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SEMICON Japan Standards Awards

By Keigo Nakajima, SEMI Japan

The SEMI International Standards Program is operated in all major electronics manufacturing regions including the Americas, Europe, Japan, Korea, Taiwan, and China to increase the manufacturing efficiency and interoperability. Over 5,000 volunteers representing over 2,000 companies work in 21 global technical committees and over 200 task forces to find solutions to common technology challenges.

The SEMI Japan Standard Award is given to an individual or group that has made significant contributions to the Standards activities in Japan.

For this year, the award announcement took place at the SEMI Standards Pavilion at SEMICON Japan 2021 Hybrid, the world's leading international exhibition on the microelectronics manufacturing supply chain, located at Tokyo Bigsite on December 15-17, 2021.

Following awards were given to individual members, who was recommended by the SEMI Standard Japan Regional Technical Committee Co-chairs.

SEMI Standard Awards: SEMI Japan Honor Award

This year, “SEMI Japan Honor Award” was awarded to Hiroyuki Araki. Mr. Hiroyuki Araki has contributed to the Standard Activities for the Technical Committee of Liquid Chemicals for many years and has contributed greatly to smooth communication as a co-chair of the Global Liquid Chemicals Japan TC Chapter since 2013.

SEMICON Japan 2021 Awards

Mr. Hiroyuki Araki, SCREEN Semiconductor Solutions Co., Ltd.

SEMI Standard Awards: Technical Committee Awards

The awardees and reasons are as follows:

Technical Committee

Name

Company

Award Category

Silicon Wafer

Shingo Sumie

Kobelco Research

Institute, Inc.

1,2

Information & Control

(I&C)

Albert Fuchigami

PEER Group

3

Metrics

Supika Mashiro

Tokyo Electron

Limited

2

Physical Interfaces & Carriers

 (PI&C)

Hayato Iwamoto

Sony Semiconductor

Solutions Corporation

2,3

Physical Interfaces & Carriers

(PI&C)

Hisashi Gotoh

Sony Semiconductor

Solutions Corporation

2,3

Physical Interfaces & Carriers

(PI&C)

Naomune Taniguchi

TOKYO SEIMITSU

CO., LTD.

2,3

Flat Panel Display (FPD) –

Materials & Components

Atsushi Uehigashi

MORESCO Corporation

1

Performed outstanding activities in At the Japan Regional Technical Committee, accordance with either of the following rules. (For individuals.)

  1. Took the lead in document development for the first time
  2. Made significant contributions to document development as the lead developer
  3. Contributed to committee management and committee membership
  4. Contributed to coordinating task force activities and promoting cooperation with other associations
  5. Contributed to the spread of standards

 

Shingo Sumie (Kobelco Research Institute, Inc.) / Global Silicon Wafer Japan TC Chapter

Took the lead in the document (New Standard SEMI M89-0721: Test Method for Recombination Lifetime of the Epilayer of the Silicon Epitaxial Wafer (p/p+, n/n+) by the Short Wavelength Excitation Microwave Photoconductive Decay Method) development for the first time and made significant contribution as the lead developer.

 

Albert Fuchigami (PEER Group) / Global I&C Japan TC Chapter  

Contributed to committee management and committee membership.

Such as active participation in committee / TF activities despite the inconvenient time from North America, reports for

North American liaison activities, detailed explanation mainly for DDA TF, make opinions on the activities of the Japan Regional Committee, etc.

 

Supika Mashiro (Tokyo Electron Limited) / Global Metrics Japan TC Chapter

Made significant contributions to document development (Revision to SEMI E136-1104: SEMI E136-0122 - Test Method for Determining the Output Power of RF Generators Used in Semiconductor Processing Equipment RF Power Delivery Systems ), as the lead developer

 

Hayato Iwamoto (Sony Semiconductor Solutions Corporation) / Global PI&C Japan TC Chapter

Hisashi Gotoh (Sony Semiconductor Solutions Corporation) / Global PI&C Japan TC Chapter

Naomune Taniguchi (TOKYO SEIMITSU CO., LTD.)  / Global PI&C Japan TC Chapter

Contributed to coordination of task force activities and document development for standardization of 300 mm Tape Frame FOUP (New Standards SEMI E184-1221: Specification for 300 mm Tape Frame FOUP Load Port, SEMI E185-1221: Specification for 300 mm Tape Frame FOUP ).

 

Atsushi Uehigashi (MORESCO Corporation) / Global FPD Materials & Components Japan TC Chapter

Took the lead in the document (New Standard SEMI D80-0421: Test Method for Measurement of Water Vapor Transmission Rate for High Gas Barrier Plastic Film in a Short Time) development for the first time.

 

Get Involved

SEMI Standards development activities take place throughout the year in all major manufacturing regions. To get involved, join the SEMI International Standards Program at: www.semi.org/standardsmembership.

For more information, please visit our main Web site and current events page. If you have any questions regarding SEMI Standards activities, please contact your local SEMI Standards staff.

 

Standards Watch
SEMI
www.semi.org
March 7, 2022