availability improvement. The IIoT-enabled smart factory led to a 22% scrap and product downgrade reduction. Advanced analytics for process optimization with OEMs reduced time to ramp new products by 50%. Deep learning optical-defect detection created a 2% yield improvement. The integrated deviation management platform reduced time to resolve quality issues by 50%. Micron was a natural choice for the Global Lighthouse Network, an organization whose creation is timely. The World Economic Forum points out that “global production industry is lagging in its adoption of Fourth Industrial Revolution manufacturing technologies, with more than 70% of companies stuck in pilot-phases … [There is] a need for a neutral learning platform to showcase top-use cases, roadmaps and organizational approaches to adopting and scaling technologies from which other companies globally could benefit.”As part of the Global Lighthouse Network, Micron will be able to share knowledge and best practices with peers, support new partnerships and help other manufacturers deploy technology, adopt sustainable practices and transform their workforces. We can all build on this community of like-minded organizations, levering technology to improve efficiencies and promote sustainability.This recognition from the World Economic Forum is a win-win. We look forward to joining the club of lighthouse factories around the world and to helping propel the entire global manufacturing industry into the Fourth Industrial Revolution. At Micron, we are at the forefront of this transformation and welcome the opportunity to serve as a lighthouse.Koen De Backer is responsible for driving Micron’s smart manufacturing initiatives and digital operations including capabilities with IoT, artificial intelligence, advanced analytics, cognitive computing and machine learning to enhance Micron’s business, global operations and product development. Prior to joining Micron, Mr. De Backer led large-scale operations projects for more than a decade to help clients reduce inefficiencies and achieve excellence in manufacturing, procurement, supply chain and support functions.Most recently, De Backer was a partner at McKinsey Company, where he steered the semiconductor consulting practice in Southeast Asia and was one of the firm’s leading experts on applying artificial intelligence and automation techniques across operations and support functions such as finance, human resources and procurement. Additionally, Mr. De Backer consulted with high-tech global clients while working at Deloitte Consulting, Altran Europe and CSC. Mr. De Backer holds a master’s degree in business administration from INSEAD and a master’s degrees in both industrial management and electromechanical engineering from Katholieke Universiteit Leuven.De Backer is also chairman of the SEMI Southeast Asia Smart Manufacturing Chapter. For information on participating in the chapter, contact Shannen Koh at [email protected].

During the COVID-19 pandemic, the SEMI Global Advocacy team has been working tirelessly to ensure the microelectronics manufacturing and design supply chain is classified as an “essential business” in the United States and for similar designations in several other countries so that SEMI member companies can maintain operations. Their efforts have included direct lobbying and letters to the governors of 16 states in the U.S., 23 European countries and several European Union officials across the continent, as well as government officials in Japan, Mexico and Malaysia. The bedrock of these efforts, and the reason they have been highly effective, is that our industry enables both modern digital infrastructure and technology critical in the fight against the virus.SEMI takes immense pride in highlighting the role of our industry in providing the building blocks for innovations that improve social and economic prosperity the world over. It is never more apparent that necessity is the mother of invention than during a crisis, and the pandemic has created a diverse range of demands for technological advancements to address the myriad of challenges it presents. Our SEMI Tech Spotlight blog series highlights some of the many ways that our industry and member companies are enabling technology employed on the front lines of this fight – and that we strongly believe will ultimately help to win it. Our first piece in this series focuses on platforms enabled by big data and artificial intelligence.Fighting the Pandemic with Big Data-AI Enabled PlatformsThe COVID-19 pandemic is testing humanity in unprecedented ways, but it is also uniting us to fight this crisis with the best weapons we have. Big data and Artificial Intelligence (AI) technologies – built with microelectronic chips and systems that generate, transmit, store and analyze data – are making a profound contribution to our arsenal for this protracted war. Big data-AI technologies are enabling platforms such as data analytics, robotics, augmented/virtual reality (AR/VR), 3D printing, and others that are already being applied to address many facets of this crisis.Big Data and