Recently Published Guide on Facilities Data Package and BIM Formats for Efficient Installation of Manufacturing Equipment

By Laura Nguyen, SEMI

Document 6628, New Standard: Guide for Facilities Data Package for Manufacturing Equipment Installation and Building Information Modeling, was reviewed and approved at the Facilities & Gases Joint North America TC Chapter Meeting during the Fall Standards meetings in November 2024.

After numerous industry input and multiple reiterations, SEMI F122 - Guide for Facilities Data Package for Manufacturing Equipment Installation and Building Information Modeling, is now available. This marks a major milestone for the integration of facilities data package and building information modeling (BIM) in the semiconductor industry.

🔗 Access the original article here!

We encourage stakeholders to review the final document and begin implementing its guidelines where applicable.

During the NA Winter Standards Meetings 2025, the Task Force was revised from the Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force to the Manufacturing Equipment Installation Task Force, to incorporate the newly published SEMI F122 and several SEMI Standards that cover this scope; SEMI E6, E51, and E76, which are also up for review. The Task Force welcomes anyone who is interested in participating, especially equipment suppliers, semiconductor manufacturers, architecture/engineering/construction (AEC) service providers.

Get Involved

SEMI Standards development activities take place throughout the year in all major manufacturing regions. To get involved, join the SEMI International Standards Program at: www.semi.org/standardsmembership.

For more information, please visit our main Web site and current events page. If you have any questions regarding SEMI Standards activities, please contact your local SEMI Standards staff.

Standards Watch
SEMI
www.semi.org
April 17, 2025