MEMS Standard Successfully Driven to Publication by MSIG
By Laura Nguyen, SEMI HQ
No standards exist specifically for the substrates used to produce MEMS devices. While substrates used in the production of MEMS devices share many physical and electrical properties with those used in IC manufacturing, some significant differences exist. In order to achieve the mechanical features of various MEMS devices, particular substrate configurations may be required which differ significantly from substrates used in traditional semiconductor device fabrication.
The initial idea for this document was generated out of the MEMS and Sensors Industry Group (MSIG) before transitioning into the Standards Program. Since the integration of MSIG into SEMI the two groups have worked together on pulling together industry experts and last month have successfully published their first standard through this collaboration, SEMI MS12, Specification for Silicon Substrates Used in Fabrication of MEMS Devices.
SEMI MS12 includes information on physical properties such as dimensions and surface properties as well as basic electrical properties of customized silicon substrates (150 mm and 200 mm nominal diameter) to be used for MEMS device fabrication, and will allow the stocking of standard material, lowering the time to purchase, time to market and overall cost.
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March 5, 2020