Analytics Inform Policy In the fight against COVID-19, data analytics platforms are being used first and foremost to slow the rapid spread and to inform policy decisions. This requires analysis of massive amounts of data about public health and travel, often using AI algorithms. The state of California, for example, is partnering with companies such as BlueDot, Esri and Facebook to build a software platform that uses smartphones and location intelligence to track people’s movement and predict hospital needs. Taiwan owes its considerable success in limiting the spread of the virus to the extensive use of big data analytics for identifying and tracking carriers. Google and Apple are driving a joint effort that connects Bluetooth with their popular iOS and Android platforms to trace contacts of infected people. India has developed Aarogya Setu, a mobile app based on Bluetooth and location-mapping platforms, designed to alert citizens if they have crossed paths with another app user who has tested positive for the virus. This app was launched in 11 languages, and despite being entirely voluntary, it was downloaded by 50 million people in 13 days, making it the world’s fastest-ever to reach that number. Such contact-tracing apps, now being rolled out in at least 26 countries, carry inherent privacy and security challenges due to the sensitive data they access. While mitigation strategies like strict data anonymity and opt-in protocols are being implemented, these will need to be refined over time.Robotics Protect Frontline SoldiersToday’s robust robotics platforms are enabled by huge amounts of data from sensors and guidance from predictive AI algorithms. These robots can learn on the job, adapt to the environment, and work safely with humans. In this pandemic, they are perfect for minimizing human interaction with infectious environments. Companies around the world such as Boston Dynamics, Akara Robotics, UBTECH Robotics and CloudMinds have already deployed robots on the front lines of this war to assess patient health, disinfect hospital surfaces, and help health workers with Personal Protective Equipment (PPE).Robot drones are also delivering blood and other lab samples. For example, WakeMed hospitals in North Carolina launched the first drone delivery program approved by the U.S. Federal Aviation Administration with Matternet drones operated by UPS; while Terra Drone from Japan executed similar tasks in the hard-hit Wuhan province of China.3D Printing Speeds ManufacturingBig data-AI technologies enable 3D printing platforms by providing accurate 3D models for optimized designs and defect-free manufacturing. Low-cost, fast-cycle-time 3D printing has helped to alleviate at least some of the medical equipment shortages. For example, the U.S. Food and Drug Administration (FDA) has approved the first 3D-printed “Stopgap Face Mask” for liquid barrier protection from the SARS-CoV-2 coronavirus for healthcare workers. The U.S. Veterans Health Administration has developed this in collaboration with America Makes using an open-source database – the 3D Print Exchange from the National Institutes of Health. In another example, Formlabs worked with Northwell Health, New York’s largest healthcare provider, and University of South Florida (USF) Health to develop and test a nasal swab prototype over just one weekend, and it is now producing up to 150,000 test swabs daily. Prisma Health in South Carolina received emergency FDA authorization for VESper, a 3D printed device that allows a single ventilator to support two patients, and possibly up to four.Telehealth Becomes a “New Normal”Telehealth is not a new concept but is much enhanced by today’s microelectronics platforms that can collect and transmit rich datasets with very low latency. Further, rapid data analysis is increasingly supported by AI systems. The requirement for social distancing makes telehealth a perfect solution for many healthcare consultations. U.S. government data indicates that the daily average of telehealth claims from private insurance for upper respiratory infections increased nearly 12 times over the previous month from March 14 to April 1. Similarly, Teladoc Health coordinated 100,000 patient “televisits” in the week of March 8 – a 50 percent spike over the previous week, taking pressure off the healthcare system. The next generation of telehealth is likely to use AR/VR platforms, which use even richer datasets and AI to improve the accuracy and predictive capability of their underlying models. Consequently, these platforms can provide more realistic experiences and improved outcomes. At least 11 states in the U.S. are already working with AR/VR companies such as XRHealth and AppliedVR for primary care and many medical specialties. Accelerating the Search for a Vaccine or TreatmentThe way out of this pandemic depends on swiftly finding a vaccine and a treatment, ideally by fast-tracking the traditionally slow drug development process. Big data-AI technologies are at the forefront of such efforts globally, often using the most powerful supercomputers available. For example, researchers