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New SEMI SCIS Activity Launched on Chamber Parts Cleaning

By Paul Trio, SEMI

The Semiconductor Components, Instruments, and Subsystems (SCIS) is the SEMI Technology Community focused on addressing defectivity of critical semiconductor components especially at advanced process nodes. SEMI Technology Communities are collaborative technology platforms where SEMI Members come together to discuss critical issues and pre-competitively developed solutions that benefit the entire industry. There are over 50 SEMI member companies participating from component suppliers, process equipment OEMs, and device makers. 

SCIS is focused on driving consistent methodologies for measuring defects by process-critical components. There are working groups focused on specific areas such as traceability and chamber components. There are also component-specific efforts including: seals & valves, pumps, gas & liquid delivery systems, and RF. Overall activities are strategically guided by an executive advisory committee composed of thought-leaders from device maker, equipment OEM, and component supplier companies.

To date, there are six industry standards that have been incubated in SCIS and driven through the SEMI Standards Program:

  • SEMI E180 — Test Method for Measuring Surface Metal Contamination Through ICP-MS of Critical Chamber Components Used in Semiconductor Wafer Processing
  • SEMI F70.1 — Test Method for Determination of Particle Contribution of Gas Delivery System and Its Components Through Pulsed Testing
  • SEMI F114 — Test Method for the Determination of Organic Contaminants Present on Wetted Surfaces of Ultra High Purity Chemical Delivery Systems and Components
  • SEMI F115 — Test Method for the Determination of Metallic Elements Present on Wetted Surfaces of Ultra High Purity Chemical Delivery Systems and Components
  • SEMI F51 — Guide for Elastomeric Sealing Technology
  • SEMI E135 — Test Method for RF Generators to Determine Transient Response for RF Power Delivery Systems Used in Semiconductor Processing Equipment

There are more SCIS-initiated activities in the development pipeline including a new SEMI Specification that establishes a material Bar Code Label (BCL) standard for all incoming direct materials, parts, and consumables for semiconductor manufacturing.

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In early 2020, a new SCIS activity was launched focused on parts cleaning for critical chamber components. There are defectivity concerns whenever critical chamber parts are sent out for cleaning and refurbishment especially those used for advanced node high volume manufacturing. First-time-right predictive maintenance, cleaning techniques, and metrology are just some of the many important considerations that come into play. This new SCIS initiative aims to create a forum for such discussions, bringing together essential stakeholders to the table to drive industry solutions.

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In late 2020, SCIS organized a webinar providing perspectives on: 

  • The importance of OEM part design, cleaning & refurbishment loops for advanced node high volume manufacturing and designing for zero defects
  • The standards gap between cleanliness specs, measurement methods & successful predictive maintenance (PdM) in the Fab and how to enable AI based maintenance scheduling
  • Applicability of cleaning techniques vs OEM part designs and mitigating human variability during parts cleaning
  • The emerging considerations for parts designed to facilitate cleaning
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Speakers from equipment OEM, clean vendor, and clean metrology companies shared their unique perspectives on these various challenges while offering potential areas for collaborative discussions. A new SCIS Parts Clean Working Group will kick-off in Q2 2021.

The recording of the SCIS Parts Clean webinar is now available as an on-demand content . Complimentary access is available for SEMI Members. For more information about SCIS, please contact Paul Trio at SEMI.


 

Standards Watch
SEMI
www.semi.org
March 11, 2021