Standards for the Manufacturing Information Superhighway
New Standards, New Horizons
By Paul Trio, Director, Standards, SEMI
As we round the corner to finish 2024, November has been “pedal to the metal” for the SEMI team. We published new SEMI Standards supporting smart data initiatives that ultimately can help enable digital twin implementation. SEMI E190 – Specification for Equipment Data Publication (EDP) – provides a framework to equipment suppliers on how equipment data is categorized for specific component types and the minimum set of data required for that component type. Additionally, SEMI E190.1 – Specification for Common Data for Etch Components – provides an implementation mapping of SEMI E190 EDP Level Categories to Etch Components.
We also recently published our third SEMI Standard on manufacturing cybersecurity. SEMI E191 – Specification for Computing Device Cybersecurity Status Reporting – specifies a framework for reporting cybersecurity status information about a computing device. Securing the semiconductor manufacturing supply chain requires computing devices provided by equipment suppliers to be secure. There are many factors that contribute to this process, including the computing device’s operating system and installed software. Equipment user’s IT and OT departments want this information to help ensure these computing devices are not vulnerable to cybersecurity attacks. SEMI E191 addresses what cybersecurity status information is to be reported.
Cybersecurity remains a critical industry topic being addressed in SEMI Technology Communities, including the Semiconductor Manufacturing Cybersecurity Consortium (SMCC), and will continue to be a priority effort in 2025. Cybersecurity Forums have been held at recent SEMICONs – including West 2024 and Europa 2024 – as well as in SEMICON Japan 2024 this December.
The Europe Standards meetings were also held during SEMICON Europa hosting several Technical Committees including Silicon Wafer, Gases & Liquid Chemicals, as well as Compound Semiconductor Materials. A proposed new Standard on Silicon Carbide (SiC) Engineered Substrates (#7225) passed Technical Committee review. Pending a successful procedural review, the new SiC standard joins other Compound Semi Standards that were updated this year including SEMI M92, M93, and M54. Similarly, three (3) new Standards were also approved during the recent North America Fall 2024 Meetings that took place November 4-7. Pending successful procedural review, these new standards cover MEMS manufacturing, semiconductor facility planning, and 300 mm wafer handling. To learn more about new and ongoing SEMI activities on compound semiconductor materials, please reach out to your local SEMI staff.
SEMICON Japan will host our last set of Standards meetings for 2024 featuring seven (7) Technical Committees and their associated Task Forces. Once again, there is much to explore at SEMICON Japan this year including programs on Smart Manufacturing/Cybersecurity, Advanced Packaging & Chiplet, Flexible Hybrid Electronics, as well as the first-ever SEMI Global Standards Summit. The inaugural event will gather industry leaders to discuss Standards needs for future factories. The Global Standards Summit will cover three main themes: Smart Manufacturing for Future Factories, Packaging Architectures & Materials, Environmental Sustainability. SEMI sat down with one of our industry leaders to learn more about the importance and timeliness of such an event.
In all, the topics featured in our first-ever Global Standards Summit will provide a glimpse on critical standards activities on the horizon and paves the way for other topics to be explored in future SEMI Global Standards Summits. We look forward to having you all join us on this incredible journey.
Standards Watch
SEMI
www.semi.org
December 5, 2024