at the University of California, San Diego (UCSD) are using the Frontera supercomputer to build a complete model of the SARS-CoV-2 coronavirus envelope – a formidable task, requiring analysis of data from 200 million atoms and interactions between them. Researchers at Argonne National Laboratory are combining AI with physics-based models to search for a molecule that might disrupt the activity of the virus, a precursor to finding a treatment. Also, several companies around the globe such as BenevolentAI (UK), Gero (Singapore), Innoplexus (Germany-India), and Insilico Medicine (US-Hong Kong) are using AI platforms to accelerate the search for a solution. ConclusionUltimately, the success of technology is not measured by the number of bits and bytes or by the speed of algorithms. It is measured by every janitor who did not have to clean a hazardous surface because a robot did, by every doctor and nurse protected by a 3D-printed mask, and by every person whose life may be saved by the accelerated discovery of a vaccine or treatment. Big data-AI technologies, and the platforms they enable, are just coming of age – they give us hope that as they evolve in the future, we can use them to build a more resilient society and economy.Note/Disclaimer: The examples cited above are purely for illustration – they are neither comprehensive, nor intended to endorse any particular product or solution.The SEMI Smart Data AI initiative helps members realize full value in the intelligent future enabled by Big Data and Artificial Intelligence – including the large revenue upside, and the transformational potential for operational and supply-chain efficiency. For more information on the initiative, contact Pushkar Apte at [email protected] Manocha is President and CEO of SEMI. Pushkar P. Apte, Ph.D., is the Strategic Technology Advisor for the Smart Data AI Initiative at SEMI.

Ischemic stroke is the leading cause of long-term disability worldwide, affecting over 13 million people each year and costing tens of billions of dollars. Sensome, a French medtech that offers connected medical devices, has developed micrometric AI-powered impedance sensors that can identify the biological nature of the tissue they touch in real-time. Integration of this proprietary technology into a probe to guide medical devices in arteries (a guidewire) has given rise to Sensome’s first product, Clotild®, which recognizes blood clot types in ischemic strokes so clots can be treated faster to improve patients’ chances of a full recovery. The Sensome technology also helps transform the current standard of care in oncology.SEMI spoke with Franz Bozsak, CEO and co-founder of Sensome, about innovative medical technology trends and how microelectronics plays a crucial role.SEMI: When did your adventure with Sensome start? Bozsak: My former Ph.D. advisor Abdul Barakat and I spun-out Sensome from the Ecole Polytechnique in Paris in early 2014 after receiving a 200.000 Euro grant from the French government. We then developed a micrometric impedance sensor that coupled to machine-learning algorithms to identify biological tissues on contact. We are still integrating this sensing technology with existing medical devices in order to create a new category of smart medical devices that provides physicians with relevant insights during their interventions and treatments. These additional insights aim to render healthcare treatments more effective by reducing the risk of complications and the cost of interventions while improving patient monitoring.SEMI: How are strokes typically treated? Bozsak: Before 2014 the almost exclusive way of treating ischemic stroke was by injecting tissue plasminogen activator (tPA) intravenously in order to chemically dissolve an arterial clot. This treatment approach has severe limitations and can only be used in the first 4.5 hours following the onset of a stroke. In 2015, several randomized clinical trials demonstrated the efficacy of a new treatment modality: mechanical thrombectomy.Medical devices that allow a clot to be removed mechanically either using a grid-like structure (a stentriever) or by aspirating the clot using an aspiration catheter completely changed the paradigm in the treatment of ischemic stroke for up to a third of all patients. This new intervention removes the clot in up to 90% of all cases and can for certain patients be used up to 24 hours after the onset of the stroke.Mechanical thrombectomy is now one of the most effective medical treatments in the world. The clinical data gathered over the past years also shows that, in order to maximize the patient’s chances to lead a life free from disability after a stroke, it is not only a question of getting the clot out but also about how the clot was removed. Removing the clot on the first attempt significantly increases the patient’s chances of recovery – the first-pass-effect that is now the objective when treating ischemic stroke patients. And this is exactly where Sensome wants to help since clot removal after several attempts increases risk for patients. SEMI: How did you improve mechanical