Major Revision of SEMI E137: More Practical and Explicit Guidance for SME Packing and Transportation
By Haruna Hayashi (Tokyo Electron)
As semiconductor manufacturing facilities and supply chains expand globally, semiconductor manufacturing equipment (SME) may be shipped through a wide range of transportation environments and conditions. This means that transportation operators at the supplier and recipient locations may have limited experience handling packed SME.
To address these challenges, packing practices that ensure appropriate protection while enabling efficient packaging methodologies are indispensable.
The revised SEMI E137 is intended to support more consistent and easier-to-follow packing and transportation activities.
About the SEMI E137 Standard
SEMI E137 was originally published in 2004 and provides guidance for activities specific to the final assembly and packing at the supplier's facility, transportation, unpacking, and moving of SME into the user's cleanroom.
The current version, E137-0705, covers both recommended materials for packing and crating and recommended step-by-step procedures for each process.
Why Is E137 Revision Needed?
As mentioned above, changes in the handling environment require packing practices that ensure appropriate protection while enabling efficient packing methodologies. This also means that E137 should clearly describe the intended handling methods so that it can be applied correctly regardless of the handlers' level of experience. However, the current version, E137-0705, does not adequately address these needs; therefore, a comprehensive update is necessary.
What Are the Key Revisions?
This revision:
Makes the recommended instructions easier to understand,
- Improves clarity regarding the intended methods for securing and protecting SME, and
- Clarifies that crating materials other than wood may be used in specific circumstances.
The revised E137 provides packing and crating procedures in a step-by-step order. It also includes workflows for the activities and recommended configurations. In addition, consistency of terminology has been improved throughout the document. Accordingly, the Standard title will be changed to “Guide for Final Assembly, Packing, Transportation, Unpacking, and Moving of Semiconductor Manufacturing Equipment.”
As for the second point, the section describing the crating process has been significantly updated. Because the crating process includes securing SME, which is critical to protect the SME, more detailed descriptions and new illustrations support appropriate crate construction and application.
Regarding the third point, since the current version recommends wooden crates only, the revised document allows the use of other materials in specific cases. In addition, because a wider variety of crating materials may cause additional mishandling and accident risks during transportation, the revised E137 also provides identified risks and corresponding mitigation measures.
Using crating materials other than wood may help address deforestation concerns. Therefore, those updates may contribute to sustainability and environmental objectives.
The revised document was developed from 2024 to 2026 and balloted in Cycle 3, 2026. The ballot results were adjudicated and the document successfully passed technical review in May 2026.
The revised SEMI E137 will be available soon through SEMI.
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SEMI
www.semi.org
August 20, 2026