Next Gen Assembly / Test Material Handling Task Force Will Meet at SEMICON Japan 2024
By Takeaki Hirabara, SEMI Japan
The Next Gen Assembly / Test Material Handling (NGAT) Task Force (TF), related to the back-end process automation, was established last year under the Physical Interface & Carriers (PIC) Technical Committee. This initiative is closely tied to the Semiconductor Assembly and Test Automation and Standardization Technology Research Association (SATAS), and plans to meet in conjunction with SEMICON Japan 2024 in Tokyo.
Next Gen Assembly / Test Material Handling Task Force Meeting Information
Date: December 11, 2024
Time: 1:30 PM – 5:00 PM Japan Time
Venue: Room 703, International Conference Tower, Tokyo Big Sight
Online participation is available. Please contact us for details.
About the Next Gen Assembly / Test Material Handling Task Force
Charter
Despite pervasive automated material handling systems (AMHS) in semiconductor fabs and highly automated individual equipment in assembly/test, transport of units between equipment remains manual for many applications and areas of assembly/test factories. Apart from JEDEC trays, virtually no physical interface standards exist for assembly test factories. The NGAT TF aims to develop physical interfaces standards to help enable greater automation in assembly/test factories.
Scope
- Carrier Development: Design a new carrier, partially based on SEMI E181 / E181.1, capable of holding two side-by-side stacks of “large” JEDEC trays. (Parallel efforts with JEDEC are underway to define and standardize large trays.)
- Load Port Development: Load port for carrier developed as described in scope item 1, leveraging SEMI E182.
- Equipment Module Platform Interface: Develop standardized interfaces between equipment process modules and a central material handling system. These may include mechanical, utility, handoff interfaces, among others, as needed and agreed upon by the TF.
For more details, click here.
Invitation to Participate
We invite your company and others to join the NGAT TF and contribute to these critical standardization activities.
Why Participate?
SEMI Standards are global, industry-driven standards that are consensus-based, open forums for standardization activities that anyone can participate in. Participation offers a unique opportunity to shape the future of automation in semiconductor assembly and testing.
How to Join:
- Register as a SEMI Standards Program Member: Member Registration Page
- Let us know in advance if you plan to attend by contacting Takeaki Hirabara at [email protected].
Note: You must be a registered SEMI Standards Program Member to participate in SEMI Standards meetings.
Other Related SEMI Standards Meetings
The Panel Level Packaging (PLP) Panel FOUP Task Force meeting will be held earlier on the same day, starting at 9:00 AM Japan Time
For additional details about SEMI Standards meeting schedules during SEMICON Japan 2024, click here.
If you have any questions regarding the SEMI Standards mentioned in this article, please contact Takeaki Hirabara at [email protected].
Get Involved
SEMI Standards development activities take place throughout the year in all major manufacturing regions. To get involved, join the SEMI International Standards Program at: https://www.semi.org/standardsmembership.
For more information, please visit the Standards website and events page. If you have any questions regarding SEMI Standards activities, please contact your local SEMI Standards staff.
Standards Watch
SEMI
www.semi.org
December 5, 2024