stroke treatments?We have integrated our sensor technology into a guidewire, the first device to enter a patient’s blood vessels for navigation to the clot. Once in place, the smart guidewire – called Clotild® – guides the thrombectomy device to provide the physician with information on the clot to help the physician choose the thrombectomy device with the highest chances of achieving the first-pass-effect. SEMI: Medical technology has made astonishing advances over the years. How did Sensome develop the micrometric AI-powered impedance sensors?Bozsak: The development of a product like Clotild® would have not been possible five years ago, and many people considered what we wanted to achieve simply incredible. Today, we can answer those same people: We knew it was almost impossible and therefore we just did it. By combining diverse semiconductor technologies, we were able to build the smallest impedance meter in the world. This was then integrated into a guidewire that can be connected via a transmitter to a tablet that serves as the interface with the physician. The guidewire provides impedance measurements that can be analyzed by a machine-learning algorithm, which in turn identifies the tissue in contact with the sensor. A very diverse team of people, collaboration and several different disciplines such as micro-electronics, data science, biology and engineering were required to make this happen.Our ambitious team has been able to flourish and accomplish their ideas in the very stimulating and resourceful environment of the Ecole Polytechnique, while being embedded into the rich and fertile start-up ecosystem of Paris. It is the combination of all these factors taken together that have made our innovation possible.SEMI: What are the main challenges and what are the market opportunities? Bozsak: Bringing semiconductor technology into the medical field is not a straightforward process. The primary hurdle is the simple fact that medical device production volumes are not comparable with consumer electronics volumes and that development cycles are much longer due to regulatory constraints. Both factors are, at first sight, not necessarily compatible with today’s business model of the semiconductor industry. At the same time, this is also a unique opportunity for the semiconductor industry to diversify and expand into a new field – sensors and, in particular, their seamless integration into the healthcare workflow, are a key driver for the healthcare sector of the future. And to achieve this objective, semiconductor technologies are key. What is beneficial, in my opinion, is that the quality standards and requirements of the semiconductor industry are highly compatible with the needs of the medical device industry.SEMI: Are market fragmentation and the high level of regulation making medtech innovation harder?Bozsak: Both are challenging but very rewarding to pursue since the impact on a patient’s life can be profound. Innovation is harder because many stakeholders are involved in ensuring the success of a medical device launch. The involved, milestone-driven, highly regulated process of developing a medical device and bringing the device to the market assures its eventual success. The development process differs very much from those for normal consumer devices. In our case the beneficiary, the patient, is not necessarily the user of the device but rather the physician. The physician is not necessarily the buyer of the device, but the hospital. The hospital is not necessarily paying the device, but ideally the government.The interests of all these stakeholders need to be satisfied to bring a successful device to the market.SEMI: What are your expectations regarding the future of medtech digital innovation? Bozsak: This is the right moment for the medical device and semiconductor industries to come together. The healthcare sector is not low on medical needs for which innovative ideas exist, and the semiconductor industry has many technologies that can enable these ideas to generate solutions. But to make this happen, both sectors need to collaborate. Working together requires both sides to understand their respective needs and constraints. The earlier the knowledge exchange starts, the more powerful the solutions. SEMI MedTech Forum at SEMICON Europa last year was a wonderful opportunity for Sensome to get this discussion going. We are looking forward to continuing the exchange and push the frontiers of the possible further to create the future of digital healthcare.Franz Bozsak, CEO and co-founder at Sensome, obtained a M.S. in Aerospace Engineering from the University of Stuttgart and a Ph.D. from the Ecole Polytechnique in Biomedical Engineering on the optimization of stents. He is a graduate of the Stanford Ignite/Polytechnique business program. In 2014, he co-founded Sensome and has since built a team of renowned scientists, engineers and doctors to realize his vision of connected medical devices. He was named Innovator Under 35 by the MIT Technology Review in 2016. Serena Brischetto is a marketing and communications manager at SEMI Europe.

