downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Group 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content

December 15, 2020

colorful wafer the last frontier




    8:00 am - 10:30 am

    Add to Calendar 2020-12-15 08:00:00 2020-12-15 10:30:00 SCIS Part Clean Program     Virtual, United States America/Los_Angeles public

    United States

    colorful wafer the last frontier

    About The Webinar

    Defect prediction and defect source mitigation is critical to enabling high-volume manufacturing at all semiconductor fabs, but especially at advanced process nodes. This program will provide perspectives on:

    • Importance of OEM part design, cleaning & refurbishment loops for advanced node high volume manufacturing and designing for zero defects
    • The standards gap between cleanliness specs, measurement methods & successful predictive maintenance (PdM) in the Fab  and how to enable AI based maintenance scheduling
    • Applicability of cleaning techniques vs OEM part designs and mitigating human variability during parts cleaning
    • The emerging considerations for parts designed to facilitate cleaning

    Who Should Attend

    • IDMs, fabs, foundries; fab managers, process engineers
    • Semiconductor processing equipment OEMs
    • Critical chamber component suppliers
    • Semiconductor processing equipment parts clean vendors
    • Parts clean metrology service providers


    8:00 am - 8:05 am
    Paul Trio
    Paul Trio, SEMI

    Welcome Remarks & Moderation

    Paul Trio, Senior Manager, Strategic Initiatives, SEMI

    8:05 am - 8:40 am
    Patrick Martin, Applied Materials
    Patrick Martin, Applied Materials

    OEM Perspective on Parts Cleaning

    Patrick Martin, Business Development, New Markets and Alliances
    Applied Materials

    Speaker Bios

    8:40 am - 9:09 am
    dave Laube
    David Laube

    Parts Cleaning from Design to Scrap

    David Laube, CTO,
    Pentagon Technologies

    Speaker Bios

    Reed Rosenberg
    Reed Rosenberg

    Parts Cleaning from Design to Scrap

    Reed Rosenberg, CTO
    Cleanpart USA

    Speaker Bios

    9:45 am - 10:00 am
    Victor Chia
    Victor Chia

    Cleanliness Methodology

    Victor Chia, International Expert; Director, Surface Contamination Technologies
    Air Liquide / Balazs NanoAnalysis

    Speaker Bios

    10:00 am - 10:15 am
    Max van den Berg
    Max van den Berg

    Product Cleanliness – International Collaboration Initiatives

    Max van den Berg, System Architect, Electronics and Assembly, Global Application Engineering

    Speaker Bios

    10:15 am - 10:30 am

    Q&A and Closing Remarks

    Questions about the webinar? Contact


    Are you interested in sponsoring this program?  Contact Paul Trio at


    Semiconductor Components, Instruments, and Subsystems (SCIS) is a SEMI technology community chartered to address process-critical components challenges to meet the demands of high-volume manufacturing (HVM) at advanced process nodes. SCIS brings together all stakeholders that are driving yield improvements through the very last frontier of component and hardware defect reduction.