SEMI Taiwan Standards Activities Update
By Cher Wu, SEMI Taiwan
SEMI Taiwan held the SEMI Standards Annual Workshop on November 28, 2023, in Hsinchu, with a focus on navigating Taiwan's semiconductor industry through the significant business opportunities arising from the global surge in AI. The event also unveiled the publication of the world's first two flexible hybrid electronics measurement standards for electronic textiles, SEMI FH1 (line impedance) and SEMI FH2 (sheet resistance), formulated by the standards Taiwan Chapter of the Flexible Hybrid Electronics (FHE) Global Technical Committee.
With the rise of AI wave, 3D IC helps to break through the yield rate and seize the opportunity.
Dr. Chen Zhengzhang, leader of the SEMI Taiwan Middle-end Process Task Force of the SEMI 3D Packaging & Integration Global Technical Committee, and the deputy CEO of the ITRI Measurement Center, shared the latest measurement tools at the meeting and pointed out, "AI is not only a popular technology today, but also an important foundation for leading continuous innovation in the future, and to achieve the huge computing power of AI, we must rely on 3D IC chips with more complex structures and processes. For Taiwan's semiconductor industry, how to improve the yield rate of advanced processes and advanced packaging will be an important key to seizing the market. Among them, the introduction of the latest development of measurement technology will be the key to improving the yield of the new generation process." According to MarketsandMarkets market data, the 3D IC and 2.5D IC packaging market is expected to grow to a market size of US$82 billion in 2028.
International standards condense Taiwan's soft hybrid electronics upstream and downstream industry chain to take shape, seizing the global output value of US$3.4 million in 2025
Citing market insights from IDTechEx,it is anticipated that the global FHE market wil attain an output value of approximately US$3.4 million by 2025. The SEMI FHE Standards Global Technical Committee’s release of the world's inaugural FHE measurement standards holds significance, particularly for applications in smart wear, smart medical and smart mobility, contributing to 10% of the FHE market’s overall output value, which projected to encompass 65% of the total market. Li Chung-I, leader of the SEMI FHE Systems for Wearable Task Force and the leader of the Electro-Optical System Institute of the Industrial Technology Research Institute, further explained, "In order to meet industry expectations, the Flexible Hybrid Electronics industry must have evidence based on standards, the SEMI Flexible Hybrid Electronics Committee has first set the direction of standard promotion including fabric wires, connectors, and sensors to solve the measurement standards of FHE components or modules. This will form an upstream and downstream supply chain for the FHE industry, and attract cross-field cooperation to develop key components, including equipment manufacturers, textile manufacturers, system manufacturers, etc., and invest in the evaluation of testing equipment or new products.”
The SEMI Fab & Equipment Information Security Task Force, led by Dr. Cho Chuanyu of the Industrial Technology Research Institute, shared the SEMI E187 information security standard checklist, including 12 key inspection elements and verification and diffusion practices. This checklist is designed to fortify joint information security defenses in collaboration with industry stakeholders.
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SEMI Standards development activities take place throughout the year in all major manufacturing regions. To get involved, join the SEMI International Standards Program at: www.semi.org/standardsmembership.
For more information, please visit our main Web site and current events page. If you have any questions regarding SEMI Standards activities, please contact your local SEMI Standards staff.
Standards Watch
SEMI
www.semi.org
December 18, 2023