Smart technologies have gripped the world’s imagination with their promise to revolutionize the way we live and work. With the semiconductor supply chain central to these advances, SEMI Japan in October hosted 200 members for SEMI Japan Members Day as speakers from three of the world’s top device manufacturers – Denso, Sony and Kioxia – offered their perspectives on the strides the semiconductor industry needs to make in three key areas: automotive, smart manufacturing and 3D flash memory manufacturing technology. Automotive Evolution and Electronics – DensoThe automotive industry is re-inventing itself to innovate across connectivity, autonomy, sharing and electric (CASE) and ensure safe, comfortable and environmentally friendly autonomous driving, said Nobuaki Kawahara, executive fellow and director of the Advanced Research and Innovation Center at Denso. Key focus areas of Denso in CASE innovation are Extraordinary Safety and Everyday Confidence. The company’s goal is to minimize damage to vehicles involved in collisions or one-car accidents by making it easier for drivers to detect and steer clear of objects in their path.To improve automobile safety and security, the company is developing advanced driver-assistance systems (ADAS) and autonomous driving technologies as it promotes the confluence of four areas of technology – HMI (Human Machine Interface), environmental recognition, vehicle control assistance, and information and communications. One use case Denso sees as a significant opportunity is deploying sensors such as millimeter-wave radar, cameras and LiDAR to monitor a vehicle’s surroundings, using GPS and precision mapping to pinpoint its location and determine the best route for safety and distance, and then transmitting that information to a motion-control system.Denso is also out to solve the hard challenges associated with autonomous driving in dynamic road conditions. Kawahara pointed out that road conditions vary and that rules for "driving at certain intervals in a certain lane" vary depending on the time of day. Also, on public roads in Abashiri, Hokkaido, where the company is currently conducting field tests, snowfall makes it difficult to recognize road images and gather sensor information. In Asia, it is also common for motorcycles and automobiles to speed along with very little space between them.Image Sensors to Accelerate Development of Smart Manufacturing – SonyTo fulfill the promise of smart manufacturing, the semiconductor supply chain must continue to invest in sensor and imaging technology innovation, said Shigeo Ohba, deputy senior general manager of the Imaging System Business Division at Sony Semiconductor Solutions. For its part, Sony is developing imaging sensors that help network and automate factories to achieve new production and cost efficiencies. For example, the company plans to design devices to increase equipment uptime through predictive maintenance, reduce defect rates and drive other manufacturing efficiencies. The challenge with today’s factory lines that produce a number of different devices is that they are highly complex to manage and therefore prone to human error, undercutting manufacturing efficiency. In the future, AI-powered machines will leverage data analysis to help streamline operations. Adapting an image sensor with AI to machine vision applications can simplify key processes such as measurement and inspection processes while reducing safety and security costs.Of the vast amount of information on all machines connected to the cloud, only essential details will be processed at the edge since edge data processing offers stronger security and reduces data transfer time. Ohba said image sensors will evolve based on edge AI, adding that "AI will be a paradigm shift for image sensors if it’s economically feasible."3D Flash Memory Manufacturing Technology Challenges – KioxiaIncreasing connectivity in factories for smarter, more efficient operations places huge demands on memory since networked devices typically store duplicate data, said Hideshi Miyajima, head of the Advanced Memory Development Center (AMDC) at Kioxia. To meet demand for higher networking speed and capacity, 2d NAND flash memory is moving to 3D and, in particular, three 3D techniques: multivalued memory, cell partitioning and layer stacking.To increase storage capacity, the third-generation 64-layer BiCS FLASH™ stacks layers to form nearly two trillion holes with a diameter of 100nm and a depth of 5μm on a wafer and places a uniform 2-3nm thin film on the inner wall of each 5-μm hole. For its BiCS FLASH™, Kioxia uses a dry etching technique that forms a straight, elongated through-hole and atomic layer deposition (ALD) technology, which creates a uniform laminate atomic layer on the wafer surface to grow materials uniformly and with high precision on large, complex substrates.In order to meet the cost expectations of high-volume 3D flash memory manufacturers, outlays across fabs must be reduced by better monitoring plasma control, enhancing yield through particle control, speeding film formation, and reducing gas, power and water usage, Miyajima said.SMART Transportation and SMART Manufacturing in the Spotlight at SEMICON JapanPlease join us at SEMICON Japan 2019, December 11-13 at Tokyo Big Sight, for the latest developments and trends in SMART Transportation and Smart Manufacturing. There are also a few other great reasons to attend. We look forward to seeing you in Tokyo!Jim Hamajima is president of SEMI Japan.

Part 2 of 2-part series on MSEC 2019 highlights. Read Part 1. Neural Networks on ChipTo be sure, low power is king when bringing machine learning to the sensor edge. Battery-powered, always-on sensing devices require it since frequent recharging is the death knell of any electronic product. That’s why semiconductor companies are offering new ways to conserve power.“MEMS sensor suppliers have made significant strides in the power, size and performance of their devices,” said Aspinity CEO Tom Doyle. “Yet these gains deliver only incremental power improvements to the system.”Doyle advocates a new architectural model that uses an analog neuromorphic processor to analyze all sensor data at the start of the signal chain instead of sending it downstream so power-hungry chips such as DSPs can digitize it before analysis.“The technology industry wants to take advantage of the many benefits of always-on sensing applications,” said Doyle. “Before we can reach mass proliferation, however, we need to resolve the power issues that are deal-breakers for some applications. We believe the answer to this challenge is architectural. All the data gathered by always-on sensing systems is analog in nature, yet as soon as it’s captured, it’s digitized immediately for analysis. Determining which data is important up front eliminates the digitization and processing of irrelevant data so that voice-first devices such as smart speakers and wearables/hearables can run for long periods of time without requiring battery recharge.”Syntiant CTO Jeremy Holleman agreed that on-device intelligence is the future.“Did you just fall? Is your heartrate a bit off? Deep learning provides a toolset that yields vastly superior decisions,” said Holleman. “The problem is that deep learning is computationally intensive. The answer is a neural network that performs on-device edge inferencing.”Holleman added that Syntiant’s neural decision processor was recently certified as Amazon Voice Service (AVS)-compliant for wake-word detection, making it easier to design voice control in battery-powered devices such as earbuds and wearables.MSEC Technology Showcase WinnerWith the groundswell of interest in intelligence at the edge, it was no surprise that Cartesiam won top honors among all competitors in the MSEC Technology Showcase for its NanoEdge AI, software that brings AI to the edge of the signal chain, making it easier for designers to create intelligent objects that can learn and understand.“Unlike other AI algorithmic technologies for sensing devices, NanoEdge enables both learning and inference at the edge, providing accurate and adaptive intelligence,” said Cartesiam Managing Director and Co-founder Marc Dupaquier, who accepted the award. “It’s also the only tool of its kind that does not require data scientists on board for implementation, which saves a tremendous amount of money. Our clients can build a machine learning library and embed it into their own code within weeks to realize the same caliber of unsupervised neural network that was once the exclusive domain of AI cloud vendors.”MSIG 2019 Hall of FameAt this year’s conference, MSIG Director Carmelo Sansone recognized two longtime contributors to the commercialization of MEMS and sensors: Peter G. Hartwell, Ph.D., chief technology officer at InvenSense, a TDK group company; and Thomas Kenny, professor and senior associate dean of engineering at Stanford University.Hartwell leads technology strategy and the InvenSense advanced technology research group. He has more than 25 years’ experience commercializing silicon MEMS products, including advanced sensors and actuators, and developing MEMS testing techniques.Kenny’s academic accomplishments include authoring or co-authoring more than 250 scientific papers and holding 50 issued patents. He has also advised more than 50 graduated Ph.D. students from Stanford.MSEC 2020Mark your calendar for next year’s MSEC, October 12-14, at Coronado Island Marriott Resort Spa in Coronado, Calif. Get updates from MSIG on MSEC and other upcoming events including MSTC 2020.Stay in Touch with MSIGMEMS Sensors Industry Group (MSIG), a SEMI Strategic Association Partner, is the industry association representing the global MEMS and sensors supply chain. To learn how MSIG enables professionals in the MEMS and sensors industry to innovate, address common challenges and accelerate business results, visit us today.Connect with MSIG on Twitter and LinkedIn. Subscribe to SEMI Blog: Technology and Trends.Maria Vetrano is a public relations consultant at SEMI.